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The explosion occurred in Telangana Spice Kitchen on Road Number One Jubilee Hills. According to police, the explosion damaged the boundary wall of the hotel.

A body of a man has been found in a plastic bag in seven pieces on Mumbai's Gorai beach, the police said today.

Bangladesh is pinning its hopes on one of the nation's most acclaimed intellectuals to bring stability to a country scarred by coups and political upheaval.

Backed by Iran and hated by Israel, Hezbollah chief Hassan Nasrallah is Lebanon's most powerful man. He enjoys cult status among his Shiite supporters and holds sway over the country's institutions.

Japan's next prime minister, Shigeru Ishiba, says he reads three books a day and would rather do that than mingle with the ruling party colleagues who picked him as their new leader today

Ratan Naval Tata, the business titan and global icon who led the Tata behemoth from thirty countries to over a hundred since becoming chairman in 1991, died today at Mumbai's Breach Candy Hospital. He was 86.

Industrialist Ratan Tata, who passed away at the age of 86, is credited with transforming the Tata Group's portfolio during his tenure as chairman to include products from salt to software to sports cars.

Liam Payne, who rose to fame as a member of the boy band One Direction has died at the age of 31. The British singer fell to his death from the third-floor balcony of Hotel CasaSur Palermo in Buenos Aires, Argentina.

US President-elect Donald Trump has named Mike Waltz, a Congressman from Florida and co-chair of the India Caucus, as the new National Security Adviser.

1. Ricky Ponting hits back at Gautam Gambhir, calls him 'prickly character'  The Times of India
2. Ricky Ponting Fires Back At Gautam Gambhir After India Coach's Press Conference Remarks  NDTV Sports
3. A fired-up Virat Kohli is Australia's worry after Ricky Ponting's 'bad move'  The Times of India
4. Gambhir a prickly character, never took dig at Kohli: Ponting  The Hindu
5. Border-Gavaskar Trophy: Why Gautam Gambhir comes across as abrasive at times  The Indian Express

1. Magnus Carlsen interview: I probably will have the most fun playing Gukesh  Hindustan Times
2. "It's Chaotic": Chess World No. 1 Magnus Carlsen Reveals Why He Does Not Play In India  NDTV Sports
3. Tata Steel Chess set for a Carlsen-Pragg opening  Hindustan Times
4. Magnus Carlsen returns to Kolkata after almost five years at Tata Steel India Rapid and Blitz 2024  ChessBase India
5. King Carlsen hails growth of Indian chess, praises Praggnanandhaa's fighting spirit  Telegraph India

1. Best smartphones under ₹30,000 with good battery life and cameras | Mint  Mint
2. Best smartphones under 20,000 with good cameras: Redmi Note 13 Pro, Vivo T3 5G and others  Hindustan Times
3. 5 Affordable Camera Phones To Make Instagram Reels  Times Now
4. Best Smartphones Under Rs 20,000 With Excellent Cameras, Redmi Note 13 Pro, Vivo T3 5G & More  NewsX

1. Battered Reliance Shares To Make A Comeback? This Analyst Sees 29% Upside Ahead  Benzinga India
2. Reliance Industries shares may see 30% upside according to CLSA, who cites this key trigger  CNBCTV18
3. RIL shares are down 20% from record high, oversold on charts; here's what analysts say  Business Today
4. Six of India’s top 10 most valuable firms shed Rs 1.55 lakh crore in market value  Moneycontrol
5. Reliance Industries Share Price Today on 13-11-2024: Reliance Industries share price are down by -0.63%, Nifty down by -0.8%  Mint

1. Donald Trump picks ex-US spy John Ratcliffe as CIA chief, Mike Huckabee as ambassador to Israel  Hindustan Times
2. Trump picks Ratcliffe as CIA director, Kash Patel misses out  India Today
3. Donald Trump picks ‘China hawk’ John Ratcliffe as CIA director, taps Fox News host Pete Hegseth as defence secretary  Mint
4. Trump picks John Ratcliffe to be CIA director  The Hindu
5. Meet former US spy John Ratcliffe, Trump's choice for CIA director  The Times of India

Atlas Biomed's website is no longer active and the phone number listed is dead as well.

Zomato witnesses approximately 400,000 cancelled orders monthly which prompted it to launch the initiative.

By celebrating Children's Day as Bal Diwas, India reinforced the cultural and emotional significance of the day, making it a uniquely Indian celebration rooted in national pride and values.

Owlet, a connected-baby care company raised a $24 million Series B investment from Trilogy Equity Partners, with participation from existing investors, including Eclipse Ventures, Broadway Angels, and Enfield Ventures, and the addition Pelion Venture Partners.

Owlet’s core product is a baby sock that contains a smart sensor. The sensor monitors pulse oximetry, a technology used in hospitals to measure an infant's heart rate and blood oxygen levels. The vital signs are communicated to parents’ smartphone via Bluetooth connection. The product retails for $299 and parents can also choose from monthly payment plans.

Other IoT-health startups using sensors to monitor vital signs include Aifloo, a company selling wrist-bands for elders and Air by Propeller, a smart health company that provides an API to predict local asthma conditions.

A complete product package of Owlet monitor includes three fabric socks, smart sock sensor, a base station (which rings an alarm if a baby’s vital signs are abnormal), and charging cords.

Before the company raised the latest round, it closed a $15 million Series B round in late 2016. The recent investment brought Owlet’s total equity funding to $46M. Owlet plans to use the growth capital to launch more baby care products.

Vesper, the maker of piezoelectric sensors used in microphone production and winner of CES Innovation Award 2018 raised a $23M Series B round. American Family Ventures led the investment with participation from Accomplice, Amazon Alexa Fund, Baidu, Bose Ventures, Hyperplane, Sands Capital, Shure, Synaptics, ZZ Capital and some undisclosed investors.

Vesper’s innovative sensors can be used in consumer electronics like TV remote controls, smart speakers, smartphones, intelligent sensor nodes, and hearables. The company will use the funding proceeds to scale-up its functions like mass production of its microphones and support expanded research and development, hiring, and establishing international sales offices.

The main product of Vesper is VM1000, a low noise, high range,single-ended analog output piezoelectric MEMS microphone. It consists of a piezoelectric sensor and circuitry to buffer and amplify the output.

The hot-selling product of Vesper is VM1010 with ZeroPower Listening which is the first MEMS microphone that enables voice activation to battery-powered consumer devices.

The unique selling point of Vesper’s products is they are built to operate in rugged environments that have dust and moisture.

"Vesper's ZeroPower Listening capabilities coupled with its ability to withstand water, dust, oil, and particulate contaminants enables users that have never before been possible," said Katelyn Johnson, principal of American Family Ventures. "We are excited about Vesper's quest to transform our connected world, including IoT devices."

Other recent funding news include $24 raised by sensor-based baby sock maker Owlet, IFTTT banks $24M from Salesforce to scale its IoT Enterprise offering, and Intel sells its Wind River Software to TPG.

Smart baby monitor company Nanit raised a $14M Series B round led by Jerusalem Venture Partners (JVP). Other investors that participated include existing investors Upfront Ventures, RRE Ventures, Vulcan Capital and Vaal Investment Partners. The latest investment brings total equity funding of Nanit to $30M.

Nanit announced it will use the funding proceeds to expand its team of computer vision and machine learning engineers and grow its sales in Europe and Canada.

Nanit’s baby monitor helps new parents oversee nursery conditions as it has built-in temperature and humidity sensors. The camera lets parents remotely monitor baby’s crib whereas sound and motion are detected via smart sensors.

The monitor’s insights can be accessed via an accompanying mobile app. Nanit charges $10 per month for its premium package.

The key use cases of Nanit’s baby monitoring technology include sleep insights, behavioral analysis, expert guidance, and nightly video summaries. The company currently sells its smart monitors via its website.

Report on Corporate Social Responsibility (CSR) in Indian BFSI sector.

[State Department] U.S. Ambassador-at-Large to Monitor and Combat Trafficking in Persons Cindy Dyer will travel to Madagascar November 13-16 and South Africa November 17-21.

[allAfrica]

[DA] It is a national embarrassment that the inability of the City of Johannesburg to supply water to its residents, business and public sector offices, has now led to the shutdown of operations at the Constitutional Court, on Constitution Hill in Braamfontein.

In the rapidly evolving landscape of automotive electronics, traditional monolithic design approaches are giving way to something more flexible and powerful—chiplets. These modular microchips, which are themselves parts of a whole silicon system, offer unparalleled potential for improving system performance, reducing manufacturing costs, and accelerating time-to-market in the automotive sector. However, the transition to working with chiplets in automotive electronics is not without its challenges.

Designers must now grapple with a new set of considerations, such as die-to-die interconnect standards, complex processes, and the integration of diverse IPs. Advanced toolsets and standardized design approaches are required to meet these challenges head-on and elevate the potential of chiplets in automotive innovation. In the following discourse, we will explore in detail the significance of chiplets in the context of automotive electronics, the obstacles designers face when working with this paradigm, and how Cadence comprehensive suite of IPs, tools, and flows is pioneering solutions to streamline the chiplet design process.

Unveiling Chiplets in Automotive Electronics

For automotive electronics, chiplets offer a methodology to modularize complex functionalities, integrate different chiplets into a package, and significantly enhance scalability and manufacturability. By breaking down semiconductor designs into a collection of chiplets, each fulfilling specific functions, automotive manufacturers can mix and match chiplets to rapidly prototype new designs, update existing ones, and specialize for the myriad of use cases found in vehicles today.

The increasing significance of chiplets in automotive electronics comes as a response to several industry-impacting phenomena. The most obvious among these is the physical restriction of Moore's Law, as large die sizes lead to poor yields and escalating production costs. Chiplets with localized process specialization can offer superior functionality at a more digestible cost, maintaining a growth trajectory where monolithic designs cannot. Furthermore, chiplets support the assembly of disparate technologies onto a single subsystem, providing a comprehensive yet adaptive solution to the diverse demands present in modern vehicles, such as central computing units, advanced driver-assistance systems (ADAS), infotainment units, and in-vehicle networks. This chiplet-based approach to functional integration in automotive electronics necessitates intricate design, optimization, and validation strategies across multiple domains.

The Complexity Within Chiplets

Yet, with the promise of chiplets comes a series of intricate design challenges. Chiplets necessitate working across multiple substrates and technologies, rendering the once-familiar 2-dimensional design space into the complex reality of multi-layered, sometimes even three-dimensional domains. The intricacies embedded within this design modality mandate devoting considerable attention to partitioning trade-offs, signal integrity across multiple substrates, thermal behavior of stacked dies, and the emergence of new assembly design kits to complement process design kits (PDKs).

To effectively address these complexities, designers must wield sophisticated tools that facilitate co-design, co-analysis, and the creation of a robust virtual platform for architectural exploration. Standardizations like the Universal Chip Interconnect Express (UCIe) have been influential, providing a die-to-die interconnect foundation for chiplets that is both standardized and automotive-ready. The availability of UCIe PHY and controller IP from Cadence and other leading developers further eases the integration of chiplets in automotive designs.

The Role of Foundries and Packaging in Chiplets

Foundries have also pivoted their services to become a vital part of the chiplet process, providing specialized design kits that cater to the unique requirements of chiplets. In tandem, packaging has morphed from being a mere logistical afterthought to a value-added aspect of chiplets. Organizations now look to packaging to deliver enhanced performance, reduced power consumption, and the integrity required by the diverse range of technologies encompassed in a single chip or package. This shift requires advanced multiscale design and analysis strategies that resonate across a spectrum of design domains.

Tooling Up for Chiplets with Cadence

Cadence exemplifies the rise of comprehensive tooling and workflows to facilitate chiplet-based automotive electronics design. Their integrations address the challenges that chiplet-based SoCs present, ensuring a seamless design process from the initial concept to production. The Cadence suite of tools is tailored to work across design domains, ensuring coherence and efficiency at every step of the chiplet integration process.

For instance, Cadence Virtuoso RF subflows have become critical in navigating radio frequency (RF) challenges within the chiplets, while tools such as the Integrity 3D-IC Platform and the Allegro Advanced Multi-Die Package Design Solution have surfaced to enable comprehensive multi-die package designs. The Integrity Signal Planner extends its capabilities into the chiplet ecosystem, providing a centralized platform where system-wide signal integrity can be proactively managed. Sigrity and Celsius, on the other hand, offer universally applicable solutions that take on the challenges of chiplets in signal integrity and thermal considerations, irrespective of the design domain. Each of these integrated analysis solutions underscores the intricate symphony between technology, design, and packaging essential in unlocking the potential of chiplets for automotive electronics.

Cadence portfolio includes solutions for system analysis, optimization, and signoff to complement these domain-specific tools, ensuring that the challenges of chiplet designs don't halt progress toward innovative automotive electronics. Cadence enables designers to engage in power- and thermal-aware design practices through their toolset, a necessity as automotive systems become increasingly sophisticated and power-efficient.

A Standardized Approach to Success with Chiplets

Cadence’s support for UCIe underscores the criticality of standardized approaches for heterogeneous integration by conforming to UCIe standards, which numerous industry stakeholders back. By co-chairing the UCIe Automotive working group, Cadence ensures that automotive designs have a universal and standardized Die-to-Die (D2D) high-speed interface through which chiplets can intercommunicate, unleashing the true potential of modular design.

Furthermore, Cadence champions the utilization of virtual platforms by providing transaction-level models (TLMs) for their UCIe D2D IP to simulate the interaction between chiplets at a higher level of abstraction. Moreover, individual chiplets can be simulated within a chiplet-based SoC context leveraging virtual platforms. Utilizing UVM or SCE-MI methodologies, TLMs, and virtual platforms serve as first lines of defense in identifying and addressing issues early in the design process before physical silicon even enters the picture.

Navigating With the Right Tools

The road to chiplet-driven automotive electronics is one paved with complexity, but with a commitment to standards, it is a path that promises significant rewards. By leveraging Cadence UCIe Design and Verification IP, tools, and methodologies, automotive designers are empowered to chart a course toward chiplets and help to establish a chiplet ecosystem. With challenges ranging from die-to-die interconnect to standardization, heterogeneous integration, and advanced packaging, the need for a seamless integrated flow and highly automated design approaches has never been more apparent. Companies like Cadence are tackling these challenges, providing the key technology for automotive designers seeking to utilize chiplets for the next-generation E/E architecture of vehicular technology.

In summary, chiplets have the potential to revolutionize the automotive electronics industry, breathing new life into the way vehicles are designed, manufactured, and operated. By understanding the significance of chiplets and addressing the challenges they present, automotive electronics is poised for a paradigm shift—one that combines the art of human ingenuity with the power of modular and scalable microchips to shape a future that is not only efficient but truly intelligent.

Learn more about how Cadence can help to enable automakers and OEMs with various aspects of automotive design.

The rapid rise in size and sophistication of AI/ML training models requires increasingly powerful hardware deployed in the data center and at the network edge. This growth in complexity and data stresses the existing infrastructure, driving the need for new and innovative processor architectures and associated memory subsystems. For example, even GPT-3 at 175 billion parameters is stressing the bandwidth, capacity, training time, and power of the most advanced GPUs on the market.

To this end, Cadence has shown our HBM3E memory subsystem running at 12.4Gbps at nominal voltages, demonstrating the PHY’s robustness and performance margin. The production version of our latest HBM3E PHY supports DRAM speeds of up to 10.4Gbps or 1.33TB/s per DRAM device. This speed represents a >1.6X bandwidth increase over the previous generation, making it ideal for LLM training.

Cadence has been the HBM performance leader since 2021, when we announced our first 8.4Gbps HBM3E PHY supporting >1TB/s of memory bandwidth per HBM DRAM. Customers building advanced AI processors have used this speed while building margin into their systems. Recall that HBM3E is a 3D stacked DRAM with 1024-bit wide data (16 64-bit channels). While this wide data bus enables high data transfer, routing these signals requires interposer technology (2.5D) capable of routing close to 2000 signals (data and control), including silicon, RDL, and silicon bridges.

The interposer design is critical for the system to operate at these data rates. Cadence provides 2.5D reference designs, including the interposer and package, as part of our standard IP package. As demonstrated in our test silicon, these designs give customers confidence they will meet their memory bandwidth requirements. The reference design is also a good starting point, helping to reduce development time and risk. Our expert SI/PI and system engineers work closely with customers to analyze their channels to ensure the best system performance.

Even as HBM3E delivers the highest memory bandwidth today, the industry keeps pushing forward. JEDEC recently announced that HBM4, the next version of the HBM DRAM standard, is nearing completion. JEDEC calls HBM4 an “evolutionary step beyond the currently published HBM3 standard.” They also claim HBM4 “enhancements are vital for applications that require efficient handling of large datasets and complex calculations.” HBM4 will support AI training applications, high-performance computing (HPC), and high-end graphics cards.

Cadence will continue to push the HBM performance boundaries to ensure designers of these data-intensive systems can take advantage of the highest memory bandwidth available.

Learn more about Cadence HBM PHY IP products.

Disappearing toolbar or docked menu

Is there a way for the toolbar or floating menu from disappearing when a cells tab is added to a window?

I have created a skill toolbar and it disappeared when I add another cell or tab to a window.

The only toolbars that stay are the ones I have defined in the Layout.toolbar file.

Do I have to add a trigger to keep the toolbars visible or not disappearing from the window?

Cadence version IC23.1-64b.ISR7.27

Paul