A. V. Domrina
Trans. Moscow Math. Soc. 83 (), 201-215.
Abstract, references and article information

A deep dive into loss and damage solutions 8 February 2022 — 1:00PM TO 2:15PM Anonymous (not verified) 31 January 2022 Online

This second event of our loss and damage series cuts through polarized debate by bringing together international experts to discuss innovative legal and financial approaches.

This event will focus on a deep dive into constructive solutions and progress made to address loss and damage.

Following the first event of this two-part series, ‘Loss and Damage – where are we now and what happens next’, this event focuses on a deep dive into constructive solutions and progress made to address loss and damage.

Loss and damage refers to harms and destruction caused by climate change impacts that cannot be avoided through mitigation or adaptation. While it has gained increasing recognition in international climate change negotiations, turning the concept of loss and damage into tangible action for climate-vulnerable countries has been contentious.

Loss and damage is interwoven with issues of fairness and equity. The issue is highly disputed due to its connection with the historical responsibility of developed countries in causing climate change, as well as associated calls for compensation from developing countries.

At COP26, Scotland became the first government to pledge funds for loss and damage for countries in the Global South. However, most climate-vulnerable countries left disappointed by the failure of the Glasgow Climate Pact to secure the establishment of a dedicated loss and damage financing facility.

Developing countries have made it clear that they will continue to push for a new financing facility in the Glasgow Dialogue, a set of international discussions on loss and damage kicking off in June. The Environment and Society Discussion Series is hosting two events on loss and damage ahead of that date.

This second event convenes a deep dive into the progress and potential on loss and damage solutions, while also examining the hurdles that are still to overcome to make loss and damage support a reality.

Feminist solutions to the climate crisis 8 March 2022 — 11:00AM TO 12:00PM Anonymous (not verified) 1 March 2022 Online

This International Women’s Day panel explores intersectional feminist approaches to solving the climate crisis.

Gender inequality and climate change are closely intertwined. Due to their different and unequal social roles and status, women, girls and people of marginalised genders are disproportionately affected by climate change impacts, also differentiated by factors such as age, race, ability and location.

They are also leading innovative solutions to climate change at all levels, especially in frontline communities. Yet as the Glasgow Women’s Leadership statement highlighted at COP26, there is still a lack of momentum for prioritising their knowledge, tools and leadership in climate policy and action.  

This panel considers what feminist approaches can bring to climate change communication and movement building, spotlighting a range of local and regional gender-responsive climate initiatives. It also discusses concrete examples of feminist and gender-responsive policies to address climate change, such as the Feminist Green New Deal.

The panel highlights the critically important work being carried out by diverse feminist activists and researchers, and how the audience can centre gender and social equality in their work on climate change.  

Shengyu Tang
Proc. Amer. Math. Soc. 152 (), 5381-5394.
Abstract, references and article information

Anh Tuan Nguyen, Tómas Caraballo and Nguyen Huy Tuan
Proc. Amer. Math. Soc. 152 (), 5175-5189.
Abstract, references and article information

Alin Bostan, Xavier Caruso and Julien Roques
Bull. Amer. Math. Soc. 61 (), 609-658.
Abstract, references and article information

Towards just transition in Africa: Green financing for urban energy solutions and job creation 9 June 2022 — 7:30AM TO 11:00AM Anonymous (not verified) 18 May 2022 Nairobi and online

This event explores the major openings and potential impediments to the development of a just transition policy in Africa.

Global climate policies towards a ‘just transition’ under the Paris Agreement should also align with and support African states’ national sustainable development priorities. In particular, the need for decent and fair job creation and the establishment of sufficient, resilient and sustainable power supply, accessible to all, and efficient energy use.

Achieving green growth requires innovative and more accessible financing models, especially as wealthy nations’ financial pledges have fallen short. Ahead of the ‘African COP27’ set to take place in Egypt in November 2022, there is a need for transformational strategic thinking and context-specific action from African governments, civil society, businesses and financiers in their green financing demands and national implementation plans.

Sustainable urban energy solutions represent a critical zone of opportunity for the development of new and more reliable green finance pathways. Africa’s rapidly expanding cities present a significant economic opportunity and source of growth. However, urban centres are also where income and energy inequalities are at their starkest. The acceleration of sustainable energy generation and use could have a transformative impact on SMEs and livelihoods across value chains.

At this event, participants will discuss the major openings and potential impediments to the development of a credible ‘just transition’ policy in Africa towards net zero goals, with a particular focus on establishing and enhancing links between green financing innovation, employment creation, sustainable power supply and generation, and sustainable energy usage and consumption in an urban environment.

This event is held in partnership with the Pan African Climate Justice Alliance (PACJA). It is part of a series on Towards Just Transition: Connecting Green Financing and Sustainable Job Creation in Africa, supported by the Chatham House Sustainability Accelerator.

This event will be held in English and French with simultaneous interpretation.

Towards just transition in Africa: Green financing for nature-based solutions and rural resilience 21 July 2022 — 9:30AM TO 1:00PM Anonymous (not verified) 30 June 2022 Libreville and online

This hybrid event in Libreville explores just transition policy and green financing for nature-based solutions, with a particular focus on the integration of job creation priorities in conservation and rural resilience.

Global climate policies towards a ‘just transition’ under the Paris Agreement should align with and support African states’ national sustainable development priorities – in particular, the need for decent and fair job creation, as well as resilient and sustainable land, environment, and ecosystem management policies.

Achieving green growth requires innovative and more accessible financing models, especially as wealthy nations’ financial pledges have fallen short. Ahead of the ‘African COP27’ set to take place in Egypt in November 2022, there is a need for transformational strategic thinking and context-specific action from African governments, civil society, businesses and financiers, in their green financing demands and national implementation plans.

Preservation of biodiversity and nature is not only critical in the global fight against climate change but is also vital for conservation-based economic development. Natural capital stocks, such as terrestrial and marine ecosystems and biodiversity, produce benefits that support societal and individual well-being and economic prosperity, such as clean air, fresh water, regulation of water flows and pollination of crops – while also acting as important carbon sinks. Financing environmental protection must go beyond compensation and contribute to creating fair social and economic conditions for incentivizing conservation.

At this hybrid event in Libreville, participants will discuss green financing for nature-based solutions, particularly the integration of plans for job creation in conservation and rural resilience within just transition planning.

This event is part of a series on Towards Just Transition: Connecting Green Financing and Sustainable Job Creation in Africa, supported by the Chatham House Sustainability Accelerator.

This event will be held in French and English with simultaneous interpretation.

This event will also be broadcast live on the Chatham House Africa Programme’s Facebook page.

Alice Santonastaso
Dec 1, 2020; 61:1687-1696
Research Articles

Lipoprotein (a) [Lp(a)] is characterized by an LDL-like composition in terms of lipids and apoB100, and by one copy of a unique glycoprotein, apo(a). The apo(a) structure is mainly based on the repetition of tandem kringle domains with high homology to plasminogen kringles 4 and 5. Among them, kringle IV type 2 (KIV-2) is present in a highly variable number of genetically encoded repeats, whose length is inversely related to Lp(a) plasma concentration and cardiovascular risk. Despite it being the major component of apo(a), the actual function of KIV-2 is still unclear. Here, we describe the first high-resolution crystallographic structure of this domain. It shows a general fold very similar to other KIV domains with high and intermediate affinity for the lysine analog, -aminocaproic acid. Interestingly, KIV-2 presents a lysine binding site (LBS) with a unique shape and charge distribution. KIV-2 affinity for predicted small molecule binders was found to be negligible in surface plasmon resonance experiments; and with the LBS being nonfunctional, we propose to rename it "pseudo-LBS". Further investigation of the protein by computational small-molecule docking allowed us to identify a possible heparin-binding site away from the LBS, which was confirmed by specific reverse charge mutations abolishing heparin binding. This study opens new possibilities to define the pathogenesis of Lp(a)-related diseases and to facilitate the design of specific therapeutic drugs.

Webinar: Finding Solutions to Insecurity in Cabo Delgado 16 June 2020 — 3:00PM TO 4:30PM Anonymous (not verified) 9 June 2020

SpaceX has reportedly struck a deal with LG Energy Solution Ltd. to supply cylindrical lithium-ion batteries for Elon Musk's Starship rocket, expected to launch early next year, according to industry sources.

HANOVER, Md., Nov. 5, 2024 — Ciena has announced that its optical and routing and switching innovations will once again support the SCinet network at SC24, taking place November 17–22 […]

The post Ciena Powers SC24’s SCinet with High-Speed Connectivity and Advanced Optical Solutions appeared first on HPCwire.

Data center infrastructure running AI and HPC workloads requires powerful microprocessor chips and the use of CPUs, GPUs, and acceleration chips to carry out compute intensive tasks. AI and HPC […]

The post QCT QoolRack: An Optimized Liquid Cooling Solution for HPC/AI Workloads appeared first on HPCwire.

Nov. 6, 2024 — CoolIT Systems, a world leader in liquid cooling systems for artificial intelligence (AI) and high-performance computing (HPC), will showcase its latest AI cooling products at the Supercomputing […]

The post CoolIT Systems Showcases AI and HPC Liquid Cooling Solutions at SC24 appeared first on HPCwire.

SANTA CLARA, Calif. and MUNICH, Nov. 7, 2024 — Cerabyte, a pioneer of ceramic-based data storage solutions, today announced its participation at SuperComputing 2024 (SC24), taking place at the Georgia […]

The post Cerabyte Discusses Use Cases for Its Ceramic Data Storage Solution at SC24 appeared first on HPCwire.

TROY, Mich., Oct. 17, 2024 — Altair, a global leader in computational intelligence, is proud to announce its collaboration with Motivo, a product engineering firm for clients in the mobility, […]

The post Altair’s HPC and Simulation Solutions Advance Motivo’s Aerospace Prototyping appeared first on HPCwire.

CALGARY, Alberta, Nov. 5, 2024 — Computer Modelling Group Ltd. (CMG) has announced it is collaborating with NVIDIA to further develop and optimize CMG subsurface simulation solutions for increased speed, […]

The post CMG Targets Faster Simulation Solutions with NVIDIA for Enhanced Reservoir Modeling appeared first on HPCwire.

MANCHESTER, England, Nov. 12, 2024 — PEAK:AIO today announced it has achieved 400% growth in U.S. sales over the past year. This expansion, driven by its high-performance, energy-efficient solutions, solidifies PEAK:AIO’s […]

The post PEAK:AIO Showcases Expansive Growth and Energy-Efficient Solutions Ahead of SC24 appeared first on HPCwire.

Studies of goal setting reveal why it’s so hard to keep resolutions—and how to make ones that actually stick

SAN ANTONIO, Nov. 1, 2024 — Rackspace Technology, a leading hybrid, multicloud, and AI technology services company, announced that it has signed a Strategic Collaboration Agreement (SCA) with Amazon Web […]

The post Rackspace and AWS Expand Partnership to Accelerate Generative AI and Cloud Solutions appeared first on HPCwire.

SpaceX has reportedly struck a deal with LG Energy Solution Ltd. to supply cylindrical lithium-ion batteries for Elon Musk's Starship rocket, expected to launch early next year, according to industry sources.

WALLISELLEN, Switzerland, Nov. 15, 2023 — Hewlett Packard Enterprise (HPE) today announced that Sauber Motorsport AG is partnering with HPE to advance aerodynamics of its Formula One race cars. The […]

The post HPE Unveils Advanced Computational Fluid Dynamics Solutions for Sauber Motorsport appeared first on HPCwire.

PITTSBURGH, Feb. 22, 2024 — Ansys and Intel Foundry have collaborated to provide multiphysics signoff solutions for Intel’s innovative 2.5D chip assembly technology, which uses EMIB technology to connect the […]

The post Ansys, Intel Foundry Collaborate on Multiphysics Analysis Solution for EMIB 2.5D Assembly Tech appeared first on HPCwire.

March 26, 2024 — Scientists at the Department of Energy’s Oak Ridge National Laboratory have determined how to avoid costly and potentially irreparable damage to large metallic parts fabricated through […]

The post ORNL Develops Solution to Residual Stress Challenges in 3D-Printed Metal Structures appeared first on HPCwire.

The Mississippi education department will be the first to operate a teacher residency program, which aims to increase retention and diversity in the profession.

Tessa E.S. Charlesworth
Sep 11, 2019; 39:7228-7243
Viewpoints

Further to the Director-General’s speech delivered to the 159^th Session of the FAO Council this morning, Monday 4 June and specifically with reference to the letter from [...]

Researchers say burying wood could be a viable method to prevent carbon from reaching the atmosphere

Building highways isn't the only solution to the growing problem of traffic congestion in and around the Halifax Regional Municipality, says the head of an organization that advocates for rail-based public transit.

Islanders are coming together to think up solutions to food insecurity and homelessness. About 80 Islanders attended a symposium at UPEI on Thursday night for a discussion focused on the intersection of food insecurity and homelessness.

A recent request to change the wording in a mandatory Indigenous intercultural course for lawyers in British Columbia led to a debate over whether the changes amounted to residential school denialism. 

Integrated Tools Make Mechatronics-Oriented Design and Seamless Deployment to Hardware Easy

20th Release of Leading CAD Software Provides More than 200 New Functions to Community

3DVision Helps Leading Ventilation Manufacturer Visualize Air Flow, Saving Time and Money

The Penn State Climate Consortium has awarded funding to four research projects that look to put promising climate solutions into action through interdisciplinary partnerships. 

Penn State Hazleton Associate Professor Joseph Ranalli developed a method to identify mislabeled equipment in solar plants by analyzing cloud motion, significantly reducing labor and costs for a large energy provider and enriching the educational experience for his engineering students by demonstrating real-world applications of data analysis. His collaboration with Principal Research Engineer Will Hobbs from Southern Co. has resulted in the publication of two articles and open-source software. 

Gigabyte M27QA ICE monitor has been launched in India. It joins the Taiwanese manufacturer’s extensive lineup of gaming monitors and boasts features such as a 27-inch panel with QHD resolution, a refresh rate of 180Hz, and AMD FreeSync technology for improved visuals. Gigabyte says its monitor carries support for OSD Sidekick software which enables users to tweak various display settings and allows for further customisation through the keyboard and mouse.

The Delaware Department of Justice secured Friday a Court of Chancery ruling dissolving four LLCs and two corporations owned by Paul J. Manafort, Jr. and Richard W. Gates, III after the Court approved an Order granting a default judgment. “This is another victory for the integrity of Delaware’s corporate brand,” said Attorney General Jennings. “Paul Manafort […]

The Delaware Department of Justice secured Friday a Court of Chancery ruling dissolving four LLCs and two corporations owned by Paul J. Manafort, Jr. and Richard W. Gates, III after the Court approved an Order granting a default judgment. “This is another victory for the integrity of Delaware’s corporate brand,” said Attorney General Jennings. “Paul Manafort and […]

Amber Solutions, an IoT product company that sells smart outlets, switches and circuit breakers closed Series A Preferred Stock round of financing that equals $3.3M in gross proceeds. Amber will use the funds to support the commercial development of Amber's core technologies.

One of Amber’s product is solid-state circuit interrupter (GFCI) that basically stops harmful levels of electricity from passing through a person. It operates as a safety device alerting the homeowner of electrocution incidents in real time.

Amber Solutions’ core markets are builders that prepare smart home/smart building ready infrastructure, certified electrical contractors or remodelers, and electrical manufacturers.

Other latest funding news include Owlet’s $24M Series B, Axonize’s $6M Series A round and addition of Deutsche Telekom as its strategic investor, and $30M Series B raised by Palo Alto-based Armis.

PCI-SIG DevCon 2024 – 32^nd Anniversary

For more than a decade, Cadence has been well-known in the industry for its strong commitment and support for PCIe technology. We recognize the importance of ensuring a robust PCIe ecosystem and appreciate the leadership PCI-SIG provides. To honor the 32^nd anniversary of the PCI-SIG Developer’s Conference, Cadence is announcing a complete PCIe 7.0 IP solution for HPC/AI markets.

Why Are Standards Like PCIe So Important?

From the simplest building blocks like GPIOs to the most advanced high-speed interfaces, IP subsystems are the lifeblood of the chipmaking ecosystem. A key enabler for IP has been the collaboration between industry and academia in the creation of standards and protocols for interfaces. PCI-SIG drives some of the key definitions and compliance specifications and ensures the interoperability of interface IP.

HPC/AI markets continue to demand high throughput, low latency, and power efficiency. This is fueling technology advancements, ensuring the sustainability of PCIe technology for generations to come. As a close PCI-SIG member, we gain valuable early insights into the evolving specs and the latest compliance standards. PCIe 7.0 specifications and beyond will enable the market to scale, and we look forward to helping our customers build best-in-class cutting-edge SoCs using Cadence IP solutions.

Figure 1. Evolution of PCIe Data Rates (source PCI-SIG)

What’s New This Year at DevCon?

At DevCon ’24, the PCIe 7.0 standard will take center stage, and Cadence is showing off a full suite of IP subsystem solutions for PCIe 7.0 this year.

What Sets Cadence Apart?

At Cadence, we believe in building a full subsystem for our testchips with eight lanes of PHY along with a full 8-lane controller. Adding a controller to our testchip significantly increases the efficiency and granularity in characterization and stress testing and enables us to demonstrate interoperability with real-world systems. We are also able to test the entire protocol stack as an 8-lane solution that encompasses many of the applications our customers use in practice. This approach significantly reduces the risks in our customers’ SoC designs.

Figure 2: Piper - Cadence PHY IP for PCIe 7.0

Figure 3: Industry’s first IP subsystem for PCIe 7.0

Which Market Is This For?

At a time when accelerated computing has gone mainstream, PCIe links are going to take on a role of higher importance in systems. Direct GPU-to-GPU communication is crucial for scaling out complex computational tasks across multiple graphics processing units (GPUs) or accelerators within servers or computing pods. There is a growing recognition within the industry of a need for scalable, open architecture in high-performance computing. As AI and data-intensive applications evolve, the demand for such technologies will likely increase, positioning PCIe 7.0 as a critical component in the next generation of interface IP.

Here's a recent article describing a potential use case for PCIe 7.0.

Figure 4: Example use case for PCIe 7.0

Why Are Optical Links Important?

It takes multiple buildings of data centers to train AI/ML models today. These buildings are increasingly being distributed across geographies, requiring optical fiber networks that are great at handling the increased bandwidth over long distances. However, these optical modules soon hit a power wall where all the budgeted power is used to drive the signal from point A to point B, and there is not enough power left to run the actual CPUs and GPUs. Such scenarios create a need for non-retimed, linear topologies. Linear Pluggable Optics (LPO) links can significantly reduce module power consumption and latency when compared to traditional Digital Signal Processing (DSP) based retimed optical solutions, which is critical for accelerating AI performance. Swapping from DSP-based solutions to LPO results in significant cost savings that help drive down expenditure due to lower power and cooling requirements, but this requires a robust high-performance ASIC to drive the optics rather than retimers/DSP.

To showcase the robustness of Cadence IP, we have demonstrated that our subsystem testchip board for PCIe 7.0 can successfully transmit and receive 128GT/s signals through a non-retimed opto-electrical link configured in an external loopback mode with multiple orders of margin to spare.

Figure 5: Example of ASIC driving linear optics

Compliance Is Key

For PCIe 6.0, the official compliance program has not started yet; this is typical for the SIG where the official compliance follows a few years after the spec is ratified to give enough time for the ecosystem to have initial products ready, and for test and equipment vendors to get their hardware/software up and running. At this time, PCIe Gen6 implementations can only be officially certified up to PCIe 5.0 level (the highest official compliance test suite that the SIG supports). We have taken our PCIe 6.0 IP subsystem solution to the SIG for multiple process nodes, and they are all listed as compliant. You can run this query on the pcisig.com website under the Developers->Integrators list by making the following selections:

Due to space limitations, not all combinations could be tested at the May workshop (e.g., N3 root port) – this will be tested in the next workshop.

Also, the SIG just held an “FYI” compliance event this week to bring together the ecosystem for confidential testing (no results were reported, and data cannot be shared outside without violating the PCI-SIG NDA). We participated in the event with multiple systems and can report that our systems have done quite well. The test ecosystem is not mature yet, and a few more FYI workshops will be conducted before the official compliance for 6.0 is launched. We have collaborated with all the key test vendors for electrical and protocol testing throughout the year. As early as the middle of last year, we were able to provide test cards to all these vendors to demo PCIe 6.0 capabilities in their booths at various events. Many of them recorded these videos, and they can be found online.

• Cadence Subsystem IP for PCIe 6.0: Protocol and Electrical Testing
• Cadence Subsystem IP for CXL Protocol Test Demo
• Cadence Subsystem IP for CXL2.0/3.0 Protocol Test Demo
• Cadence Subsystem IP for PCIe 6.0: Protocol Stack Demo

More at the PCI-SIG Developers Conference

Check us out at the PCI-SIG Developer’s conference on June 12 and 13 to see the following demonstrations:

• Robust performance of Cadence IP for PCIe 7.0 transmitting and receiving 128GT/s signals over non-retimed optics
• Capabilities of Cadence IP for PCIe 7.0 measured using oscilloscope instrumentation detailing its stable electrical performance and margin
• The reliability of Cadence IP for PCIe 6.0 interface using Test Equipment to characterize the PHY receiver quality
• A PCI-SIG-compliant Cadence IP subsystem for PCIe 6.0 optimized for both power and performance

As a leader in PCI Express, Anish Mathew of Cadence will share his valuable insights on an important topic: “Impact of UIO ECN on PCIe Controller Design and Performance,” highlighting the strides made by the Cadence design team in achieving this implementation.

Figure 6: Cadence UIO Implementation Summary

Summary

Cadence showcased PCIe 7.0-ready IP at PCI-SIG Developers Conference 2023 and continues to lead in PCIe IP development, offering complete solutions in advanced nodes for PCIe 7.0 that will be generally available early next year. With a full suite of solutions encompassing PHYs, Controllers, Software, and Verification IP, Cadence is proud to be a member of the PCI-SIG community and is heavily invested in PCIe. Cadence was the first IP provider to bring complete subsystem solutions for PCIe 3.0, 4.0, 5.0, and 6.0 with industry-leading PPA and we are proud to continue this trend with our latest IP subsystem solution for PCIe 7.0, which sets new benchmarks for power, performance, area, and time to market.

The generative AI market is experiencing rapid growth, driven by the increasing parameter size of Large Language Models (LLMs). This growth is pushing the boundaries of performance requirements for training hardware within data centers. For an in-depth look at this, consider the insights provided in "HBM3E: All About Bandwidth". Once trained, these models are deployed across a diverse range of applications. They are transforming sectors such as finance, meteorology, image and voice recognition, healthcare, augmented reality, high-speed trading, and industrial, to name just a few.

The critical process that utilizes these trained models is called AI inference. Inference is the capability of processing real-time data through a trained model to swiftly and effectively generate predictions that yield actionable outcomes. While the AI market has primarily focused on the requirements of training infrastructure, there is an anticipated shift towards prioritizing inference as these models are deployed.

The computational power and memory bandwidth required for inference are significantly lower than those needed for training. Inference engines typically need between 300-700GB/s of memory bandwidth, compared to 1-3TB/s for training. Additionally, the cost of inference needs to be lower, as these systems will be widely deployed not only in data centers but also at the network's edge (e.g., 5G) and in end-user equipment like security cameras, cell phones, and automobiles.

When designing an AI inference engine, there are several memory options to consider, including DDR, LPDDR, GDDR, and HBM. The choice depends on the specific application, bandwidth, and cost requirements. DDR and LPDDR offer good memory density, HBM provides the highest bandwidth but requires 2.5D packaging, and GDDR offers high bandwidth using standard packaging and PCB technology.

The GDDR7 standard, announced by JEDEC in March of this year, features a data rate of up to 192GB/s per device, a chip density of 32Gb, and the latest data integrity features. The high data rate is achieved by using PAM3 (Pulse Amplitude Modulation) with 3 levels (+1, 0, -1) to transmit 3 bits over 2 cycles, whereas the current GDDR6 generation uses NRZ (non-return-to-zero) to transmit 2 bits over 2 cycles.

GDDR7 offers many advantages for AI Inference having the best balance of bandwidth and cost. For example, an AI Inference system requiring 500GB/s memory bandwidth will need only 4 GDDR7 DRAM running at 32Gbp/s (32 data bits x 32Gbp/s per pin = 1024Gb/s per DRAM). The same system would use 13 LPDDR5X PHYs running at 9.6Gbp/s, which is currently the highest data rate available (32 data bits x 9.6Gb/s = 307Gb/s per DRAM).

Cadence stands at the forefront of AI inference hardware support, being the first IP company to roll out GDDR7 PHYs capable of impressive speeds up to 36Gb/s across various process nodes. This milestone builds on Cadence's established leadership in GDDR6 PHY IP, which has been available since 2019. The company caters to a diverse client base spanning AI inference, graphics, automotive, and networking equipment.

While GDDR7 continues to utilize standard PCB board technology, the increased signal speeds seen in GDDR6 (20Gbp/s) and now GDDR7 (36Gb/s) calls for careful attention with the physical design to ensure optimized system performance. In addition to providing the PHY, Cadence also offers comprehensive PCB and package reference design, which are essential in helping customers achieve optimal signal and power integrity (SI/PI) for their systems.

Cadence is dedicated to ensuring customer success beyond just providing hardware. They provide expert support in SI/PI, collaborating closely with customers throughout the design process. This approach ensures that customers can benefit from Cadence's expertise in navigating the complexities of high-speed design and achieving optimal performance in their AI inference systems.

As the AI market continues to advance, Cadence remains at the forefront by offering a comprehensive memory IP portfolio tailored for every segment of this dynamic market. From DDR5 and HBM3E, which cater to the intensive demands of training in servers and high-performance computing (HPC), to LPDDR5X designed for low-end inference at the network edge and in consumer devices, Cadence's offerings cover a wide range of applications.

Looking to the future, Cadence is dedicated to innovating at the forefront of memory system performance, ensuring that the evolving needs of AI training and inference are met with the highest standards of excellence. Whether it's pushing the boundaries with GDDR7 or exploring new technologies, Cadence is dedicated to driving the AI revolution forward, one breakthrough at a time.

Learn more about Cadence GDDR7 PHY

Learn more about Cadence Simulation VIP for GDDR7.

The demand for higher compute performance, energy efficiency, and faster time-to-market drove the conversations at this year's Open Compute Project (OCP) Global Summit in San Jose, California. It was the scene of showcasing groundbreaking innovations, expert-led sessions, and networking opportunities to drive the future of data center technology. For those who didn't get to attend or stop by our booth, here's a recap of Cadence's comprehensive solutions that enable next-generation compute technology, AI data center design, analysis, and optimization. Optimized Data Center Design and Operations As the data center community increasingly faces demands for enhanced efficiency, thermal management, sustainability, and performance optimization, data center operators, IT managers, and executives are looking for solutions to these challenges. At the Cadence booth, attendees explored the Cadence Reality Digital Twin Platform and Celsius EC Solver. These technologies are pivotal in achieving high-performance standards for AI data centers, providing advanced digital twin modeling capabilities that redefine next-generation data center design and operation. The Celsius EC Solver demonstration showed how it solves challenging thermal and electronics cooling management problems with precision and speed. CadenceCONNECT: Take the Heat Out of Your AI Data Center Cadence hosted a networking reception on October 16 titled "Take the Heat Out of Your AI Data Center." In today's AI era, managing the heat generated by high-density computing environments is more critical than ever. This reception offered insights into current and emerging data center technologies, digital twin cooling strategies that deliver energy-saving operations, and a chance to engage with industry leaders, Cadence experts, and peers to explore the latest cooling, AI, and GPU acceleration advancements. Here's a recap: Researcher, author, and entrepreneur Dr. Jon Koomey highlighted the inefficiency of data centers in his talk "The Rise of Zombie Data Centers," noting that 20-30% of their capacity is stranded and unused. He advocated for organizational changes and technological solutions like digital twins to reduce wasted energy and improve computational effectiveness as AI deployments increase. In "A New Millennium in Multiphysics System Analysis," Cadence Corporate VP Ben Gu explained the company's significant strides in multiphysics system analysis, evolving from chip simulation to a broader application of computational software for simulating various physical systems, including entire data centers. He noted that the latest Cadence venture, a digital twin platform for data center optimization, opened the opportunity to use simulation technology to optimize the efficiency of data centers. Senior Software Engineering Group Director Albert Zeng highlighted the Cadence Reality DC suite's ability to transform data center operations through simulation, emphasizing its multi-phase engine for optimal thermal performance and the integration of AI capabilities for enhanced design and management. A panel discussion titled "Turning AI Factory Blueprints into Reality at the Speed of Light" featured industry experts from NVIDIA, Norman Wright Precision Environmental and Power, NV5, Switch Data Centers, and Cadence, who explored the evolving requirements and multidimensional challenges of AI factories, emphasizing the need for collaboration across the supply chain to achieve high-performing and sustainable data centers. Watch the highlights. Transforming Designs from Chips to Data Centers The OCP Global Summit 2024 has reaffirmed its status as a pivotal event for data center professionals seeking to stay at the forefront of technological advancements. Cadence's contributions, from groundbreaking digital twin technologies to innovative cooling strategies, have shed light on the path forward for efficient, sustainable data centers. For data center professionals, IT managers, and engineers, the insights gained at this summit are invaluable in navigating the challenges and opportunities presented by the burgeoning AI era. Partnering with Arm Arm Total Design Cadence is a member of the Arm Total Design program. At an invitation-only special Arm event, Cadence's VP of Research and Development, Lokesh Korlipara, delivered a presentation focusing on data center challenges and design solutions with Arm Neoverse Compute Subsystem (CSS). The session highlighted: Efficient integration of Arm Neoverse CSS into system on chips (SoCs) with pre-integrated connectivity IP Performance analysis and verification of the Neoverse CSS integration into the SoC through Cadence's System VIP verification suite and automated testbench creation, enhancing both quality and productivity Jumpstarting designs through Cadence's collaboration with Arm for 3D-IC system planning, chiplets, and interposers Design Services readiness and global scale to support and/or deliver the most demanding Arm Neoverse CSS-based SoC design projects Cadence Supports Arm CSS in Arm Booth During the event, Cadence conducted a demo in the Arm booth that showcased the Cadence System VIP verification suite. The demo highlighted automated testbench creation and performance analysis for integrating the Arm CSS into SoCs while enhancing verification quality and productivity. Summary Cadence offers data center solutions for designing everything from the compute and networking chips to the board, racks, data centers, and campuses. Stay connected with Cadence and other industry leaders to continue exploring the innovations set to redefine the future of data centers. Learn More Cadence Joins Arm Total Design Cadence Arm-Based Solutions Cadence Reality Digital Twin Platform

I have been involved in the Virtuoso RF Solution for the last four years. Most of the customers I work with have a SiP package already in progress. They often ask "How do I get my SiP design into Virtuoso RF Solution?" I am excited about new functionality in the latest ICADVM20.1 ISR25 release. It is a new GUI under the Tools menu called Enablement. (read more)