The object of the invention is to provide a method for fabricating a semiconductor device having a peeled layer bonded to a base material with curvature. Particularly, the object is to provide a method for fabricating a display with curvature, more specifically, a light emitting device having an OLED bonded to a base material with curvature. An external force is applied to a support originally having curvature and elasticity, and the support is bonded to a peeled layer formed over a substrate. Then, when the substrate is peeled, the support returns into the original shape by the restoring force, and the peeled layer as well is curved along the shape of the support. Finally, a transfer object originally having curvature is bonded to the peeled layer, and then a device with a desired curvature is completed.

The present application discloses apparatus and methods for increasing channel utilization for a high-speed serial interface of an integrated circuit (IC). A new circuit architecture is disclosed which provides circuitry that may be programmed flexibly to support a multitude of different channel bonding schemes. In accordance with one aspect of the invention, the new architecture decouples the granularity of control-signal channel bonding from the granularity of data-aggregation channel bonding. This advantageously allows optimization of configurations for both types of channel bonding. In another aspect of the invention, the logical boundaries of bonded user channels are decoupled from the physical boundaries of the PCS modules. This decoupling advantageously eliminates a rigid constraint of previous architectures.

A rosin composition includes a gum rosin, an emulsifier, a randomizing additive and a bonding agent. This rosin composition may be used as a temporary or permanent adhesive for the soldering of components. The rosin composition may be temporary as it is easily removed from a surface without damaging the surface.

The present invention relates to an assembly structure of a diaphragm for a microspeaker. The present invention discloses a bonding structure of a diaphragm for a microspeaker, the boding structure comprising: a suspension including a central portion, an outer peripheral portion, and a connecting portion connecting the central portion and the outer peripheral portion; and a side diaphragm including an inner peripheral portion and an outer peripheral portion, which are attached to the central portion and outer peripheral portion of the suspension, respectively, and a dome portion, which projects between the inner peripheral portion and the outer peripheral portion, wherein the suspension and the side diaphragm are attached by thermal compression.

A device and a method for cutting through the adhesive bead of panes that have been fixed by bonding is specified, said device having a base body on which at least one suction plate for fixing on a pane to be separated out as well as one motor-drivable coil for winding-on a separating wire are accommodated, wherein at least two guide rollers are held on the base body by means of extension arms at a distance which is adjustable in respect to each other. The device is preferably positioned approximately diagonally on the pane in such a manner that the guide rollers are situated on the outer ends of the extension arms in the vicinity of the corner regions of the pane.

The present invention provides a method for bonding two substrates using a UV radiation curing-redox curing adhesive system having a shadow area and a transparent area, comprising: bonding the shadow area of the substrates using a redox curing adhesive system, and bonding the transparent area of the substrates using a liquid optically clear adhesive containing UV initiators.

The invention relates to the use of a hot-melt adhesive having high hardness for adhesive bonding of metal films or foils, paper films or foils, and/or plastic films or foils. The invention further relates to a method for adhesively bonding a metal film or foil, paper film or foil, and/or plastic film or foil onto a substrate.

A multi-layer bonding method of the present invention includes: forming a first bonded substrate by bonding a first substrate and an intermediate substrate in a bonding chamber; conveying a second substrate inside said bonding chamber when said first bonded substrate is arranged inside said bonding chamber; and forming a second bonded substrate by bonding said first bonded substrate and said second substrate in said bonding chamber. According to such a multi-layer bonding method, the upper-side substrate can be bonded with an intermediate substrate and then a first bonded substrate is bonded with a lower-side substrate without taking out the first bonded substrate from the bonding chamber. For this reason, a second bonded substrate can be produced at high speed and at a low cost.

An adhesive may bond a plastic bonded explosive to a metal surface. The adhesive may include a mixture of hydroxyl-terminated polybutadiene (HTPB) and isophorone di-isocyanate (IPDI) in a weight ratio in the range of about 5 to 1 to about 10 to 1. The adhesive may include a solvent and/or a catalyst.

To enable firm bonding to a member including a polyaryl ether ketone resin. A bonding method including: a bonding material applying step for applying, to the surface of a member including a polyaryl ether ketone resin, a bonding material including (A) a polymerizable monomer and (B) at least a portion of components for configuring a polymerization initiator, the content ratio of polymerizable monomers at least having two or more polymerizable functional groups in a (p2) molecule among all polymerizable monomers being 50% by mass or greater, and the content ratio of polymerizable monomers at least having one or more polymerizable functional groups and one or more functional groups capable of hydrogen bonding in a (p1h1) molecule being 5% by mass or greater; and a curing step for curing the bonding material. A bonding material and bonding kit using the bonding method.

A post for a dental crown is disclosed having improved structural features—including increased post strength and reduced likelihood of root fracture. In one embodiment, the post includes a quadrangle (4-way) split shank for increased compliance and root stress reduction while providing very high mechanical grip strength and pull-out resistance. In another embodiment, a shortened threaded section and a thread-free shank tip minimize the possibility of root fracture while still providing high grip strength and pull-out resistance. Embodiments also include a radiused transition from a primary thread to a secondary thread portion of the shank for stress reduction; and axial grooves, cross-axis through holes and other shape features of the post head for increased crown retention strength.

The present invention provides a modified cellulosic fiber having reduced hydrogen bonding capabilities. The modified fiber formed in accordance with the present invention may be useful in the production of tissue products having improved bulk and softness. More importantly, the modified fiber is adaptable to current tissue making processes and may be incorporated into a tissue product to improve bulk and softness without an unsatisfactory reduction in tensile.

A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element; (b) ultrasonically forming tack bonds between ones of the first conductive structures and respective ones of the second conductive structures; and (c) forming completed bonds between the first conductive structures and the second conductive structures.

A package includes a conductive pad, with a plurality of openings penetrating through the conductive pad. A dielectric layer encircles the conductive pad. The dielectric layer has portions filling the plurality of openings. An Under-Bump Metallurgy (UBM) includes a via portion extending into the dielectric layer to contact the conductive pad. A solder region is overlying and contacting the UBM. An integrated passive device is bonded to the UBM through the solder region.

The adhesive system of the invention is especially useful in bonding replacement windows into vehicles. They allow for sufficient working time while still realizing a fast drive away time. The adhesive system is comprised of a moisture curable adhesive and a cure accelerator that may be applied using a simple single caulk gun and may be applied at ambient temperatures such as −10° C. and about 45° C. The cure accelerator is comprised of a polyol having a backbone that has at least one amine in the backbone. The moisture curable adhesive typically is comprised of an isocyanate terminated prepolymer.

Provided are a substrate chuck and a substrate bonding system including the substrate chuck. The substrate bonding system includes a lower substrate chuck and an upper substrate chuck disposed on the lower substrate chuck. The lower substrate chuck has a non-flat lower substrate contact surface, and the upper substrate chuck has a flat upper substrate contact surface.

A machine (1) and a method for thermobonding using an emission of electromagnetic waves (13), for example microwaves, to activate one or a plurality of adhesive layers located between a support and one or a plurality of layers of flexible covering, through a bed of particles (4) fluidized by a humidified gas. A multi-layer upholstery item including at least one non-permeable layer and produced in a single operation is also described.

Cleaning up after class turns into a moment of sharing between an OM worker and two North African women.

Title: Pregnancy Ultrasound a Big Bonding Moment for Dads-to-Be
Category: Health News
Created: 4/30/2014 5:36:00 PM
Last Editorial Review: 5/1/2014 12:00:00 AM

The Barca goalie shares his routine from quarantine in Spain.

Plus, more celebrity fathers and daughters!

same-night delivery, nice

Sunday's episode of My Kitchen Rules saw an unlikely alliance form between Americans Josh and Piper, when they discovered a mutual love for pork ribs, which they were due to be served.

Tristan Thompson has been in quarantine with ex Khloe Kardashian and their one-year-old daughter True in hopes of deterring the spread of COVID-19.

It seems more like an adult playground. But kids can have fun in Las Vegas, too and the actor, 39, proved that as he took his little girl to a games arcade at one of the casinos on Friday evening.

Blac Chyna and her son King Cairo filmed a workout video together on Saturday in which they lifted and did pushups with kettle bells.

The Indian men's and women's hockey teams are locked inside the SAI centre in Bengaluru due to the coronavirus pandemic.

Barker Library - TA403.T746 2018

Check out WIRED's music issue featuring Ahmir 'Questlove' Thompson at: http://www.wired.com/listen Music: "Big Headed" Performed by Kooley High Written DJ Prince, Charlie Smarts, Tab-One

Rahman, Mohammad Mahbubur, author

This week we hear stories on involving more AIs in negotiations, tiny algae that might be responsible for killing some (not all) dinosaurs, and a chemical intended to make farm fish grow faster that may be also be causing one area’s crocodile population to skew male—with Online News Editor David Grimm.   Sarah Crespi talks to Rich Stone about being on the scene for a joint U.S.-China mission to remove bomb-grade fuel from a nuclear reactor in Ghana.   Listen to previous podcasts.    [Image:Chad Sparkes; Music: Jeffrey Cook]