Arrays of resonator sensors include an active wafer array comprising a plurality of active wafers, a first end cap array coupled to a first side of the active wafer array, and a second end cap array coupled to a second side of the active wafer array. Thickness shear mode resonator sensors may include an active wafer coupled to a first end cap and a second end cap. Methods of forming a plurality of resonator sensors include forming a plurality of active wafer locations and separating the active wafer locations to form a plurality of discrete resonator sensors. Thickness shear mode resonator sensors may be produced by such methods.

A circuit includes first and second transconductance stages that generate first and second currents, respectively, in response to an input signal. A current combiner circuit selectively couples the first current to a first output, selectively couples the second current to the first output, selectively couples the first current to a second output, and selectively couples the second current to the second output. In response to the first current being coupled to both the first and second outputs, the current combiner circuit couples the second current to both the first and second outputs. In response to the first current being decoupled from the second output, the current combiner circuit decouples the second current from both the first and second outputs. In response to the first current being decoupled from the first output, the current combiner circuit decouples the second current from both the first and second outputs.

In a method for operating a fluid valve for controlling or regulating a fluid, having at least one movable valve component is displaceable with the aid of at least one electrical actuating signal which contains at least one first actuating signal portion which causes an oscillating valve motion of the valve component. Pressure oscillations generated in the fluid due to the oscillating valve motion are detected, and are used for regulation of the oscillating valve motion caused by the first actuating signal portion.

Power-efficient actuator apparatus and methods. In one exemplary embodiment, the actuator assembly utilizes a shape memory alloy (SMA) filament driven by an electronic power source to induce movement in the underlying assembly to actuate a load (e.g., water valve). In addition, a circuit board is included which allows the actuator assembly to be readily incorporated or retrofit into a wide range of systems such that the signal characteristics of the supply line can, among other applications, be conditioned in order to protect the SMA filament. Furthermore, the circuit board can also readily be adapted for use with “green” power sources such as photovoltaic systems and the like. Methods for manufacturing and utilizing the aforementioned actuator assembly are also disclosed.

An apparatus includes a light foil device configured to move based on radiation pressure associated with light received by the light foil device. The apparatus includes a mechanism configured to transition between operational states in response to the movement of the light foil device, or includes a valve configured to control a flow of material through a conduit based, at least in part, on the movement of the light foil device.

The present invention involves, in some embodiments, systems and methods involving fluid handling apparatus for pumping fluid to and from a patient, which may include a reusable component and a disposable pumping cartridge. The reusable component may comprise a control chamber and a pressure transducer configured to measure a gas pressure associated with the control chamber, as well as a processor. The processor may be configured to supply the control chamber with a gas at a predetermined pressure, monitor the gas pressure associated within the control chamber with the pressure transducer over a predetermined period of time, and determine if the change in gas pressure associated within the control chamber exceeds a maximum allowable predetermined limit.

A method for operating a collection system for printed products includes drawing off the printed products from discharge device(s) disposed at corresponding discharge point(s) in the collection system. The printed products are deposited on a collection section during a cycle period of the discharge device(s) so as to form a bundle of printed products. The bundle is transferred to a subsequent conveying mechanism having receiving pockets. It is determined whether at least one missing printed product exists due to an incorrect drawing off from the discharge point(s). A repair process is initiated and controlled in which the at least one missing printed product is drawn off from the corresponding discharge point(s) at a time corresponding to a subsequent recurrent pocket-related cycle of the subsequent conveying mechanism in a subsequent cycle period of the discharge device(s). The at least one missing printed product is inserted in the relevant receiving pocket.

According to one embodiment, a sheet finishing apparatus includes a finishing section configured to apply finishing to a sheet placed on a processing tray, a sheet discharging section configured to discharge the sheet subjected to the finishing to a stack tray via a discharge port, a roller attached to a shaft provided in parallel to the discharge port and which rotate in a first direction for guiding the sheet in the direction of the finishing section and a second direction for discharging the sheet, and an arm attached to the shaft to extend in the centrifuging direction from the shaft, rotate with the torque of the shaft, and idly rotate when force for regulating the torque acts. The arm flaps down the trailing end of the sheet on the stack tray onto the stack tray.

A method and device for the production of books, including: moving book blocks successively along a conveying section of a book production line; supplying a stack of book cases to the book production line; identifying a marking on each of the book blocks and the book cases; transmitting an identified marking on at least one book case to a machine control of the book production line; assigning a dataset stored in the machine control for a sequence of book cases to the supplied stack; determining a sequence in the machine control for book blocks positioned on the conveying section; comparing the dataset for the sequence of the book cases to the sequence of the book blocks; and removing and/or supplying at least one book block from or to the conveying section if the sequence of the book blocks deviates from the sequence of the book cases using the machine control.

A method for producing a bundle composed of book blocks includes gathering a plurality of printed sheets to form respective book blocks. The plurality of the book blocks are positioned with the same orientation and respectively positioned on lower edges of the printed sheets. Respectively two adjacent book blocks are offset from one another parallel to the lower edges of the printed sheets and transverse to a height of the bundle to be formed, such that a side edge of one of the two book block projects relative to a side edge of the adjacent book block. Thereafter the offset book blocks are combined to form the bundle and the bundle is compressed to fix the offset position of the book blocks.

A method for operating a processing system, in which product units of different formats are processed. The processing system contains a plurality of processing devices that are arranged one after the other in a processing line. In the event of a format changeover, certain component arrangements arranged in the processing system must be adapted to the new product format. In the event of an upcoming format change, a gap in the conveyed goods is generated while the conveying operation is maintained, wherein the gap in the conveyed goods runs through the processing system along the processing devices. As soon as the gap in the conveyed goods runs through a component arrangement to be adapted to the new format, the format is changed over at the component arrangement while the gap in the conveyed goods runs through the component arrangement.

A sheet processing apparatus which is capable of completing a bound document containing appropriately Z-folded sheets when performing folding together with edge cutting and binding. The sheet processing apparatus controls a Z-folding process, a cutting process, and a binding process for a sheet. A first folding position from a free end of the sheet coincides with a position corresponding to half a width of the sheet excluding a cut width of the sheet a binding margin, when the Z-folding process, the cutting process, and the binding process are executed.

Imaging apparatus and methods for bindery systems. An example apparatus disclosed herein includes a platform having a plurality of openings to provide suction through a surface of the platform and a first track that moves across the surface of the platform. The first track has a plurality of apertures to fluidly couple the suction to an upper surface of the first track.

A method of producing a print product comprises: performing digital printing of each surface of the print product, sequentially and repeatedly, on a continuous paper; forming a section by cutting the printing-completed continuous paper into a paper sheet and folding the paper sheet in two; forming a section block by at least one of sections; and folding the section block in two.

In a first step, in a printed material web (1) moved in a feed direction, a first material web part (5) which is formed by a material web section (1a)is folded against the rest of the material web (6) that is formed from two material web portions (1b, 1c)).In the region of a connecting line (2b) extending between neighbouring material web sections (1b, 1c) the two material web parts (5,6) are connected to one another by a means of a bonding adhesive. In a subsequent step the material web (1) is folded again along a line (2b) extending between two neighbouring material web sections. (1b, 1c)All material web sections (1a, 1b, 1c) lie above one another. Subsequently, multi-page sub-products (11), the pages (12a, 12b, 12c) of which are connected to one another in the region of the spine (13) of the sub-product, are separated from the twice-folded material web (1). Finally, the sub-products (11) are placed on top of one another to form a stack (16) and are connected to one another in the region of the spine (13) thereof by means of a bonding adhesive.

A method for operating a thread stitching machine for processing printed sheets to form book blocks includes providing at least one sewing station with an active connection to at least one stitching saddle and providing the at least one stitching saddle with an active connection to at least one transporting system. The printed sheets are supplied to the at least one stitching saddle, using the at least one transporting system, in at least one of a substantially vertical and a substantially horizontal plane relative to the at least one stitching saddle. At least the printed sheets in the substantially vertical plane are supplied directly onto the at least one stitching saddle or to a region of the at least one stitching saddle. The printed sheets are supplied to the at least one sewing station resting astride the at least one stitching saddle.

This invention provides a technique of preventing a collision between an original document and a printing material on a conveyance path when an image forming apparatus executes both additional printing on the original document and printing on the printing material. In a case where both additional printing on an original document and printing on a printing material are executed, the image forming apparatus according to one aspect of the invention conveys a read original document to a transfer unit through a conveyance path commonly used for an original document and sheet, and prints an image to be added on the original document. After the original document is conveyed to the transfer unit through the conveyance path, the image forming apparatus feeds a sheet from a sheet feeding unit to the conveyance path, and performs copying on the sheet in the transfer unit.

A printing control apparatus according to one aspect of this invention controls to print images on sheets based on image data of a plurality of pages, generate a bookbinding product by executing folding processing for the image-printed sheets, and output the bookbinding product. The printing control apparatus further accepts the position of an insertion sheet to be inserted into the sheets for which the folding processing is executed, and controls to output a plurality of bookbinding products by using, as a reference, the accepted position of the insertion sheet.

A creasing device forms a crease in a to-be-folded portion of a sheet. The creasing device includes a sheet-information reading unit that reads any one of sheet information and binding information; a determining unit that determines a surface, on which the crease is to be formed, of the sheet according to the one of the sheet information and the binding information read by the sheet-information reading unit; and a creasing unit that forms the crease on the surface determined by the determining unit.

According to one embodiment, a sheet post-processing apparatus includes a machine body, a first roller pair, a tray, a second roller pair, a driving unit, an inlet sensor, a receiving unit and a control unit. The inlet sensor is configured to detect presence or absence of the sheet in the first roller pair driven by the driving unit. The receiving unit is configured to receive, from an image forming apparatus, sheet length information in the sheet conveying direction of the sheet as a target to which the print job is applied. The control unit is configured to control the driving unit to rotate, if the sheet length information indicates special length and the inlet sensor detects a trailing end of the sheet, at least rollers of the second roller pair a predetermined number of times and stop the rollers, the second roller pair nipping the sheet.

The present invention is directed to providing a mechanism for allowing a user to easily take out print products discharged onto a plurality of sheet discharge trays in the discharge order. A control method for controlling a sheet processing apparatus for performing control to discharge sheets onto a plurality of sheet discharge trays includes storing, in a storage unit, the discharge order in which sheets have been discharged onto equal to or more than two sheet discharge trays by executing a job, and performing, upon reception of a take-out instruction for taking out in the discharge order the sheets discharged by executing the job, processing for allowing a user to take out the sheets discharged onto the equal to or more than two sheet discharge trays, in the discharge order stored in the storage unit.

An image recording apparatus includes: a recording unit for recording an image on a recording medium; a tray for supporting the recording medium recorded by the recording unit; a conveyor mechanism for conveying the recorded medium to the tray; and an alignment mechanism for aligning a plurality of recording media stacked on the tray, by application of an external force. In a period from a start to an end of recording based on one recording job, the alignment mechanism aligns the plurality of recording media stacked on the tray in a period in which image recording is not performed, and the alignment mechanism does not align the plurality of recording media stacked on the tray in a period in which image recording is being performed.

A sheet processing apparatus includes a pair of squeezing members having a projection and a recess to engage each other, to squeeze a sheet bundle inserted therebetween in a direction of thickness of the sheet bundle, and a pressure applying unit to apply pressing force to the squeezing members to squeeze and bind the sheet bundle. The pressing force generated between the squeezing members by the pressure applying unit increases in strength as a relative distance between the squeezing members decreases.

An image forming system includes the following elements. An image forming apparatus forms images on plural sheets sequentially transported with a spacing therebetween. A sheet transport apparatus includes a transport section which receives and transports the plural sheets farther downstream. The sheet transport apparatus supplies a different type of sheet from a different-type-of-sheet supply device, inserts it into the spacing, and transports the sheets. The sheet transport apparatus includes the following elements. A transport information obtaining unit obtains information concerning transporting of sheets. A different-type-of-sheet stop unit supplies the different type of sheet, on the basis of the information concerning transporting of sheets, and stops the different type of sheet at a position before the transport section. A different-type-of-sheet supply information output unit outputs information concerning the supply of the different type of sheet, the information being obtained regarding a standby state of the different type of sheet.

A sheet processing apparatus and a method of controlling the same align sheets stacked on a stacking unit, by causing a first alignment member and a second alignment member to come into contact with edges of a sheet stacked on the stacking unit in a sheet width direction. In a case that a second sheet that is different from a first sheet stacked on the stacking unit is to be stacked on the first sheet and aligned using the first alignment member and the second alignment member, control is performed to discharge a partition sheet onto the first sheet stacked on the stacking unit.

A mechanism capable of changing an upper limit number of sheets for a post-process is provided. To achieve this, a control method for controlling a sheet processing apparatus which performs the post-process for the sheets on which images are formed, comprising: storing, in a storage unit, the upper limit number of sheets to which the post-process can be performed; and changing the upper limit number of sheets stored in the storage unit is provided.

A puncher cylinder includes a puncher knife, the cylinder being arranged for cooperation with a paper web such that the cylinder when in use can be rolled longitudinally along and in contact with the paper web, punching holes in the paper web by way of the puncher knife. The holes are punched a longitudinal distance from each other essentially corresponding to the circumference of the cylinder. A system is further disclosed including the punching cylinder, as is a method utilizing the punching cylinder, and a newspaper partly produced by way of the punching cylinder.

An apparatus for processing sheets of different formats, the apparatus including a feeding device that feed sheets of different formats in a feeding direction one behind the other, and at a certain conveying speed, at least two collecting drums disposed downstream of the feeding device, the at least two collecting drums having cylindrical lateral surfaces that rotate about an axis of rotation, securing means for temporarily securing the fed sheets on a circumference of the at least two collecting drums, a drive device that drives the collecting drums in rotation at a circumferential speed that corresponds to the conveying speed of the feeding device, and a sensing device for sensing the sheets of different formats moving past is arranged along the conveying path and senses the leading edge of the sheets of different formats, as seen in the feeding direction, or markings applied to the sheets of different formats.

The present invention relates generally to a semiconductor device and, more specifically, to optimizing the creep-age distance of the power semiconductor device and a preparation method thereof. The power semiconductor device includes a chip mounting unit with a die paddle and a plurality of leads arranged side by side located close to one side edge of the die paddle in a non-equidistant manner, a semiconductor chip attached on the die paddle, and a plastic packaging body covering the die paddle, the semiconductor chip, where the plastic packing body includes a plastic extension portion covering at least a part of a lead shoulder of a lead to obtain better electrical safety distance between the terminals of the semiconductor device, thus voltage creep-age distance of the device is increased.

The stack package includes a first semiconductor package and a second semiconductor package. The first semiconductor package includes a first substrate having a first modulus and at least one semiconductor chip mounted on the first substrate. The second semiconductor package stacked on the first semiconductor package and includes a second substrate having a second modulus and at least one semiconductor chip mounted on the second substrate. The second modulus is less than the first modulus. Even in the event that the first semiconductor package is under severe warpage due to a temperature change, the flexible second substrate, which includes e.g., polyimide or poly ethylene terephthalate, of the second semiconductor package may be less sensitive to the temperature change, thereby improving reliability of the stack package.

A semiconductor device comprises a first semiconductor chip including a first substrate and a plurality of first metal lines formed over the first substrate and a second semiconductor chip bonded on the first semiconductor chip, wherein the second semiconductor chip comprises a second substrate and a plurality of second metal lines formed over the second substrate. The semiconductor device further comprises a conductive plug coupled between the first metal lines and the second metal lines, wherein the conductive plug comprises a first portion formed over a first side of a hard mask layer, wherein the first portion is of a first width and a second portion formed over a second side of the hard mask layer, wherein the second portion is of a second width greater than or equal to the first width.

An apparatus including a die including a dielectric material on a device side, an insulating layer surrounding a die area and embedding a thickness dimension of the die; and a carrier including a plurality of layers of conductive material disposed on the device side of the die, a first one of the layers of conductive materials being formed on the insulating layer and patterned into traces at least a portion of which are connected to respective contact points on the die. A method including disposing a die on a sacrificial substrate with a device side of the die opposite the sacrificial substrate; disposing a mold on the sacrificial substrate around; introducing an insulating material into a chase of the mold; removing the mold; forming a carrier on the insulating material adjacent a device side of a die; and separating the die and the carrier from the sacrificial substrate.

In a disclosed embodiment, a method for tiling selected vias in a semiconductor device having a plurality of vias comprises generating a layout database for the semiconductor device; creating zones around the plurality of vias; measuring density of covering metal in each zone; selecting a low density zone as being a zone that has a metal density less than a threshold metal density; and adding at least one tiling feature on a metal layer above the plurality of vias in the low density zone so that metal density of the low density zone increases to at least the same as the threshold metal density.

A through silicon via with sidewall roughness and methods of manufacturing the same are disclosed. The method includes forming a via in a substrate and roughening a sidewall of the via by depositing material within the via. The method further includes removing a backside of the substrate to form a through via with a roughened sidewall structure.

Methods for the fabrication of a Microelectromechanical Systems (“MEMS”) devices are provided, as are MEMS devices. In one embodiment, the MEMS device fabrication method includes forming at least one via opening extending into a substrate wafer, depositing a body of electrically-conductive material over the substrate wafer and into the via opening to produce a via, bonding the substrate wafer to a transducer wafer having an electrically-conductive transducer layer, and forming an electrical connection between the via and the electrically-conductive transducer layer. The substrate wafer is thinned to reveal the via through a bottom surface of the substrate wafer, and a backside conductor is produced over a bottom surface of the substrate wafer electrically coupled to the via.

Disclosed herein is a single mask package apparatus on a device comprising a first substrate having a land disposed on a first surface, a stud disposed on the land and a protective layer disposed over the first surface of the first substrate and around the stud. The protective layer may optionally have a thickness of at least 3 μm. A PPI may be disposed over the protective layer and in electrical contact with the stud, with a first portion of the PPI extending laterally from the stud. An interconnect may be disposed on and in electrical contact with the first portion of the PPI, and a second substrate mounted on the interconnect. A molding compound may be disposed over the PPI and around the interconnect. The stud may be a substantially solid material having a cylindrical cross section and may optionally be wirebonded to the land.

An interconnect structure and a method of forming an interconnect structure are disclosed. The interconnect structure includes a lower conductive feature in a lower low-k (LK) dielectric layer; a first etch stop layer (ESL) over the lower conductive feature, wherein the first ESL comprises a metal compound; an upper LK dielectric layer over the first ESL; and an upper conductive feature in the upper LK dielectric layer, wherein the upper conductive feature extends through the first ESL and connected to the lower conductive feature. The interconnect structure may further include a second ESL between the upper LK dielectric layer and the first ESL, or between the first ESL and the lower conductive feature, wherein the second ESL comprises a silicon compound.

A multi-chip package is provided. The multi-chip package includes a plurality of chips including at least one bad chip and at least one good chip that are stacked and a plurality of through electrodes each penetrating the chips. A logic circuit included in the at least one bad chip is isolated from each of the plurality of through electrodes.

A method for producing a solder joint between at least one base part (2) and at least one first component (3) includes the following steps: providing the base part (2); partially blasting a surface of the base part (2) using a SACO blasting agent, the blasting material (50) of which has a silicate coating (52), in such a way that a SACO-blasted region (20) and a non-blasted positioning region (40) are present; and soldering the at least first component (3) onto the non-blasted positioning region (40), wherein the SACO-blasted region (20) acts as a solder resist.

In various embodiments, a chip arrangement is provided. The chip arrangement may include a chip carrier and a chip mounted on the chip carrier. The chip may include at least two chip contacts and an insulating adhesive between the chip and the chip carrier to adhere the chip to the chip carrier. The at least two chip contacts may be electrically coupled to the chip carrier.

Described herein are methods and systems for providing corrective maintenance using global knowledge sharing. A method to provide corrective maintenance with a CM system includes performing a query to generate a ranking of fixable causes based on factors (e.g., symptoms, configuration, test). The ranking may be determined based on a fixable cause percent match with the factors. The ranking of fixable causes may be associated with one or more solutions for each fixable cause. The ranking can be updated based on performing tests or solutions.

A base at least one principal plane of which is a nitride is prepared for use in epitaxial growth. The base is placed on a susceptor in an epitaxial growth reactor and heated to a predetermined temperature (step A). The heating is started with inactive, nitrogen gas being supplied into the reactor. Then, active, NH3 gas is supplied. Then, a growth step (step B) of a first nitride semiconductor layer is started without an intervening step of thermally cleaning the principal nitride plane of the base. In step B, the first nitride semiconductor layer is epitaxially grown on a principal nitride plane of a base without supply of an Si source material. Then, a relatively thick, second nitride semiconductor layer is epitaxially grown on the first nitride semiconductor layer by supplying an n-type dopant source material (step C).

A method for fabricating a sensor includes: forming, on a base substrate, a pattern of a source electrode and a drain electrode, a pattern of a data line, a pattern of a receiving electrode, a pattern of a photodiode, and a pattern of a transparent electrode disposed by using a first patterning process; forming a pattern of an ohmic layer by using a second patterning process; forming a pattern of an active layer by using a third patterning process; forming a pattern of a gate insulating layer by using a fourth patterning process, wherein the gate insulating layer has a via hole above the transparent electrode; and forming a pattern of a gate electrode, a pattern of a gate line, and a pattern of a bias line connected to the transparent electrode via the via hole above the transparent electrode by using a fifth patterning process.

In manufacturing an LSI, or semiconductor integrated circuit device, the step of assembling device (such as resin sealing step) is normally followed by a voltage-application test in an environment of high temperature (e.g., from 85 to 130° C.) and high humidity (e.g., about 80% RH). It has been found that separation of a titanium nitride anti-reflection film from an upper film and generation of cracks in the titanium nitride film at an upper surface edge part of the aluminum-based bonding pad applied with a positive voltage in the test is caused by an electrochemical reaction due to moisture incoming through the sealing resin and the like to generate oxidation and bulging of the titanium nitride film. These problems are addressed by removing the titanium nitride film over the pad in a ring or slit shape at peripheral area of the aluminum-based bonding pad.

A larger substrate can be used, and a transistor having a desirably high field-effect mobility can be manufactured through formation of an oxide semiconductor layer having a high degree of crystallinity, whereby a large-sized display device, a high-performance semiconductor device, or the like can be put into practical use. A first multi-component oxide semiconductor layer is formed over a substrate and a single-component oxide semiconductor layer is formed thereover; then, crystal growth is carried out from a surface to an inside by performing heat treatment at 500° C. to 1000° C. inclusive, preferably 550° C. to 750° C. inclusive so that a first multi-component oxide semiconductor layer including single crystal regions and a single-component oxide semiconductor layer including single crystal regions are formed; and a second multi-component oxide semiconductor layer including single crystal regions is stacked over the single-component oxide semiconductor layer including single crystal regions.

A method for manufacturing a light-emitting device includes a step of forming an etching resistant protection layer on a substrate provided with an organic planarizing layer, a step of forming a plurality of electrodes on the etching resistant protection layer, a step of forming an organic compound layer on the substrate provided with the plurality of electrodes, a step of forming a resist layer on the organic compound layer formed on parts of electrodes among the plurality of electrodes using a photolithographic method, and a step of removing the organic compound layer in a region not covered with the resist layer by dry etching, wherein an entire surface of the organic planarizing layer on the substrate on which steps up to the step of forming the plurality of electrodes have been performed is covered with at least one of the etching resistant protection layer and the electrode.

An object of an embodiment of the present invention to be disclosed is to prevent oxygen from being taken in a single crystal semiconductor layer in laser irradiation even when crystallinity of the single crystal semiconductor layer is repaired by irradiation with a laser beam; and to make substantially equal or reduce an oxygen concentration in the semiconductor layer after the laser irradiation comparing before the laser irradiation. A single crystal semiconductor layer which is provided over a base substrate by bonding is irradiated with a laser beam, whereby the crystallinity of the single crystal semiconductor layer is repaired. The laser irradiation is performed under a reducing atmosphere or an inert atmosphere.

A first impurity region is formed by ion implantation through a first opening formed in a mask layer. By depositing a spacer layer on an etching stop layer on which the mask layer has been provided, a mask portion having the mask layer and the spacer layer is formed. By anisotropically etching the spacer layer, a second opening surrounded by a second sidewall is formed in the mask portion. A second impurity region is formed by ion implantation through the second opening. An angle of the second sidewall with respect to a surface is 90°±10° across a height as great as a second depth. Thus, accuracy in extension of an impurity region can be enhanced.

A semiconductor device has a semiconductor wafer with a plurality of contact pads. A first insulating layer is formed over the semiconductor wafer and contact pads. A portion of the first insulating layer is removed, exposing a first portion of the contact pads, while leaving a second portion of the contact pads covered. An under bump metallization layer and a plurality of bumps is formed over the contact pads and the first insulating layer. A second insulating layer is formed over the first insulating layer, a sidewall of the under bump metallization layer, sidewall of the bumps, and upper surface of the bumps. A portion of the second insulating layer covering the upper surface of the bumps is removed, but the second insulating layer is maintained over the sidewall of the bumps and the sidewall of the under bump metallization layer.

Embodiments of a method for fabricating stacked microelectronic packages are provided, as are embodiments of a stacked microelectronic package. In one embodiment, the method includes arranging microelectronic device panels in a panel stack. Each microelectronic device panel includes a plurality of microelectronic devices and a plurality of package edge conductors extending therefrom. Trenches are formed in the panel stack exposing the plurality of package edge conductors. An electrically-conductive material is deposited into the trenches and contacts the plurality of package edge conductors exposed therethrough. The panel stack is then separated into partially-completed stacked microelectronic packages. For at least one of the partially-completed stacked microelectronic packages, selected portions of the electrically-conductive material are removed to define a plurality of patterned sidewall conductors interconnecting the microelectronic devices included within the stacked microelectronic package.