Form-A-Tread Original is a durable high-tech epoxy paste designed to be easy to apply to stair treads. Form-A-Tread’s kit includes a 400-milliliter cartridge of material that can produce 25 to 40 linear feet of 1-inch-wide tread depending on the surface type.

Taylor Adhesives 501 is a fast-setting, two-part, low-VOC epoxy system used to install vinyl and rubber flooring, including hard-to-stick recycled products.

Sherwin-Williams High-Performance Flooring seamless flooring systems offers up durable, chemical resistant systems that cover a range of commercial applications, ranging from moderate to heavy use.

A common issue with cool-temperature floor coating jobs, amine blush is an oily surface imperfection caused by moisture or dew settling on uncured epoxy. 

In the title compound, C18H22O7, two hexane rings and an oxane ring are fused together. The two hexane rings tend toward a distorted boat conformation, while the tetra­hydro­furan and di­hydro­furan rings adopt envelope conformations. The oxane ring is puckered. The crystal structure features C—H⋯O hydrogen bonds, which link the mol­ecules into a three-dimensional network. According to a Hirshfeld surface study, H⋯H (60.3%) and O⋯H/H⋯O (35.3%) inter­actions are the most significant contributors to the crystal packing.

Partnership is set to bring lots of benefits for Allstar players, customers as well as the local community

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An aqueous epoxy resin system AB is described comprising an aqueously dispersed epoxy resin A having, on the average, at least one epoxy group per molecule, and a water-soluble or water-dispersible curing agent B which comprises the reaction product of an amine B1 having at least one primary and/or at least one secondary amino group, an adduct B2 of a polyalkylene ether polyol B21 and an epoxide component B22, and an aromatic compound B3 having at least one acidic group selected from the group consisting of hydroxyl and carboxyl groups, which system can be applied by rolling, spraying or brushing to provide corrosion protection on base metals.

The present invention relates to epoxy group-terminated polymers of the formula (I). Said epoxy group-terminated polymers are suited extremely well as impact resistance modifiers, particularly in epoxy resin compositions. They are particularly suited for use in heat-curing epoxy resin adhesives. It has been found that such epoxy resin compositions not only have excellent mechanical properties and high glass transition temperatures, but also above all improved impact resistance properties, both at room temperature and at low temperatures.

The present invention relates to a process for the production of a ready-to-use epoxy composition having a filler content of at least 55 vol.-%, relative to the complete ready-to-use epoxy composition, which comprises: providing a liquid A, which comprises at least one epoxy resin,providing a liquid B, which comprises at least one curing agent,providing a solid component C, which comprises at least one filler,wherein in a first step one of the liquids A or B is filled in a mixing container,in a second step the solid component C is deposited on top of the liquid in the mixing container,in a third step the remaining liquid A or B is deposited on top of the solid component C, andin a fourth step the components are mixed to obtain the ready-to-use epoxy composition.

Disclosed are an epoxy resin composition and a light emitting apparatus. The epoxy resin composition includes a triazine derivative epoxy resin and an alicyclic epoxy resin.

Disclosed is an epoxy resin composition used for encapsulation of a semiconductor containing an epoxy resin (A), a curing agent (B), an inorganic filler (C) and a mold releasing agent, in which the mold releasing agent contains a compound (D) having a copolymer of an α-olefin having 28 to 60 carbon atoms and a maleic anhydride esterified with a long chain aliphatic alcohol having 10 to 25 carbon atoms.

Aqueous emulsions of epoxy- and organo-substituted, branched organopolysiloxanes are prepared by emulsifying the latter in water with the aid of a dispersing agent. The emulsions are storage stable and are useful in multi-component coating, adhesive, and binder systems.

Water based lignoepoxy resins, and methods for their preparation and use are provided. Methods of making lignoepoxy resins without the use of volatile organic compounds are also provided.

In some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced having epoxy material and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured. Other embodiments are also disclosed and claimed.

Provided is a fluorine- and epoxy group-containing copolymer with excellent workability at room temperature, high water-repellency, and excellent characteristics as a water vapor barrier. Also provided is an efficient method for producing said copolymer. The fluorine and epoxy group-containing copolymer is characterized by containing at least a monomer unit represented by general formula (1): {Therein, R1-R10 each independently represent an alkyl group having 1-3 carbon atoms or a hydrogen atom, R11 is a hydrogen atom, methyl group, or phenyl group, and R5 or R6 can be linked with R7 or R8 to form a ring.} and a monomer unit represented by general formula (2): {Therein, R12 and R13 each independently represent a hydrogen atom or a fluorine atom; R14 represents a hydrogen atom, fluorine atom, methyl group or trifluoromethyl group, and R15 represents a flourine atom or perfluoro group having at most 12 carbon atoms}.

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Plastic is one of the commonest materials suited to be used for a wide array of home appliances. This is a material that can be both highly durable and highly flexible. At the same time, it can be really tough to find the right kind of glue for it since many of the products that […]

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