The invention concerns a cold-rolled aluminum killed steel sheet, which includes by weight between 0.003 and 0.130% of carbon, between 0.10 and 1% of manganese, between 0.010 and 0.100% of aluminum, between 0.0015 and 0.0140% nitrogen, the remainder being of iron and impurities resulting from the manufacturing, and which has a content of carbon in solid solution (Css) of at least 50 ppm, as well as a method of manufacturing packaging from said sheet.

A multiphase steel sheet has a steel composition containing, in percent by mass, more than 0.015% to less than 0.100% of carbon, less than 0.40% of silicon, 1.0% to 1.9% of manganese, more than 0.015% to 0.05% of phosphorus, 0.03% or less of sulfur, 0.01% to 0.3% of soluble aluminum, 0.005% or less of nitrogen, less than 0.30% of chromium, 0.0050% or less of boron, less than 0.15% of molybdenum, 0.4% or less of vanadium, 0.02% or less of titanium, wherein [Mneq] is 2.0 to 2.8, the balance being iron and incidental impurities.

An aluminum alloy wrought product including, in wt. %, Mg 3.0 to 7.0, Zn 0.6 to 2.8, Mn 0 to 1.0, Cu 0 to 2.0, Sc 0 to 0.6, at least one element selected from the group of Zr 0.04 to 0.4, Cr 0.04 to 0.4, Hf 0.04 to 0.4 and Ti 0.01 to 0.3; Fe maximum 0.3, Si maximum 0.3, inevitable impurities, and balance aluminum. The range for the Zn-content in wt. % is a function of the Mg-content according to: lower-limit of the Zn-range: [Zn]=0.34[Mg]−0.4, and upper-limit of the Zn-range: [Zn]=0.34[Mg]+0.4.

Provided is a method of preparing a nanocrystalline titanium alloy at low strain to have better strength. The present invention is characterized in that an initial microstructure is induced as martensites having a fine layered structure, and then a nanocrystalline titanium alloy is prepared at low strain by optimizing process variables through observation of the effects of strain, strain rate, and deformation temperature on the changes in the microstructure.

There are provided a permanent magnet and a manufacturing method thereof enabling carbon content contained in magnet particles to be reduced in advance before sintering even when wet milling is employed. Coarsely-milled magnet powder is further milled by a bead mill in a solvent together with an organometallic compound expressed with a structural formula of M-(OR)X (M represents V, Mo, Zr, Ta Ti W or Nb, R represents a substituent group consisting of a straight-chain or branched-chain hydrocarbon, X represents an arbitrary integer) so as to uniformly adhere the organometallic compound to particle surfaces of the magnet powder. Thereafter, a compact body of compacted magnet powder is held for several hours in hydrogen atmosphere at 200 through 900 degrees Celsius to perform hydrogen calcination process. Thereafter, through sintering process, a permanent magnet 1 is formed.

A steel for an induction hardening including, by mass %, C: more than 0.75% to 1.20%, Si: 0.002 to 3.00%, Mn: 0.20 to 2.00%, S: 0.002 to 0.100%, Al: more than 0.050% to 3.00%, P: limited to 0.050% or less, N: limited to 0.0200% or less, O: limited to: 0.0030% or less, and the balance composing of iron and unavoidable impurities, wherein an Al content and a N content satisfy, by mass %, Al−(27/14)×N>0.050%.

The galvannealed steel sheet includes: a galvannealed layer formed on at least one surface of a steel sheet and contains includes an amount of 0.05 mass % to 0.5 mass % of Al, an amount of 6 mass % of 12 mass % of Fe, and the balance composed of Zn and inevitable impurities; and a mixed layer formed on a surface of the galvannealed layer and includes a composite oxide of Mn, Zn, and P and an aqueous P compound, wherein the composite oxide includes 0.1 mg/m2 to 100 mg/m2 of Mn, an amount of 1 mg/m2 to 100 mg/m2 of P, and Zn, and a P/Mn ratio is 0.3 to 50, and wherein the total size of an area of the mixed layer in which an attached amount of P is equal to or more than 20 mg/m2 is 20% to 80% of a surface area of the mixed layer.

Provided is a hot-rolled steel sheet that has a chemical composition including, by mass %: C: 0.060% to 0.150%; Si: 0.15% to 0.70%; Mn: 1.00% to 1.90%; P: 0.10% or less; S: 0.010% or less; Al: 0.01% to 0.10%; N: 0.010% or less; Nb: 0.010% to 0.100%; and the balance including Fe and incidental impurities. The hot-rolled steel sheet has a microstructure containing ferrite of 18 μm or less in average grain size by a volume fraction of at least 75% and pearlite of at least 2 μm in average grain size by a volume fraction of at least 5%, the balance being low-temperature-induced phases, the pearlite having a mean free path of at least 5.0 μm.

A predetermined steel containing Te: 0.0005 mass % to 0.0050 mass % is heated to 1320° C. or lower to be subjected to hot rolling, and is subjected to annealing, cold rolling, decarburization annealing, and nitridation annealing, and thereby a decarburized nitrided steel sheet is obtained. Further, an annealing separating agent is applied on the surface of the decarburized nitrided steel sheet and finish annealing is performed, and thereby a glass coating film is formed. The N content of the decarburized nitrided steel sheet is set to 0.0150 mass % to 0.0250 mass % and the relationship of 2×[Te]+[N]≦0.0300 mass % is set to be established. Note that [Te] represents the Te content and [N] represents the N content.

A multipurpose organizer that can be quickly and easily converted into multiple articles such as but not limited to a carrying tote, a purse, a seat organizer and a head rest is provided. The method of making the multifunctional organizer and the methods of using the multifunctional organizer are also provided. In one embodiment the main body of consists of a single piece of material providing for low cost construction.

Embodiments of club head covers having a pull strap and methods to manufacture club head covers are generally described herein. Other embodiments of club head covers having a pull strap may be described and claimed.

The present invention is directed to an article of manufacture and method of manufacture relating to purses, handbags, wallets and the like. The method disclosed herein relates to utilizing text book covers off of books, such as legal treatises and case law books as the primary material for such articles. The text book cover is removed, cleaned, prepared, cut, sewn and glued together to form a purse, handbag, wallet and the like. The result of the disclosed invention is eco-friendly as it takes an old, often discarded item and forms a highly useful and quite stylish “new” article.

An advertising apparatus including a body portion adapted to be one or both of connected to or disposed on a support structure accessible for advertising purposes and, an interchangeable and/or replaceable advertising device, the advertising device being adapted to be one or both of connected to or disposed on the body portion.

An electroluminescent arrangement is described. This electroluminescent arrangement comprises the following functional layers: (a) rear electrode as layer A;(b) dielectric layer as layer B;(c) electroluminescent layer as layer C; and(d) cover electrode as layer D.

A portable movie screen includes a screen portion and a frame portion surrounding at least part of the periphery of the screen portion. The screen portion has a screen gain greater than about 0.8 and an elasticity greater than an elasticity of the frame portion. The movie screen includes at least one side connected to the front portion and a receiving space defined at least in part by the front portion and the side portion. The receiving space is configured to selectively receive a support body including at least one sealed chamber and movable between a collapsed configuration and an expanded configuration. The frame portion is configured such that when the support body is in the expanded configuration and positioned in the receiving space, the frame portion tensions the screen portion and substantially maintains the screen portion in a desired shape.

The invention relates to a device for identifying an animal, comprising a male part and a female part which are intended to be joined together, said female part comprising a head (12) for holding a tip of said male part, and a rigid shell (11) containing electronic identification means (42). According to the invention, a resin (41) is placed inside a housing defined in said shell so as to cover said electronic means (42) and to secure said head (12) to said shell (11).

A self-supporting sign of unitary construction comprises a middle portion having a first side, a second side, an upper side, and a lower side. A first foldable flap extends from the first side at a first distance beneath the upper side. A second foldable flap extends from the second side at a second distance beneath the upper side. A front foldable portion having a rounded perimeter extends from the lower side. In a use configuration, the middle portion forms an obtuse angle with respect to the front portion. A first slit is provided adjacent the first side and a second slit is provided adjacent the second side. The first and second slits are configured to aid in the respective folding of the first flap and the second flap with respect to the middle portion.

A poster clamp comprising first and second members, the members comprising first and second gripping surfaces, respectively, for gripping opposing sides of a poster or a like, and a poster mounting system comprising a hoarding and a plurality of such clamps, and a wire on which the clamps are to be mounted for tightening a poster within the frame of the hoarding.

Methods for cleaning a side edge of a thin film photovoltaic substrate utilizing a laser are provided. The method can include transporting the substrate in a machine direction to move the substrate past a first laser source, and focusing a first laser beam generated by the first laser source onto the side edge of the substrate such that the laser beam removes the thin film present on the side edge of the substrate. An apparatus is also generally provided for cleaning a first side edge and a second side edge of a thin film photovoltaic substrate.

Provided is a method for cleaning the inside of a pressure tight container for a blasting treatment, wherein the inside of a pressure tight container can be cleaned for a short period of time after a blasting treatment. The method is comprised of a setting process wherein a cleaning blast (1) capable of cracking a part of a residual substance remaining on the inside of a pressure tight container (10), and a solid separating material (2) which collides with a substance bonded to an inner wall surface (32a) of the pressure tight container (10), to separate the bonded substance from the inner wall surface (32a) of the pressure tight container (10), are set on the inside of the pressure tight container (10); and a separation process wherein the cleaning blast (1) blasts on the inside of the pressure tight container (10), to crack a part of the residual substance remaining on the inside of the pressure tight container (10), and the separating material (2) is divided into a plurality of granular elements by the blast, so that the granular elements are spread, and collide with the bonded substance to remove the bonded substance.

A system and method for securing tokens to be cleaned includes a tray with a curved surface defining a channel extending along a first direction and spacers projecting from the curved surface into the channel. The spacers are disposed at regular intervals along the first direction. The curved surface also has at least one opening. The tokens may be inserted into the channel between adjacent spacers and the tray holding the tokens can be submerged into a cleaning liquid. Identical trays containing tokens can also be stacked and together submerged into the cleaning liquid. The tray holding the tokens can be placed on a drying surface that has a drainage hole, and wetness remaining on the tokens can be sucked through the hole in the channel and the drainage hole by a vacuum or blown through the hole in the channel and drainage hole by an air blower.

A substrate rotates, and a liquid nozzle of a gas/liquid supply nozzle moves to a position above the center of the rotating substrate. In this state, a rinse liquid is discharged from the liquid nozzle onto the rotating substrate. The gas/liquid supply nozzle moves toward a position outside the substrate. A gas nozzle reaches the position above the center of the rotating substrate, so that the gas/liquid supply nozzle temporarily stops. With the gas/liquid supply nozzle stopping, an inert gas is discharged onto the center of the rotating substrate for a given period of time. After that, the gas/liquid supply nozzle again moves toward the position outside the substrate.

A method for cleaning a film separating device involves: a) performing positive-direction water cleaning when the ratio between the film filter resistance and the preliminary film filter resistance is less than 1.2; b) performing reverse water cleaning when the ratio between the film filter resistance and the preliminary film filter resistance is greater-than or equal-to 1.2; c) performing reverse chemical cleaning when the ratio between the film filter resistance and the preliminary film filter resistance is greater-than or equal-to 2; d) performing positive-direction chemical cleaning when the ratio between the film filter resistance and the preliminary film filter resistance is greater-than or equal-to 3.

A surface treatment composition of the present invention contains a first surfactant, a second surfactant, a basic compound, and water. The surface treatment composition has a pH of 8 or more. The second surfactant has a weight-average molecular weight one-half or less that of the first surfactant. The sum of the content of the first surfactant and the content of the second surfactant is 0.00001 to 0.1% by mass.

A method for processing a plurality of substrates after forming a photosensitive film on each substrate includes carrying each substrate into a placement buffer including a plurality of supporters by a first transport mechanism; taking out each substrate from the placement buffer to an interface by a second transport mechanism; carrying each substrate into the exposure device; carrying each substrate out of the exposure device into the placement buffer by the second transport mechanism; taking out each substrate from the placement buffer to the processing section by the first transport mechanism; performing development processing on each substrate; making each substrate stand by at the placement buffer based on timing at which the exposure device can accept each substrate; and making each substrate stand by at the placement buffer based on timing at which the developing device can accept each substrate.

A method for grit blasting tubes and for blowing swabs through tubes, automatically sensing that the swab has passed through the tube, and logging the event. Also, various methods are used for inserting the swabs into the tubes efficiently.

An engine wash system includes a manifold to secure to a nose cone of an engine; a feeder pipe connecting to the manifold to deliver wash liquid to the manifold; a plurality of nozzles connected to the manifold to direct the wash liquid into the engine; a hook connected to the manifold to connect to a slot on the nose cone; and a guide connected to the feeder to align the manifold relative to the engine.

Strategies for tool designs and their uses wherein the tools can operate in either closed or open modes of operation. The tools easily transition between open and closed modes on demand. According to one general strategy, environmentally controlled pathway(s) couple the ambient to one or more process chambers. Air amplification capabilities upstream from the process chamber(s) allow substantial flows of air to be introduced into the process chamber(s) on demand. Alternatively, the fluid pathways are easily closed, such as by simple valve actuation, to block egress to the ambient through these pathways. Alternative flows of nonambient fluids can then be introduced into the process chamber(s) via pathways that are at least partially in common with the pathways used for ambient air introduction. In other strategies, gap(s) between moveable components are sealed at least with flowing gas curtains rather than by relying only upon direct physical contact for sealing.

In a method for multiple cutoff machining a rare earth magnet block, a cutting fluid feed nozzle having a plurality of slits is combined with a plurality of cutoff abrasive blades coaxially mounted on a rotating shaft, each said blade comprising a base disk and a peripheral cutting part. The slits in the feed nozzle into which the outer peripheral portions of cutoff abrasive blades are inserted serve to restrict any axial run-out of the cutoff abrasive blades during rotation. Cutting fluid is fed from the feed nozzle through slits to the rotating cutoff abrasive blades and eventually to points of cutoff machining on the magnet block.

A body, such as a pick tool for cutting coal, includes a steel substrate and a hard face structure fused to the steel substrate. The hard face structure includes at least 1 weight percent Si, at least 5 weight percent Cr and at least 40 weight percent W. Substantially the balance of the hard face structure includes carbon and an iron group metal M selected from Fe, Co, Ni and alloy combinations of these elements. The hard face structure includes a plurality of elongate or platelike micro-structures having a mean length of at least 1 micron, a plurality of nano-particles having a mean size of less than 200 nanometers, and a binder material.

An apparatus for splitting a plurality of masonry blocks is provided. The apparatus includes a plurality of first splitting blades that are configured to simultaneously move in a first direction, so as to split one of each of the plurality of masonry blocks into two or more sections during a single splitting operation. Each section has a first split surface. A plurality of second splitting blades is provided, where each is perpendicular and adjacent to one of the first splitting blades. Each of the second splitting blades is configured to form a second split surface on one of the masonry block sections that is perpendicular to at least one of the first split surfaces.

Methods, wires, and apparatus for use in cutting (e.g., slicing) hard, brittle materials is provided. The wire can be a super-abrasive wire that includes a wire core and super-abrasive particles bonded to the wire core via a metal bonding layer. This wire, or another type of wire, can be used to slice workpieces useful for producing wafers. The workpieces can be aligned within a holder to produce wafers using the device and methods presently provided. The holder rotates about its central axis, which translates to workpieces moving in orbit around this axis. A single abrasive wire, or multiple turns of wire stretched tightly between wire guides, is then contacted with the rotating holder to slice the workpieces.

Methods, wires, and apparatus for use in cutting (e.g., slicing) hard, brittle materials is provided. The wire can be a super-abrasive wire that includes a wire core and super-abrasive particles bonded to the wire core via a metal bonding layer. This wire, or another type of wire, can be used to slice workpieces useful for producing wafers. The workpieces can be aligned within a holder to produce wafers using the device and methods presently provided. The holder rotates about its central axis, which translates to workpieces moving in orbit around this axis. A single abrasive wire, or multiple turns of wire stretched tightly between wire guides, is then contacted with the rotating holder to slice the workpieces.

An apparatus, a system and a method may use a diamond-impregnated wire loop to cut an underwater pipeline. The apparatus may have a frame, a carriage attached to the frame and/or pulleys connected to the carriage. The diamond-impregnated wire loop may be connected to the pulleys. The carriage may move relative to the frame to direct the diamond-impregnated wire loop in a forward direction relative to the frame and/or through the pipeline.

A concrete saw is disclosed having a rigid metal frame, a hydraulic drive system, a water-cooled hub, and an axially rotatable trigger assembly comprising a 12 volt switch. The saw may include a hydraulic pump operable to supply pressurized hydraulic fluid to the drive system. In some embodiments, the saw may includes a flow sharing valve fluidly coupled to the hydraulic drive system to distribute the pressurized hydraulic fluid from the a hydraulic pump in a portable power pack. A method of removing trip hazards with the saw is also disclosed.

A method for slicing a plurality of wafers from a crystal includes providing a crystal of semiconductor material having a longitudinal axis, a cross section and at least one pulling edge. The crystal is fixed on a table and guided through a wire gang defined by sawing wire so as to form the wafers. The guiding is provided by a relative movement between the table and the wire gang such that entry sawing or exit sawing using the sawing wire occurs in a vicinity of the at least one pulling edge of the crystal.

The present invention provides a self-cleaning wiresaw cutting apparatus including a cleaning mechanism adapted to clean the components of the wiresaw before, during, or after a cutting process or to humidify the cutting region of the apparatus. The apparatus contains at least one dispenser adapted to dispense an aqueous fluid onto various components of the wiresaw.

A method of ductile mode machining a component of a plasma processing apparatus wherein the component is made of nonmetallic hard and brittle material wherein the method comprises single point turning the component with a diamond cutting tool causing a portion of the nonmetallic hard and brittle material to undergo a high pressure phase transformation to form a ductile phase portion of the hard and brittle material during chip formation wherein a turned surface is formed from a phase changed material and the turned surface is a grooved textured surface of phase changed material.

Disclosed is a movable cutting tool apparatus and/or methods for cutting workpieces; either generally including a cutting tool apparatus having a cutting tool unit support apparatus including at least a substantially stationary support structure and one or more rear-mount glide rails; a cutting tool unit which is supported by the support apparatus; a cutting implement held by the cutting tool unit, whereby the cutting tool unit operates and controls the cutting implement; and, at least one fluid coolant and/or lubricant tube connected to the cutting tool unit and adapted to flow a fluid to the cutting implement in operation; wherein the cutting tool unit and the cutting implement are directly movable with the glide rails to provide reciprocal and translational movability for the cutting tool unit and the cutting implement.

The motorized cutter with wheels (10) comprises a motorized cutter (20) and a carriage (30). The motorized cutter (20) is equipped with an engine (24), a blade (22) rotatably driven by the engine (24), and a light-emitting unit (50) that generates laser light (52) in the same plane as the plane of rotation of the blade (22). A roadbed (90) is then cut along a line (X) drawn on the roadbed (90) by operating the motorized cutter with wheels (10) so that the line (X) is irradiated with the laser light (52). It is possible to remove the motorized cutter (20) from the carriage (30) together with the light-emitting unit (50).

A method of dressing a wheel using a polycrystalline CVD synthetic diamond dresser, the method comprising: rotating the wheel; and contacting a working surface of the wheel with a working surface of the polycrystalline CVD synthetic diamond dresser, wherein the polycrystalline CVD synthetic diamond dresser is oriented such that a leading edge of the working surface of the polycrystalline CVD synthetic diamond dresser is formed of larger grains than a trailing edge of the working surface of the polycrystalline CVD synthetic diamond dresser.

A method for slicing a workpiece into wafers in which a polyphosphate solution is applied to the workpiece during the slicing process. The method comprises the steps of positioning the workpiece, such as a silicon ingot, in the vicinity of a wire saw that can cut through the workpiece without the use of an abrasive slurry; causing an aqueous polyphosphate solution to contact the workpiece; and causing the wire saw to cut into the workpiece while the polyphosphate solution is in contact with the workpiece. After the workpiece has been cut into wafers, the polyphosphate solution is rinsed off of the wafers. Preferably, the wire saw used in this method is a diamond wire saw.

The present invention provides a wiresaw cutting method comprising cutting a workpiece with a wiresaw while applying an aqueous cutting fluid to the wiresaw from a recirculating reservoir of cutting fluid, monitoring at least one of a chemical property, a physical property, or both, and adjusting the chemical composition of the cutting fluid while cutting the workpiece to maintain the property being monitored. The present invention additionally provides an apparatus to perform the inventive method.

Systems and methods are disclosed for connecting an ingot to a wire saw with an ingot holder, a bond beam, and a bar. The bar has an angled mating surface that engages a recessed surface formed in a slot of the bond beam. Mechanical fasteners are used to connect the tee bar to the ingot holder. The angle of the mating surface with respect to the recessed surface of the slot prevents deformation of the bond beam and prevents compromising the integrity of the adhesive bond between the ingot and the bond beam.

A method for cooling a cylindrical workpiece during wire sawing includes applying a liquid coolant to a surface of the workpiece. The workpiece is made of semiconductor material having a surface including two end faces and a lateral face. The method includes sawing the workpiece with a wire saw including a wire web having wire sections arranged in parallel by penetrating the wire sections into the workpiece by an oppositely directed relative movement of the wire sections and the workpiece. Wipers are disposed so as to bear on the surface of the workpiece. The temperature of the workpiece is controlled during the wire sawing using a liquid coolant applied onto the workpiece above the wipers so as to remove the liquid coolant with the wipers bearing on the workpiece surface.

There is provided a method of cutting or drilling workpiece including stone such as marble and granite, brick, concrete and asphalt, using a frame gang saw. There are provided a workpiece cut by a frame gang saw that includes one or a plurality of blades having multiple cutting tips or that includes a blade without including a cutting tip; a method of cutting the workpiece by using a frame gang saw; and a product provided by the cutting method. The workpiece is provided to include one or more grooves into which at least a portion of at least one cutting tip among the multiple cutting tips or at least a portion of the blade without a cutting tip is inserted and which is formed in a surface thereof. Here, an initial cutting time on a workpiece may be shortened to greatly improve productivity and the quality of a product and a lifespan of a frame gang saw blade may be improved by significantly decreasing deflection in the blade.

The present invention provides a method of cutting a workpiece efficiently with high accuracy by utilizing tension adjusters to approximate tension in a wire in a wire saw to a predetermined target tension while effectively reducing only tension in a winder-side wire. The method comprises a forward-driven cutting step of cutting a workpiece while moving a wire forward, a first switching step of reversing a driving direction of the wire, a backward-driven cutting step of cutting the workpiece while moving the wire backward, and a second switching step of reversing a driving direction of the wire and returning to the forward-driven cutting step, the steps being repeated in this order. In both switching steps, only tension in a winder-side wire is reduced by tension manipulators. A reduction in target wire tension therefor is performed after completion of deceleration of the wire in each switching step.

A saw apparatus for sawing paving slabs has a frame mounted on a ground contacting propulsion member such that the frame may move above a slab to be cut without touching the slab. A first saw support assembly disposes a blade of a saw in cutting engagement with the slab for a transverse cut. A second saw support assembly disposes a blade of another saw in cutting engagement with the slab for a longitudinal cut. The saws are mounted on the saw assemblies and the saw assemblies are mounted on the frame and the frame is mounted on the ground contact propulsion members such that no part of said frame need contact the slab during cutting.

An apparatus, a system and a method may use a diamond-impregnated wire loop to cut an underwater pipeline. The apparatus may have a frame, a carriage attached to the frame and/or pulleys connected to the carriage. The diamond-impregnated wire loop may be connected to the pulleys. The carriage may move relative to the frame to direct the diamond-impregnated wire loop in a forward direction relative to the frame and/or through the pipeline.

An outer blade cutting wheel comprising an annular thin disc base of cemented carbide and a blade section of metal or alloy-bonded abrasive grains on the outer periphery of the base is provided. The abrasive grains are diamond and/or cBN grains having an average grain size of 45-310 μm and a TI of at least 150. The blade section includes overlays having a thickness tolerance (T3max−T3min) of 0.001 mm to 0.1×T2 mm. The blade section has a roundness (ODmax/2−ODmin/2) of 0.001 mm to 0.01×ODmax mm.