The Pinarayi Vijayan government in Kerala has suspended two officers of the Indian Administrative Service (IAS) on disciplinary grounds. K Gopalakrishnan, director of Industries and Commerce, faced the action over a religion-based WhatsApp group for

Kerala IAS officer N Prashanth aka 'Collector Bro', who has been suspended on disciplinary grounds after he publicly criticised a senior officer, has over 3 lakh followers on Facebook and 50,000 on Instagram

Read the in depth Review of Jak and Daxter Collection [PS3] Gaming. Know detailed info about Jak and Daxter Collection [PS3] configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

A man climbed an electric tower in Uttar Pradesh's Noida Sector 76 on Sunday afternoon. After nearly two hours, he was brought down by the police and fire department officials.

The results for the Delhi University Students' Union elections will be declared on November 21, almost two months after the polls were held, according to university officials.

1. Has AIMIM’s Owaisi, the dark horse in Maharashtra elections, played a winning move?  Hindustan Times
2. Video | Maharashtra Election Will Throw Up Fractured Mandate: A Owaisi's Party Leader  NDTV
3. Owaisi backs Maratha reservation ahead of Maharashtra Assembly polls  India Today
4. Need to fight unitedly by Muslims, Maratha and Dalits: Barrister Owaisi.  Etemaad
5. No one can say Uddhav Thackrey won't go back to BJP: AIMIM  The Times of India

Amber Solutions, an IoT product company that sells smart outlets, switches and circuit breakers closed Series A Preferred Stock round of financing that equals $3.3M in gross proceeds. Amber will use the funds to support the commercial development of Amber's core technologies.

One of Amber’s product is solid-state circuit interrupter (GFCI) that basically stops harmful levels of electricity from passing through a person. It operates as a safety device alerting the homeowner of electrocution incidents in real time.

Amber Solutions’ core markets are builders that prepare smart home/smart building ready infrastructure, certified electrical contractors or remodelers, and electrical manufacturers.

Other latest funding news include Owlet’s $24M Series B, Axonize’s $6M Series A round and addition of Deutsche Telekom as its strategic investor, and $30M Series B raised by Palo Alto-based Armis.

EV Ultimo launches platform to assist brands, buyers, stakeholders in the Electric Vehicles ecosystem

In the rapidly evolving landscape of automotive electronics, traditional monolithic design approaches are giving way to something more flexible and powerful—chiplets. These modular microchips, which are themselves parts of a whole silicon system, offer unparalleled potential for improving system performance, reducing manufacturing costs, and accelerating time-to-market in the automotive sector. However, the transition to working with chiplets in automotive electronics is not without its challenges.

Designers must now grapple with a new set of considerations, such as die-to-die interconnect standards, complex processes, and the integration of diverse IPs. Advanced toolsets and standardized design approaches are required to meet these challenges head-on and elevate the potential of chiplets in automotive innovation. In the following discourse, we will explore in detail the significance of chiplets in the context of automotive electronics, the obstacles designers face when working with this paradigm, and how Cadence comprehensive suite of IPs, tools, and flows is pioneering solutions to streamline the chiplet design process.

Unveiling Chiplets in Automotive Electronics

For automotive electronics, chiplets offer a methodology to modularize complex functionalities, integrate different chiplets into a package, and significantly enhance scalability and manufacturability. By breaking down semiconductor designs into a collection of chiplets, each fulfilling specific functions, automotive manufacturers can mix and match chiplets to rapidly prototype new designs, update existing ones, and specialize for the myriad of use cases found in vehicles today.

The increasing significance of chiplets in automotive electronics comes as a response to several industry-impacting phenomena. The most obvious among these is the physical restriction of Moore's Law, as large die sizes lead to poor yields and escalating production costs. Chiplets with localized process specialization can offer superior functionality at a more digestible cost, maintaining a growth trajectory where monolithic designs cannot. Furthermore, chiplets support the assembly of disparate technologies onto a single subsystem, providing a comprehensive yet adaptive solution to the diverse demands present in modern vehicles, such as central computing units, advanced driver-assistance systems (ADAS), infotainment units, and in-vehicle networks. This chiplet-based approach to functional integration in automotive electronics necessitates intricate design, optimization, and validation strategies across multiple domains.

The Complexity Within Chiplets

Yet, with the promise of chiplets comes a series of intricate design challenges. Chiplets necessitate working across multiple substrates and technologies, rendering the once-familiar 2-dimensional design space into the complex reality of multi-layered, sometimes even three-dimensional domains. The intricacies embedded within this design modality mandate devoting considerable attention to partitioning trade-offs, signal integrity across multiple substrates, thermal behavior of stacked dies, and the emergence of new assembly design kits to complement process design kits (PDKs).

To effectively address these complexities, designers must wield sophisticated tools that facilitate co-design, co-analysis, and the creation of a robust virtual platform for architectural exploration. Standardizations like the Universal Chip Interconnect Express (UCIe) have been influential, providing a die-to-die interconnect foundation for chiplets that is both standardized and automotive-ready. The availability of UCIe PHY and controller IP from Cadence and other leading developers further eases the integration of chiplets in automotive designs.

The Role of Foundries and Packaging in Chiplets

Foundries have also pivoted their services to become a vital part of the chiplet process, providing specialized design kits that cater to the unique requirements of chiplets. In tandem, packaging has morphed from being a mere logistical afterthought to a value-added aspect of chiplets. Organizations now look to packaging to deliver enhanced performance, reduced power consumption, and the integrity required by the diverse range of technologies encompassed in a single chip or package. This shift requires advanced multiscale design and analysis strategies that resonate across a spectrum of design domains.

Tooling Up for Chiplets with Cadence

Cadence exemplifies the rise of comprehensive tooling and workflows to facilitate chiplet-based automotive electronics design. Their integrations address the challenges that chiplet-based SoCs present, ensuring a seamless design process from the initial concept to production. The Cadence suite of tools is tailored to work across design domains, ensuring coherence and efficiency at every step of the chiplet integration process.

For instance, Cadence Virtuoso RF subflows have become critical in navigating radio frequency (RF) challenges within the chiplets, while tools such as the Integrity 3D-IC Platform and the Allegro Advanced Multi-Die Package Design Solution have surfaced to enable comprehensive multi-die package designs. The Integrity Signal Planner extends its capabilities into the chiplet ecosystem, providing a centralized platform where system-wide signal integrity can be proactively managed. Sigrity and Celsius, on the other hand, offer universally applicable solutions that take on the challenges of chiplets in signal integrity and thermal considerations, irrespective of the design domain. Each of these integrated analysis solutions underscores the intricate symphony between technology, design, and packaging essential in unlocking the potential of chiplets for automotive electronics.

Cadence portfolio includes solutions for system analysis, optimization, and signoff to complement these domain-specific tools, ensuring that the challenges of chiplet designs don't halt progress toward innovative automotive electronics. Cadence enables designers to engage in power- and thermal-aware design practices through their toolset, a necessity as automotive systems become increasingly sophisticated and power-efficient.

A Standardized Approach to Success with Chiplets

Cadence’s support for UCIe underscores the criticality of standardized approaches for heterogeneous integration by conforming to UCIe standards, which numerous industry stakeholders back. By co-chairing the UCIe Automotive working group, Cadence ensures that automotive designs have a universal and standardized Die-to-Die (D2D) high-speed interface through which chiplets can intercommunicate, unleashing the true potential of modular design.

Furthermore, Cadence champions the utilization of virtual platforms by providing transaction-level models (TLMs) for their UCIe D2D IP to simulate the interaction between chiplets at a higher level of abstraction. Moreover, individual chiplets can be simulated within a chiplet-based SoC context leveraging virtual platforms. Utilizing UVM or SCE-MI methodologies, TLMs, and virtual platforms serve as first lines of defense in identifying and addressing issues early in the design process before physical silicon even enters the picture.

Navigating With the Right Tools

The road to chiplet-driven automotive electronics is one paved with complexity, but with a commitment to standards, it is a path that promises significant rewards. By leveraging Cadence UCIe Design and Verification IP, tools, and methodologies, automotive designers are empowered to chart a course toward chiplets and help to establish a chiplet ecosystem. With challenges ranging from die-to-die interconnect to standardization, heterogeneous integration, and advanced packaging, the need for a seamless integrated flow and highly automated design approaches has never been more apparent. Companies like Cadence are tackling these challenges, providing the key technology for automotive designers seeking to utilize chiplets for the next-generation E/E architecture of vehicular technology.

In summary, chiplets have the potential to revolutionize the automotive electronics industry, breathing new life into the way vehicles are designed, manufactured, and operated. By understanding the significance of chiplets and addressing the challenges they present, automotive electronics is poised for a paradigm shift—one that combines the art of human ingenuity with the power of modular and scalable microchips to shape a future that is not only efficient but truly intelligent.

Learn more about how Cadence can help to enable automakers and OEMs with various aspects of automotive design.

Hi Cadence & forumers, 

I am running a conformal LEC with a flattened netlist against RTL. 

The run hang for 5 days at the "analyze abort" step which is automatically launched by the compare. 

The netlist is flattened at some levels so hierarchical flow which I tried didn't help much. The flattened/highly optimized netlist is from customer and the ultimate goal. How shall I proceed now? 

On the a side note, a test run with a hierarchical netlist from a simple DC "compile -map_effort medium" command finished after 1 day or so. 

Thank you! 

// Command: vpx compare -verbose -ABORT_Print -NONEQ_Print -TIMEstamp
// Starting multithreaded comparison ...
Comparing 241112 points in parallel.

// Multithreading Overhead: 38% Gates: 8501606/6168138
// Multithreaded processing completed.
================================================================================
Compared points PO DFF DLAT BBOX CUT Total
--------------------------------------------------------------------------------
Equivalent 1025 241638 30 75 21 242789
--------------------------------------------------------------------------------
Abort 0 124 0 0 0 124
================================================================================
Compare results of instance/output/pin equivalences and/or sequential merge
================================================================================
Compared points DFF Total
--------------------------------------------------------------------------------
Equivalent 204 204
================================================================================
// Warning: 512 DFFs/DLATs have 1 disabled clock port: skipped data cone comparison
// Resolving aborts by analyze abort...

I'm currently trying to explore the verilog simulation option in cadence.

One thing that comes to my mind that if there exists a way in cadence workflow to dump selected register/wire's waveform during the simulation. 

Are there any additional tools needed apart from xcelium, is there a tutorial or specific training course for this aspect. I glance through Xcelium Simulator Course Version 22.09, but it seems not having related context. 

I know in Synopsys's workflow, it can be realized using verdi & fsdb in the command line as follows:

if (inst.CTRL_STATE==STATE_START_TO_DUMP)

$fsdbDumpvars(0, inst_1.reg_0);

end

Thanks in advance!

Hi，

I want to delete via use skill，but i dont write this skill. can you help me.

This skill has Interactive interface，the interface can imput  Select Net and select padstack；

I can  use temp group to select the via；

example，i want to delete via，the padstack is L1:L3，the net is vss. i can imput padstack  L1:L3 and select net: VSS；

Note: The green is VSS，the padstack L1:L3 and L3:L5 ；

thanks

Hi, 

I am running a regression in order to collect the coverage. However I have an issue. I am setting a signal to 0 when reset is de-asserted  then this signal takes a fixed value when the reset is asserted. 

if(!rst_n) 
init_val= 'b0;

else 

init_val= 31'h34013FF7

the issue is that I got 0%  coverage for the init_value since we only have a rising edge and the signal is not toggling during the simulation. is there an option to collect coverage when there is a rising edge or a falling edge? 

As noted in white papers, posts on the Team Specman Blog, and the Specman documentation, IntelliGen is a totally new stimulus generator than the original "Pgen" and, as a result, there is some amount of effort needed to migrate an existing verification environment to fully leverage the power of IntelliGen.  One of the main steps in migrating code is running the linters on your code and adressing the issues highlighted. 

Included below is a simple utility you can include in your environment that allows you to collect some valuable statistics about your code base to allow you to better gauge the amount of work that might be required to migrate from Pgen to IntelliGen.  The ICFS statistics reported are of particular benefit as the utility not only identifies the approximate number of ICFSs in the environment, it also breaks the total number down according to generation contexts (structs/units and gen-on-the-fly statements) allowing you to better focus your migration efforts. 

IMPORTANT: Sometimes a given environment can trigger a large number of IntelliGen linting messages right off the bat.  Don't let this freak you out!  This does not mean that migration will be a long effort as quite often some slight changes to an environment remove a large number of identified issues.  I recently encountered a situation where a simple change to three locations in the environment, removed 500+ ICFSs!

The methods included in the utility can be used to report information on the following:
- Number of e modules
- Number of lines in the environment (including blanks and comments)
- Number and type of IntelliGen Guidelines linting messages
- Number of Inconsistently Connected Field Sets (ICFSs)
- Number of ICFS contexts and how many ICFSs per context
- Number of soft..select overlays found in the envioronment
- Number of Laces identified in the environment

To use the code below, simply load it before/after loading e-code and then
you can execute any of the following methods:

- sys.print_file_stats()             : prints # of lines and files
- sys.print_constraint_stats()   : prints # of constraints in the environment
- sys.print_guideline_stats()    : prints # of each type of linting message
- sys.print_icfs_stats()            : prints # of ICFSs, contexts and #ICFS/context
- sys.print_soft_select_stats() : prints # of soft select overlay issues
- sys.print_lace_stats()           : *Only works for SPMNv6.2s4 and later* prints # of laces identified in the environment

Each of the above calls to methods produces it's own log files (stored in the current working directory) containing relevant information for more detailed analysis.
- file_stats_log.elog : Output of "show modules" command
- constraint_log.elog : Output of the "show constraint" command
- guidelines_log.elog : Output of "gen lint -g" (with notification set to MAX_INT in order to get all warnings)
- icfs_log.elog       : Output of "gen lint -i" command
- soft_select_log.elog: Output of the "gen lint -s" command
- lace_log.elog       : Output of the "show lace" command

Happy generating!

Corey Goss

Melika Roshandell talks with David Malinak in a Microwaves & RF QuickChat video about the thermal challenges in today’s complex electronic designs and how the Celsius solver uniquely addresses them.(read more)

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By combining finite element analysis with computational fluid dynamics, designers can perform complete thermal system analysis using a single tool.(read more)

Dear Community,

I have created a PCB layout with multiple high-speed nets, I want to check the SI like how signals are reflected and taken to each other.

I have the OrCAD X Professional, how to check the reflection and crosstalk using the OrCAD X Professional software version 24.1.

I want to create a topology flow to the PCB layout and perform the reflection and crosstalk.

Regards,

Rohit Rohan

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Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.