An open loop clock divider circuit includes (a) a first divider configured to receive an incoming clock signal and output a first divided clock signal, (b) a flying-adder synthesizer configured to fractionally divide the first divided clock signal and output a fractionally divided clock signal, and (c) a second divider configured to receive the fractionally divided clock signal and output a second divided clock signal. The open loop clock divider circuit advantageously provides a fractional divider in which there is no feedback loop between the source frequency (fs) and the destination frequency (fd). Methods of generating a divided clock signal involving the open loop clock divider circuit are also disclosed.

A digital fractional frequency divider for fractionally dividing a digital frequency signal can include a plurality of clock division counter modules, a plurality of sampling modules, and a summing module. The plurality of clock division counter modules can each receive an input clock signal that is phase-shifted from a remaining plurality of input clock signals. Each clock division counter module can generate a long periodic pulse from the received input clock signal. Each sampling module can couple to an output of one of the plurality of clock division counter modules and can generate a short periodic pulse from the long periodic pulse. The summing module can sum the plurality of short periodic pulses to generate a fractional frequency clock signal.

The present invention relates to a liquid crystal display (LCD) device. More particularly, the present invention relates to an LCD device including a thin film transistor (TFT) compensation circuit in an LCD device which implements a driving circuit by using an oxide TFT, the LCD device capable of compensating for degraded characteristics of a TFT due to threshold voltage shift. As the compensation circuit including a dummy TFT is formed on a non-active area of the LC panel, the degree of threshold voltage shift of the DT due to a DC voltage can be sensed. Based on the sensed result, a threshold voltage of a second TFT can be compensated. This can reduce lowering of a device characteristic.

Some embodiments of the invention relate to function elements for fixing in seat rails of aircraft. The function element according to the invention may include: a fixing rail with a web running in the x direction and a multiplicity of extensions which protrude beyond the web in a y direction to form a T profile, wherein the fixing rail is formed corresponding to the seat rail such that the fixing rail can be inserted in the seat rail and moved along the x direction into a holding position in which the extensions sit between the holes below the slots, at least one fixing peg which is arranged mobile on the fixing rail and can be brought into a blocking position in which the fixing peg engages in a hole of the seat rail so that the function element is fixed in the x direction.

An example wheel restraint includes a track to be positioned adjacent a vehicle approach path of a loading dock. A shuttle is pivotally coupled to the track via a track follower and pivots between a home position and a deployed position about a shuttle axis substantially parallel to and offset relative to a longitudinal axis of the track. A barrier is pivotally coupled to the shuttle and pivots between a non-blocking position and a blocking position about a pivot axis substantially parallel to and spaced apart from the longitudinal axis of the track such that the shuttle rotates in a first direction about the shuttle axis when the shuttle moves from the home position to the deployed position and bather rotates in a second direction about the pivot axis when the barrier moves from the non-blocking position to the blocking position, where the first direction being different than the second direction.

A box stop device includes a base member and a raised member attached to the base member. The base member has a top surface and a bottom surface. The top surface may be flat. The bottom surface may be adapted to attach to a desired surface. The raised member may be attached to the base member and may extend approximately vertically from the top surface. The raised member may include a first side and a second side. The first side and the second side may be attached together at an angle of approximately 90 degrees.

An apparatus and method for providing a removable anchor for use in tying down a load, or for securing a winch cable for use in recovering a disabled vehicle or other load. The anchor may be removably attached to the deck/bed of a trailer or vehicle (e.g., a car carrier or wrecker/tow truck), using one or more slots or stake pockets located on a cargo surface of the deck. The removable anchor may include: a projection member shaped and sized to fit into a slot on the cargo surface, or to protrude through a stake pocket; a crown attached to, or integrally forming a part of, the projection member, and configured to receive and anchor one or more tie down connectors; and a key attached to, or integrally forming a part of, the projection member. The key can be passed into the slot and manipulated between removable and locked positions. Alternatively, the key may be used to removably secure the anchor to the stake pocket.

Techniques for resolving a metastable state in a synchronizer are described herein. In one embodiment, a circuit for resolving a metastable state in a synchronizer comprises a signal delay circuit coupled to a node of the synchronizer, wherein the signal delay circuit is configured to delay a data signal at the node to produce a delayed data signal, and a transmission circuit coupled to the signal delay circuit, wherein the transmission circuit is configured to couple the delayed data signal to the node after a delay from a first edge of a clock signal.

A method for quickly calibrating a memory interface circuit from time to time in conjunction with operation of a functional circuit is described. The method uses controlling the memory interface circuit with respect to read data capture for byte lanes, including controlling CAS latency compensation for the byte lanes. In the method control settings for controlling CAS latency compensation are determined and set according to a dynamic calibration procedure performed from time to time in conjunction with functional operation of a circuit system containing one or more memory devices connected to the memory interface circuit. In the method, determining and setting the control settings for controlling CAS latency compensation is performed independently and parallely in each of the byte lanes.

Multi-threshold flash Null Convention Logic (NCL) includes one or more high threshold voltage transistors within a flash NCL gate to reduce power consumption due to current leakage by transistors of the NCL gate. High-threshold voltage transistors may be added and/or may be used in place of one or more lower voltage threshold transistors of the NCL gate. A high-Vt device is included in the pull-up path to reduce power when the flash NCL logic gate is in the null state.

A system and methods that generates a physical unclonable function (“PUF”) security key for an integrated circuit (“IC”) through use of equivalent resistance variations in the power distribution system (“PDS”) to mitigate the vulnerability of security keys to threats including cloning, misappropriation and unauthorized use.

A multi-chip package may include first and second integrated circuit dies that are each partitioned into multiple logic regions. The logic regions of the first and second dies may be coupled via interconnects. Each integrated circuit die may include at least one spare logic region. Multiple logic groups may be formed with each logic group including logic regions from the first and second integrated circuit dies and the interconnects that couple those logic regions. The logic groups may be evaluated to identify defective logic groups. In response to identifying a defective logic group, the defective logic group may be repaired by configuring the first and second integrated circuit dies to stop using the defective logic group and to use a spare logic group. The spare logic group may include spare logic regions of the first and second dies that are coupled by spare logic region interconnects.

An impedance tuning circuit includes a calibration unit and a post-processing unit. The calibration unit generates an initial pull-up code and an initial pull-down code by performing a calibration operation using an external resistor during an initial impedance tuning operation. The post-processing unit outputs the initial pull-up code and the initial pull-down code as a final pull-up code and a final pull-down code during the initial impedance tuning operation, and generates the final pull-up code and the final pull-down code by using the initial pull-up code and the initial pull-down code during a subsequent impedance tuning operation.

According to one embodiment, a first oscillator has an oscillation frequency that is changed depending on a temperature. A second oscillator has different temperature characteristics from the first oscillator. An on-chip heater heats the first oscillator and the second oscillator. A counter counts a first oscillation signal of the first oscillator. An ADPLL generates a third oscillation signal on the basis of a second oscillation signal of the second oscillator and corrects the frequency of the third oscillation signal on the basis of a count value of the counter.

A circuit for a single differential-inductor oscillator with common-mode resonance may include a tank circuit formed by coupling a first inductor with a pair of first capacitors; a cross-coupled transistor pair coupled to the tank circuit; and one or more second capacitors coupled to the tank circuit and the cross-coupled transistors. The single differential-inductor oscillator may be configured such that a common mode (CM) resonance frequency (FCM) associated with the single differential-inductor oscillator is at twice a differential resonance frequency (FD) associated with the single differential-inductor oscillator.

The present disclosure relates to nanoresonator oscillators or NEMS (nanoelectromechanical system) oscillators. A circuit for measuring the oscillation frequency of a resonator is provided, comprising a first phase-locked feedback loop locking the frequency of a controlled oscillator at the resonant frequency of the resonator, this first loop comprising a first phase comparator. Furthermore, a second feedback loop is provided which searches for and stores the loop phase shift introduced by the resonator and its amplification circuit when they are locked at resonance by the first loop. The first and the second loops operate during a calibration phase. A third self-oscillation loop is set up during an operation phase. It directly links the output of the controllable phase shifter to the input of the resonator. The phase shifter receives the phase-shift control stored by the second loop.

A digitally controlled oscillator has a high-order ΔΣ modulator configured to be of at least an order higher than a first order and configured to input a digital control signal and output a pseudorandom digital output signal, a first-order ΔΣ modulator configured to input the pseudorandom digital output signal and generate a control pulse signal including a pulse width corresponding to the pseudorandom digital output signal, a low pass filter configured to pass a low frequency component of the control pulse signal, and an oscillator configured to generate a high-frequency output signal whose frequency is controlled based on the control pulse signal outputted by the low pass filter so as to be a frequency corresponding to the digital control signal.

The invention concerns an oscillator generating a wave composed of a frequency of on the order of terahertz from a beat of two optical waves generated by a dual-frequency optical source. The oscillator includes a modulator the transfer function of which is non-linear for generating harmonics with a frequency of less than one terahertz for each of the optical waves generated by the dual-frequency optical source, an optical detector able to detect at least one harmonic for each of the optical waves generated by the dual-frequency optical source and transforming the harmonics detected into an electrical signal, a phase comparator for comparing the electrical signal with a reference electrical signal, and a module for controlling at least one element of the dual-frequency optical source with a signal obtained from the signal resulting from the comparison.

An atomic oscillator includes: a gas cell which includes two window portions having a light transmissive property and in which metal atoms are sealed; a light emitting portion that emits excitation light to excite the metal atoms in the gas cell; a light detecting portion that detects the excitation light transmitted through the gas cell; a heater that generates heat; and a connection member that thermally connects the heater and each window portion of the gas cell to each other.

Systems and methods for switching impedance are provided. In some aspects, a system includes first and second impedance elements and an impedance switch module, which includes a third impedance element coupled between the first and second impedance elements and a switch parallel to the third impedance element. The switch is coupled between the first and second impedance elements, and is configured to switch between an open configuration and a closed configuration. An electrical path is completed between the first impedance element and the second impedance element via the first switch in the closed configuration. The electrical path is not completed in the open configuration. A total impedance of the first impedance element, the second impedance element, and the impedance switch module is varied based on the switching between the open configuration and the closed configuration.

A system is disclosed for a voltage controlled oscillator (“VCO”) having a large frequency range and a low gain. Passive or active circuitry is introduced between at least one VCO cell in the voltage controlled oscillator and the voltage source for the VCO cell which reduces a gain value for the VCO to maintain stability of the system.

The invention relates to a method for operating control equipment (1) of a resonance circuit (2), wherein the control equipment (1) comprises at least two circuit elements (8, 9) connected in series, in particular each comprising a recovery diode (13, 14) connected in parallel, between which a connection (6) of the resonance circuit (2) is connected. According to the invention, the circuit elements (8, 9) are actuated as a function of the voltage detected at the connection (6). The invention further relates to control equipment (1) of a resonance circuit (2).

Disclosed are a phase locked loop (PLL) of a digital scheme and a method thereof. More specifically, disclosed are a digital phase locked loop having a time-to-digital converter (TDC), a digital loop filter (DLF), and a digitally controlled oscillator (DCO), and that is designed to have a constant jitter characteristic at all times even though an operating condition of a circuit varies according to a process, voltage, temperature (PVT) change, and a method thereof.

A current output control device is provided that includes: a current cell array section including plural current cell circuits that are each connected in parallel between a first terminal (power source) and a second terminal (ground) that connect between the first terminal and the second terminal in by operation ON so as to increase control current flowing between the first terminal and the second terminal; and a code conversion section (decoder) that generates signals (row codes, column codes) to ON/OFF control current cells so as to change the number of current cells that connect the first terminal and the second terminal according to change in an externally input code and that inputs the generated signals to the current cell array section.

The switching element is provided in a state of being electromagnetically coupled to the cavity resonator of the high frequency oscillator; the bias voltage applying terminal is connected to one electrode of the switching element; another electrode of the switching element is electrically connected to the cavity resonator (the anode shell in FIG. 1); the metal plate having a size enough for reflecting an electric wave to be transmitted before and after the switching element in a high-frequency manner is provided at any one end of the switching element; and by applying a bias voltage to the switching element and varying that, a reactance of the switching element is changed and a resonance frequency of the cavity resonator is varied. By this method, an oscillation frequency can be varied greatly relative to a small change in a bias voltage.

Pressure relief/drainage valve for a concrete pumper having a valve body with an axially extending passageway through which concrete flowing in a pumping line passes, an outlet port in a side wall of the passageway, and a valve member which prevents concrete from passing through the port when the valve is a closed position and permits concrete to discharge through the outlet port when the valve is in an open position.

Water valves and methods of regulating fluid flow for low ambient pressure water sources that reduce the amount of filtration needed for valve mechanisms operating in the water source.

A flow control valve element has a generally spherical ball. An inlet is formed in the ball. An outlet is also formed in the ball, the outlet opposing the inlet. A hollowed-out portion extends between the inlet and the outlet. A pair of opposing flats are formed in the ball, the flats each having a first flat portion formed in an external portion of the ball and an opposing second flat portion formed in the hollowed-out portion of the ball.

A sheet handling apparatus includes a sheet folding unit configured to perform folding on a sheet; and a sheet stacking unit configured to stack the folded sheet on a sheet stacking surface having an inclined surface and a horizontal surface in order from upstream to downstream in a sheet conveying direction. A downstream end of the inclined surface is higher than an upstream end of the inclined surface with respect to a horizontal plane. The sheet handling apparatus also includes a discharging unit configured to discharge the folded sheet to the sheet stacking unit; a sheet conveying unit configured to convey the discharged sheet from the inclined surface to the horizontal surface; and a conveying force applying unit configured to apply a conveying force to the sheet in contact with an upper surface of the sheet from above the inclined surface.

A sheet binding apparatus which forms concavity and the convexity on a sheet bundle including a plurality of sheets in a thickness direction so as to bind the sheet bundle, the sheet binding apparatus includes: a pair of concave-convex members, each of which has concave-convex portion in the thickness direction of the sheet bundle and which forms the concavity and the convexity on the sheet bundle in the thickness direction while niping the sheet bundle therebetween; wherein in the pair of concave-convex members, one of the concave-convex members has a greater difference in height of the concave-convex portion than that of the other concave-convex member which engages with the above-described concave-convex member.

In the invention, for a first sheet, regardless of the sheet size (width), a lateral registration detector is moved in a direction towards an edge face of the sheet from a home position to detect the edge face of the sheet. With lateral deviation in the sheet position corrected, punching is performed by a puncher. For the second and subsequent sheets, the lateral registration detector is moved in advance to near the edge face of the sheet with reference to the detected position of the sheet edge of the first sheet, and the edge face is detected at a given timing. With lateral deviation in the sheet position corrected, punching is performed by the puncher.

A multi-function binding machine is proposed. The multi-function binding machine (700) comprises a binding station (135) for binding blocks of signatures (105), and a feeding station (115) for receiving signatures in succession, opening the signatures, and feeding the signatures to the binding station; in the solution according to an embodiment of the invention, the multi-function binding machine further comprises a further feeding station (715) for receiving pre-signatures in successions, folding groups of at least one pre-signature into further signatures (729), and feeding the further signatures to the binding station.

A land grid array (LGA) package including a substrate having a plurality of lands formed on a first surface of the substrate, a semiconductor chip mounted on a second surface of the substrate, a connection portion connecting the semiconductor chip and the substrate, and a support layer formed on part of a surface of a first land.

An apparatus including a die including a dielectric material on a device side, an insulating layer surrounding a die area and embedding a thickness dimension of the die; and a carrier including a plurality of layers of conductive material disposed on the device side of the die, a first one of the layers of conductive materials being formed on the insulating layer and patterned into traces at least a portion of which are connected to respective contact points on the die. A method including disposing a die on a sacrificial substrate with a device side of the die opposite the sacrificial substrate; disposing a mold on the sacrificial substrate around; introducing an insulating material into a chase of the mold; removing the mold; forming a carrier on the insulating material adjacent a device side of a die; and separating the die and the carrier from the sacrificial substrate.

The present invention relates to a camera module including: a lens unit mounted with at least one or more lenses; an image sensor mounted with an image pickup device for converting a light converged through the lenses to an electric signal; a PCB (Printed Circuit Board) mounted with the image sensor; and a holder accommodated inside the lens unit for supporting the lens unit, wherein the lens unit is bonded and fixed at an inner surface of the holder, whereby the lens unit mounted with a plurality of lenses is bonded to a lateral surface of a holder to prevent generation of vertical tilting phenomenon at the lens unit caused by a conventional improper coating of epoxy, and particularly, the coating of epoxy on the lateral surface of the holder advantageously enhances adhesive power to increase a bonded area.

Described herein are methods and systems for providing corrective maintenance using global knowledge sharing. A method to provide corrective maintenance with a CM system includes performing a query to generate a ranking of fixable causes based on factors (e.g., symptoms, configuration, test). The ranking may be determined based on a fixable cause percent match with the factors. The ranking of fixable causes may be associated with one or more solutions for each fixable cause. The ranking can be updated based on performing tests or solutions.

A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby.

A semiconductor device has a protective layer formed over an active surface of a semiconductor wafer. The semiconductor die with pre-applied protective layer are moved from the semiconductor wafer and mounted on a carrier. The semiconductor die and contact pads on the carrier are encapsulated. The carrier is removed. A first insulating layer is formed over the pre-applied protective layer and contact pads. Vias are formed in the first insulating layer and pre-applied protective layer to expose interconnect sites on the semiconductor die. An interconnect structure is formed over the first insulating layer in electrical contact with the interconnect sites on the semiconductor die and contact pads. The interconnect structure has a redistribution layer formed on the first insulating layer, a second insulating layer formed on the redistribution layer, and an under bump metallization layer formed over the second dielectric in electrical contact with the redistribution layer.

When forming sophisticated semiconductor-based gate electrode structures of transistors, the pre-doping of one type of gate electrode structure may be accomplished after the actual patterning of the electrode material by using an appropriate mask or fill material for covering the active regions and using a lithography mask. In this manner, a high degree of flexibility is provided with respect to selecting an appropriate patterning regime, while at the same time a uniform and superior cross-sectional shape for any type of gate electrode structure is obtained.

In a semiconductor device, where, with respect to a parasitic resistor in a current mirror circuit, a compensation resistor for compensating the parasitic resistor is provided in the current mirror circuit, the current mirror circuit includes at least two thin film transistors. The thin film transistors each have an island-shaped semiconductor film having a channel formation region and source or drain regions, a gate insulating film, a gate electrode, and source or drain electrodes, and the compensation resistor compensates the parasitic resistor of any one of the gate electrode, the source electrode, and the drain electrode. In addition, each compensation resistor has a conductive layer containing the same material as the gate electrode, the source or drain electrodes, or the source or drain regions.

A display device includes a display panel including a plurality of pixels arranged in a matrix form, each pixel including a plurality of sub-pixels, a lens module on the display panel, the lens module including a plurality of lenses having a pitch that corresponds to a horizontal pitch of the plurality of sub-pixels, and a driving unit configured to drive the display panel and the lens module to provide an image displayed by the display panel to a left eye of a viewer at a first frame and to provide the image displayed by the display panel to a right eye of the viewer at a second frame.

Provided is a back plate component having reflective sheet reinforcing structure. The back plate component includes: a frame, a reflective sheet and a plurality of supporting film sheets. The frame includes a plurality of lateral beams and vertical beams, and at least one hollow part is included between the lateral beams and the vertical beams. The reflective sheet is attached to the frame, and includes a reflective surface and a back surface corresponding to the reflective surface. A portion of the back surface covers the whole hollow part. The plurality of supporting film sheets is attached to the back surface at a region corresponding to the hollow part, and includes a material the same as that of the reflective sheet. A liquid crystal display device is further disclosed herein.

An optical switch for performing high extinction ratio switching of an optical signal includes a beam polarizing element and one or more optical elements. The optical elements are configured to direct an optical signal along a first or second optical path based on the polarization state of the optical signal as it passes through the optical elements. The optical switch performs high extinction ratio switching of the optical signal by preventing unwanted optical energy from entering an output port by using an absorptive or reflective optical element or by directing the unwanted optical energy along a different optical path.

The liquid crystal display device includes an island-shaped first semiconductor film 102 which is formed over a base insulating film 101 and in which a source 102d, a channel forming region 102a, and a drain 102b are formed; a first electrode 102c which is formed of a material same as the first semiconductor film 102 to be the source 102d or the drain 102b and formed over the base insulating film 101; a second electrode 108 which is formed over the first electrode 102c and includes a first opening pattern 112; and a liquid crystal 110 which is provided over the second electrode 108.

The liquid crystal display device includes an island-shaped first semiconductor film 102 which is formed over a base insulating film 101 and in which a source 102d, a channel forming region 102a, and a drain 102b are formed; a first electrode 102c which is formed of a material same as the first semiconductor film 102 to be the source 102d or the drain 102b and formed over the base insulating film 101; a second electrode 108 which is formed over the first electrode 102c and includes a first opening pattern 112; and a liquid crystal 110 which is provided over the second electrode 108.

Monoclonal antibodies (mAbs) having thyroid stimulating activity (TSAb), especially full or considerably agonistic activity, or thyroid blocking activity (TBAb), which are obtainable by genetic immunization of mice, or fragments (F(ab')2, Fab or Fv) or humanized forms of such monoclonal antibodies or single chain forms (SCA; scFv) of such fragments, which antibodies, or their fragments, compete with bovine TSH for epitopes of the human TSHr, compete with autoantibodies from sera from Graves' patients as well as with autoantibodies from sera from patients harboring blocking autoantibodies for epitopes of the human TSHr, bind to conformational epitopes of the human TSHr located in the first 281 amino acids of the human TSHr, and usually also bind to TSFR receptors (TSHr) from different animals. Various uses of such antibodies, or of peptides corresponding to variable regions of such antibodies, are also described and claimed.

The invention relates to methods and compositions for identifying and selecting maize plants with enhanced resistance to northern leaf blight. Maize plants generated by the methods of the invention are also a feature of the invention.

Isolated polynucleotides and polypeptides and recombinant DNA constructs particularly useful for altering agronomic characteristics of plants under nitrogen limiting conditions, compositions (such as plants or seeds) comprising these recombinant DNA constructs, and methods utilizing these recombinant DNA constructs. The recombinant DNA construct comprises a polynucleotide operably linked to a promoter functional in a plant, wherein said polynucleotide encodes an LNT1 polypeptide.

This invention provides recombinant DNA constructs and methods for manipulating expression of a target gene that is regulated by a small RNA, by interfering with the binding of the small RNA to its target gene. More specifically, this invention discloses recombinant DNA constructs encoding cleavage blockers, 5-modified cleavage blockers, and translational inhibitors useful for modulating expression of a target gene and methods for their use. Further disclosed are miRNA targets useful for designing recombinant DNA constructs including miRNA-unresponsive transgenes, miRNA decoys, cleavage blockers, 5-modified cleavage blockers, and translational inhibitors, as well as methods for their use, and transgenic eukaryotic cells and organisms containing such constructs.

The invention relates to genes coding for TCP family transcription factors and having a biological role in the development of axillary buds and branch growth. Furthermore, the invention relates to the promoters of the transcription of said genes, to the genetic constructs containing same and to the uses thereof, including the use of agents that modulate the expression of these genes in order to modify plant architecture.