Read the in depth Review of ZOTAC GAMING GeForce RTX 3080 Ti AMP Holo Graphics Card PC Components. Know detailed info about ZOTAC GAMING GeForce RTX 3080 Ti AMP Holo Graphics Card configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

Read the in depth Review of NVIDIA GeForce RTX 3070 Ti Graphics Card PC Components. Know detailed info about NVIDIA GeForce RTX 3070 Ti Graphics Card configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

Read the in depth Review of NVIDIA GeForce RTX 4090 Graphics Card PC Components. Know detailed info about NVIDIA GeForce RTX 4090 Graphics Card configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

Read the in depth Review of AMD Radeon RX 7900 XTX Graphics Card PC Components. Know detailed info about AMD Radeon RX 7900 XTX Graphics Card configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

Read the in depth Review of GIGABYTE GeForce RTX 4070 Ti AERO OC 12G Graphics Card PC Components. Know detailed info about GIGABYTE GeForce RTX 4070 Ti AERO OC 12G Graphics Card configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

Read the in depth Review of NVIDIA GeForce RTX 4070 Graphics Card PC Components. Know detailed info about NVIDIA GeForce RTX 4070 Graphics Card configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

Read the in depth Review of AMD Radeon RX 7600 Graphics Card PC Components. Know detailed info about AMD Radeon RX 7600 Graphics Card configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

On September 2 (3pm UTC / 11am EDT), I'll be joining Jonathon Karelse, CEO of NorthFind Management, for an interactive "fireside chat" on the application of Behavioral Economics in demand planning. This is part of the Foresight Webinar Series, and registration is free. Since we first met at an Institute [...]

The post Behavioral economics in demand planning (webinar September 2) appeared first on The Business Forecasting Deal.

Kamala Devi Harris was born on October 20, 1964, in Oakland, California, to immigrant parents.

Positioned near the side of her head, the eye provides an expansive field of vision, while a thick layer of protective blubber shields it from harm and maintains warmth.

PCI-SIG DevCon 2024 was a great success for Cadence. We posted the blog, Cadence Demonstrates Complete PCIe 7.0 Solution at PCI-SIG DevCon ‘24 a day before the event to advertise our IP solutions for PCIe 7.0, which resulted in a lot of extra traffic at our booth. All of the attendees were excited to see Cadence demonstrate the robustness of 128GT/s PCIe 7.0 IP's TX and RX capabilities over a real-world, low-latency, non-retimed, linear optics connector. We achieved and maintained a consistent, impressive pre-FEC BER of ~3E-8 (PCIe spec requires 1E-6) for the entire duration of the event, spanning over two full days with no breaks. This provides an ample margin for RS FEC. As seen in the picture below, the receiver Eye PAM4 histograms have good linearity and margin. This is the world’s first stable demonstration of 128 GT/s TX and RX over off-the-shelf optical connectors—by far the main attraction of DevCon this year.

Cadence 128 GT/s TX and RX capability over optics

Block diagram of Cadence PHY for PCIe 7.0 128 GT/s demo setup with linear pluggable optics

As a leader in PCIe, our PCIe controller architect Anish Mathew shared his valuable insights on an important topic: “Impact of UIO ECN on PCIe Controller Design and Performance,” highlighting the strides made by the Cadence design team in achieving this implementation.

Anish Mathew presenting “Impact of UIO ECN on PCIe Controller Design and Performance”

In summary, Cadence had a dominating presence on the demo floor with a record number of PCIe demos:

• PCIe 7.0 over optics
• PCIe 7.0 electrical
• PCIe 6.0 RP/EP interop back-to back
• PCIe 6.0 protocol in FLIT mode with Lecroy Exerciser (at Cadence booth)
• PCIe 6.0 protocol in FLIT mode (at the Lecroy booth)
• PCIe 6.0 JTOL with Anritsu and Tektronix equipment (at Tektronix booth)
• PCIe 6.0 protocol with Viavi Protocol Analyzer (at Viavi booth)
• PCIe 6.0 System Level Interop Demo with Gen5 platform (at SerialTek booth)

The Cadence team and its partners did a great job in coordinating and setting up the demos that worked flawlessly. This was the culmination of many weeks of hard work and dedication. Four different vendors featured our IP for PCIe 6.0. They attracted a lot of attention and drove traffic back to us.

Highlights of Cadence demos for PCIe 7.0 and 6.0

Cadence team at the PCI-SIG Developers Conference 2024

Thanks to everyone who attended the 32nd PCI-SIG DevCon. We really appreciate your interest in Cadence IP, and a big thanks to our partners and customers for all the positive feedback and for creating so much buzz for the Cadence brand.

In the rapidly evolving landscape of automotive electronics, traditional monolithic design approaches are giving way to something more flexible and powerful—chiplets. These modular microchips, which are themselves parts of a whole silicon system, offer unparalleled potential for improving system performance, reducing manufacturing costs, and accelerating time-to-market in the automotive sector. However, the transition to working with chiplets in automotive electronics is not without its challenges.

Designers must now grapple with a new set of considerations, such as die-to-die interconnect standards, complex processes, and the integration of diverse IPs. Advanced toolsets and standardized design approaches are required to meet these challenges head-on and elevate the potential of chiplets in automotive innovation. In the following discourse, we will explore in detail the significance of chiplets in the context of automotive electronics, the obstacles designers face when working with this paradigm, and how Cadence comprehensive suite of IPs, tools, and flows is pioneering solutions to streamline the chiplet design process.

Unveiling Chiplets in Automotive Electronics

For automotive electronics, chiplets offer a methodology to modularize complex functionalities, integrate different chiplets into a package, and significantly enhance scalability and manufacturability. By breaking down semiconductor designs into a collection of chiplets, each fulfilling specific functions, automotive manufacturers can mix and match chiplets to rapidly prototype new designs, update existing ones, and specialize for the myriad of use cases found in vehicles today.

The increasing significance of chiplets in automotive electronics comes as a response to several industry-impacting phenomena. The most obvious among these is the physical restriction of Moore's Law, as large die sizes lead to poor yields and escalating production costs. Chiplets with localized process specialization can offer superior functionality at a more digestible cost, maintaining a growth trajectory where monolithic designs cannot. Furthermore, chiplets support the assembly of disparate technologies onto a single subsystem, providing a comprehensive yet adaptive solution to the diverse demands present in modern vehicles, such as central computing units, advanced driver-assistance systems (ADAS), infotainment units, and in-vehicle networks. This chiplet-based approach to functional integration in automotive electronics necessitates intricate design, optimization, and validation strategies across multiple domains.

The Complexity Within Chiplets

Yet, with the promise of chiplets comes a series of intricate design challenges. Chiplets necessitate working across multiple substrates and technologies, rendering the once-familiar 2-dimensional design space into the complex reality of multi-layered, sometimes even three-dimensional domains. The intricacies embedded within this design modality mandate devoting considerable attention to partitioning trade-offs, signal integrity across multiple substrates, thermal behavior of stacked dies, and the emergence of new assembly design kits to complement process design kits (PDKs).

To effectively address these complexities, designers must wield sophisticated tools that facilitate co-design, co-analysis, and the creation of a robust virtual platform for architectural exploration. Standardizations like the Universal Chip Interconnect Express (UCIe) have been influential, providing a die-to-die interconnect foundation for chiplets that is both standardized and automotive-ready. The availability of UCIe PHY and controller IP from Cadence and other leading developers further eases the integration of chiplets in automotive designs.

The Role of Foundries and Packaging in Chiplets

Foundries have also pivoted their services to become a vital part of the chiplet process, providing specialized design kits that cater to the unique requirements of chiplets. In tandem, packaging has morphed from being a mere logistical afterthought to a value-added aspect of chiplets. Organizations now look to packaging to deliver enhanced performance, reduced power consumption, and the integrity required by the diverse range of technologies encompassed in a single chip or package. This shift requires advanced multiscale design and analysis strategies that resonate across a spectrum of design domains.

Tooling Up for Chiplets with Cadence

Cadence exemplifies the rise of comprehensive tooling and workflows to facilitate chiplet-based automotive electronics design. Their integrations address the challenges that chiplet-based SoCs present, ensuring a seamless design process from the initial concept to production. The Cadence suite of tools is tailored to work across design domains, ensuring coherence and efficiency at every step of the chiplet integration process.

For instance, Cadence Virtuoso RF subflows have become critical in navigating radio frequency (RF) challenges within the chiplets, while tools such as the Integrity 3D-IC Platform and the Allegro Advanced Multi-Die Package Design Solution have surfaced to enable comprehensive multi-die package designs. The Integrity Signal Planner extends its capabilities into the chiplet ecosystem, providing a centralized platform where system-wide signal integrity can be proactively managed. Sigrity and Celsius, on the other hand, offer universally applicable solutions that take on the challenges of chiplets in signal integrity and thermal considerations, irrespective of the design domain. Each of these integrated analysis solutions underscores the intricate symphony between technology, design, and packaging essential in unlocking the potential of chiplets for automotive electronics.

Cadence portfolio includes solutions for system analysis, optimization, and signoff to complement these domain-specific tools, ensuring that the challenges of chiplet designs don't halt progress toward innovative automotive electronics. Cadence enables designers to engage in power- and thermal-aware design practices through their toolset, a necessity as automotive systems become increasingly sophisticated and power-efficient.

A Standardized Approach to Success with Chiplets

Cadence’s support for UCIe underscores the criticality of standardized approaches for heterogeneous integration by conforming to UCIe standards, which numerous industry stakeholders back. By co-chairing the UCIe Automotive working group, Cadence ensures that automotive designs have a universal and standardized Die-to-Die (D2D) high-speed interface through which chiplets can intercommunicate, unleashing the true potential of modular design.

Furthermore, Cadence champions the utilization of virtual platforms by providing transaction-level models (TLMs) for their UCIe D2D IP to simulate the interaction between chiplets at a higher level of abstraction. Moreover, individual chiplets can be simulated within a chiplet-based SoC context leveraging virtual platforms. Utilizing UVM or SCE-MI methodologies, TLMs, and virtual platforms serve as first lines of defense in identifying and addressing issues early in the design process before physical silicon even enters the picture.

Navigating With the Right Tools

The road to chiplet-driven automotive electronics is one paved with complexity, but with a commitment to standards, it is a path that promises significant rewards. By leveraging Cadence UCIe Design and Verification IP, tools, and methodologies, automotive designers are empowered to chart a course toward chiplets and help to establish a chiplet ecosystem. With challenges ranging from die-to-die interconnect to standardization, heterogeneous integration, and advanced packaging, the need for a seamless integrated flow and highly automated design approaches has never been more apparent. Companies like Cadence are tackling these challenges, providing the key technology for automotive designers seeking to utilize chiplets for the next-generation E/E architecture of vehicular technology.

In summary, chiplets have the potential to revolutionize the automotive electronics industry, breathing new life into the way vehicles are designed, manufactured, and operated. By understanding the significance of chiplets and addressing the challenges they present, automotive electronics is poised for a paradigm shift—one that combines the art of human ingenuity with the power of modular and scalable microchips to shape a future that is not only efficient but truly intelligent.

Learn more about how Cadence can help to enable automakers and OEMs with various aspects of automotive design.

Microwave Office is Cadence’s tool-of-choice for RF and microwave designers designing everything from III-V 5G chips, to RF systems in board and package technologies. These types of designs require close interaction between the schematic and its layout. A new Training Byte demonstrates how the schematic-layout connections is built into Microwave Office.(read more)

Introduction

Multiphysics is an integral part of the concepts around digital twins. In this post, I want to discuss the mechanical aspects of multiphysics in system simulations, which are critical for 3D-IC, multi-die, and chiplet design.

The physical world in which we live is growing ever more electrified. Think of the transformation that the cell phone has brought into our lives, as has the present-day migration to electronic vehicles (EVs). These products are not only feats of electronic engineering but of mechanical as well, as the electronics find themselves in new and novel forms such as foldable phones and flying cars (eVOTLs). Here, engineering domains must co-exist and collaborate to bring about the best end products possible.

Start with the electronics—chips, chiplets, IC packaging, PCB, and modules. But now put these into a new form factor that can be dropped or submerged in water or accelerated along a highway. What about drop testing, aerodynamics, and aeroacoustics? These largely computational fluid dynamics (CFD) and/or mechanical multiphysics phenomena must also be accounted for. And then how does the drop testing impact the electrical performance? The world of electronics and its vast array of end products is pushing us beyond pure electrical engineering to be more broadly minded and develop not only heterogeneous products but heterogeneous engineering teams as well.

Cadence's Unique Expertise

It's at this crossroad of complexity and electronic proliferation that Cadence shines. Let's take, for example, the latest push for higher-performing high-bandwidth memory (HBM) devices and AI data center expansion. These technologies are growing from several layers to 12, and I can't emphasize enough the importance of teamwork and integrated solutions in tackling the challenges of advanced packaging technologies and how collaboration is shaping the future of semiconductor innovation and paving the way for cutting-edge developments in the industry.

These layered electronics are powered, and power creates heat. Heat needs to be understood, and thus, the thermal integrity issues uncovered along the way must be addressed. However, electronic thermal issues are just the first domino in a chain of interdependencies. What about the thermal stress and warpage that can be caused by the powering of these stacked devices? How does that then lend to mechanical stress and even material fatigue as the temperature cycles from high to low and back through the use of the electronic device? This is just one example in a long list of many...

Cadence Multiphysics Analysis Offerings

The confluence of electrical, mechanical, and CFD is exactly why Cadence expanded into multiphysics at a significant rate starting in 2019 with the announcement of the Clarity 3D Solver and Celsius Thermal Solver products for electromagnetic (EM) and thermal multiphysics system simulations. Recent acquisitions of Numeca, Pointwise, and Cascade (now branded within Cadence as the Fidelity CFD Platform) as well as Future Facilities (now the Cadence Reality Digital Twin product line) are all adding CFD expertise. The recent addition of Beta CAE brings mechanical multiphysics to the suite of solutions available from Cadence. The full breadth of these multiphysics system analyses, spanning EM, thermal, signal integrity/power integrity (SI/PI), CFD, and now mechanical, creates a platform for digital twinning across a wide array of applications. You can learn more by viewing Cadence's Reality Digital Twin platform launch on the keynote stage at NVIDIA's GTC in March, as well as this Designed with Cadence video: NV5, NVIDIA, and Cadence Collaboration Optimizes Data Centers.

Conclusion

Ever more sophisticated electronic designs are in demand to fulfill the needs of tomorrow's technologies, driving a convergence of electrical and mechanical aspects of multiphysics in system simulations. To successfully produce the exciting new products of the future, both domains must be able to collaborate effectively and efficiently. Cadence is fully committed to developing and providing our customers with the software products they need to enable this electrical/mechanical evolution. From EM, to thermal, to SI/PI, CFD, and mechanical, Cadence is enabling digital twinning across a wide array of applications that are forging pathways to the future.

For more information on Cadence's multiphysics system analysis offerings, visit our webpage and download our brochure.

This is the 15th installment of The Rationalist, my column for the Times of India.

It’s election season, and promises are raining down on voters like rose petals on naïve newlyweds. Earlier this week, the Congress party announced a minimum income guarantee for the poor. This Friday, the Modi government released a budget full of sops. As the days go by, the promises will get bolder, and you might feel important that so much attention is being given to you. Well, the joke is on you.

Every election, HL Mencken once said, is “an advance auction sale of stolen goods.” A bunch of competing mafias fight to rule over you for the next five years. You decide who wins, on the basis of who can bribe you better with your own money. This is an absurd situation, which I tried to express in a limerick I wrote for this page a couple of years ago:

POLITICS: A neta who loves currency notes/ Told me what his line of work denotes./ ‘It is kind of funny./ We steal people’s money/And use some of it to buy their votes.’

We’re the dupes here, and we pay far more to keep this circus going than this circus costs. It would be okay if the parties, once they came to power, provided good governance. But voters have given up on that, and now only want patronage and handouts. That leads to one of the biggest problems in Indian politics: We are stuck in an equilibrium where all good politics is bad economics, and vice versa.

For example, the minimum guarantee for the poor is good politics, because the optics are great. It’s basically Garibi Hatao: that slogan made Indira Gandhi a political juggernaut in the 1970s, at the same time that she unleashed a series of economic policies that kept millions of people in garibi for decades longer than they should have been.

This time, the Congress has released no details, and keeping it vague makes sense because I find it hard to see how it can make economic sense. Depending on how they define ‘poor’, how much income they offer and what the cost is, the plan will either be ineffective or unworkable.

The Modi government’s interim budget announced a handout for poor farmers that seemed rather pointless. Given our agricultural distress, offering a poor farmer 500 bucks a month seems almost like mockery.

Such condescending handouts solve nothing. The poor want jobs and opportunities. Those come with growth, which requires structural reforms. Structural reforms don’t sound sexy as election promises. Handouts do.

A classic example is farm loan waivers. We have reached a stage in our politics where every party has to promise them to assuage farmers, who are a strong vote bank everywhere. You can’t blame farmers for wanting them – they are a necessary anaesthetic. But no government has yet made a serious attempt at tackling the root causes of our agricultural crisis.

Why is it that Good Politics in India is always Bad Economics? Let me put forth some possible reasons. One, voters tend to think in zero-sum ways, as if the pie is fixed, and the only way to bring people out of poverty is to redistribute. The truth is that trade is a positive-sum game, and nations can only be lifted out of poverty when the whole pie grows. But this is unintuitive.

Two, Indian politics revolves around identity and patronage. The spoils of power are limited – that is indeed a zero-sum game – so you’re likely to vote for whoever can look after the interests of your in-group rather than care about the economy as a whole.

Three, voters tend to stay uninformed for good reasons, because of what Public Choice economists call Rational Ignorance. A single vote is unlikely to make a difference in an election, so why put in the effort to understand the nuances of economics and governance? Just ask, what is in it for me, and go with whatever seems to be the best answer.

Four, Politicians have a short-term horizon, geared towards winning the next election. A good policy that may take years to play out is unattractive. A policy that will win them votes in the short term is preferable.

Sadly, no Indian party has shown a willingness to aim for the long term. The Congress has produced new Gandhis, but not new ideas. And while the BJP did make some solid promises in 2014, they did not walk that talk, and have proved to be, as Arun Shourie once called them, UPA + Cow. Even the Congress is adopting the cow, in fact, so maybe the BJP will add Temple to that mix?

Benjamin Franklin once said, “Democracy is two wolves and a lamb voting on what to have for lunch.” This election season, my friends, the people of India are on the menu. You have been deveined and deboned, marinated with rhetoric, seasoned with narrative – now enter the oven and vote.

The India Uncut Blog © 2010 Amit Varma. All rights reserved.
Follow me on Twitter.

I'm working on the code coverage. Doing a metrics analysis by default we see overall average grade and overall covered. But when i do a block analysis on an instance i see overall covered grade, code covered grade, block covered grade, statement covered grade, expression covered grade, toggle covered grade.

As I dont know the difference I started to read the IMC user guide and came to know there are 3 things we come across while doing a code coverage local, covered, average

From my understanding

local - child instances metrics doesnt reach the parent level. For example, we have an instance Q and its sub instances like Q.a, Q.b. Block Local grade of Q can be 100% even when its instances Q.a and Q.b a block local grades isnt at 100%.

In the attached image there is formula 

The key difference between average and covered is the weights.

Average : Mathematically taking the above scenario where Q.a, and Q.b has 10 blocks each. Q.a has covered 8 blocks and q.b has covered 2 blocks. Now if we take the normal average it should be total covered/ totatl number = 8+2/10+10 yielding 50%. But when we add weights saying Q.a is 70% and Q.b is 30% the new number would be (8*0.7+2*0.3) / (10*0.7+10*0.3) resulting 62%. Because of the weights we see 12% bump.

Covered: there is no role of weights.

Among these 3 metrics i've changed my default view to this in the image to get more realistic picture when i do analyze metrics. Do you guys agree with the approach?

As noted in white papers, posts on the Team Specman Blog, and the Specman documentation, IntelliGen is a totally new stimulus generator than the original "Pgen" and, as a result, there is some amount of effort needed to migrate an existing verification environment to fully leverage the power of IntelliGen.  One of the main steps in migrating code is running the linters on your code and adressing the issues highlighted. 

Included below is a simple utility you can include in your environment that allows you to collect some valuable statistics about your code base to allow you to better gauge the amount of work that might be required to migrate from Pgen to IntelliGen.  The ICFS statistics reported are of particular benefit as the utility not only identifies the approximate number of ICFSs in the environment, it also breaks the total number down according to generation contexts (structs/units and gen-on-the-fly statements) allowing you to better focus your migration efforts. 

IMPORTANT: Sometimes a given environment can trigger a large number of IntelliGen linting messages right off the bat.  Don't let this freak you out!  This does not mean that migration will be a long effort as quite often some slight changes to an environment remove a large number of identified issues.  I recently encountered a situation where a simple change to three locations in the environment, removed 500+ ICFSs!

The methods included in the utility can be used to report information on the following:
- Number of e modules
- Number of lines in the environment (including blanks and comments)
- Number and type of IntelliGen Guidelines linting messages
- Number of Inconsistently Connected Field Sets (ICFSs)
- Number of ICFS contexts and how many ICFSs per context
- Number of soft..select overlays found in the envioronment
- Number of Laces identified in the environment

To use the code below, simply load it before/after loading e-code and then
you can execute any of the following methods:

- sys.print_file_stats()             : prints # of lines and files
- sys.print_constraint_stats()   : prints # of constraints in the environment
- sys.print_guideline_stats()    : prints # of each type of linting message
- sys.print_icfs_stats()            : prints # of ICFSs, contexts and #ICFS/context
- sys.print_soft_select_stats() : prints # of soft select overlay issues
- sys.print_lace_stats()           : *Only works for SPMNv6.2s4 and later* prints # of laces identified in the environment

Each of the above calls to methods produces it's own log files (stored in the current working directory) containing relevant information for more detailed analysis.
- file_stats_log.elog : Output of "show modules" command
- constraint_log.elog : Output of the "show constraint" command
- guidelines_log.elog : Output of "gen lint -g" (with notification set to MAX_INT in order to get all warnings)
- icfs_log.elog       : Output of "gen lint -i" command
- soft_select_log.elog: Output of the "gen lint -s" command
- lace_log.elog       : Output of the "show lace" command

Happy generating!

Corey Goss

With the latest release (Sigrity and Systems Analysis 2022.1 HF2) of Clarity  3D Solver, support for encrypted component models is now available. With this functionality, vendors that supply 3D components, such as connectors, can now merge their...(read more)

TikTok is divided over whether books are inherently political after Donald Trump's win in the U.S. presidential election.

At the Conference for Robot Learning (CoRL) in Munich, Germany, Hugging Face and NVIDIA announced a collaboration to accelerate robotics research and development by bringing together their open-source robotics communities. Hugging Face’s LeRobot open AI platform combined with NVIDIA AI, Omniverse and Isaac robotics technology will enable researchers and developers to drive advances across a Read Article

To provide high-quality medical care to its population — around 30% of whom are 65 or older — Japan is pursuing sovereign AI initiatives supporting nearly every aspect of healthcare. AI tools trained on country-specific data and local compute infrastructure are supercharging the abilities of Japan’s clinicians and researchers so they can care for patients, Read Article

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

The plunge in oil prices has had a significant effect on Russia, Iran and Venezuela, and is changing those countries' geopolitical calculus.

Bilateral business and financial engagement is growing between India and China, with India taking advantage of China's favorable financing terms.

New institutional economics (NIE) has received another so-called Nobel prize, ostensibly for again claiming that good institutions and democratic governance ensure growth, development, equity and democracy. Daron Acemoglu, Simon Johnson, and James Robinson (AJR) are well known for their influential cliometric work. AJR have elaborated earlier laureate Douglass North’s claim that property rights have been […]

Donald Trump promises 'deportation force' to remove 11 million undocumented immigrants

Jalen Johnson had 18 points, 13 rebounds, 10 assists and three steals to lead the visiting Atlanta Hawks to a 117-116 victory over the Boston Celtics on Tuesday in the first NBA Cup game for each team. Jaylen Brown and Derrick White scored season highs of 37 points and 31 points, respectively, for the Celtics. Brown was 7 of 12 from 3-point territory and 10 of 15 overall. White added six rebounds and five assists. Atlanta took a 117-116 lead when Onyeka Okongwu tipped in a missed shot with 6.1 seconds to play. After each team turned the ball over […]...

Keep on reading: NBA Cup: Hawks catch Celtics in closing seconds for win

nostrand s nightmares chilling archives of horror comics

This report emphasizes that open and fair trade is essential for Asia and the Pacific’s transition to low-carbon economies and outlines the important role of Aid for Trade in this transition.

1. Output 1: Quality of STEM education with support of technology improved.

Dolphins in the Gulf of Mexico have tiny bits of plastic in their breath, and this is probably a worldwide problem

Britain should be too cold for the invasive Aesculapian snake to survive, but it is thriving by exploiting the warmth of attics, wall cavities and compost heaps

Strange solids called temporal metamaterials finally make it possible to investigate the controversial idea of quantum friction – and push special relativity to its limits

Simple words like "force" and "particle" can mislead us as to what reality is actually like. Physicist Matt Strassler unpacks how to see things more clearly

Daniele Oriti’s pursuit of a theory of quantum gravity has led him to the startling conclusion that the laws of nature don’t exist independently of us – a perspective shift that could yield fresh breakthroughs

Could the universe's missing matter be hiding in a "dark" extra dimension? We now have simple ways to test this outlandish idea - and the existence of extra dimensions more generally

An outlandish experiment searching for a brain network that tunes up and down the feeling of immersion is hoping to unlock the therapeutic effects of psychedelics

Strange solids called temporal metamaterials finally make it possible to investigate the controversial idea of quantum friction – and push special relativity to its limits

While time is relative, it still flows in one direction for every observer. We don’t yet understand why, but some physicists are looking for answers that invoke the evolution of entropy, says Chanda Prescod-Weinstein

Working with a tiny cantilever, physicists managed to violate the second law of thermodynamics, using less energy than expected to change the cantilever’s motion

A jiggling robot has revealed the ideal vibrating speed to free jumbled fibres

In the quantum realm, a particle’s properties can be separate from the particle itself, including its angular momentum – which could require a rethinking of fundamental laws

In 2022, physicists were excited by hints that something was wrong with our understanding of the universe - but new results have put that in doubt