Binding equipment and false cover forming equipment for hardcover books are disclosed. The false cover forming equipment carries out false covers, by positioning a pair of endpapers in correspondence of lateral binding flaps of a respective backstrip, arranging folds of the endpapers at a pre-assembling distance associated with the thickness of the text block and gluing margins of past-down sheets of the endpapers with binding edges of the backstrip. The binding equipment is feedable, at a cover input “IC”, with the false covers for carrying out book blocks by gluing the backstrips of the false covers with the binding edges of corresponding text blocks and refolding the pairs of endpapers on the respective text blocks. An electronic processing unit is settable for the control of the false cover forming equipment and the binding equipment as a function of the dimensions of the hardcover book to be bound.

A highlighter strip including adhesive to form a removable bond with a substrate, constructed from a translucent and colored material. The highlighter strip can be affixed over writing or other markings, which highlights the indicia that remains legible. One or both ends of the strip can omit the adhesive, thereby providing a grabbing portion to facilitate removal from an initial position and optionally subsequent positions. The strip can be included in a set of strips affixed to each other and optionally affixed to another base; such as a notebook, binder, or other entity where one would expect writing, text, or other indicia requiring highlighting.

A bound document has front, back, and interior sheets with spine edges. The document has a binding strip and fasteners binding the sheets and the binding strip together. The strip has a flexible substrate with a face-attachment portion through which the fasteners are driven, and a wraparound portion that is bent so adhesive on the wraparound portion contacts the back sheet farther from the spine edge of the book than the feet of the fasteners. The strip also has a first spacer affixed to the interior surface opposite the face-attachment portion so that a fastener area is defined, the spacer at least as thick as the protrusion of the heads of the fasteners above the face-attachment portion.

A clipboard having a board assembly with a front face and a rear face. A clip assembly is mounted onto the board assembly. The board assembly docks onto a docking assembly. The front face is defined by a top edge, a bottom edge, and first and second lateral edges. The rear face has first and second lower interior channel guide edges and first and second higher interior channel guide edges. The board assembly tapers from the top edge towards the bottom edge. The first and second higher interior channel guide edges terminate forming a channel neck. The channel neck is a channel to receive the docking assembly. The rear face further has at least one grip section that extends from the first or second lateral edge. The front face has a recessed face, and the clip assembly has a docking station, a spring assembly, and a writing instrument holder.

Recessed adhesive binding systems. One system can include a plurality of sheets arranged in a stack, each of the plurality of sheets having a front surface, a rear surface, and an exposed edge. At least one of the front surface and the rear surface of each of the plurality sheets can include at least one recessed adhesive positioned adjacent the exposed edge to form an at least partially exposed recessed adhesive, which can be selectively activated. The rear surface of a first sheet in the plurality of sheets can be positioned adjacent the front surface of a second sheet in the plurality of sheets, or vice versa, and the exposed edges of the plurality of sheets can be staggered, such that the exposed edge of the second sheet extends further outwardly from the stack than the exposed edge of the first sheet in the stack.

A bound document having a plurality of sheets is produced. Image data for a cover image is received and dividing along a sheet-edge curve into first and second image portions. The first image portion is printed on an inner cover sheet so that an alignment location is defined on the inner cover sheet corresponding to the sheet-edge curve. The inner cover sheet and the plurality of sheets are bound together. The second image portion is printed on an outer cover sheet, and is printed borderlessly with respect to a selected edge of the outer cover sheet. After the binding step, the outer cover sheet is affixed to the inner cover sheet so that the selected edge aligns with the alignment location to form the bound document.

A binding system for binding a set of media sheets, including a cylinder having an outer diameter and a length, and a retainer fabricated from a flexible material. The retainer has an arc-shaped cross-section having an inner diameter and an associated arc angle thereby providing an opening slot that extends along a length of the retainer. The binding system is adapted to bind the set of media sheets by wrapping the media sheets around the cylinder and inserting the wrapped cylinder into the retainer with the wrapped media sheets extending out of the opening slot in the retainer. The inner diameter of the retainer is less than the sum of the outer diameter of the cylinder and a total thickness of the wrapped media sheets so that the retainer flexes to provide a clamping force to bind the media sheets.

A composition book having a front and back cover and a plurality of pages stitched together wherein the plurality of pages may have hole punches and the front and back cover may have hole punches such as to allow the composition book to fit within a binder and wherein the plurality of pages are perforated such that they may be removed from the composition book.

A system for affixing a printed image onto a book cover, comprising a sleeve having a front surface, a back surface and four edges. The sleeve includes a front layer having a transparent window region surrounded by an opaque mask region and a back layer joined to the front layer along at least two of the edges, wherein the back layer is not joined to the front layer along at least one of the edges thereby providing at least one open edge adapted to receive the printed image. Adhesive strips having peelable coverings are affixed onto the back surface of the sleeve along at least two of the edges. The opaque mask region is adapted to cover the edges of the printed image, and the adhesive strips are adapted to affix the sleeve onto the book cover.

A book having a page construction for improved page manipulation. The book includes a plurality of pages bound together at an edge margin, wherein each page includes a bound edge and a plurality of free edges. At least one of the free edges of at least one of the pages includes an edge relief. The pages may comprise cardboard or other stiff material having a thickness. The free edges include opposed top and bottom edges and a side edge. The edge relief may extend along the entire side edge or only a portion thereof. The edge relief may be in the form of, for example, a chamfer, a bevel, a radius, a notch, a step, or the like.

A publication including a plurality of pairs of pages, with the pair of pages comprised of a removable page and non-removable page. The removable page has a perforated edge, an adhesive edge opposite the perforated edge and a printable surface. The non-removable page has a printable surface. The pairs of pages are arranged such that alternate pages are removable and can be removed without harming the publication or the non-removable pages. The removable pages can be arranged to form an image larger than the publication itself and removable attached to a surface through the adhesive edge.

A booklet stacker to stack multiple booklets each bound with a ring member includes a stack tray on which multiple booklets are stacked, a shifter disposed upstream from the stack tray in a booklet conveyance direction in which a booklet is conveyed, the shifter to adjust a position of the booklet in a width direction perpendicular to the booklet conveyance direction by shifting the booklet a distance shorter than a ring pitch of the ring member in the width direction, and a booklet conveyer disposed upstream from the stack tray in the booklet conveyance direction, to convey the booklet positioned by the shifter to the stack tray.

The present invention relates to a multilayer information page (1) for a security document, which includes an information part (3) manufactured from a material allowing at least some identification information of the information page to be entered thereto by utilizing laser engraving, the identification information provided on the information page (1) being readable from an upper surface thereof, and a flexible and bending resistant connecting part (2) for connecting the information page (1) to the security document, the connecting part (2) comprising a fastening end (8) by means of which the connecting part (2) is fastened to the information part (3). In order to ensure that detachment of the information part and the connecting part from one another leaves visible marks, the fastening end (3) of the connecting part (2) is arranged to overlap with a lower surface of the information part (3). Furthermore, the information page (1) includes a transparent surface layer (7) which covers at least the fastening end (8) and at least a part of the lower surface of the information part (3) and through which at least the fastening end (8) is visible.

A wireless communication node (10) dynamically estimates passive intermodulation (PIM) interference coupled into the node's receive path from the transmission of a composite signal through the node's transmit path. The node (10) then cancels the estimated PIM interference in the receive path. In some embodiments, the node dynamically estimates the PIM interference as a function of the composite signal that models PIM interference generation and coupling in the node (10) according to one or more coefficients (30). The coefficients (30) may be determined by transmitting a test signal (34) during a test stage, when the node (10) is not scheduled to receive any signal. Later, when the composite signal (18) is transmitted, the node (10) uses the coefficients (10) to dynamically estimate and cancel the resulting PIM interference.

A radio-frequency (RF) amplifier having a direct response to an arbitrary signal source to output one or more electrosurgical waveforms within an energy activation request, is disclosed. The RF amplifier includes a phase compensator coupled to an RF arbitrary source, the phase compensator configured to generate a reference signal as a function of an arbitrary RF signal from the RF arbitrary source and a phase control signal; at least one error correction amplifier coupled to the phase compensator, the at least one error correction amplifier configured to output a control signal at least as a function of the reference signal; and at least one power component coupled to the at least one error correction amplifier and to a high voltage power source configured to supply high voltage direct current thereto, the at least one power component configured to operate in response to the control signal to generate at least one component of the at least one electrosurgical waveform.

A method and circuit arrangement for controlling the motor current in an electric motor, in particular a stepper motor, by a chopper method is provided. In the method/circuit arrangement, the motor is operated with a coil current that follows a target coil current substantially more accurately at least at the zero crossing of the coil current. The method/circuit arrangement provides a good symmetry of the sinusoidal wave shape of the coil current with respect to the zero crossing of the coil current. The method is achieved in particular by the active control of the coil current both in the direction of a predefined target coil current and opposite the direction of the predefined target coil current with respect to upper or lower desired current values and a lowering or increasing of the upper or lower desired current values.

A radio frequency channel amplification module for communication satellite, comprises an input configured to convey an input radio frequency signal, an output configured to restore a pre-amplified output radio frequency signal intended to power a travelling wave tube amplifier that can be equipped with linearization means with predistortion, at least one first upstream gain control module arranged downstream of the input and one second downstream gain control module arranged downstream of the first upstream gain control module and upstream of any linearization means by predistortion. The channel amplification module also comprises an instantaneous power limiter intended to clip the peaks of the input radio frequency signals with a level exceeding a determined threshold value, the instantaneous power limiter being arranged in series between said first upstream gain control module and said second downstream gain control module.

A differential circuit with a function to compensate unevenness observed in the differential gain thereof is disclosed. The differential circuit provides a low-pass filter in one of the paired transistors not receiving the input signal in addition to another low-pass filter that provides an average of output signals as a reference level of the differential circuit. The cut-off frequency of the filter is preferably set to be equal to the transition frequency at which the self-heating effect explicitly influences the trans-conductance of the transistor.

An amplifier circuit includes an input terminal and an output terminal. A current sinking transistor includes a first conduction terminal coupled to the output terminal and a second conduction terminal coupled to a reference supply node. A voltage sensing circuit has a first input coupled to the input terminal and a second input coupled to the output terminal. An output of the voltage sensing circuit is coupled to the control terminal of the current sinking transistor. The voltage sensing circuit functions to sense a rise in the voltage at the output terminal which exceeds the voltage at the input terminal, and respond thereto by activating the current sinking transistor.

A system for pre-charging a current minor includes a controller configured to provide a first current and an additional current to a current minor to rapidly charge a capacitance associated with the current minor based on a reference voltage or control signals. A power amplifier module includes at least one current minor and a controller. A capacitor is coupled to the current minor. The controller provides a bias current in an amount proportional to an input to a voltage-to-current converter. The controller receives a control signal that directs the controller to apply one of a pre-charge voltage and a nominal voltage to the voltage-to-current converter.

An amplifying structure includes a main amplifier configured to amplify a first signal; and a peak amplifier configured to amplify a second signal, each of the main amplifier and the peak amplifier including, respectively, a hybrid power device, the hybrid power device including, a first power transistor die configured to amplify signals of a first frequency, and a second power transistor die configured to amplify signals of a second frequency different than the first frequency.

A power converter with positive and negative supply rail outputs for feeding a single ended class D amplifier, the converter comprising a transformer arrangement, a supply pump reduction arrangement connected between the secondary windings and the positive and negative supply rail outputs, and a boost drive mode switching arrangement. A controller is adapted to control the power converter in a negate drive mode and a boost drive mode, wherein the output voltage in the boost mode is increased by means of the transformer and the boost drive mode switching arrangement. The output voltages on the positive and negative rails can be generated at two different output voltage levels without changing the duty cycle or dead time of the control signals.

An input receiver circuit including a single-to-differential amplifier and a semiconductor device including the input receiver circuit are disclosed. The input receiver circuit includes a first stage amplifier unit and a second stage amplifier unit. The first stage amplifier unit amplifies a single input signal in a single-to-differential mode to generate a differential output signal, without using a reference voltage. The second stage amplifier unit amplifies the differential output signal in a differential-to-single mode to generate a single output signal.

A TIA circuit and method are provided that merge the automatic gain control function with the bandwidth adjustment function to allow the TIA circuit to operate over a wide dynamic range at multiple data rates. The TIA circuit has an effective resistance that is adjustable for adjusting the gain and the bandwidth of the TIA circuit. The mechanism of the TIA circuit that is used to adjust the effective resistance, and hence the gain and bandwidth of the TIA circuit, is temperature independent, and as such, the performance of the TIA circuit is not affected by temperature variations.

A power combiner/divider having a waveguide, a plurality of amplifiers disposed on a supporting structure, a plurality of probes, each one having a first end electrically coupled to an output of a corresponding one of the plurality of amplifiers and a second end projecting outwardly from the supporting structure and into the waveguide. The probes are disposed in a common region of the waveguide. The region has a common electric field maximum within the waveguide. A first portion of the probes proximate the sidewalls have lengths different from a second portion of the probes disposed in a region distal from the sidewalls of the waveguide. The waveguide is supported by the support structure. The power combiner is a monolithic microwave integrated circuit structure.

The present invention discloses a transmit-receive (TR) front end. The TR front end includes a low-noise amplifier (LNA); a power amplifier (PA); a transformer, coupled to the PA, for increasing a voltage swing and a power transmission of the PA; and a TR switch, coupled between the transformer and the LNA. The LNA is single ended and there is no transformer between the LNA and the TR switch.

An amplifier includes a first input terminal, a second input terminal, a TIA, and a compensation circuit. The TIA includes a first transistor, a second transistor, a first current source connected to the first input terminal and an emitter of the first transistor, a second current source connected to the second input terminal and an emitter of the second transistor, a first load resistor connected to a collector of the first transistor, and a second load resistor connected to a collector of the second transistor. A bias voltage is supplied to bases of the first and second transistors, the compensation circuit adjusts a first load current and a second load current based on voltage signals, and the TIA outputs the voltage signals based on collector voltages of the first and second transistors.

Split amplifiers with configurable gain and linearization circuitry are disclosed. In an exemplary design, an apparatus includes first and second amplifier circuits and a linearization circuit, which may be part of an amplifier. The first and second amplifier circuits are coupled in parallel and to an amplifier input. The linearization circuit is also coupled to the amplifier input. The first and second amplifier circuits are enabled in a high-gain mode. One of the first and second amplifier circuits is enabled in a low-gain mode. The linearization circuit is enabled in the second mode and disabled in the first mode. The amplifier is split into multiple sections. Each section includes an amplifier circuit and is a fraction of the amplifier. High linearly may be obtained using one amplifier circuit and the linearization circuit in the low-gain mode.

Embodiments include systems and methods for accurately controlling gain of a high-speed variable-gain amplifier (VGA) without adversely impacting bandwidth performance. Embodiments include a VGA with a variable resistor, for which resistance is a function of a control level. A gain calibration system controls the control level by using a gain control feedback subsystem to sample outputs of a duplicate VGA, which includes a duplicate variable resistor. The sampled duplicate outputs are compared to a target gain generated by a reference generator. The control level can be fed back to control the gain of the duplicate VGA until the target gain is reached. The control level can also be fed to the actual VGA to control its gain. By performing gain control on the duplicate VGA without interfering with the output signal path of the actual VGA, the actual VGA's gain can be accurately controlled without impacting its bandwidth.

Exemplary embodiments are directed to operating a multi-stage amplifier with low-voltage supply voltages. A multi-stage amplifier may include a first path of an amplifier output stage configured to convey an output signal if a first supply voltage is greater than a threshold voltage. The multi-stage amplifier may also include a second path of the amplifier output stage configured to convey the output signal if the first supply voltage is less than or equal to the threshold voltage.

A variable gain amplifier (100) includes a transistor (110), an FB impedance section (120), a source impedance section (130), a drain impedance section (140), a gain controller (150), and a frequency characteristic controller (160). The gain controller (150) varies impedance of one of the FB impedance section (140), the source impedance section (130), and the drain impedance section (140), and outputs a gain control signal. The frequency characteristic controller (160) varies the impedance of different impedance section, based on the gain control signal.

This disclosure relates generally to radio frequency (RF) amplification devices and methods of limiting an RF signal current. Embodiments of the RF amplification device include an RF amplification circuit and a feedback circuit. The RF amplification circuit is configured to amplify an RF input signal so as to generate an amplified RF signal that provides an RF signal current with a current magnitude. The feedback circuit is used to limit the RF signal current. In particular, a thermal sense element in the feedback circuit is configured to generate a sense current, and thermal conduction from the RF amplification circuit sets a sense current level of the sense current as being indicative of the current magnitude of the RF signal current. To limit the RF signal current, the feedback circuit decreases the current magnitude of the RF signal current in response to the sense current level reaching a trigger current level.

A microwave semiconductor amplifier includes a semiconductor amplifier element, an input matching circuit and an output matching circuit. The semiconductor amplifying element includes an input electrode and an output electrode and has a capacitive output impedance. The input matching circuit is connected to the input electrode. The output matching circuit includes a bonding wire and a first transmission line. The bonding wire includes first and second end portions. The first end portion is connected to the output electrode. The second end portion is connected to one end portion of the first transmission line. A fundamental impedance and a second harmonic impedance seen toward the external load change toward the one end portion. The second harmonic impedance at the one end portion has an inductive reactance. The output matching circuit matches the capacitive output impedance of the semiconductor amplifying element to the fundamental impedance of the external load.

A tunable wide band driver amplifier is disclosed. In an exemplary embodiment, an apparatus includes a first band selection circuit selectively connected between an output terminal of an amplifier and a circuit ground. The first band selection circuit configured to adjust an amplification band from a first frequency band to a second frequency band. The apparatus also includes a first harmonic reduction circuit selectively connected between the first band selection circuit and the circuit ground and configured to reduce 2nd harmonic frequencies associated with the first frequency band when the amplification band is set to the first frequency band.

High impedance, high frequency nanoscale device electronics configured to interface with low impedance loads include an impedance transforming stage constructed of multiple nanoscale devices, such as carbon nanotube field-effect transistors. In an embodiment of the present invention, an impedance transforming output stage of a multistage amplifier is configured to drive a 50 ohm transmission line with unity voltage gain using multiple carbon nanotube field-effect transistors in parallel. In a further embodiment, a receiver provided for an electronically steered receive array is a monolithic, lumped-element system formed from nanoscale devices and configured to interface with the external electrical systems via a single transmission line.

A light emitting apparatus including: a plurality of light emitting elements; a drive circuit including a transistor and a capacitor having one end connected to a gate of the transistor; and a signal supply circuit for receiving a digital gradation signal and outputting an analog voltage signal to the drive circuit, including a computation circuit configured to correct the input digital gradation signal to generate a corrected digital gradation signal, in which the drive circuit is configured to conduct an auto-zero operation which reduce the gate-source voltage of the transistor to a threshold voltage by flowing the drain current to the capacitor, and the computation circuit is configured to generate the corrected digital gradation signal by multiplying a correction coefficient to the input digital gradation signal subtracted by a particular signal common to the plurality of light emitting elements.

An apparatus is described that includes an audio power amplifier having an input and an output. An alternating-current to direct-current power converter is coupled to the audio power amplifier in a single package to supply power to the audio power amplifier.

Disclosed is a technique for reducing noise superimposed on an output signal while keeping loop gain constant without increasing the circuit scale and without changing the transfer function of the amplifier apparatus (frequency characteristics of gain and phase). According to the technique, there are included a power-supply voltage control unit 7 for detecting the amplitude level S9 of an input audio signal S1 and outputting power with a voltage value indicated by target set voltage value information Vs corresponding to this amplitude level S9, and a PWM modulation unit 2 including a PWM converter 23 for converting the pulse width of the input audio signal S1 and a correction unit for correcting the signal modulated by the PWM converter 23. The PWM modulation unit 2 corrects the pulse width of a PWM signal S5 modulated by the PWM converter 23 so that the correction unit will cancel out a change in amplification gain of a power amplification unit 4 according to the target set voltage value information Vs.

Aspects of the disclosure provide a circuit that includes a first circuit, a second circuit, and an adder. The first circuit is configured to generate a first signal by outputting and holding, at a first timing, a first stream in response to an input stream of data. The second circuit is configured to generate a second signal by outputting and holding, at a second timing, a second stream in response to the input stream of data. The adder is configured to add the first signal with the second signal to generate an up-sampled stream for the input stream of data and reduce a frequency component in the up-sampled stream generated by the up-sampling.

A pop-free single-ended output class-D amplifier includes: an input signal generator for generating an input signal; a power supply for supplying input power; a reference voltage generator for generating a reference voltage; a gain-adjustable stage for generating an amplified signal according to the reference voltage and adjusting a gain of the single-ended output class-D amplifier; a pulse width modulation module for outputting a pulse width modulation signal according to the reference voltage, the amplified signal, and the input power; a low-pass filter for low-pass filtering the pulse width modulation signal to generate an output voltage; and a logic controller for generating at least one control signal to control the reference voltage generator, the gain-adjustable stage, and the pulse width modulation module according to the input power, the reference voltage, and the pulse width modulation signal.

An electronic circuit, including, a power amplifier adapted to amplify an RF signal and provide it as output from the integrated circuit; a power source that is adapted to provide an unregulated voltage to the power amplifier; a regulator adapted to provide a regulated bias voltage; a subtracter that is adapted to accept a voltage proportional to the unregulated voltage and subtract it from the bias voltage to provide a reference voltage to the power amplifier; wherein the power amplifier is adapted to use the reference voltage to adjust the output from the power amplifier so that it will provide a stable power output.

Circuitry for reducing power consumption is described. The circuitry includes a power amplifier. The circuitry also includes a predistorter coupled to the power amplifier. The circuitry further includes a power supply coupled to the power amplifier. The circuitry additionally includes a controller coupled to the power amplifier, to the predistorter and to the power supply. The controller captures a transmit signal and a feedback signal concurrently and determines a minimum bias voltage from a set of voltages and a predistortion that enable the power amplifier to produce an amplified transmit signal in accordance with a requirement.

Differential amplifier circuits for LDMOS-based amplifiers are disclosed. The differential amplifier circuits comprise a high resistivity substrate and separate DC and AC ground connections. Such amplifier circuits may not require thru-substrate vias for ground connection.

Differential power amplifier circuitry includes a differential transistor pair, an input transformer, and biasing circuitry. The base contact of each transistor in the differential transistor pair may be coupled to the input transformer through a coupling capacitor. The coupling capacitors may be designed to resonate with the input transformer about a desired frequency range, thereby passing desirable signals to the differential transistor pair while blocking undesirable signals. The biasing circuitry may include a pair of emitter follower transistors, each coupled at the emitter to the base contact of each one of the transistors in the differential transistor pair and adapted to bias the differential transistor pair to maximize efficiency and stability.

An amplifier circuit amplifies a signal for wireless transmission. A feedback circuit, including a capacitor, is coupled to the amplifier circuit. Components of the feedback circuit are selected based on a feedback factor such that an input impedance to the amplifier circuit has a same impedance characteristic as a feedback circuit impedance of the feedback circuit.

A method of operating a switched-mode power supply (SMPS) for supplying power to a load circuit, which draws a supply current that varies with an input signal to the load circuit is disclosed. The method comprises monitoring the input signal and controlling the amount of accumulated energy transferred for consumption by the load circuit, in use, in accordance with the input signal.

One or more embodiments of the present invention pertain to an all solid-state microwave power module. The module includes a plurality of solid-state amplifiers configured to amplify a signal using a low power stage, a medium power stage, and a high power stage. The module also includes a power conditioner configured to activate a voltage sequencer (e.g., bias controller) when power is received from a power source. The voltage sequencer is configured to sequentially apply voltage to a gate of each amplifier and sequentially apply voltage to a drain of each amplifier.

A semiconductor package device comprises a radio frequency power transistor having an output port operably coupled to a single de-coupling capacitance located within the semiconductor package device. The single de-coupling capacitance is arranged to provide both high frequency decoupling and low frequency decoupling of signals output from the radio frequency power transistor.

A radio frequency system includes a power amplifier that outputs a radio frequency signal to a matching network via a transmission line between the power amplifier and the matching network. A sensor monitors the radio frequency signal and generates first sensor signals based on the radio frequency signal. A distortion module determines a first distortion value according to at least one of (i) a sinusoidal function of the first sensor signals and (ii) a cross-correlation function of the first sensor signals. A first correction circuit (i) generates a first impedance tuning value based on the first distortion value and a first predetermined value, and (ii) provides feedforward control of impedance matching performed within the matching network including outputting the first impedance tuning value to one of the power amplifier and the matching network.

A power amplifier module includes a power amplifier including a GaAs bipolar transistor having a collector, a base abutting the collector, and an emitter, the collector having a doping concentration of at least about 3×1016 cm−3 at a junction with the base, the collector also having at least a first grading in which doping concentration increases away from the base; and an RF transmission line driven by the power amplifier, the RF transmission line including a conductive layer and finish plating on the conductive layer, the finish plating including a gold layer, a palladium layer proximate the gold layer, and a diffusion barrier layer proximate the palladium layer, the diffusion barrier layer including nickel and having a thickness that is less than about the skin depth of nickel at 0.9 GHz. Other embodiments of the module are provided along with related methods and components thereof.