An injection-molding method for selectively manufacturing molded parts with and without a breakthrough is disclosed. A molded part with a breakthrough is manufactured by positioning a mold core in a mold cavity, whereas a molded part without breakthrough is manufactured by removing the mold core at least partly from the mold cavity. The mold cavity delimited by a nozzle-side mold platen and an ejector-side mold platen. The mold core is movable relative to at least one of the mold platens, in particularly the nozzle-side mold platen, in an advance direction, where the mold core is closer to the nozzle-side mold platen and an opposite withdrawal direction. At least one protective measure is provided for protecting the inner surface facing the mold cavity of the respective mold platen, in particularly the nozzle-side mold platen, from adverse mechanical effects during movement of the mold core in the advance direction.

Provided is a method for manufacturing a sheet for a solar cell encapsulant which has stability against yellowing after a crosslinking process and thus good appearance with improved productivity in the sheet manufacture process, specifically to a method for manufacturing a sheet for a solar cell encapsulant characterized by melt-mixing a resin composition with an organic peroxide, a co-crosslinking agent and a silane coupling agent at the degradation temperature of the organic peroxide or less, wherein the resin composition is obtained by melt-mixing EVA resin with an antioxidant, an UV absorber and a light stabilizer at 80-220° C., and forming a sheet from the obtained melt-mixed resin composition.

A system for a thermal manufacturing system including a heliostat and a mold. The heliostat includes at least one reflecting surface, a steering mechanism and a controller. The steering mechanism is coupled to the at least one reflecting surface and capable of directing at least a first portion of the at least one reflecting surface toward a first one of multiple, selectable focal points. The mold is located in a second one of the selectable focal points. A manufacturing method is also disclosed.

Devices and methods for high-throughput manufacture of concentrically layered nanoscale and microscale fibers by electrospinning are disclosed. The devices include a hollow tube having a lengthwise slit through which a core material can flow, and can be configured to permit introduction of sheath material at multiple sites of Taylor cone formation formation.

The present invention provides a handle for a container, a handle-equipped container, and a method for manufacturing same. It is accordingly possible to provide a container that has a cross-sectional shape that is substantially quadrangular and allows for exceptional storability, has favorable blow-molding properties, presents none of a variety of anomalies in the container and the handle, and has adequate strength to withstand drop impact.

Method of manufacturing a fibre-reinforced composite moulding, the method comprising the steps of: (a) disposing at least one layer of fibrous reinforcing material within a mould; (b) disposing at least one pre-preg layer adiacent to the fibrous reinforcing material, the pre-preg layer comprising fibrous reinforcement at least partially impregnated with uncured first resin material, to form a laminar assembly of the at least one layer of fibrous reinforcing material and the at least one pre-preg layer within the mould; (c) applying a vacuum to the assembly; (d) infusing a flowable uncured second resin material, under the vacuum, into the at least one layer of fibrous reinforcing material; and (e) curing the first and second resin materials at least partially simultaneously to form the fibre-reinforced composite moulding which comprises at least one first structural portion formed from the fibrous reinforcement and the cured first resin material bonded to at least one second structural portion formed from the at least one layer of fibrous reinforcing material and the cured second resin material.

Provided is a technique to secure compositional or microstructural uniformity of a ceramic sintered body while increasing the area of the ceramic sintered boy, thus improving basic performance including non-linearity, maximum withstand energy and aging characteristics. A plurality of small varistor pieces 11 and insulating resin are kneaded and extruded for shaping, whereby a sheet-form varistor layer 13 can be formed where a plurality of small varistor pieces 11 are spaced from one another and are aligned on the same plane, and the adjacent small varistor pieces 11 are bonded via insulating resin.

A chip thermistor has a thermistor portion including a ceramic material containing respective metal oxides of Mn, Ni, and Co as major ingredients; a pair of composite portions including a composite material of Ag—Pd, and respective metal oxides of Mn, Ni, and Co and arranged on both sides of the thermistor portion so as to sandwich in the thermistor portion between the composite portions; and external electrodes connected to the pair of composite portions, respectively. In this manner, the pair of composite portions are used as bulk electrodes and, for this reason, the resistance of the chip thermistor can be adjusted mainly with consideration to the resistance in the thermistor portion without need for much consideration to the distance between the external electrodes and other factors.

A wiring substrate includes a substrate main body having a first main face and a second main face opposite the first main face; a resistor formed on the first main face; a plurality of first-main-face-side wiring layers which are each formed on the resistor and which each include a grounding metal layer formed of a metal having a resistance lower than that of the resistor and a conductor layer formed on the grounding metal layer; a second-main-face-side wiring layer formed on the second main face; and a via which is formed in the substrate main body and which establishes electrical connectivity between the first-main-face-side wiring layers and the second-main-face-side wiring layer. The wiring substrate further includes a conductive covering layer which covers an upper surface and substantially covers the side surfaces of each of the first-main-face-side wiring layers.

A thermal, flow measuring device for determining and/or monitoring the flow of a measured medium through a measuring tube. The thermal, flow measuring device includes: a first pin-shaped shell and at least a second pin-shaped shell; a first resistance thermometer and at least a second resistance thermometer. At least the first resistance thermometer is embodied so as to be heatable, wherein the resistance thermometers, in each case, have a first surface, and at least a second surface, which lies opposite the first surface. The first pin-shaped shell surrounds the first resistance thermometer, and the second pin-shaped shell surrounds the second resistance thermometer. The pin-shaped shells are fillable with a fill material. In each case, at least one spacer is placeable between the pin-shaped shell and the first surface of the resistance thermometer, and the second surface of the resistance thermometer is at least partially covered with fill material.

In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.

A method of manufacturing a chip resistor includes forming a resistor assembly in which a conductive member including portions separated from each other in a first direction is provided in a resistance body member; and dividing the resistor assembly into chip resistors, each including a chip-shaped resistance body formed by a part of the resistance body member, a pair of main electrodes formed by a part of the conductive member and separated from each other in the first direction, and a pair of sub-electrodes formed by a part of the conductive member, separated from each other in the first direction, and adjacent to the main electrodes in a second direction perpendicular to the first direction with concave portions recessed in the first direction interposed therebetween, by punching.

The object of the invention is to provide a method and an apparatus that allow production of metal plate chip resistors having a relatively low resistance with high accuracy and yield through simple process. The object is achieved by apparatus for manufacturing metal plate chip resistors including cutting mold for cutting intermediate product strip transversely to obtain worked product chip, ohm meter for measuring the resistance of the worked product chip, control device having a calculating part for performing a calculation using the resistance measured by the ohm meter to work out a width in which the strip is to be cut transversely so as to obtain a worked product chip of a desired resistance, and cutting width adjustor for making an adjustment so that the strip is to be cut transversely in the width obtained from the calculating part.

There is provided an array type chip resistor including: a chip body, four pairs of lower electrodes disposed on both sides of a lower surface of the chip body and formed so as to be extended to edges of the chip body, side electrodes formed so that the lower electrodes are extended to sides of the chip body, and a resistor interposed between the lower electrodes on the lower surface of the chip body and electrically connected to the lower electrode through a contact portion, wherein when a width of the side electrode is defined as d1, a distance between adjacent side electrodes is defined as d2, and a height of the side electrode is defined as h, in the case in which d1/d2 is 0.5 to 1.5, a value of h is 4,300/d1 μm or above and is 0.24d2+87.26 μm or less.

There are provided a chip resistor and a method of manufacturing the same. The chip resistor includes a ceramic substrate; an adhesion portion formed on a surface of the ceramic substrate; and a resistor formed on the adhesion portion, wherein the adhesion portion includes at least one of copper (Cu), nickel (Ni), and copper-nickel (Cu—Ni).

A touch panel includes a touch sensor layer including a first transparent electrode and a second transparent electrode, wherein an arrangement direction of the first transparent electrode can be perpendicular to that of the second transparent electrode, and both of the first and second transparent electrodes include two transparent metallic patterns which are stacked and electrically connected to each other.

A resistive device includes a resistive layer, a flexible substrate arranged on the resistive layer, and an electrode layer. The electrode layer includes two electrode sections arranged below the resistive layer and separate to each other. Moreover, a method for manufacturing the resistive device with flexible substrate is also disclosed.

A support disk fixing apparatus which includes an upper surface to which a wafer is bonded, a lower surface, a cylindrical side surface between the upper surface and the lower surface, and a chamfered portion between the upper surface and the side surface, includes a base upon which the support disk is placed; and a fixture that is provided on the base, and that has a first surface that abuts against the side surface of the support disk and covers the side surface of the support disk, and a second surface that abuts against the chamfered portion of the support disk and covers the chamfered portion of the support disk.

An ink jet recording head includes a substrate having a plurality of discharge energy generation elements and having an ink supply port, a protective film provided on the substrate and configured to protect wiring connected to the discharge energy generation elements, and an ink discharge port forming member, wherein the protective film has a protruding portion, wherein the ink discharge port forming member has a beam-like protrusion, wherein the beam-like protrusion has a reinforcing rib, and wherein a separation film containing gold is formed at a portion where the protruding portion and the reinforcing rib are held in close contact with each other.

A mobile terminal has a waterproof sheet interposed between a first body portion and a second body portion. The waterproof sheet is formed with a curved shaped or step-like cross-section in consideration of characteristic of internal component or a battery arranged on the first body portion of the mobile terminal, the curved shaped or step-like cross-section is configured to encase, in part or in whole, the internal component or the battery.

Disclosed herein is a thin film type chip device, including: a plurality of unit circuit structures laminated on a substrate; and an adhesive layer adhering the unit circuit structures to each other.

Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a base substrate; an outer circuit layer formed on an upper portion of the base substrate and including a connection pad; a first solder resist formed on the upper portion of the base substrate so that the connection pad of the outer circuit layer is exposed; and a second solder resist formed on an upper portion of an outer circuit layer and formed so that the connection pad is exposed.

A capacitor includes: an anode part that is drawn from an anode body of a capacitor element to an element end-face, to be formed over the element end-face; a cathode part that is drawn from a cathode body of the capacitor element to the element end-face, to be formed over the element end-face; an anode terminal member that is disposed in a sealing member; a cathode terminal member that is disposed in the sealing member; an anode current collector plate that is connected to the anode part, and is also connected to the anode terminal member; and a cathode current collector plate that is connected to the cathode part, and is also connected to the cathode terminal member.

An apparatus includes a case capable of receiving a plurality of capacitive elements, each capacitor element having at least two capacitors, and each capacitor having a capacitive value. The apparatus also includes a cover assembly with a peripheral edge secured to the case. The cover assembly includes, for each of the plurality of capacitive elements, a cover terminal that extends upwardly from the cover assembly generally at a central region of the cover assembly. Each cover terminal is connected to one of the at least two capacitors of the respective one of the plurality of capacitive elements. The cover assembly also includes, for each of the plurality of capacitive elements, a cover terminal that extends upwardly from the cover assembly at a position spaced apart from the cover terminal generally at the central region of the cover assembly.

The electric tool is powered by a secondary battery as a power source, and includes: an output section configured to be transmitted thereto a rotation of a motor directly or through a decelerator; a voltage measurement section that measures a battery voltage; a storage means that stores, as a reference voltage, a voltage value of the battery voltage measured preliminarily when a motor-lock is occurring; and a control means that controls a driving of the motor. The control means is configured to decide that the motor is being locked and then stop or decelerate the motor upon detecting that the battery voltage measured through the voltage measurement section is maintained lower than or equal to the reference voltage stored in the storage means for a predetermined period of time during the driving of the motor.

Reduction in cooling rate of a substrate having a lower temperature is suppressed because the substrate having a lower temperature is not affected by radiant heat of a substrate having a higher temperature while cooling a plurality of substrates in a cooling chamber. The substrate processing apparatus includes a load lock chamber configured to accommodate stacked substrates; a first transfer mechanism having a first transfer arm provided with a first end effector, and configured to transfer the substrates into/from the load lock chamber at a first side of the load lock chamber; a second transfer mechanism having a second transfer arm provided with a second end effector, and configured to transfer the substrates into/from the load lock chamber at a second side of the load lock chamber; a barrier installed between the substrates to be spaced apart from the substrates supported by a substrate support provided in the load lock chamber; and an auxiliary barrier unit installed between the substrate support and the barrier, wherein the auxiliary barrier unit is installed at places other than standby spaces of the end effectors.

Boom drive apparatus for substrate transport systems and methods are described. The boom drive apparatus is adapted to drive one or more multi-arm robots rotationally mounted to the boom to efficiently put or pick substrates. The boom drive apparatus has a boom including a hub, a web, a first pilot above the web, and a second pilot below the web, a first driving member rotationally mounted to the first pilot, a second driving member rotationally mounted to the second pilot, a first driven member rotationally mounted to the boom above the a web, a second driven member rotationally mounted to the boom below the a web, and a first and second transmission members coupling the driving members to driven members located outboard on the boom. Numerous other aspects are provided.

A robot system includes a crane unit, a crane moving mechanism, a robot, and a controller. The crane unit is to suspend a workpiece. The crane unit moves in a horizontal direction via the crane moving mechanism. The robot is to move the crane unit in the horizontal direction via the crane moving mechanism. The controller is configured to control the crane unit to move upwardly to suspend the workpiece after controlling the robot to bring the crane unit into an engaging state in which the crane unit engages with the workpiece located at a first position. The controller is configured to control the crane unit suspending the workpiece to move downwardly to place the workpiece at a second position after controlling the robot to move the crane unit toward the second position while the crane unit suspends the workpiece.

This invention provides a biomolecule modifying substrate comprising biomolecules selectively fixed to given regions thereon. The biomolecule modifying substrate comprises: a substrate at least comprising a first surface and a second surface; a first linker molecule comprising a hydrocarbon chain and a functional group capable of selectively binding to the first surface at one end of the hydrocarbon chain, which is bound to the first surface via such functional group; a second linker molecule comprising a reactive group capable of binding to the hydrocarbon chain of the first linker molecule, which is bound to the first linker molecule via a bond between the reactive group and the hydrocarbon chain; and a biomolecule bound thereto via the second linker molecule.

One exemplary process for manufacturing a surgical apparatus may include providing a flat, generally-planar strip of biocompatible material; cutting the strip to produce a feeder belt with at least one lateral edge, and staples affixed to the feeder belt in proximity to at least one lateral edge, where the staples and feeder belt are substantially aligned along a first plane; and bending at least one staple out of the first plane, while the feeder belt remains in the first plane. Another exemplary process for manufacturing a surgical apparatus may include providing a flat, generally-planar strip of biocompatible material; cutting that strip to produce a feeder belt with edges, and staples affixed to different edges of the feeder belt; and coining at least one staple after the cutting.

According to one embodiment, a system for manufacturing a semiconductor device includes a spontaneous joining unit and a deformative joining unit. The spontaneous joining unit overlaps a first substrate and a second substrate and spontaneously joins mutual center portions of respective joint faces of the first substrate and the second substrate. The deformative joining unit deforms at least one peripheral portion of the respective joint faces of the first substrate and second substrate joined by the spontaneous joining unit toward the other peripheral portion and joins the mutual peripheral portions of the respective joint faces.

Sliding element for seals includes 25 to 75 weight % carbonaceous impalpable powdery aggregate of non-graphitizing carbon and/or graphitizing carbon and 20 to 50 weight % synthetic resin as binder. The sliding element is blended with the range of 5 to 25 weight % carbonaceous carbon fibers without surface treatment and inside the carbon matrix, the carbon fibers are randomly scattered.

An improved manufacturing method for the hole-punching assembly of a hole-punching unit is disclosed. The method of the present invention comprises the following steps: (1) forming a plurality of aluminum balancing pieces with a rectangular shape by extrusion, and forming an indentation area on one side of each balancing piece; (2) forming an elongated slot by an application of stamping on the indentation area of each balancing piece; (3) obtaining a plurality of rectangular pieces (the number of which equals that of the balancing pieces), made of iron, and forming a row of holes by a single application of stamping on each rectangular piece; and (4) fitting each of the rectangular pieces onto the indentation area of a balancing piece, and connecting the balancing pieces together by screws or bolts. The manufacturing method can lower the production cost and simplify the production process of the hole-punching assembly.

Gum manufacturing machinery and method of manufacturing gum is illustrated in which a gum loafing machine generates loaves of finished gum that are then subsequently run through a gum conditioner to more uniformly set the temperature and viscosity of the gum material prior to further processing. Upon achieving the appropriate conditioning level, a further forming extruder may be used to generate a continuous gum ribbon for subsequent rolling and scoring operations. The gum conditioner may include vertically stacked conveyors that have different operational modes including a first mode that provides a serpentine path for a long residence time and a second mode that provides a cascading path that avoids or bypasses much of the length of some of the conveyors to provide a shorter residence time. The gum manufacturing machinery may be used in an adjustable manner so as to accommodate difference gum recipes for different batches of gum product.

A method and an installation are provided for preserving desired seasoning flavour profiles during the manufacturing of food-seasoning sheets. The method includes the steps of; laying a thin layer of adhesive on a base sheet; removing air from the adhesive prior to the step of laying; reducing free moisture from the adhesive during the step of laying, and depositing food-seasoning ingredients onto the thin layer of adhesive. The installation for manufacturing food-seasoning sheets includes an adhesive dispenser having a reservoir and a delivery slot communicating with the reservoir for dispensing adhesive. The dispenser has a heating element mounted thereto for heating the adhesive. The adhesive is made under a partial vacuum and it is conveyed to the dispenser in a partial vacuum.

An optical active fiber is configured with an asymmetrically-shaped core having at least one long axis and a shortest axis which extends transversely to the long axis. The outmost cladding of the active fiber is configured with a marking indicating the orientation of the short axis. The marking allows for bending the fiber so that the shortest axis extends along and lies in the plane of the bend thereby minimizing distortion of a mode which is guided by the asymmetrically-shaped core as light propagates along the bend.

A method of manufacturing an optical semiconductor device including: forming a mesa structure including a first conductivity type cladding layer, an active layer and a second conductivity type cladding layer in this order on a first conductivity type semiconductor substrate, an upper most surface of the mesa structure being constituted of an upper face of the second conductivity type cladding layer; growing a first burying layer burying both sides of the mesa structure at higher position than the active layer; forming an depressed face by etching both edges of the upper face of the second conductivity type cladding layer; and growing a second burying layer of the first conductivity type on the depressed face of the second conductivity type cladding layer and the first burying layer.

A manufacturing method for an excimer laser that includes a reflective Echelle diffraction grating includes obtaining information of a wavelength of a light source, a blazed order, a repetitive pitch of the grating, a material of the grating, and a predefined orientation ratio B/A that is a ratio between that a diffraction efficiency A of the blazed order and a diffraction efficiency Bb of an order lower by one order than the blazed order, and determining an initial value of a blaze angle based upon these pieces of information.

A wire-bound product using a double type laminated paper board and a method for manufacturing the same are disclosed. The wire-bound product employs a structure in which inner paper sheets are turned over in the rightward and leftward directions on front plates of a frame, instead a structure in which a plurality of inner paper sheets is turned over toward the rear surface of a frame, thereby allowing a user to see both surfaces of the inner paper sheets. Further, rear plates of the frame are inserted into various positions of a spring to support the front plates, thereby allowing a standing angle of the front plates of the frame to be adjustable.

In a machine (1) for manufacturing perfect-bound brochures (2) that includes a book block conveying device (10) with an endless conveying means (11), a plurality of clamps (14) that are arranged on the conveying means at a fixed pitch spacing (T) and serve for clamping book blocks (3, 3.1 . . . 3.8), and of at least one processing station (25, 18, 19, 20, 21, 22, 30) that can be adjusted in a motor-driven fashion, the cycle time (t0) referred to the conveyance of the clamps (14) by the pitch spacing (T) defined in the at least one processing station is divided into an adjusting segment (tV1, tV2) for resetting and/or adjusting the at least one processing station (25, 18, 19, 20, 21, 22, 30) in accordance with changing printed product characteristics and a processing segment (tB1, tB2) for processing the book blocks (3, 3.1 . . . 3.8) and/or covers (4, 4.1 . . . 4.4). The resetting of the at least one processing station to another printed product can take place within one work cycle (t0) of the respective processing station while the conveyance of the book blocks (3, 3.1 . . . 3.8) continues.

Method and device for manufacturing adhesively bound printed products composed of a book block and a cover, in which the book block is conducted past processing stations of the adhesive binding device for processing and applying glue to its back. A cover is supplied to the back to which glue has been applied in a synchronously timed controlled manner. After merging of the cover with the book block, a measuring procedure for measuring a mutual actual position of cover relative to book block. Subsequently, this actual position is compared to a predetermined desired position, and, in the case of deviations, a correction value is determined and stored. Prior to the renewed occurrence of the pairing of drive member and clamp, an appropriate change of the mutual positions of clamp and drive member is carried out.

Disclosed is a compressive album manufacturing apparatus in that independent areas for performing an aligning process, a heat providing process, a compressing process, and a cooling process respectively are formed in the multistage compressive album manufacturing apparatus, so that each process, which is done by hand, is merged into one, thereby rapidly manufacturing the bulk of compressive albums.

A floorplan for a Structured ASIC chip is shown having a core region containing memory and VCLB logic cells surrounded by a plurality of IO connection fabrics that include a first IO connection fabric comprising IO sub-banks connecting the core of the chip to pins for external signals to the core, a first high-speed routing fabric disposed along the east-west vertical top of the core and connects the core to high-speed IO such as SerDes; a network-aware connection fabric connects the core to a microcontroller primarily for testing and repair of the memory in the core; and a second-high speed routing fabric is disposed on the north-south vertical sides of the core and communicates with the IO sub-banks. The VCLB Structured ASIC chip is manufactured on a 28 nm CMOS process lithographic node or smaller, having several metal layers and preferably is programmed on a single via layer.

The present invention discloses an Oven Controlled Crystal Oscillator and a manufacturing method thereof. The Oven Controlled Crystal Oscillator comprises a thermostatic bath, a heating device, a PCB and a signal generating element, where the signal generating element is used for generating a signal of a certain frequency, the heating device, the PCB and the signal generating element are mounted in the thermostatic bath, the signal generating element is mounted in a groove formed on one side of the PCB, while the heating device is mounted against the other side of the PCB that is opposite to the groove. The signal generating element may be a passive crystal resonator or an active crystal oscillator. The Oven Controlled Crystal Oscillator according to the invention is advantageous for a small volume and a high temperature control precision.

Power-efficient actuator apparatus and methods. In one exemplary embodiment, the actuator assembly utilizes a shape memory alloy (SMA) filament driven by an electronic power source to induce movement in the underlying assembly to actuate a load (e.g., water valve). In addition, a circuit board is included which allows the actuator assembly to be readily incorporated or retrofit into a wide range of systems such that the signal characteristics of the supply line can, among other applications, be conditioned in order to protect the SMA filament. Furthermore, the circuit board can also readily be adapted for use with “green” power sources such as photovoltaic systems and the like. Methods for manufacturing and utilizing the aforementioned actuator assembly are also disclosed.

The stack package includes a first semiconductor package and a second semiconductor package. The first semiconductor package includes a first substrate having a first modulus and at least one semiconductor chip mounted on the first substrate. The second semiconductor package stacked on the first semiconductor package and includes a second substrate having a second modulus and at least one semiconductor chip mounted on the second substrate. The second modulus is less than the first modulus. Even in the event that the first semiconductor package is under severe warpage due to a temperature change, the flexible second substrate, which includes e.g., polyimide or poly ethylene terephthalate, of the second semiconductor package may be less sensitive to the temperature change, thereby improving reliability of the stack package.

A through silicon via with sidewall roughness and methods of manufacturing the same are disclosed. The method includes forming a via in a substrate and roughening a sidewall of the via by depositing material within the via. The method further includes removing a backside of the substrate to form a through via with a roughened sidewall structure.

A multi-chip package is provided. The multi-chip package includes a plurality of chips including at least one bad chip and at least one good chip that are stacked and a plurality of through electrodes each penetrating the chips. A logic circuit included in the at least one bad chip is isolated from each of the plurality of through electrodes.

In various embodiments, a chip arrangement is provided. The chip arrangement may include a chip carrier and a chip mounted on the chip carrier. The chip may include at least two chip contacts and an insulating adhesive between the chip and the chip carrier to adhere the chip to the chip carrier. The at least two chip contacts may be electrically coupled to the chip carrier.

In manufacturing an LSI, or semiconductor integrated circuit device, the step of assembling device (such as resin sealing step) is normally followed by a voltage-application test in an environment of high temperature (e.g., from 85 to 130° C.) and high humidity (e.g., about 80% RH). It has been found that separation of a titanium nitride anti-reflection film from an upper film and generation of cracks in the titanium nitride film at an upper surface edge part of the aluminum-based bonding pad applied with a positive voltage in the test is caused by an electrochemical reaction due to moisture incoming through the sealing resin and the like to generate oxidation and bulging of the titanium nitride film. These problems are addressed by removing the titanium nitride film over the pad in a ring or slit shape at peripheral area of the aluminum-based bonding pad.