A laser-welded joint structure between insulation frame and bearing cup of fan includes a base having a bearing cup and a stator having at least one insulation frame. The insulation frame includes a sleeve portion defining a bore axially extending therethrough. The sleeve portion is provided on an inner wall surface with at least one pressing section that radially projects into the bore to press a lower side against an upper end of the bearing cup and a bearing received therein. A portion of at least one lateral side of each pressing section that is in contact with the upper end of the bearing cup is melted by laser beam to form a laser-welded joint, so that the insulation frame and the bearing cup are integrally connected together at reduced manufacturing cost and have increased structural strength. A method of forming the laser-welded joint structure is also disclosed.

A head structure of a robot according to the invention includes a first motor and a second motor so supported side by side within a head of the robot that output shafts are positioned coaxially with each other; a left elastic frame that is so driven by the first motor and one end of which is so fitted as to be rotatable around the output shaft and the other end of which extending in a perpendicular direction from the output shaft is supported by a trunk of the robot; and a right elastic frame that is so driven by the second motor and one end of which is so fitted as to be rotatable around the output shaft and the other end of which extending side by side with the left elastic frame from the output shaft is supported by the trunk.

An improved set of toy building or construction blocks, each block having a substantially square cross-section and a generally rectilinear configuration. Incorporated into the structure of the individual toy blocks are transversely oriented slots, grooves and protrusions of predetermined size and location. The slots, grooves and protrusions of pre-determined size and location are of either male or female configuration disposed medially along one or more plane of each block. When the male protrusion of one block is introduced perpendicular to the female slot of one end of another block, a frictional engagement is created resulting in a right angle. When the male protrusion of one block is introduced to the female slot in a linear fashion the result is a line segment. Joining a plurality of said toy building or construction blocks using various perpendicular connections in conjunction with linear connections results in the stable formation of construction or geometric structures without the use of fasteners or other connecting elements.

Various embodiments of a photonic device and fabrication method thereof are provided. In one aspect, a device includes a substrate, a current confinement layer disposed on the substrate, an absorption layer disposed in the current confinement layer, and an electrical contact layer disposed on the absorption layer. The current confinement layer is doped in a pattern and configured to reduce dark current in the device. The photonic device may be a photodiode or a laser.

A building structure including a first building member and a second building member may be connected by a plurality of fasteners, each fastener having a head, a threaded portion having a through hardness of between HRB 70 and HRC 40, a thread-forming portion of at least HRC 50 hardness enabling the fastener to form threads in at least the second steel building member, and a fluted lead portion of at least HRC 50 hardness with a nominal diameter between 70 and 95% of major diameter, such that the fastener is capable of providing a ratio of strip torque to thread-forming torque of at least 2.7 and a ratio of strip torque to drive torque greater than 6.0 when the second steel building member having a thickness of 0.25 inch and the fluted lead portion having at least one diameter within nominal diameter between 80 and 98% of major diameter.

A floorplan for a Structured ASIC chip is shown having a core region containing memory and VCLB logic cells surrounded by a plurality of IO connection fabrics that include a first IO connection fabric comprising IO sub-banks connecting the core of the chip to pins for external signals to the core, a first high-speed routing fabric disposed along the east-west vertical top of the core and connects the core to high-speed IO such as SerDes; a network-aware connection fabric connects the core to a microcontroller primarily for testing and repair of the memory in the core; and a second-high speed routing fabric is disposed on the north-south vertical sides of the core and communicates with the IO sub-banks. The VCLB Structured ASIC chip is manufactured on a 28 nm CMOS process lithographic node or smaller, having several metal layers and preferably is programmed on a single via layer.

An integrated structure of compound semiconductor devices is disclosed. The integrated structure comprises from bottom to top a substrate, a first epitaxial layer, an etching-stop layer, a second epitaxial layer, a sub-collector layer, a collector layer, a base layer, and an emitter layer, in which the first epitaxial layer is a p-type doped layer, the second epitaxial layer is an n-type graded doping layer with a gradually increased or decreased doping concentration, and the sub-collector layer is an n-type doped layer. The integrated structure can be used to form an HBT, a varactor, or an MESFET.

A solenoid valve includes a plunger, an actuating device, and an air tap assembly. The plunger is connected to the actuating device. The air tap assembly is secured to the actuating device and has a cavity. The air tap assembly includes a main body, and first and second tubes. The first tube protrudes from the main body and defines a first through hole. The main body defines a second through hole communicated with the first through hole and the cavity. The second tube defines a third through hole. The main body defines a fourth through hole extended from the third through hole and a fifth through hole extended from the fourth through hole to the cavity. The fifth and second through holes are parallel. The plunger head is used to seal the second and fifth through holes.

An assembly structure of an electronic control unit and a coil assembly of a solenoid valve for an electronic brake system connected to the electronic control unit having a printed circuit board and applying power to the solenoid valve. The coil assembly is penetrated to allow an upper portion of the solenoid valve to be fitted thereinto, and includes a cylindrical bobbin provided with a coil and a coil case. The electronic control unit is provided with a housing having an insertion groove and joined to the hydraulic control unit, the printed circuit board being disposed spaced apart from the coil assembly, and the housing is provided with an elastic member having one end contacting the printed circuit board and the other end contacting the coil case. The elastic member is configured with a coil spring to produce different elastic forces.

Some implementations provide a structure that includes a first package substrate, a first component, a second package substrate, a second component, and a third component. The first package substrate has a first area. The first component has a first height and is positioned on the first area. The second package substrate is coupled to the first package substrate. The second package substrate has second and third areas. The second area of the second package substrate vertically overlaps with the first area of the first package substrate The third area of the second package substrate is non-overlapping with the first area of the first package substrate. The second component has a second height and is positioned on the second area. The third component is positioned on the third area. The third component has a third height that is greater than each of the first and second heights.

A semiconductor device comprises a first semiconductor chip including a first substrate and a plurality of first metal lines formed over the first substrate and a second semiconductor chip bonded on the first semiconductor chip, wherein the second semiconductor chip comprises a second substrate and a plurality of second metal lines formed over the second substrate. The semiconductor device further comprises a conductive plug coupled between the first metal lines and the second metal lines, wherein the conductive plug comprises a first portion formed over a first side of a hard mask layer, wherein the first portion is of a first width and a second portion formed over a second side of the hard mask layer, wherein the second portion is of a second width greater than or equal to the first width.

An interconnect structure and a method of forming an interconnect structure are disclosed. The interconnect structure includes a lower conductive feature in a lower low-k (LK) dielectric layer; a first etch stop layer (ESL) over the lower conductive feature, wherein the first ESL comprises a metal compound; an upper LK dielectric layer over the first ESL; and an upper conductive feature in the upper LK dielectric layer, wherein the upper conductive feature extends through the first ESL and connected to the lower conductive feature. The interconnect structure may further include a second ESL between the upper LK dielectric layer and the first ESL, or between the first ESL and the lower conductive feature, wherein the second ESL comprises a silicon compound.

A bump-on-trace (BOT) structure is described. The BOT structure includes a first work piece with a metal trace on a surface of the first work piece, wherein the metal trace has a first axis. The BOT structure further includes a second work piece with an elongated metal bump, wherein the elongated metal bump has a second axis, wherein the second axis is at a non-zero angle from the first axis. The BOT structure further includes a metal bump, wherein the metal bump electrically connects the metal trace and the elongated metal bump. A package having a BOT structure and a method of forming the BOT structure are also described.

An embodiment is an integrated circuit structure including a first die attached to a second die by a first connector. The first connector includes a solder joint portion between a first nickel-containing layer and a second nickel-containing layer, a first copper-containing layer between the first nickel-containing layer and the solder joint portion, and a second copper-containing layer between the second nickel-containing layer and the solder joint portion.

A semiconductor device has a semiconductor wafer with a plurality of contact pads. A first insulating layer is formed over the semiconductor wafer and contact pads. A portion of the first insulating layer is removed, exposing a first portion of the contact pads, while leaving a second portion of the contact pads covered. An under bump metallization layer and a plurality of bumps is formed over the contact pads and the first insulating layer. A second insulating layer is formed over the first insulating layer, a sidewall of the under bump metallization layer, sidewall of the bumps, and upper surface of the bumps. A portion of the second insulating layer covering the upper surface of the bumps is removed, but the second insulating layer is maintained over the sidewall of the bumps and the sidewall of the under bump metallization layer.

A process for preparing a semiconductor structure for mounting to a carrier is disclosed. The process involves causing a support material to substantially fill a void defined by surfaces formed in the semiconductor structure and causing the support material to solidify sufficiently to support the semiconductor structure when mounted to the carrier.

Methods for fabricating integrated circuits include fabricating a logic device on a substrate, forming an intermediate semiconductor substrate on a surface of the logic device, and fabricating a capacitor-less memory cell on the intermediate semiconductor substrate. Integrated circuits with capacitor-less memory cells formed on a surface of a logic device are also disclosed, as are multi-core microprocessors including such integrated circuits.

A semiconductor device has a protective layer formed over an active surface of a semiconductor wafer. The semiconductor die with pre-applied protective layer are moved from the semiconductor wafer and mounted on a carrier. The semiconductor die and contact pads on the carrier are encapsulated. The carrier is removed. A first insulating layer is formed over the pre-applied protective layer and contact pads. Vias are formed in the first insulating layer and pre-applied protective layer to expose interconnect sites on the semiconductor die. An interconnect structure is formed over the first insulating layer in electrical contact with the interconnect sites on the semiconductor die and contact pads. The interconnect structure has a redistribution layer formed on the first insulating layer, a second insulating layer formed on the redistribution layer, and an under bump metallization layer formed over the second dielectric in electrical contact with the redistribution layer.

Provided is a back plate component having reflective sheet reinforcing structure. The back plate component includes: a frame, a reflective sheet and a plurality of supporting film sheets. The frame includes a plurality of lateral beams and vertical beams, and at least one hollow part is included between the lateral beams and the vertical beams. The reflective sheet is attached to the frame, and includes a reflective surface and a back surface corresponding to the reflective surface. A portion of the back surface covers the whole hollow part. The plurality of supporting film sheets is attached to the back surface at a region corresponding to the hollow part, and includes a material the same as that of the reflective sheet. A liquid crystal display device is further disclosed herein.

A pixel structure comprises a plurality of pixel regions, and each of the pixel regions includes first and second electrodes that are overlapped with each other, the first electrode is disposed above the second electrode, and each of the pixel regions is divided at least into a first to fourth domain display regions; strip-shaped first electrodes in the first to fourth domain display regions make first to fourth angles with a reference direction; the sum of the first angle and the second angle is 180 degrees, the sum of the third angle and the fourth angle is 180 degrees, and the first, the second, the third and the fourth angles are different from one another.

The present invention discloses a tape substrate for chip on film structure of a liquid crystal panel. The tape substrate is provided with plural package units of chip on film structures arranged along its longitudinal direction, and the package unit has a driver chip, input leads and output leads. The longitudinal direction of the driver chip is parallel to the longitudinal direction of the tape substrate, and the input leads and the output leads are located at the two opposite sides of the driver chip. Each package unit is set up with a short side and a long side, and the input leads are formed at the short side, while the output leads are formed at the long side. In the package units adjacent to each other, the short side of one package unit joins the long side of a next package unit. This invention further discloses a liquid crystal panel having the tape substrate.

A stopper structure includes a wall defining an opening. A rotary electronic component has a rotational shaft extending through the opening. A channel stopper has a tubular body and an engagement projection. The tubular body is detachably mounted onto the rotational shaft and is inhibited from rotating relative thereto. The engagement projection extends from an end of the tubular body in an axial direction and a radial direction with respect to the rotational shaft. A rotary operation member is detachably mounted onto the rotational shaft and the tubular body and is inhibited from rotating relative thereto. The rotary operation member has an axial hole in which at least portions of the rotational shaft and the tubular body fit. A limiting portion provided on the wall is engageable with the engagement projection for limiting a range of rotation of the rotational shaft.

Nanostructured Mn—Al, Mn—Al—C permanent magnets are disclosed. The magnets have high coercivities (about 4.8 kOe and 5.2 kOe) and high magnetization values. An intennetallic composition includes a ternary transition metal modified manganese aluminum alloy Mn—Al—Fe, Mn—Al—Ni, or Mn—Al—Co having at least about 80% of a magnetic τ phase and permanent magnetic properties. The alloy may have a saturation magnetization value of at least 96 emu/g with approximately 5% ternary transition metal replacing Al. The alloy may also have a saturation magnetization value of at least 105 emu/g with 10% ternary transition metal replacing Al.

A grooved supporting member for assisting in the construction of a card structure is provided. Specifically, the grooved supporting member provides support for the beginning foundational planar stackable members. The grooved supporting member includes a planar base member, top surface, bottom surface, at least one edge, and at least one groove. Preferably, the groove is cut completely through the planar base member and provides lateral support for a planar stackable member. In the preferred embodiment, the grooved supporting member has four edges and four grooves, thus providing support for four planar stackable members to create the cell of a card structure. The user may employ one or more of the grooved supporting members of the present invention in a card structure. Further disclosed is a kit including a grooved supporting member of the present invention and a plurality of stackable planar members.

An ID document includes a document core and a multi-layer laminate. The multi-layer laminate includes at least three layers: a top layer, a middle layer, and a bottom layer. The top layer, in combination with other layers, provides durability to the ID document. The top layer can be made of a material with strong intrusion or scratch resistance and a high thermal softening/deformation point and can also have high resistance to solvents. The middle layer may be made of a material with a low melting point, and may also have high resistance to solvents. The bottom layer helps to facilitate strong binding to the document core or inlay and may be made of a material with a relatively high melting point.

Disclosed is an organic light-emitting display device in which the substrate and the encapsulation substrate are attached to each other by using a frit. The organic light-emitting display device includes a first substrate including a pixel region in which an organic light-emitting diode is formed, and a non-pixel region. The organic light-emitting diode includes an organic light-emitting layer between a first electrode and a second electrode. A second substrate attached to the first substrate. A frit is provided between the non-pixel region of the first substrate and the second substrate to attach the first substrate and the second substrate. A reinforcement material of resin is formed outside the frit.

The invention relates to a catalytic reactor including: at least one first architecture/microstructure including a ceramic and/or metal cellular architecture having a pore size of 2 to 80 ppi and a macroporosity of more than 85%, and a microstructure having a grain size of 100 nm to 5 microns, and skeleton densification of more than 95%, and a catalytic layer; and at least one second architecture/microstructure including a spherical or cylindrical architecture having a pore size of 0.1 to 100 μm and a macroporosity of less than 60%, and a microstructure having a grain size of 20 nm to 10 μm and a skeleton densification of 20% to 90%, and a catalytic layer; the first and second architecture/microstructure being stacked inside said reactor.

A process for the production of nano-structures is presented, involving providing a graphite flake comprising graphene layers; intercalating the graphite flake to form a graphite intercalation compound exhibiting Stage I, II or III intercalation; and exfoliating the graphite intercalation compound by exposing it to a temperature between about 1600° C. and about 2400° C. such that a plurality of individual graphene layers are separated from the graphite intercalation compound.

According to one embodiment, a battery-mounting structure includes a first housing, a second housing including a display device including a display screen, a hinge configured to attach the second housing to the first housing rotatably between a first position in which the display screen is covered with the first housing and a second position in which the display screen is exposed, and a battery configured to be attached to the first housing and including a recess configured to accommodate a part of the second housing in the second position.

portable electronic device includes a host module, a display module and a hinge structure. The hinge structure is pivotally connected to the host module and the display module. The hinge structure includes a support frame, a rotating component and two pivotal components. An end of the rotating component is installed inside the support frame and another end of the rotating component is installed inside the display module, so that the display module is capable of rotating in a first rotating direction relative to the support frame. The two pivotal components are disposed at opposite sides of the support frame and separated from the rotating component. An end of each pivotal component is installed inside the support frame and another end of each pivotal component is installed inside the host module, so that the display module is capable of rotating in a second rotating direction relative to the host module.

A drawer structure (5) includes a fixing device (6) for fixing a front panel (7) to a drawer container (8) in a detachable and position-adjustable manner. The front panel (7) can be detachably connected to the fixing device (6) by means of a connection element (9) pre-mounted on the front panel (7). A first adjusting element (1) is associated with the container (8), for adjusting the position of the front panel (7) in the vertical direction (HR), and a second adjusting element (2) is associated with the container (8), for adjusting the position of the front panel (7) in the lateral direction (SR), at least the first (1) and second (2) adjusting elements engaging with the same part of the connection element (9).

Methods and systems for transportation using a rail structure are disclosed. In one aspect, a track for use with at least one of a magnetic levitation vehicle and a rolling vehicle having one or more wheels is disclosed. The track includes a first head having a maximum lateral dimension, a second head having a maximum lateral dimension, and a connection portion extending between the first head and the second head. The first connection portion may have a maximum lateral dimension that is less than the maximum lateral dimension of the first head. The track may also include a base and a support extending between the second head and the base.

An inflatable structure may be formed from a single piece of flexible film using a provided method of manufacturing. The inflatable structure may include quilting seals which divide the inflatable chamber. The inflatable structure may also include an external valve opening extending through multiple layers of the flexible film. The external valve opening may further be partially defined by edge portions of the flexible film formed by folding the flexible film. The external valve opening may be configured to align with an opening in a container or an inflation aperture in a pouch so that the inflatable structure can be inflated while inside the container/pouch. A corresponding inflation device fills the inflatable structure with air and may do so without requiring heat sealing or contact between the inflatable structure and outlet of the inflation device. A hinged plate apparatus may assist in directing air into the external valve opening.

A nacelle main frame structure and drive train assembly (1) for being mounted on a tower (2) of a wind turbine. The nacelle main frame structure and drive train assembly (1) comprises a nacelle main frame structure (4) with a central part (6) connecting a first part (7) to a second part (8). The first part (7), during wind turbine operation and/or servicing activities, takes up loads of a rotor (9). A drive train (5) is at least partially located between the first and second parts (7, 8). The central part (6) of the main frame structure (4) is located substantially above at least part of the drive train (5) and is such that at least part of the drive train (5) can only be removed from the main frame structure (4) by lowering at least part of the drive train (5) from the main frame structure (4).

A marine propeller has at least two blades each having a body, a vane and connection members that enable the blades to be fixed together. The blades are formed with a one-piece vane and the bodies are attached to one another and with the bodies form the central hub of the propeller that may be fitted on a ship's shaft after mounting.

A system comprises a structure having particles embedded at a level within the structure, and X-ray imaging apparatus for capturing images of the particles at the level.

A training device for sclerotherapy. The device includes at least one artificial venous structure adapted to contain a fluid, a reservoir, and a fluid path connecting the artificial venous structure to the reservoir.

Type composing apparatus is disclosed as including means for representing its binary code a series of characters, means for generating a relative width value for each character, means for representing a succession of point size factors, one for each character, and means for multiplying a relative width value assigned to each character by a point size factor for that character. The means for multiplying associated pairs of relative width values and point size factors is disclosed as comprising a memory having stored therein products of relative width values and point size factors. Means are shown for addressing and extracting from the memory an adjusted width value and point size factor. The means for generating a relative width value for each character is depicted as including a read-only integrated circuit memory having permanently stored therein at mutually exclusive addresses a relative width value for each of the characters. One embodiment of a photocomposing machine is disclosed.

A vehicle front part structure includes right and left front side frames provided rightwardly and leftwardly of and extending longitudinally of a vehicle body. A front bumper beam is attached to front ends of the right and left front side frames and extends transversely of the vehicle body. Right and left substays extend downwardly from front parts of the right and left front side frames. The right and left substays have lower parts connected to each other through a front lower cross member. Each of the right and left substays has first portions coupled through fastening members to and has second portions coupled through fillet welding to the respective front parts of the right and left front side frames.

A mounting structure 10 having improved stiffness characteristics. The mounting structure 10 includes a pillar 14 which forms a portion of a vehicle body 12 and which operatively supports a vehicle door which is selectively attached to the pillar 14 by hinges 16. The structure 10 includes a pair of “closed-loop” beads which are formed around hinges 16, and which increase the stiffness characteristics of the pillar 14 and of the vehicle door.

A three dimensional (3D) branchline coupler using through silicon vias (TSV), methods of manufacturing the same and design structures are disclosed. The method includes forming a first waveguide structure in a first dielectric material. The method further includes forming a second waveguide structure in a second dielectric material. The method further includes forming through silicon vias through a substrate formed between the first dielectric material and the second dielectric material, which connects the first waveguide structure to the second waveguide structure.

The present invention provides an artificial microstructure employed in an artificial electromagnetic material. The artificial microstructure includes a first segment, a second segment, and a third segment. The first segment is parallel to the second segment, and the third segment is connected between the first segment and the second segment. The artificial electromagnetic material has a special electromagnetic effect. The artificial electromagnetic material can be applied to various electromagnetic application systems instead of the typical electromagnetic material.

An attenuation reduction control structure for high-frequency signal transmission lines of a flexible circuit board includes an impedance control layer formed on a surface of a substrate. The impedance control layer includes an attenuation reduction pattern that is arranged in an extension direction of the high-frequency signal transmission lines of the substrate and corresponds to bottom angle structures of the high-frequency signal transmission lines in order to improve attenuation of a high-frequency signal transmitted through the high-frequency signal transmission lines. An opposite surface of the substrate includes a conductive shielding layer formed thereon. The conductive shielding layer is formed with an attenuation reduction pattern corresponding to top angle structures of the high-frequency signal transmission lines.

A coupling structure for a multi-layered chip filter includes a resonator layer including a resonator pattern with spaced areas and a coupling layer including at least two separated overlap portion patterns overlapped with the spaced areas of the resonator pattern respectively and a connecting portion pattern having multiple linear portions connecting the separated overlap portion patterns in an area not-overlapped with the resonator pattern.

A cavity filter includes a slider, a driving device, and an adapter. The slider is used to slide relative to and couple with a plurality of resonators located in the cavity filter to adjust a resonating frequency of the cavity filter. The driving device is used to drive the slider slide relative to the plurality of resonators and includes a shaft having a free end. The adapter is installed between the slider and the driving device and rotateably connected to the free end of the shaft with a gap configured between the free end and the adapter.

A papermaking machine for the production of a fibrous web including a plurality of rollers and a structured fabric moving along the rollers. The structured fabric includes a plurality of weft yarns and a plurality of warp yarns woven with the plurality of weft yarns to produce a weave pattern, the plurality of warp yarns being a plurality of paired warp yarn sets. Each paired warp yarn set including a first warp yarn and a second warp yarn. Within the weave pattern the first warp yarn forms a float over at least four weft yarns and weaves with a single weft yarn immediately adjacent with the float. The second warp yarn having an inverse pattern to the first warp yarn, with the second warp yarn weaving with another single weft yarn that is not adjacent to the single weft yarn with which the first warp yarn is woven.

Provided are a lightweight, compact reinforcing tape capable of improving a tensile strength. A reinforcing tape for reinforcing a tensile strength of a cloth includes weft threads which constitute a weave structure of the reinforcing tape, and warp threads which constitute a weave structure of the reinforcing tape, wherein a part of the warp threads are made of a high-strength fiber.

Fabric strap having at least two different segments. The first segment is wider and less elastic, providing a comfortable contacting area to the skin and the other segment is narrower and more elastic which is aesthetically more pleasing and easier for applying sewing process in the garment production. Preferably, the first segment is a sealed tubular structure and contains internally free-floating yarns, making it exert less stress to the skin and thus more comfortable to the wearer. In addition, the different segments of the strap are made in a single integral weaving process and thus is conducive to industry automation.

A multilayer fabric is joined by engaging joining loops formed at both ends of a disjoined industrial multilayer fabric having wefts and warps in layers. The joining loops are formed by folding back some or all the end portions of warps. The both ends of the fabric are joined by engaging the loops to form a common hole and inserting a core wire into the common hole. At least one upper side weft remains while a lower side weft below the remaining upper side weft is removed at the both ends of the fabric. The common hole and the core wire inserted therein are located below the remaining upper side weft. The folded portions of the warps are interwoven with wefts of a normal portion of the fabric.

An auxiliary and motive electric power pick-up structure for articulated and non-articulated land vehicles, such as electric public transport vehicles, that pass close to a collector-shoe-type power supply member mounted on a stationary support (17) along the route of the vehicle and positioned at intervals along the length of the route in order to provide auxiliary and motive electric power to the vehicle by way of the shoe (16). The structure comprises at least one conductor rail mounted on insulating supports (11) attached to the vehicle by suspension points (34), each including an elastic suspension unit (30) and a pneumatic, hydraulic or other type active suspension unit (33). In the case of articulated vehicles, the pick-up structure is divided into power supply segments (14) separated by a conducting link (19) at each articulated unit of the vehicle.