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Game calling device having varied pitch and intensity

A game calling device including a mouthpiece having inlet and outlet portions and holes between the inlet and outlet portions, whereby sounds having varied pitch and intensity can be generated. The game calling device also includes an inner tubular member that at least partially houses a reed and configured to be selectively positioned on the axial direction of the reed so that the emitted sound can be varied based at least on the position of the inner tubular member along the reed and thereby allowing the game calling device to be used hands-free.




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All fiber passively Q-switched laser

Embodiments relate to an all fiber passively Q-switched laser. The laser includes a large core doped gain fiber having a first end. The large core doped gain fiber has a first core diameter. The laser includes a doped single mode fiber (saturable absorber) having a second core diameter that is smaller than the first core diameter. The laser includes a mode transformer positioned between a second end of the large core doped gain fiber and a first end of the single mode fiber. The mode transformer has a core diameter that transitions from the first core diameter to the second core diameter and filters out light modes not supported by the doped single mode fiber. The laser includes a laser cavity formed between a first reflector positioned adjacent the large core doped gain fiber and a second reflector positioned adjacent the doped single mode fiber.




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Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic components

An interposer (support substrate) for an opto-electronic assembly is formed to include a thermally-isolated region where temperature-sensitive devices (such as, for example, laser diodes) may be positioned and operate independent of temperature fluctuations in other areas of the assembly. The thermal isolation is achieved by forming a boundary of dielectric material through the thickness of the interposer, the periphery of the dielectric defining the boundary between the thermally isolated region and the remainder of the assembly. A thermo-electric cooler can be used in conjunction with the temperature-sensitive device(s) to stabilize the operation of these devices.




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Vibration resistant optically pumped semiconductor laser

An intra-cavity frequency doubled OPS-laser includes a laser-resonator terminated by a plane mirror and a mirror-structure of an OPS-chip. The resonator is folded by three fold-mirrors. The fold-mirrors are supported on a vibration-isolation plate supported by isolation posts above a base-plate. The plane mirror and the mirror-structure of the OPS-chip are mounted back to back on opposite parallel surfaces of a mounting block. The mounting-block is supported on the base-plate and extends through an aperture in the vibration-isolation plate. Movement of the vibration-isolation plate with respect to the base-plate does not change the resonator length.




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Panel fastener, panel assembly and methods of assembly and installation

Panel fasteners, panel assemblies, methods of assembly and installation of panel assemblies and panel fasteners, anchor systems, anchor systems with captive fasteners and assemblies are disclosed.




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Tall toilet bolt cap

Decorative toilet bolt caps having and elongated tube positioned above an aperture are disclosed. The cap may be formed of a single unit of material. By virtue of having an elongated tube positioned above an aperture, the cap may cover a closet bolt having an unreduced length.




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Pallet having reconfigurable tie-down system

A pallet system includes a pallet upon which cargo or other payloads may be carried. The pallet has a plurality of tie-down locations at which the pallet may be tied-down on a base, and at least one tie-down device for tying down the pallet on the base at any of the tie-down locations. The pallet further includes structure for mounting the tie-down device on the pallet at any of the tie-down locations.




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Architectural floorplan for a structured ASIC manufactured on a 28 NM CMOS process lithographic node or smaller

A floorplan for a Structured ASIC chip is shown having a core region containing memory and VCLB logic cells surrounded by a plurality of IO connection fabrics that include a first IO connection fabric comprising IO sub-banks connecting the core of the chip to pins for external signals to the core, a first high-speed routing fabric disposed along the east-west vertical top of the core and connects the core to high-speed IO such as SerDes; a network-aware connection fabric connects the core to a microcontroller primarily for testing and repair of the memory in the core; and a second-high speed routing fabric is disposed on the north-south vertical sides of the core and communicates with the IO sub-banks. The VCLB Structured ASIC chip is manufactured on a 28 nm CMOS process lithographic node or smaller, having several metal layers and preferably is programmed on a single via layer.




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Semiconductor device having serializer converting parallel data into serial data to output serial data from output buffer circuit

Disclosed herein is a device that includes first and second buffer circuits connected to a data terminal and a first control circuit controlling the first and second buffer circuits. The first control circuit receives n pairs of first and second internal data signals complementary to each other from 2n input signal lines and outputs a pair of third and fourth internal data signals complementary to each other to first and second output signal lines, where n is a natural number more than one. The first and second buffer circuits are controlled based on the third and fourth internal data signals such that one of the first and second buffer circuits turns on and the other of the first and second buffer circuits turns off.




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Massively parallel interconnect fabric for complex semiconductor devices

An embodiment of this invention uses a massive parallel interconnect fabric (MPIF) at the flipped interface of a core die substrate (having the core logic blocks) and a context die (used for in circuit programming/context/customization of the core die substrate), to produce ASIC-like density and FPGA-like flexibility/programmability, while reducing the time and cost for development and going from prototyping to production, reducing cost per die, reducing or eliminating NRE, and increasing performance. Other embodiments of this invention enable debugging complex SoC through large contact points provided through the MPIF, provide for multi-platform functionality, and enable incorporating FGPA core in ASIC platform through the MPIF. Various examples are also given for different implementations.




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Semiconductor integrated circuit having a switch, an electrically-conductive electrode line and an electrically-conductive virtual line

A semiconductor integrated circuit including: a circuit block having an internal voltage line; an annular rail line forming a closed annular line around the circuit block and supplied with one of a power supply voltage and a reference voltage; and a plurality of switch blocks arranged around the circuit block along the annular rail line, the plurality of switch blocks each including a voltage line segment forming a part of the annular rail line and a switch for controlling connection and disconnection between the voltage line segment and the internal voltage line.




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Digitally controlled oscillator and digital PLL including the same

A digitally controlled oscillator has a high-order ΔΣ modulator configured to be of at least an order higher than a first order and configured to input a digital control signal and output a pseudorandom digital output signal, a first-order ΔΣ modulator configured to input the pseudorandom digital output signal and generate a control pulse signal including a pulse width corresponding to the pseudorandom digital output signal, a low pass filter configured to pass a low frequency component of the control pulse signal, and an oscillator configured to generate a high-frequency output signal whose frequency is controlled based on the control pulse signal outputted by the low pass filter so as to be a frequency corresponding to the digital control signal.




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Progressively sized digitally-controlled oscillator

A digitally-controlled oscillator includes a base frequency generator having an odd number of base inverters connected end-to-end to generate an output signal that oscillates at a predetermined frequency and a frequency-adjusting unit connected to the base frequency generator. The frequency-adjusting unit includes a first string of switchable inverters connected in series with each other, the switchable inverters having sizes that decrease from an input end of the first string to the output end of the first string.




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Digitally controlled injection locked oscillator

An injection locking oscillator (ILO) comprising a tank circuit having a digitally controlled capacitor bank, a cross-coupled differential transistor pair coupled to the tank circuit, at least one signal injection node, and at least one output node configured to provide an injection locked output signal; a digitally controlled injection-ratio circuit having an injection output coupled to the at least one signal injection node, configured to accept an input signal and to generate an adjustable injection signal applied to the at least one injection node; and, an ILO controller connected to the capacitor bank and the injection-ratio circuit configured to apply a control signal to the capacitor bank to adjust a resonant frequency of the tank circuit and to apply a control signal to the injection-ratio circuit to adjust a signal injection ratio.




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Numerically-controlled oscillator

Various techniques for generating an output clock based on a reference clock. This disclosure relates to generating an output clock signal based on a reference clock signal. In one embodiment, a method includes generating, using information received from a control circuit, an output clock signal using both a first number of edges or an input clock signal and a second, different number of edges of the input clock signal. In this embodiment, the control circuit runs at a frequency that is less than a frequency of the input clock signal. The received information may indicate, for a pulse of the output clock signal, whether the pulse should be generated using the first number of edges or the second number of edges. In some cases, the second number of edges may be the first number of edges plus one. The first and second number of edges may be programmable quantities.




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Current output control device, current output control method, digitally controlled oscillator, digital PLL, frequency synthesizer, digital FLL, and semiconductor device

A current output control device is provided that includes: a current cell array section including plural current cell circuits that are each connected in parallel between a first terminal (power source) and a second terminal (ground) that connect between the first terminal and the second terminal in by operation ON so as to increase control current flowing between the first terminal and the second terminal; and a code conversion section (decoder) that generates signals (row codes, column codes) to ON/OFF control current cells so as to change the number of current cells that connect the first terminal and the second terminal according to change in an externally input code and that inputs the generated signals to the current cell array section.




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Ball valve

A ball valve which can suppress the increasing of processing labor time and reliably prevent simultaneous rotation of a ball seat and a ball when the ball is rotated by handle manipulation is provided. The valve body 2 is formed of a hard material such as stainless steel, the ball seat is formed of a relatively soft material such as a fluorine resin, and a protrusion 18 is formed on a ball seat support surface 13 of the valve body 2 made of a hard material so as to bite into the ball seat 4.




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Small and bulk pack napkin separator

An apparatus and method are provided, for alternatively producing either small or bulk packs of napkins from a stack of folded napkins produced by one folding machine, through use of a pack dispatching arrangement having an inlet, a small pack transfer station and a bulk pack transfer station, and configured for operation in a small pack mode for dispatching a stream of spaced apart small packs of folded sheets separated from the stack of folded sheets, and received at an inlet of the pack dispatching arrangement, to the small pack transfer station, and alternatively operable in a bulk pack mode for dispatching a stream of spaced apart bulk packs of folded sheets separated from the stack of folded sheets, and received at an inlet of the pack dispatching arrangement, to the bulk pack transfer station.




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Stacked microelectronic packages having patterned sidewall conductors and methods for the fabrication thereof

Embodiments of a method for fabricating stacked microelectronic packages are provided, as are embodiments of a stacked microelectronic package. In one embodiment, the method includes arranging microelectronic device panels in a panel stack. Each microelectronic device panel includes a plurality of microelectronic devices and a plurality of package edge conductors extending therefrom. Trenches are formed in the panel stack exposing the plurality of package edge conductors. An electrically-conductive material is deposited into the trenches and contacts the plurality of package edge conductors exposed therethrough. The panel stack is then separated into partially-completed stacked microelectronic packages. For at least one of the partially-completed stacked microelectronic packages, selected portions of the electrically-conductive material are removed to define a plurality of patterned sidewall conductors interconnecting the microelectronic devices included within the stacked microelectronic package.




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Genetically modified Streptococcus thermophilus bacterium

Methods and compositions for targeted delivery of biotherapeutics are provided. The compositions comprise bile-sensitive St. thermophilus bacteria modified to release a biotherapeutic agent following bile exposure. Biotherapeutic agents released by the St. thermophilus bacteria disclosed herein include AQ and AQR rich peptides. Methods of the invention comprise administering to a subject a St. thermophilus bacterium modified to release a biotherapeutic agent following bile exposure. Administration of the St. thermophilus bacterium promotes a desired therapeutic response. The bacterium may be modified to express and release AQ or AQR rich peptides which subsequently inhibit cellular apoptosis or reduce mucosal damage. Thus, methods of the invention find use in treating or preventing a variety of gastrointestinal disorders including C. difficile infection and antibiotic-associated diarrhea.




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Small molecule antagonists of phosphatidylinositol-3,4,5-triphosphate (PIP3) and uses thereof

Disclosed are new members of a class of non-lipid small molecule inhibitors which interfere with the interaction between phosphoinositol-3,4,5-triphosphate (PIP3) and pleckstrin homology (PH) domains. These molecules target a broad range of PIP3-dependent signaling events in vitro and exert significant anti-tumor activity in vivo, with improved activity and selectivity toward particular PH domains. The small molecule inhibitors of the invention can be used alone or together with tumor necrosis factor (TNF)-related apoptosis-inducing ligand (TRAIL) or other cancer medicament to treat cancer. Small molecule inhibitors of the invention act synergistically in combination with TRAIL and with other Akt inhibitors in treating cancer. Pharmaceutical compositions and methods for treating cancer are provided.




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Chair having a dynamically-flexible back and seat

A chair including a dynamically-flexible back and seat having a shape that adjusts to the movements of a user seated in the chair to enhance user comfort. Each of the back and seat has an air gap formed therewithin and a resilient frame or liner with a spring memory. The resilient liner is adapted to flex in response to compressive forces that are generated as the user slides his body back or from side-to-side in the chair. Accordingly, some of the chair back and some of the chair seat move into respective air gaps so that the shapes of the back and seat change to conform to the movements of the user. The air gaps also establish air flow ventilation channels which run laterally through the back and seat of the chair.




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Operating unit for installation in an aircraft cabin

An operating unit (1) for installation in an aircraft cabin comprises an operating unit front side (10) and an operating unit rear side (20), at least one operating element (12, 14) attached in the region of the operating unit front side (10) and accessible to a user, and a holding device (40) for attaching the operating unit (1) to a monument (30) accommodating the operating unit (1) in its state mounted in the aircraft cabin. The holding device (40) is designed to attach the operating unit (1) in its state mounted in the aircraft cabin to the monument (30), in a first position or in a second position, as desired, the operating element (12, 14) in the second position of the operating unit (1) being situated in a spatial position which is lowered with respect to the spatial position of the operating element (12, 14) in the first position of the operating unit (1) and/or is displaced in a direction parallel to an imaginary straight line connecting the operating unit rear side (20) to the operating unit front side (10).




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Zero-wall clearance linkage mechanism for a lifting recliner

A seating unit that includes a linkage mechanism adapted to move the seating unit between seat-lift, closed, extended, reclined, and seat-lift positions is provided. The linkage mechanism includes a seat-mounting plate mounted to a footrest assembly, a base plate fixedly mounted to a lift assembly, a back-mounting link rotatably coupled to the seat-mounting plate, a seat-adjustment assembly with a bellcrank, and a linear actuator for automating adjustment of the linkage mechanism. In operation, a stroke in a first phase of the linear actuator generates a force on the bellcrank that translates the seat-mounting plate rearward in a consistent angle of inclination and rotates the back-mounting link from a reclined to an upright orientation. A stroke in a second phase acts to collapse the footrest assembly. A stroke in a third phase causes the lift assembly to raise and tilt the seating unit, thereby accommodating egress and ingress of an occupant.




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Small-step, switchable capacitor

According to an example embodiment, an apparatus is provided that produces a small-step switchable capacitor, which can have steps that are smaller in value than the smallest capacitor used in the system. In one embodiment, an input signal is connected to a switchable capacitor system that includes at least one and/or a plurality of small-step, switchable capacitors. In an example embodiment, a capacitor system may be provided that includes a first capacitance block coupled in series with a second capacitance block. In an example embodiment, the second capacitance block may include one or more switchable capacitors to provide a step in capacitance for the capacitor system between a first setting and a second setting using the one or more switchable capacitors. Also, in an example embodiment, the step in capacitance of the capacitor system may be determined based, at least in part, on a ratio of the capacitance of the second capacitance block to the capacitance of the first capacitance block.




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Dynamically adjustable Q-factors

One embodiment relates to a circuit for active loss compensation. The circuit includes a parallel inductor-capacitive (LC) tank circuit having a first single-ended output. A first adjustable capacitor, which includes a first terminal and a second terminal, is coupled to the first single-ended output. The circuit also includes a first pair of transistors having sources coupled to a first common node. One transistor of the first pair of transistors has a drain coupled to the first single-ended output and the other transistor of the first pair of transistors has a gate coupled to the second terminal of the first adjustable capacitor. Other embodiments are also disclosed.




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Powder coating gun with manually operated controls on gun

Control method and apparatus for a manual spray gun may include a second manually actuated trigger disposed on the spray gun handle, with the second trigger being operational to select or change one or more coating operation parameters.




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Mechanically controlled variable capacitors for impedance tuners

An improved grounding technique for mechanically adjustable rotary capacitors uses a directly grounded bronze sliding contact to effectively and continuously ground the rotating comb-like blades of the capacitor. RF measurements of the continuity and repeatability of the capacitance settings prove the suitability of the modified capacitors for using in pre-calibrated multi-capacitor MHz range impedance tuners.




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Method and apparatus for use in digitally tuning a capacitor in an integrated circuit device

A method and apparatus for use in a digitally tuning a capacitor in an integrated circuit device is described. A Digitally Tuned Capacitor DTC is described which facilitates digitally controlling capacitance applied between a first and second terminal. In some embodiments, the first terminal comprises an RF+ terminal and the second terminal comprises an RF− terminal. In accordance with some embodiments, the DTCs comprise a plurality of sub-circuits ordered in significance from least significant bit (LSB) to most significant bit (MSB) sub-circuits, wherein the plurality of significant bit sub-circuits are coupled together in parallel, and wherein each sub-circuit has a first node coupled to the first RF terminal, and a second node coupled to the second RF terminal. The DTCs further include an input means for receiving a digital control word, wherein the digital control word comprises bits that are similarly ordered in significance from an LSB to an MSB.




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Template-based installation of workflow systems in a print shop environment

Systems and methods are provided for installing workflow servers for a print shop. One embodiment is a system that installs a workflow server for a print shop. The system accesses installation templates, configured for different categories of print shop, that describe a set of print shop resources expected to exist at the category of print shop. The system also installs workflow server software on a computer system of a print shop. During the installation, the system determines a category for the print shop, selects an installation template that matches the category of the print shop, and performs a dialogue of queries with a user to determine which resources of the set of print shop resources identified by the installation template are available to the print shop, wherein the dialogue excludes queries for print shop resources that are not in the set of print shop resources described by the installation template.




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Nickel-base superalloys and components formed thereof

A gamma prime nickel-base superalloy and components formed therefrom that exhibit improved high-temperature dwell capabilities, including creep and hold time fatigue crack growth behavior. A particular example of a component is a powder metallurgy turbine disk of a gas turbine engine. The gamma-prime nickel-base superalloy contains, by weight, 16.0 to 30.0% cobalt, 11.5 to 15.0% chromium, 4.0 to 6.0% tantalum, 2.0 to 4.0% aluminum, 1.5 to 6.0% titanium, up to 5.0% tungsten, 1.0 to 7.0% molybdenum, up to 3.5% niobium, up to 1.0% hafnium, 0.02 to 0.20% carbon, 0.01 to 0.05% boron, 0.02 to 0.10% zirconium, the balance essentially nickel and impurities, wherein the titanium:aluminum weight ratio is 0.5 to 2.0.




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Nickel-base superalloys and components formed thereof

A gamma prime nickel-base superalloy and components formed therefrom that exhibit improved high-temperature dwell capabilities, including creep and hold time fatigue crack growth behavior. A particular example of a component is a powder metallurgy turbine disk of a gas turbine engine. The gamma-prime nickel-base superalloy contains, by weight, 18.0 to 30.0% cobalt, 11.4 to 16.0% chromium, up to 6.0% tantalum, 2.5 to 3.5% aluminum, 2.5 to 4.0% titanium, 5.5 to 7.5% molybdenum, up to 2.0% niobium, up to 2.0% hafnium, 0.04 to 0.20% carbon, 0.01 to 0.05% boron, 0.03 to 0.09% zirconium, the balance essentially nickel and impurities, wherein the titanium:aluminum weight ratio is 0.71 to 1.60.




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Sliding part made of Pb-free Cu-Bi based sintered alloy

Sliding parts are made of Pb-free Cu—Bi based sintered material. The side in contact with a shaft is machined to a predetermined roughness. A number of Bi phases are present on the finished surface. Stable performance of Bi is to be exhibited. Machined sintered material covers a portion of the Bi phases. The ratio of the exposed surface area of the Bi phases is 0.5% or more relative to the area of the finished surface.




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6xxx aluminum alloys, and methods for producing the same

New 6xxx aluminum alloy bodies and methods of producing the same are disclosed. The new 6xxx aluminum alloy bodies may be produced by preparing the aluminum alloy body for post-solutionizing cold work, cold working by at least 25%, and then thermally treating. The new 6xxx aluminum alloy bodies may realize improved strength and other properties.




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Casting aluminum alloy and internal combustion engine cylinder head

Disclosed are: a casting aluminum alloy that is excellent in elongation as alternative properties of a high cycle fatigue strength and a thermal fatigue strength and is suitably usable for a casting for which both of the excellent high cycle fatigue strength and the excellent thermal fatigue strength are required, for example, an internal combustion engine cylinder head; a casting made of the aluminum alloy; a manufacturing method of the casting; and further, an internal combustion engine cylinder head composed of the aluminum alloy casting and manufactured by the manufacturing method of the casting. The casting aluminum alloy contains, in terms of mass ratios, 4.0 to 7.0% of Si, 0.5 to 2.0% of Cu, 0.25 to 0.5% of Mg, no more than 0.5% of Fe, no more than 0.5% of Mn, and at least one component selected from the group consisting of Na, Ca and Sr, each mass ratio of which is 0.002 to 0.02%.




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Methods for determining a recovery state of a metal alloy

Methods for determining a recovery state of a metal alloy are disclosed herein. In one example, a fluctuation in a crystallographic grain orientation of the metal alloy is determined by utilizing electron backscatter diffraction (EBSD) data of the metal alloy. A processor of an electron backscatter diffraction machine utilizes a local orientation deviation quantifier to correlate the fluctuation in the crystallographic grain orientation of the metal alloy with a plastic strain recovery of the metal alloy. Other examples of the method are also disclosed herein.




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Amorphous alloys having zirconium and methods thereof

Alloys and methods for preparing the same are provided. The alloys are represented by the general formula of (ZraAlbCucNid)100-e-fYeMf, wherein a, b, c, and d are atomic fractions, in which: 0.472≦a≦0.568; 0.09≦b≦0.11; 0.27≦c≦0.33; 0.072≦d≦0.088; the sum of a, b, c, and d equals 1; e and f are atomic numbers of elements Y and M respectively, in which 0≦e≦5 and 0.01≦f≦5; and M is selected from the group consisting of Nb, Ta, Sc, and combinations thereof.




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Cu—Ni—Si alloy for electronic material

The distribution of Ni—Si compound grains is controlled to thereby improve the properties of Corson alloys. The copper alloy for electronic materials comprises 0.4 to 6.0% mass of Ni and 0.1 to 1.4% by mass of Si, with the balance being Cu and unavoidable impurities. The copper alloy comprising: small particles of Ni—Si compound having a particle size of equal to or greater than 0.01 μm and smaller than 0.3 μm; andlarge particles of Ni—Si compound having a particle size of equal to of greater than 0.3 μm and smaller than 1.5 μm. The number density of the small particles is 1 to 2000 pieces/μm2 and the number density of the large particles is 0.05 to 2 pieces/μm2.




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Silver alloy

A platinum-free silver alloy may include about 0.1% to 0.9% Au, about 83% to 90% Ag, about 2% to 3% Pd, about 3% to 5% Zn, about 2% to 8% Cu, about 0.01% to 0.4% B, about 0.1% to 0.3% Ge, and about 0.01% to 0.03% Ir.




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Nickel-chromium-cobalt-molybdenum alloy

A nickel-chromium-cobalt-molybdenum alloy includes (in weight %) Cr 21-23%, Fe 0.05-1.5%, C 0.05-0.08%, Mn≦0.5%, Si≦0.25%, Co 11-13%, Cu≦0.15%, Mo 8.0-10.0%, Ti 0.3-0.5%, Al 0.8-1.3%, P




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Magnesium based-alloys for hydrogen storage

Magnesium-based hydrogen storage alloys with addition of transition and rare earth elements were produced by conventional induction melting and by rapid solidification. The magnesium based-alloys of this invention posses reversible hydrogen storage capacities ranging from 3 to over 6 wt. %, and excellent performance on the hydrogen absorption and desorption kinetics.




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Magnesium alloys containing rare earths

Magnesium alloys containing: Y: 2.0-6.0% by weight Nd: 0-4.0% by weight Gd: 0-5.5% by weight Dy: 0-5.5% by weight Er: 0-5.5% by weight Zr: 0.05-1.0% by weight Zn+Mn:




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Nickel-based superalloy

A nickel-base superalloy is characterized by the following chemical composition (details in % by weight): 7.7-8.3 Cr, 5.0-5.25 Co, 2.0-2.1 Mo, 7.8-8.3 W, 5.8-6.1 Ta, 4.9-5.1 Al, 1.0-1.5 Ti, 1.0-2.0 Re, 0.11-0.15 Si, 0.1-0.7 Hf, 0-0.5 Nb, 0.02-0.17 C, 50-400 ppm B, remainder Ni and production-related impurities. The alloy is distinguished by a very high resistance to oxidation, resistance to corrosion and good creep properties at high temperatures.




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Thin film of copper—nickel—molybdenum alloy and method for manufacturing the same

A Cu—Ni—Mo alloy thin film, including Ni as a solution element and Mo as a diffusion barrier element. Ni and Mo are co-doped with Cu. The enthalpy of mixing between Mo and Cu is +19 kJ/mol, and the enthalpy of mixing between Mo and Ni is −7 kJ/mol. The atomic fraction of Mo/Ni is within the range of 0.06-0.20 or the weight faction of Mo/Ni within the range of 0.10-0.33. The total amount of Ni and Mo additions is within the range of 0.14-1.02 at. % or wt. %. A method for manufacturing the alloy thin film is also provided.




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Ni-based superalloy, and turbine rotor and stator blades for gas turbine using the same

An object of the present invention is to provide a Ni-based superalloy, especially for a conventional casting, having a good balance among high temperature strength, corrosion resistance and oxidation resistance, as compared to a conventional material. The Ni-based superalloy comprises Cr, Co, Al, Ti, Ta, W, Mo, Nb, C, B, and inevitable impurities, the balance being Ni, the Ni-based superalloy having a superalloy composition comprising, by mass, 13.1 to 16.0% Cr, 11.1 to 20.0% Co, 2.30 to 3.30% Al, 4.55 to 6.00% Ti, 2.50 to 3.50% Ta, 4.00 to 5.50% W, 0.10 to 1.20% Mo, 0.10 to 0.90% Nb, 0.05 to 0.20% C, and 0.005 to 0.02% B.




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Heteroleptic (allyl)(pyrroles-2-aldiminate) metal-containing precursors, their synthesis and vapor deposition thereof to deposit metal-containing films

Disclosed are metal-containing precursors having the formula Compound (I) wherein: —M is a metal selected from Ni, Co, Mn, Pd; and —each of R-1, R2, R3, R4, R5, R6, R7, R8, R9, and R10 are independently selected from H; a C1-C4 linear, branched, or cyclic alkyl group; a C1-C4 linear, branched, or cyclic alkylsilyl group (mono, bis, or tris alkyl); a C1-C4 linear, branched, or cyclic alkylamino group; or a C1-C4 linear, branched, or cyclic fluoroalkyl group. Also disclosed are methods of synthesizing and using the disclosed metal-containing precursors to deposit metal-containing films on a substrate via a vapor deposition process.




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Copper alloy sheet, and method of producing copper alloy sheet

Provided is one aspect of copper alloy sheet containing 4.5% by mass to 12.0% by mass of Zn, 0.40% by mass to 0.90% by mass of Sn, 0.01% by mass to 0.08% by mass of P, as well as 0.005% by mass to 0.08% by mass of Co and/or 0.03% by mass to 0.85% by mass of Ni, the remainder being Cu and unavoidable impurities. The copper alloy sheet satisfies a relationship of 11≦[Zn]+7×[Sn]+15×[P]+12×[Co]+4.5×[Ni]≦17. The one aspect of copper alloy sheet is produced by a production process including a finish cold rolling process at which a copper alloy material is cold-rolled. An average grain size of the copper alloy material is 2.0 μm to 8.0 μm, circular or elliptical precipitates are present in the copper alloy material, and an average particle size of the precipitates is 4.0 nm to 25.0 nm, or a percentage of precipitates having a particle size of 4.0 nm to 25.0 nm makes up 70% or more of the precipitates.




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Method for replacing a transformer in a wind energy installation

A method of replacing a generator of a wind power installation. The generator is provided in the interior of a pylon of a wind power installation and the pylon has a door opening. An exchanging cross beam is fixed by way of a first fastening point to a crane hook of a mobile crane. A first end of the cross beam is introduced with a second fastening point through the door opening into the pylon. The transformer to be replaced is fixed to the second fastening point of the first end. A compensating weight is fixed at the second fastening point to the second end of the cross beam. The second end of the cross beam is tilted or inclined until the transformer is at the height of the door opening and the crane hook is moved until the transformer to be replaced is outside the door opening.




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Installation method of water-chamber working apparatus

According to an installation method of a water-chamber working apparatus of the present invention, the water-chamber working apparatus includes a base that holds heat transfer tubes on a tube plate surface and is fixed to the tube plate surface, and a manipulator that is coupled with the base, suspended in a water chamber and arranged therein, and has a separable configuration. In this case, a base installing step of installing the base on the tube plate surface and a manipulator coupling step of carrying the separated manipulator (a front stage and a rear stage) into the water chamber sequentially and individually and coupling the manipulator with the base (a coupling link) are performed.




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Zirconium alloy material

Disclosed is a zirconium alloy material having high corrosion resistance regardless of thermal history during its manufacturing process. The zirconium alloy material is obtained by providing a zirconium alloy containing on the mass basis: 0.001% to 1.9% of Sn, 0.01% to 0.3% of Fe, 0.01% to 0.3% of Cr, 0.001% to 0.3% of Ni, 0.001% to 3.0% of Nb, 0.027% or less of C, 0.025% or less of N, 4.5% or less of Hf and 0.16% or less of O with the remainder being inevitable impurities and zirconium, being formed of a bulk alloy and a surface layer, in which the surface layer has a plastic strain of 3 or more or a Vickers hardness of 260 HV or more and an arithmetic mean surface roughness Ra of 0.2 μm or less.