Trace levels of mercury in a natural gas are reduced by scrubbing the natural gas in an absorber with an aqueous solution comprising a water-soluble sulfur compound. The water-soluble sulfur compound reacts with a least a portion of the mercury in the natural gas to produce a treated natural gas with a reduced concentration of mercury, and a mercury containing sulfur-depleted solution which can be disposed by injection into a (depleted) underground formation. The produced water extracted with the natural gas from the underground formation can be recycled for use as the scrubbing solution. In one embodiment, a fresh source of water-soluble sulfur compound as feed to the absorber can be generated on-site by reacting an elemental sulfur source with a sulfur reagent in produced water.

Methods are disclosed for generating electrical power from a compound comprising carbon, oxygen, and hydrogen. Water is combined with the compound to produce a wet form of the compound. The wet form of the compound is transferred into a reaction processing chamber. The wet form of the compound is heated within the reaction chamber such that elements of the compound dissociate and react, with one reaction product comprising hydrogen gas. The hydrogen gas is processed to generate electrical power.

A process for recovering sulfur from a hydrogen sulfide-bearing gas utilizes an aqueous reaction medium, a temperature of about 110-150° C., and a high enough pressure to maintain the aqueous reaction medium in a liquid state. The process reduces material and equipment costs and addresses the environmental disadvantages associated with known processes that rely on high boiling point organic solvents.

A system includes a carbon dioxide treatment system that includes a catalyst configured to treat carbon dioxide to produce a treated carbon dioxide. The system also includes a gasifier injector configured to inject the treated carbon dioxide, a fuel, and oxygen into a gasifier. The gasifier injector may be coupled to or located inside the gasifier.

A gasification quench chamber is disclosed. The gasification quench chamber includes a reservoir that contains liquid coolant in its lower portion and an exit for the cooled syngas in its upper portion; a dip tube that is configured to introduce a syngas mixture to contact the liquid coolant which produces the cooled syngas; a cooling device configured to further cool the cooled syngas in its upper portion; and a stability device in the lower portion that is configured to mitigate coolant level fluctuation and sloshing. In an embodiment of the quench chamber, the cooling device includes a heat exchanger pipe. A quench chamber and scrubber assembly is also disclosed.

An odorant addition device for adding odorant to fuel gas in a gas system that consumes the fuel gas, the device including: an addition unit for adding the odorant to fuel gas to be consumed by the gas system; an environmental condition detection unit for detecting in the gas system an environmental condition regarding diffusion of odorant in fuel gas; and an addition adjustment unit for adjusting mode of odorant addition by the addition unit based on the environmental condition detected by the environmental condition detection unit. In this way, it is possible to detect leakage of fuel gas more reliably and improve safety dramatically, in a gas system that consumes the fuel gas as fuel.

A process and system for cooling syngas provides effective syngas cooling and results in reduced levels of fouling in syngas cooling equipment. A process for cooling syngas includes blending syngas with cooled recycled syngas in an amount effective for providing a blended syngas with a temperature at an inlet of a syngas cooler of about 600° F. to about 1400° F. The blended syngas changes direction of flow at least once prior to the inlet of the syngas cooler.

The present invention provides a reformer tube apparatus, including: an axially aligned tubular structure including a flange section, a top section, a middle section, and a bottom section; wherein the top section of the axially aligned tubular structure includes a first portion having a first wall thickness; wherein the top section of the axially aligned tubular structure includes a second portion having a second wall thickness; and wherein the top section of the axially aligned tubular structure includes a third portion having a transitioning wall thickness that joins the first portion to the second portion. The flange section includes a concentric flange disposed about a top portion thereof. The bottom section of the tubular structure includes a plurality of concentric wedge structures disposed about the interior thereof. The bottom section of the tubular structure also includes a recess disposed about the exterior thereof. The axially aligned tubular structure further includes a secondary flange section coupled to the flange section, wherein the secondary flange section includes a concentric flange disposed about a top portion thereof. Optionally, the reformer tube apparatus is disposed within a reformer used in a direct reduction process.

A reforming process for synthesis gas (12) production from a mixture of hydrocarbons (14) comprises a first step, or pre-reforming step, in which a process mixture 18), comprising said mixture of hydrocarbons :14: and steam (16), is subjected to a preliminary catalytic conversion reaction, obtaining a partial conversion product (22) comprising hydrogen, carbon oxides and hydrocarbons, and a second step, or main reforming step, in which said partial conversion product (22) is subjected to a conversion completion reaction, obtaining said synthesis gas (12), said pre-reforming step being carried out in pseudo-isothermal conditions.

A method for producing a chemical reaction is provided. This method includes providing at least two helical tubes, wherein the helical tubes comprise: a first axis and a second axis; wherein the first axis and the second axis are normal to each other; a cross-sectional shape of a predetermined contour; and an inlet end and an outlet end. The method includes reforming a first gas stream and a second gas stream into a third gas stream in the presence of a catalyst. The method includes surrounding a heat source with the helical tubes are, and operating the tube with an average catalyst temperature of above 500 F. An apparatus for producing a chemical reaction is also provided. This apparatus comprises at least two helical tubes, wherein the helical tubes comprise: a first axis and a second axis; wherein the first axis and the second axis are normal to each other; a cross-sectional shape of a predetermined contour; an inlet end and an outlet end, wherein the helical tubes contain a catalyst capable of reforming a first gas stream and a second gas stream into a third gas stream. The helical tubes are designed to surround a heat source, and the tube operates with an average catalyst temperature of above 500 F.

The invention provides a M.2 interface memory device and a M.2 interface connection seat insertedly provided thereof. The M.2 interface memory device comprises a M.2 interface card and a housing provided with at least one guide groove. The M.2 interface connection seat is disposed on a circuit board, and comprises two arms and a base comprising a M.2 interface slot. At least one arm is provided with a guide rail. An opening direction of the M.2 interface slot is horizontal to a surface of the circuit board. When the M.2 interface card is inserted into the M.2 interface slot in a horizontal direction, the M.2 interface memory device will be fixed within the M.2 interface connection seat by embedding between the guide groove and the guide rail. Thus, M.2 interface memory devices of a variety of specification lengths are able to be inserted into the M.2 interface connection seat.

Connector latch used to securely hold together a connector apparatus, such that the connector apparatus has at least a first connector assembly and a second connector assembly which can be mated together. Initially, after the connector latch is manufactured, the connector latch is in an undeflected position. After manufacture, the connector latch is subjected to a pre-mating deflection process, in order to move the connector latch into a preloaded position. After the pre-mating deflection process has been completed, the connector latch is locked in the preloaded position. The preloaded connector latch provides a number of desirable characteristics, including at least an extra loud “click” sound when the first connector assembly and the second connector assembly are mated together.

In one example an electronic device comprises at least one electronic component, a chassis comprising a first section, a connector to connect the first section of the chassis to a second section, the connector comprising a housing defining a first shaft, a retention structure disposed in the shaft, and a plurality of electrical contacts positioned within a corresponding plurality of channels in the retention structure. Other examples may be described.

A flexible flat cable structure capable of improving crosstalk interference includes plural telecommunication signal conductors separated from one another and provided for transmitting differential signals, two support members installed on two lateral sides of the telecommunication signal conductor respectively, at least one filled material disposed between the telecommunication signal conductors. The ratio of the equivalent dielectric constant of the filled material to the equivalent dielectric constant of the support members falls within a range of 0.39˜0.27, and the ratio of the thickness of the filled material to the thickness of the support members falls within a range of 1.49˜1.37. Therefore, the flexible flat cable structure achieves the effects of reducing the time delay of the signal transmission of the flexible flat cable (FFC), suppressing the ringing noise of resonance, and improving the eye height of amplitude measurement, so as to suppress crosstalk interference and improve signal transmission quality effectively.

In one implementation, a device includes: one or more data terminals, where each of the one or more data terminals provides a respective mating interface between a respective data transmission path and a corresponding device data port; a first power terminal having a power portion and a ground portion separated by a dielectric, where the ground portion is arranged in association with the one or more data terminals in order to shield the one or more data terminals from electromagnetic interference from the power portion, and where the first power terminal provides a respective mating interface between a respective power transmission path and a corresponding device power port; and a support member provided to maintain the arrangement of the one or more data terminals in combination with the first power terminal.

A printed circuit board includes a substrate including a surface layer and a first ground layer; a high-frequency signal generation part provided in the surface layer of the substrate; at least one high-frequency signal connector mounting portion formed in the surface layer of the substrate; at least one high-frequency signal line formed in the surface layer of the substrate, and extend from the high-frequency signal generation part to the at least one high-frequency signal connector mounting portion; and at least one high-frequency signal connector disposed in the at least one high-frequency signal connector mounting portion, wherein an end of the first ground layer is exposed to a side surface of the substrate, and when the high-frequency signal connector is disposed in the at least one high-frequency signal connector mounting portion, a ground of the high-frequency signal connector is in contact with the end of the first ground layer.

The invention relates to a busbar having a profiled body which forms an elongate receiving channel, a first and a second groove being formed in the channel floor, and the electrical conductors being arranged in the first and second groove. Furthermore, the invention relates to a consumer unit for securing to such a busbar and for drawing current or data from such a busbar, and the use of the consumer unit in conjunction with such a busbar. Further aspects of the invention form a power transmission device having such a busbar and such a consumer unit, as well as a building element in which such a busbar is installed.

There is provided an adapter for adapting an electronic device to a modular electronic device system. The adapter generally has a housing having two lateral edges, a cavity between the lateral edges and being adapted to receive the electronic device, each of the two lateral edges of the housing having at least one magnetic coupler electrically connectable with at least one magnetic coupler of the modular electronic device system by magnetically engaging the at least one magnetic coupler of the adapter with the at least one magnetic coupler of the modular electronic device system, and an internal electric conductor network electrically connected to the magnetic couplers of the adapter and electrically connected to an internal connector which is electrically connectable to the electronic device when received in the cavity of the housing.

A binding screw for a wire connection assembly comprises a driving section, a threaded section, and a contact section. The contact section has a tapered penetration portion establishing electrical contact with a stranded wire. A length of the penetration portion is at least three-quarters of a diameter of the binding screw in the threaded section.

An arrangement for an electronic device is disclosed. A plurality of electrically conductive pins is positioned in respective vias of the circuit carrier, the pins extend from a first face of the circuit carrier to a contact end in order to electrically contact one or more components. The arrangement is equipped with an electrically insulating layer on a circuit carrier face, which is the first or a second face, in the region of the pin, the insulating layer having a prefabricated element which is positioned on the face of the circuit carrier. A portion of each pin, the portion being arranged adjacently to the respective via on the face, is surrounded by the material of the insulating layer in a continuously lateral manner.

Techniques and mechanisms for providing socket connection to a substrate. In an embodiment, a socket device includes a first socket body portion that is to provide for signal exchanges as part of a socket connector including the first socket body portion and a second socket body portion. The first socket body portion and the second socket body portion comprise respective zones, wherein, of the two zones, only one such zone has a first electro-mechanical characteristic. The first electro-mechanical characteristic is selected from the group consisting of an interconnect dimension, an interconnect material, an interconnect structure, a socket body material, and a shielding structure. In another embodiment, modular socket sub-assemblies each comprise a respective one of the first zone and the second zone.

A force biased spring probe pin assembly includes a barrel member having a barrel wall defining an elongate internal cavity with a lower end and an upper end. The assembly also includes a first plunger member reciprocally mounted in the internal cavity proximate the lower end of the internal cavity. A spring member is positioned in the internal cavity between the plunger member and the second end of the internal cavity. Three or more conductive bearings are positioned in the internal cavity in contact with the first plunger member and the spring member. A force biased spring probe pin assembly includes a barrel member having a barrel wall defining an elongate internal cavity with a lower end and an upper end. The assembly also includes a first plunger member reciprocally mounted in the internal cavity proximate the lower end of the internal cavity and a second plunger member reciprocally mounted in the internal cavity proximate the upper end of the internal cavity. A spring member is positioned in the internal cavity between the first plunger member and the second plunger member. Three or more conductive bearings are positioned in the internal cavity in contact with the first plunger member and the spring member.

A force-biased spring probe pin assembly includes a barrel member having a barrel wall defining an elongate internal cavity with a lower end and an upper end. The assembly also includes a first plunger member reciprocally mounted in the internal cavity proximate the lower end of the internal cavity. A spring member is positioned in the internal cavity between the plunger member and the second end of the internal cavity. At least one cavity formed in the plunger member with a conductive bearing in the cavity in electrical contact with the plunger and with the wall of the barrel member. A force-biased spring probe pin assembly includes a barrel member having a barrel wall defining an elongate internal cavity with a lower end and an upper end. The assembly also includes a first plunger member reciprocally mounted in the internal cavity proximate the lower end of the internal cavity and a second plunger member reciprocally mounted in the internal cavity proximate the upper end of the internal cavity. A spring member is positioned in the internal cavity between the first plunger member and the second plunger member. At least one cavity formed in the first plunger member with a first conductive bearing in the cavity in electrical contact with the first plunger and with the wall of the barrel member and at least one cavity formed in the second plunger member with a second conductive bearing in the cavity in electrical contact with the second plunger and with the wall of the barrel member.

A power outlet having safety cover, the power outlet comprises a shell body, a base fixed in the shell body, a sliding element disposed between the shell body and the base; the shell body has at least one first outlet hole and at least one second outlet hole; the base has a first post, a third outlet hole and a fourth outlet hole; one side of the sliding element has a first inclined block, the middle of the sliding element has a through hole, another side of the sliding element has a second inclined block and a second post; an elastic element is disposed between the first post and the second post; wherein the through hole can contain the first post, the second post and the elastic element; a distance between the first inclined block and an inner wall of the base is smaller than the length of the elastic element.

Provided is an electronic device that is highly resistant to a water-soluble grinding oil and a method for manufacturing the same. An electronic device includes a main body and a cable including a lead wire, an insulating portion, and an outer coat, a first sealing portion that covers the insulating portion, and a second sealing portion that seals the first sealing portion, the insulating portion is made of a material that is more resistant to a water-soluble grinding oil than the outer coat is, and the first sealing portion is made of a material that has higher adherence to the insulating portion than that of the second sealing portion does.

Previously available elastomeric EMI gaskets provided for multiport RF connector assemblies have performance limiting drawbacks. Consequently, EM isolation provided by a previously available elastomeric EMI gasket is often inadequate. Various implementations disclosed herein include multiport RF connection arrangements that use a metal gasket arranged within at least a portion of an isolation space provided by a multiport RF connector. In some implementations, a multiport connection arrangement includes a substrate, a multiport RF connector and a fitted metal gasket. The substrate includes a first surface and a first plurality of connection ports. The multiport connector has a body that includes a second surface, a second plurality of connection ports, and includes an electromagnetic isolation boundary that defines an isolation space between at least two of the second plurality of connection ports terminating at the second surface. Mechanical fasteners are optional and are included to merely provide engagement, without substantial compressive force.

The invention relates to a shielded connector for a motor vehicle. The connector comprises at least one casing shielding element. The shielding element includes a cable outlet portion provided with a plurality of resilient tabs that are integral with the shielding element. The tabs include a contact zone in electrical contact with a ferrule crimped to a shielding braid of a cable. The contact zone is maintained pressed against the shielding braid by means of a removable clamping ring.

An electronic device system can include an electronic device. The electronic device can include a receptacle, and a device logic driving status unit configured to generate a status signal indicating activity of the electronic device, and a communications cable. The communications cable can include a first plug configured to connect to the receptacle and receive the status signal, wherein the first plug includes a status indicator configured to indicate activity of the electronic device based on the status signal.

A terminal block for an electronic device, which block can be attached to an electronics housing of the electronic device, includes at least one base strip comprising a plurality of connector sockets; and a plurality of connector modules that can be attached to the connector sockets of the at least one base strip in at least one insertion direction, are held on the connector sockets in an inserted position, and can be released from the connector sockets to be removed from the at least one base strip; and a locking device. The locking device includes: an actuating part that can be moved relative to the at least one base strip in an actuation direction; and a plurality of locking elements that are engaged in a locking manner in mating elements of the connector modules in a locked position.

The present invention describes a microfabricated or nanofabricated structured diamond abrasive with a high surface density array of geometrical protrusions of pyramidal, truncated pyramidal or other shape, of designed shapes, sizes and placements, which provides for improved conditioning of CMP polishing pads, or other abrasive roles. Three methods of fabricating the structured diamond abrasive are described: molding of diamond into an array of grooves of various shapes and sizes etched into Si or another substrate material, with subsequent transferal onto another substrate and removal of the Si; etching of an array of geometrical protrusions into a thick diamond layer, and depositing a thick diamond layer over a substrate pre-patterned (or pre-structured) with an array of geometrical protrusions of designed sizes, shapes and placements on the surface.

An abrasive product includes a plurality of abrasive particles and a resin binder cured from a resin composition that includes an aqueous dispersion of melamine methylol having a melamine-to-formaldehyde molar equivalent ratio of between about 1:1 and about 1:3.2, wherein the aqueous dispersion has a pH in a range of between about 8 and about 10. The composition also includes a formaldehyde-based resins, such as a urea-formaldehyde resin or phenol-formaldehyde resin. The melamine methylol comprises between about 1 wt % and about 50 wt % of the combined weight of the formaldehyde-based resin and the melamine methylol.

The present invention concerns a method for depositing mixed crystal layers with at least two different metals on a substrate by means of PVD methods. To provide a method of depositing mixed crystal layers with at least two different metals on a substrate by means of PVD methods, which gives mixed crystal layers which are as free as possible of macroparticles (droplets) and which have a proportion as high as possible of a desired crystalline phase and which are highly crystalline, it is proposed according to the invention that deposition of the mixed crystal layer is effected with simultaneous application of i) the cathode sputtering method of dual magnetron sputtering or high power impulse magnetron sputtering and ii) arc vapour deposition.

An abrasive article includes a polymer matrix and abrasive grains dispersed in the polymer matrix, wherein the abrasive article has a void volume of at least 50%. The polymer matrix is polymerized from a monomer including at least one double bond.

Embodiments of the invention relate to polycrystalline diamond (“PCD”) fabricated by sintering a mixture including diamond particles and a selected amount of graphite particles, polycrystalline diamond compacts (“PDCs”) having a PCD table comprising such PCD, and methods of fabricating such PCD and PDCs. In an embodiment, a method includes providing a mixture including graphite particles present in an amount of about 0.1 weight percent (“wt %”) to about 20 wt % and diamond particles. The method further includes subjecting the mixture to a high-pressure/high-temperature process sufficient to form PCD.

An abrasive article includes a body having abrasive particles contained within a bond material. The abrasive particles can include a majority content of silicon nitride and a minority content of sintering material including at least two rare-earth oxide materials. In an embodiment, the rare-earth oxide materials can include Nd2O3 and Y2O3. In a particular embodiment, the abrasive particles comprise a content (wt %) of Nd2O3 that is greater than a content of Y2O3 (wt %).

A method of forming an abrasive article includes providing a green body having abrasive particles including microcrystalline alumina, and heating the green body via microwave radiation to form a bonded abrasive body including the abrasive particles and a bond material comprising a vitreous phase.

Polycrystalline ultra-hard materials and compacts comprise an ultra-hard material body having a polycrystalline matrix of bonded together ultra-hard particles, e.g., diamond crystals, and a catalyst material disposed in interstitial regions within the polycrystalline matrix. The material microstructure is substantially free of localized concentrations, regions or volumes of the catalyst material or other substrate constituent. The body can include a region extending a depth from a body working surface and that is substantially free of the catalyst material. The compact is produced using a multi-stage HPHT process, e.g., comprising two HPHT process conditions, wherein during a first stage HPHT process the catalyst material is melted and only partially infiltrates the precursor ultra-hard material, and during a second stage further catalyst material infiltrates the precursor ultra-hard material to produce a fully sintered compact.

A method for fabricating a semiconductor device includes (a) depositing an insulating film on a semiconductor substrate; (b) forming a recess in the insulating film; (c) depositing a conductive film on the insulating film while filling the recess with the conductive film; and (d) polishing the conductive film. Step (d) includes a first polishing substep of using a first polisher pad conditioned with a first dresser and a second polishing substep of using a second polisher pad conditioned with a second dresser different from the first dresser.

An abrasive article includes a fibrous substrate, a binder disposed on the fibrous substrate, and abrasive grains in contact with the binder. The binder includes an imide cross-linked urethane derived from a blocked isocyanate component and an anhydride component.

A plastic soft composition is formed of soft base material constantly provided with plasticity, porous fine particles for polishing contained in the base material, and the like, and a polishing process and a coating process are performed to a painted surface and the like using the plastic soft composition. The fine particles for polishing are impregnated with a coating agent (a surface protective agent) added with an activator which is emulsified by contact with water, and the coating agent is held in concave portions formed in the fine particles. Both polishing work and coating work are achieved by sliding the plastic soft composition on a painted surface by a palm pressure of a user.

An abrasive article including a bonded abrasive having a body formed of abrasive grains contained within a bond material, wherein the body grinds a superabrasive workpiece having an average Vickers hardness of at least about 5 GPa at an average specific grinding energy (SGE) of not greater than about 350 J/mm3, at a material removal rate of at least about 8 mm3/sec, and wherein grinding is a centerless grinding operation.

A layer of matrix powder is deposited within a mold opening. A layer of super-abrasive particles is then deposited over the matrix powder layer. The super-abrasive particles have a non-random distribution, such as being positioned at locations set by a regular and repeating distribution pattern. A layer of matrix powder is then deposited over the super-abrasive particles. The particle and matrix powder layer deposition process steps are repeated to produce a cell having alternating layers of matrix powder and non-randomly distributed super-abrasive particles. The cell is then fused, for example using an infiltration, hot isostatic pressing or sintering process, to produce an impregnated structure. A working surface of the impregnated structure that is oriented non-parallel (and, in particular, perpendicular) to the super-abrasive particle layers is used as an abrading surface for a tool.

An abrasive element comprises a body of crystalline abrasive material. The body has an array of cutting elements formed of crystalline abrasive material which projects from a surface of the body. The shape, size and form of the projections is controlled in the production process. The body may be a natural or synthetic crystal. The body may be a film formed by deposition. The body may be diamond or cubic boron nitride. The body may be monocrystalline or polycrystalline. The projections may be aligned along a crystallographic plane or planes.

Embodiments of the invention relate to methods of fabricating a polycrystalline diamond compacts and applications for such polycrystalline diamond compacts. In an embodiment, a method of fabricating a polycrystalline diamond body includes mechanically milling non-diamond carbon and a sintering aid material for a time and aggressiveness sufficient to form a plurality of carbon-saturated sintering aid particles and sintering a plurality of diamond particles in the presence of the plurality of carbon-saturated sintering aid particles to form the polycrystalline diamond body.

An abrasive article having an abrasive body including abrasive grains contained within a bond material, wherein the abrasive grains comprise microcrystalline alumina, and wherein the bond material includes less than about 1.0 mol % phosphorous oxide (P2O5), and a ratio measured in mol % between a total content of sodium oxide (Na2O) and a total content of potassium oxide (K2O) defined by [K2O/Na2O] having a value greater than about 0.5.

The present invention discloses a cleaning cloth, an abrasive cloth, a cleaning buff and an abrasive buff which are each formed by knitting/weaving bamboo fibers having excellent cleaning, abrasive capacity and excellent ignition resistance.

A fixed abrasive pad includes a substrate and a plurality of discrete abrasive blocks attached thereon, wherein the abrasive blocks comprise a plurality of abrasive sub-layers, wherein the abrasive density of the sub-layers increases layer-by-layer from the top sub-layer to the bottom sub-layer according to a predetermined ratio. The predetermined ratio ranges from about 1.099 to about 1.124.

Provided are a polishing pad which remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and which can be used for not only primary polishing but also finish polishing, and a manufacturing method therefor. The polishing pad is a polishing pad for polishing a semiconductor device, comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein the polyurethane-polyurea resin foam has a Young's modulus E in a range from 450 to 30000 kPa, and a density D in a range from 0.30 to 0.60 g/cm3.

Methods of making a superabrasive tool precursor are disclosed, along with such precursors and associated tools. Particularly, methods are disclosed for orienting superabrasive particles in a viscous binding material in order to provide tools based thereupon and having desired performance characteristics.

A low defect chemical mechanical polishing composition for polishing silicon oxide containing substrates is provided comprising, as initial components: water, a colloidal silica abrasive; and, an additive according to formula I.