A vehicle communication method comprises receiving a first wireless communication that is transmitted from a first remote device and managing a transmission of the first wireless communication over a vehicle network using a configurable message list. The receiving a first wireless communication is performed by a connectivity device coupled to a communication port of the vehicle network. The managing a transmission of the first wireless communication is performed by a message manager module of the connectivity device.

The case (1) of the watch carries, along its periphery (5), hooking members in the form of rings (6a, 6a', 6b, 6b', 6c, 6c'), these rings being disposed radially relative to the center (7) of the dial (2) and hence of the watch. A chain (8) is fixed by loops (9, 10) at its ends to two (6c, 6c') of these rings and passes through the other rings (6a, 6a', 6b, 6b'), passing several of times around the wearer's wrist. After the loops (9, 10) have been detached from their respective rings, the chain (8) can be passed in a different manner around the case, so that the watch can be hung around the neck. In order to make this change, the chain is equipped with a flat link (13) which can pass through radial slots provided in the periphery of the rings.

Herbicidal injury caused by 6-trisubstituted phenyl)-4-amino-2-pyridinecarboxylates in wheat and barley is reduced with the use of low rates of cloquintocet.

A method including depositing an alloying layer along a sidewall of an opening and in direct contact with a seed layer, the alloying layer includes a crystalline structure that cannot serve as a seed for plating a conductive material, exposing the opening to an electroplating solution including the conductive material, the conductive material is not present in the alloying layer, applying an electrical potential to a cathode causing the conductive material to deposit from the electroplating solution onto the cathode exposed at the bottom of the opening and causing the opening to fill with the conductive material, the cathode includes an exposed portion of the seed layer and excludes the alloying layer, and forming a first intermetallic compound along an intersection between the alloying layer and the conductive material, the first intermetallic compound is formed as a precipitate within a solid solution of the alloying layer and the conductive material.

An example method transmits a path message to an egress node, via intermediate nodes, that configures OAM monitoring of an entire connection between an ingress node and the egress node and also configures OAM monitoring of at least one segment of the connection shorter than the entire connection by at least one intermediate node. The path message comprises a LSP attributes object and an ERO. The LSP object comprises technology-specific attributes defining descriptors for configuring the egress node in accordance with a communication protocol utilized for the connection; and technology-independent OAM parameters that, irrespective of the communication protocol, define an OAM type to be used by the egress node, and define desired monitoring actions for the egress node to perform. The ERO comprises a respective HOP Attributes sub-object for configuring each of the at least one intermediate nodes. Each HOP Attributes sub-object also comprises technology-specific attributes and technology-independent OAM parameters.

A description is given of N-(1,2,5-oxadiazol-3-yl)pyridinecarboxamides of the general formula (I) as herbicides. R in this formula (I) stands for radicals such as hydrogen, organic radicals, and other radicals such as halogen. W stands for a substituted pyridyl radical.

A fiber optic connector fiber stub remover and method for automated fiber stub removal. The device has a top plate with a platen opening, and a platen with a well that carries a polishing film over the well. An air pocket is formed between the polishing film and the well. The platen is positioned with a top surface of the polishing film accessible via the platen opening. A fixture holds connector ends of fiber optic cables with fiber stubs extending therefrom, and a weight biases the fiber stubs into contact with the polishing film. A motor is controlled by a motor control unit to control a ramp up time and final speed of movement of the platen over a timespan. Each connector ends moves independently relative to the polishing film. The air pocket provides shock absorption of the polishing film so that an ideal pressure is exerted on each fiber stub during stub removal.

The invention provides optical interconnects of data-processing cores of multicore chips by means of digital planar holographic microchips. The method comprises delivering “N” laser lights to “N” data-processing cores on the host chip, coding the obtained optical signals by modulating them with the core-generated data, and then delivering the modulated and coded optical signals to a holographic microchip formed on the same substrate of the host chip as the data-processing cores, splitting the modulated and coded optical signals into (N−1)N modulated optical copy signals, delivering the copy signals to all data-processing cores except the one that generates the copy signals, and decoding the data obtained from the output signals delivered to the processing cores by the receivers. The method is efficient in that it allows replacing electrical interconnects between the cores with optical interconnects and can be matched to current semiconductor production technology.

Methods and systems for managing link voltages in a power converter, where single phase, three phase or universal systems can be used. Common mode management refers to shifting of voltages in a particular direction to perform transition between input and output ports, in addition to maintaining soft switching property. Voltages in power converters can be freely increasing and decreasing, and thus damage to the circuit can be caused if these voltages change are not controlled.

Disclosed is a grid-connected inverter and a method for filtering AC output thereof. The grid-connected inverter includes an AC output filter which includes two or more switchable filtering modules, with the power capacity of each filtering module corresponding to a different output power of the grid-connected inverter; a monitoring module which is used to perform realtime monitoring on voltage and current outputted by the grid-connected inverter; and a control circuit which is used to calculate an output power grade of the grid-connected inverter according to the voltage and the current monitored by the monitoring module and control switching to the filtering module having a corresponding power capacity according to the power grade, the power grade being selected from a plurality of power grades which are divided according to power capacities of the filtering modules.

A flex circuit including a dual sided interconnect structure to connect electrical components on a head or suspension assembly to head circuitry is described. The dual sided interconnect structure described has application for providing an electrical connection to one or more transducer elements on a slider and one or more elements of a heat assisted magnetic recording HAMR unit. In an illustrated embodiment, a flexible structure or insulating base layer includes one or more slider and heat assisted magnetic recording traces coupled to one or more slider or HAMR bond pads on an interconnect portion. As disclosed, the slider bond pads are on the obverse side of the flexible structure and the HAMR bond pads include a reverse side bonding surface to form reverse side bond pads to connect to one or more electrical or heating elements on the HAMR unit.

A kit of parts for forming an orthotic head support. The kit includes at least one frame having a plurality of arms extending from a central region. Examples of such frames are W-frames, Y-frames and H-frames. The kit further includes at least one extension connectable to a frame. Such extension members include straight extensions, L-shaped extensions, and extension with two elements at an acute angle to one another. The kit has elements for attaching the extensions to the frames. The frames and extensions may have lines of reduced stiffness formed therein about which they are preferentially bendable to conform the support to the shape of a wearer's head and/or neck. The kit further includes padding members connected, or connectable, to the frames and/or extensions on the surfaces thereof which in use are to be adjacent the wearer.

An automatic content recognition (ACR)-enabled connected TV device may be associated with a paired device and the paired device may comprise a browser. The ACR-enabled connected TV device may be operable to enable, utilizing an ACR system, the browser to display, within a section of a browser window, interactive content related to certain content being presented by the ACR-enabled connected TV device. The ACR-enabled connected TV device may be operable to enable, utilizing the ACR system, a viewer to interact with the interactive content. The section of the browser window may be changed dynamically. The certain content may comprise an advertisement of a particular product and the interactive content may comprise a link to a website and/or other information related to the particular product. The certain content may comprise a program associated with a network and the interactive content may comprise information on polling questions related to the program.

Systems and methods for improving operation of a hybrid vehicle are presented. In one example, torque transferred via a driveline disconnect clutch is estimated based on characteristics of a torque converter to improve driveline operation.

The present invention provides a method for enhancing an immune response in a mammal to facilitate the elimination of a chronic pathology. The method involves the removal of immune system inhibitors such as soluble TNF receptor from the circulation of the mammal, thus, enabling a more vigorous immune response to the pathogenic agent. The removal of immune system inhibitors is accomplished by contacting biological fluids of a mammal with one or more binding partner(s) such as TNFα muteins capable of binding to and, thus, depleting the targeted immune system inhibitor(s) from the biological fluids. Particularly useful in the invention is an absorbent matrix composed of an inert, biocompatible substrate joined covalently to a binding partner, such as a TNFα mutein, capable of specifically binding to a targeted immune system inhibitor such as soluble TNF receptor.

An optical disc drive (ODD) including a tray having a spindle motor, an optical pickup unit, and a transfer motor, may have first and second flat cables. The first flat cable may be connected to the transfer motor, and the second flat cable may have a first terminal part connected to the first flat cable and a second terminal part connected to a circuit board. The circuit board may be arranged at the front of the tray. The second flat cable may include a plurality of signal lines covered by an insulator. One or more exposure parts may be formed in the second flat cable to expose at least one of the plurality of signal lines. An electric actuator of a locking unit may be connected to the one or more of the plurality of signal lines through the one or more exposure parts.

A connecting structure for a secondary battery for electrically connecting a core pack where two or more unit cells are electrically connected and a protection circuit module made of the unit cells of the core pack and a PCB substrate. The connecting structure includes a metal plate having an electrode connecting unit connected to an electrode of each unit cell of the core pack and a circuit connecting unit connected to the protection circuit module; and a circuit terminal unit electrically connected to the circuit connecting unit by being located in a connection hole formed in the PCB substrate of the protection circuit module so that the upper and lower portions of the PCB substrate communicate with each other. The circuit connecting unit is coupled and electrically connected to the circuit terminal unit by means of a connection method which allows selective connection and separation.

An exemplary method includes a broker-based messaging system detecting a request provided by a software application for the software application to connect to any one of a plurality of brokers included in a cluster of brokers, dynamically identifying, in response to the request and in accordance with a connection distribution heuristic, a broker included in the cluster of brokers and that is available for connection to the software application, and attempting to establish a connection between the software application and the broker. Corresponding methods and systems are also disclosed.

A form-fitting connection between two components (5 and 14) has a break-away function in one direction. At least one connection element, designed as a shear bolt (6), is formfittingly connected to the first component (5) to be connected. The end of the shear bolt (6) is formfittingly and functionally connected to a second component (14) via an attached component (17) that is resilient in the direction of the formfitting connection.

A method and apparatus is provided that launches a selected application on a User Equipment (UE) such that if the launched application requires a mobile data connection and the UE's modem is in a dormant state, then the UE will transition the UE's modem from the dormant state to an active state and/or establish a mobile data connection while or in parallel with the selected application's initialization.

It is an object to provide a configuration with an enhanced sensing accuracy, in which a shunt resistance main body and a terminal member are formed as separate pieces. A shunt resistor includes a resistance main body and a terminal member (21) that is electrically connected to the resistance main body. The terminal member (21) includes a resistance connection portion (23) to be in contact with the resistance main body, and a circuit connection portion (24) provided so as to extend from the resistance connection portion (23). The circuit connection portion (24) is divided into two parts by a slit (27) being formed therein. The slit (27) is formed up to a part of the resistance connection portion (23).

A hand tool for inserting a large variety of connector components into narrow plastic irrigation piping is disclosed. This tool is an improved and progressive development of my previous Israeli patent no: 152089 in that it is designed to work with a large variety of connector components and is designed to accommodate both sizes of narrow spaghetti piping, whereas the previous patent could accommodate only a single size of narrow piping. The tool as shown in FIG. 2 has a body onto which all the elements are connected and the body is configured to sit comfortably in the palm of the hand. When pressing down on the handle, the grips secure the narrow piping and cause a connector component, deployed in appropriate recess provided in the tool to be easily inserted into the narrow piping.

A device and method are provided for saving power and electricity in a charging device such for external power supplies and battery chargers having a primary circuit and a secondary circuit where a switch is located in the primary circuit and a current sensing device in the secondary circuit to sense when there is a drop in current in the secondary circuit or no current in the secondary circuit because the load or a cell phone is charged and when this occurs the switch in the primary circuit is opened and the primary circuit no longer draws power from the source of power until the switch in the primary circuit is closed by activation of a user of the charging device.

An electric motor assembly includes a multi-phase electric motor, a battery of accumulators, an inverter configured to convert the direct current of the battery into multi-phase alternating current adapted to supply the motor, and a connection housing. The connection housing includes plugs allowing connection of motor phases, the battery terminals, and at least five connections to the inverter. The housing further includes a group of contacts allowing it to be connected to a single phase mains system, and a group of contacts allowing it to be connected a multi-phase mains system. The housing includes switches according to the position of which the system including the housing, the battery, the inverter, and the motor connected solely by its phases, alternatively allows the motor to be supplied from the battery, the battery to be recharged directly from a single-phase mains system, and the battery to be recharged from multi-phase mains system.

A connector device enables universal compatibility and interchangeability between any work tool accessory having a boom feature and any skid steer loader as well as controlled support of the work tool accessory. The connector device also prevents machine instability issues.

The present invention provides a system, or kit, of blow molded panels having integrally formed connectors which combine to form an enclosure, commonly in the form of a utility shed. The corner sections, roof, wall and floor panels are formed of blow molded plastic with integrally formed connectors to interlock with one another. In one embodiment, the ends of the wall panels have locking plugs that are constructed and arranged to fit into corresponding sockets and slide to an engaged position for interlocking cooperative engagement rigidly connecting the components together.

A toy construction system is provided that includes, in a toy construction system having a multiplicity of interconnecting members adapted for constructing a variety of projects, a rotator head device including a device housing having a conical-shaped cavity formed therein. The housing includes a plurality of female twist-lock connectors formed on the outer surface thereof, and the female connectors are adapted for attaching a first member of the toy construction system to the rotator head device housing. A rotating member, which is conical in shape and slightly smaller in size than the cavity formed in the device housing is included. The rotating member is rotatably disposed within the cavity and has a male twist-lock connector stem extending from an end thereof for connecting a second member of the toy construction system to the rotating member, whereby the first member is rotatable with respect to the second member.

A fastening element includes a holding part with a support plate and expanding cheeks, and a locking part guidingly received in the holding part. The expanding cheeks include cantilevered walls formed adjacent the support plate, which are offset radially outwardly with respect to a guide wall of the support plate which guides the locking part. The locking part can be pushed through the support plate substantially without force until it reaches inwardly protruding ramp projections formed on the expanding cheeks, which provide a better lever ratio for spreading the expanding cheeks.

A threaded connector for securing a panel member to a structure and for adjusting the position of the panel member relative to the structure. The connector comprises an elongate one-piece stud, a first spacer, a threaded nut, a second spacer and a turning formation. The connector permits the panel member to be mounted on the stud and the stud to be rotated to adjust the position of the panel member relative to the structure.

A connecting arrangement is provided between a plastic component with at least two mutually adjacent and at least approximately parallel walls and another structural element, having at least one force-transmission element which is adhesively bonded to the plastic component via an adhesive bond on the plastic component in frusto-conical or spherical-segment-shaped depressions in the mutually adjacent walls of the plastic component. The force-transmission element has a carrying structure for the other structural element. With the exception of a possibly provided coating, the force-transmission element is composed only of metallic material and has a plate which is adapted to the depression in the outer wall of the plastic component, which outer wall is adjacent to the other structural element. The edge of the plate rests with interposition on the outer wall in the surrounding region of the depression, wherein the plate is connected via a web to an end section of the force-transmission element, which end section is adapted to the depression in the other inner wall of the plastic component. The depression is configured in the outer wall without a bottom to such an extent that the end section of the force-transmission element can be inserted through the outer wall into the recess of the inner wall.

An improved e-track connector, or lockdown, is presented that can be installed in single locations instead of provided in tracks as in the industry. It also possesses a finished slot that accepts logistics straps buckles. The slot is a complete rectangle with no excess material folded under it and has been deburred and finished smooth. The device also possesses a drain slot along the side of the tang and drain holes in the buckle receiver such that liquid will drain out of the connector when it is mounted horizontally.

A programmable routing scheme provides improved connectivity both between Universal Digital Blocks (UDBs) and between the UDBs and other micro-controller elements, peripherals and external Inputs and Outputs (I/Os) in the same Integrated Circuit (IC). The routing scheme increases the number of functions, flexibility, and the overall routing efficiency for programmable architectures. The UDBs can be grouped in pairs and share associated horizontal routing channels. Bidirectional horizontal and vertical segmentation elements extend routing both horizontally and vertically between different UDB pairs and to the other peripherals and I/O.

An embodiment of this invention uses a massive parallel interconnect fabric (MPIF) at the flipped interface of a core die substrate (having the core logic blocks) and a context die (used for in circuit programming/context/customization of the core die substrate), to produce ASIC-like density and FPGA-like flexibility/programmability, while reducing the time and cost for development and going from prototyping to production, reducing cost per die, reducing or eliminating NRE, and increasing performance. Other embodiments of this invention enable debugging complex SoC through large contact points provided through the MPIF, provide for multi-platform functionality, and enable incorporating FGPA core in ASIC platform through the MPIF. Various examples are also given for different implementations.

Embodiments described herein provide approaches for improving a standard cell connection for circuit routing. Specifically, provided is an IC device having a plurality of cells, a first metal layer (M1) pin coupled to a contact bar extending from a first cell of the plurality of cells, and a second metal layer (M2) wire coupled to the contact bar, wherein the contact bar extends across at least one power rail. By extending the contact bar into an open area between the plurality of cells to couple the M1 pin and the M2 wire, routing efficiency and chip scaling are improved.

In a control device for a technical processing plant, a pneumatically driven actuator having an actuator stem is provided together with a valve operated by the actuator, the valve having a valve stem. A valve element is attached to the valve stem. A stem connector connects the two stems to each other for a forced transmission of axial actuating movements and for modifying an axial distance between adjacent ends of the valve stem and the actuator stem to adjust a total axial length of the two stems. The stem connector comprises two half-shells connected to each other, and two positioning devices are provided for a friction-locking coupling of the half-shells to the respective ends. At least one of the positioning devices is designed to modify an axial attachment position of the half-shells along one of the stems.

A semiconductor device comprises a first semiconductor chip including a first substrate and a plurality of first metal lines formed over the first substrate and a second semiconductor chip bonded on the first semiconductor chip, wherein the second semiconductor chip comprises a second substrate and a plurality of second metal lines formed over the second substrate. The semiconductor device further comprises a conductive plug coupled between the first metal lines and the second metal lines, wherein the conductive plug comprises a first portion formed over a first side of a hard mask layer, wherein the first portion is of a first width and a second portion formed over a second side of the hard mask layer, wherein the second portion is of a second width greater than or equal to the first width.

An interconnect structure and a method of forming an interconnect structure are disclosed. The interconnect structure includes a lower conductive feature in a lower low-k (LK) dielectric layer; a first etch stop layer (ESL) over the lower conductive feature, wherein the first ESL comprises a metal compound; an upper LK dielectric layer over the first ESL; and an upper conductive feature in the upper LK dielectric layer, wherein the upper conductive feature extends through the first ESL and connected to the lower conductive feature. The interconnect structure may further include a second ESL between the upper LK dielectric layer and the first ESL, or between the first ESL and the lower conductive feature, wherein the second ESL comprises a silicon compound.

An embodiment is an integrated circuit structure including a first die attached to a second die by a first connector. The first connector includes a solder joint portion between a first nickel-containing layer and a second nickel-containing layer, a first copper-containing layer between the first nickel-containing layer and the solder joint portion, and a second copper-containing layer between the second nickel-containing layer and the solder joint portion.

A semiconductor device has a semiconductor wafer with a plurality of contact pads. A first insulating layer is formed over the semiconductor wafer and contact pads. A portion of the first insulating layer is removed, exposing a first portion of the contact pads, while leaving a second portion of the contact pads covered. An under bump metallization layer and a plurality of bumps is formed over the contact pads and the first insulating layer. A second insulating layer is formed over the first insulating layer, a sidewall of the under bump metallization layer, sidewall of the bumps, and upper surface of the bumps. A portion of the second insulating layer covering the upper surface of the bumps is removed, but the second insulating layer is maintained over the sidewall of the bumps and the sidewall of the under bump metallization layer.

A microelectronic assembly and method of making, which includes a first microelectronic element (including a substrate with first and second opposing surfaces, a semiconductor device, and conductive pads at the first surface which are electrically coupled to the semiconductor device) and a second microelectronic element (including a handler with first and second opposing surfaces, a second semiconductor device, and conductive pads at the handler first surface which are electrically coupled to the second semiconductor device). The first and second microelectronic elements are integrated such that the second surfaces face each other. The first microelectronic element includes conductive elements each extending from one of its conductive pads, through the substrate to the second surface. The second microelectronic element includes conductive elements each extending between the handler first and second surfaces. The conductive elements of the first microelectronics element are electrically coupled to the conductive elements of the second microelectronics element.

A semiconductor device has a protective layer formed over an active surface of a semiconductor wafer. The semiconductor die with pre-applied protective layer are moved from the semiconductor wafer and mounted on a carrier. The semiconductor die and contact pads on the carrier are encapsulated. The carrier is removed. A first insulating layer is formed over the pre-applied protective layer and contact pads. Vias are formed in the first insulating layer and pre-applied protective layer to expose interconnect sites on the semiconductor die. An interconnect structure is formed over the first insulating layer in electrical contact with the interconnect sites on the semiconductor die and contact pads. The interconnect structure has a redistribution layer formed on the first insulating layer, a second insulating layer formed on the redistribution layer, and an under bump metallization layer formed over the second dielectric in electrical contact with the redistribution layer.

A system for lifting a vehicle via multiple slings comprises a vehicle not engineered with structural facility to withstand lifting forces, including a frame which unmodified will deform in response to vertically imposed lifting forces, frame reinforcing elements affixed to the frame at selected locations which are subject to lifting deformation, at least two lifting members at spaced-apart forward frame locations, at least two lifting members at spaced-apart rearward frame locations, and a plurality of elongate slings extending respectively between each lifting member and a common lifting vertex. Each lifting member has an enlarged lower base portion rigidly affixed to the frame and an upper lifting portion. The frame reinforcing elements resist deformation of the frame in response to vertically imposed lifting forces. The enlarged base portions of the lifting members apply forces over a correspondingly enlarged area of the frame and the reinforcing elements without deforming the frame.

A vacuum-lifting device includes a holding block and a nozzle. The holding block defines a holding hole and a threaded hole communicating with the holding hole. The nozzle includes a first section that is slidably received in the holding hole and a second section. The second section extends from the first section and has an outer diameter smaller than an outer diameter of the first section.

A connector-equipped communication module includes a communication module and a connector. The communication module includes a wiring board including antenna-mounted and IC-mounted regions at different positions in a planar view, an antenna element mounted in the antenna-mounted region, a wireless IC and a mounted component mounted in the IC-mounted region, and side terminals in the IC-mounted region and peripheral portions near the IC-mounted region. The connector includes a receiving portion including a placement portion configured to mount the communication module and a wall portion extending around the placement portion, inner wall terminals on an inner side of the wall portion at positions facing the side terminals, and external terminals located outward of the receiving portion and electrically connected to the inner wall terminals. In a state where the communication module is received in the receiving portion, the inner wall and side terminals are fitted so as to contact with each other.

The present disclosure provides methods and devices for testing a connection between speakers and a power amplifier. The disclosed methods and devices solve a problem that, upon a connection test for a power amplifier which has a booster power source, when a midpoint potential of the power amplifier and the voltage of the speaker connection terminal are compared, and it is determined that short-circuiting occurs on a ground side when the potential of the speaker connection terminal is lower than the midpoint potential, a wrong test is conducted if a midpoint potential is higher than a battery voltage.

The present application discloses apparatus and methods for increasing channel utilization for a high-speed serial interface of an integrated circuit (IC). A new circuit architecture is disclosed which provides circuitry that may be programmed flexibly to support a multitude of different channel bonding schemes. In accordance with one aspect of the invention, the new architecture decouples the granularity of control-signal channel bonding from the granularity of data-aggregation channel bonding. This advantageously allows optimization of configurations for both types of channel bonding. In another aspect of the invention, the logical boundaries of bonded user channels are decoupled from the physical boundaries of the PCS modules. This decoupling advantageously eliminates a rigid constraint of previous architectures.

A connecting apparatus for connecting two drawer wall parts which are intended to be arranged at a right angle includes at least one receiving part which has a receiving opening for receiving an end section of a first drawer wall part and has at least one insertion opening, a bracket which has at least two limbs which run substantially parallel, wherein the bracket can be pushed onto a web, which is arranged or formed on a second drawer wall part, in order to connect the first drawer wall part and the second drawer wall part, and wherein the at least two limbs of the bracket surround the web of the second drawer wall part, wherein a first limb of the bracket can be inserted into the insertion opening in the receiving part and connects the receiving part to the second drawer wall part in a positionally secure manner.

A method of making an electrical connection to a railroad rail includes fastening a wire bonding assembly to a railroad rail, the wire bonding assembly including first and second spaced apart washer plates contacting the rail and a metal bar supported by the washer plates. The metal bar is electrically connected with the rail with a first conductive lead contacting a selected point on the rail and a selected point on the metal bar. A second conductive lead is connected to another selected point on the metal bar for establishing an electrical connection to the rail from an electrical device.

A connection assembly for connection to the mouth of a flexible container comprising of an inner ring having an inner flange around its external diameter and an outer ring having a recess around its inner diameter sized to engage the inner flange. The inner and outer rings being adapted to interengage to trap the mouth between the inner and outer rings.

A human surrogate neck model includes a spinal neck region containing cervical vertebrae. A biosimulant intervertebral material is inserted between the cervical vertebrae. The spinal neck region is surrounded by a first silicone material mixed with a polymeric cross-linking inhibitor. One or more elastic tension bands are anchored to a top interface and a bottom interface of the neck model. A second silicone material mixed with a polymeric cross-linking inhibitor is applied to surround the spinal neck region and the first silicone material and to embed the tension bands. One or more of the elastic tension bands and/or a concentration ratio of the first silicone material or second silicone material to the polymeric cross-linking inhibitor can be adjusted for variable test conditions to closely simulate or mimic the static and dynamic characteristics of a human neck in various scenarios.