The present invention provides assays for detecting and measuring the presence or level of anti-TNFα drug therapeutics and autoantibodies in a sample. The present invention is useful for optimizing therapy and monitoring patients receiving anti-TNFα drug therapeutics to detect the presence or level of autoantibodies (e.g., HACA and/or HAHA) against the drug.

The invention concerns soluble and antigenic HTLV p24 variants that can be fused to chaperones and their use in diagnostic applications such as immunoassays for detecting antibodies against HTLV-I or HTLV-II in an isolated biological sample. In particular, the invention relates to a soluble HTLV-I or HTLV-II p24 antigen comprising either the N- or the C-terminal domain of p24 and lacking the other domain. Moreover, the invention covers recombinant DNA molecules encoding these HTLV-I and -II fusion antigens as well as their recombinant production using expression vectors and host cells transformed with such expression vectors. In addition, the invention focuses on compositions of these HTLV p24 antigens with HTLV gp21 antigen and on an immunoassay method for detection of HTLV antibodies using the antigens of the invention. Also the use of HTLV p24 antigens in an in vitro diagnostic assay as well as a reagent kit for detection of anti-HTLV-antibodies comprising said HTLV antigens is encompassed.

The present invention relates to in vitro methods of assessing the susceptibility or responsiveness of a subject to the treatment with an epidermal growth factor receptor (EGFR) inhibitor/antagonist, wherein the subject has been diagnosed or suspected of suffering from inflammation-associated. These methods comprise determining the level of expression of EGFR in myeloid cells in a sample from the subject, wherein an expression of EGFR in the myeloid cells is indicative of the subject being susceptible to the treatment with an EGFR inhibitor/antagonist. The invention also relates to EGFR inhibitors/antagonists for use in the treatment or amelioration of inflammation-associated cancer. The invention furthermore provides in vitro methods of prognosing the survival time, progression-free survival time or disease course of a subject that has been diagnosed or suspected of suffering from from inflammation-associated cancer. In addition thereto, the invention relates to in vitro diagnostic methods of assessing the proneness of a subject to develop inflammation-associated cancer in which the expression of EGFR is determined in myeloid cells from the subject.

The present invention provides an approach for the determination of the activation states of a plurality of proteins in single cells. This approach permits the rapid detection of heterogeneity in a complex cell population based on activation states, expression markers and other criteria, and the identification of cellular subsets that exhibit correlated changes in activation within the cell population. Moreover, this approach allows the correlation of cellular activities or properties. In addition, the use of modulators of cellular activation allows for characterization of pathways and cell populations. Several exemplary diseases that can be analyzed using the invention include AML, MDS, and MPN.

A method to detect prostate cancer comprising contacting a sample of prostate cells from the patient with a set of detectably labeled probes under hybridization conditions and determining the presence of chromosomal abnormalities in prostate tumor tissue, PIN (intra-epithelial neoplasia), histologically benign tissue and benign prostatic hyperplasia (BPH); a method to combine immunofluorescence and FISH (IF-FISH) to facilitate the assessment of chromosomal abnormalities; a set of probes; and a kit comprising the set of probes and instructions for diagnosing prostate cancer in a patient.

We have discovered a protein in humans, herein referred to as collagen like gene (CLG) product (SEQ ID NOS: 12 and 13), that is expressed in human prostate cancer and breast cancer cell lines but not in normal adult, placenta, lung, liver, skeletal muscle, kidney or pancreas tissues. We have also discovered that the level of CLG mRNA expression correlates positively with the metastatic potential of the cancer cell lines tested.

The diagnosis of male infertility is based predominantly on the results of standard semen analysis for concentration, total motility, progressive motility, volume, pH, viscosity and/or morphology. When sperm enter the female reproductive tract, they must undergo a series of physiological changes, known as capacitation, in order to fertilize an egg. This process involves plasma membrane changes that occur in response to stimuli within the female tract. These changes include removal of sterols and redistribution of the ganglioside GM1. Semen analysis identifies only half the cases of male infertility due to standard semen analysis providing little information on sperm functional competence. Previous data demonstrated that localization of the ganglioside, GM1, identifies sub-populations of sperm capable of undergoing the functional maturation process known as capacitation and tracks strongly with fertility.

Methods for multiplexed delivery of agents to a solid tissue in vivo followed by assessment of efficacy with mass spectrometry are described.

The present invention relates to methods of determining if a subject has an increased risk of suffering from memory impairment. The methods comprise analyzing at least one sample from the subject to determine a value of the subject's exosomal profile or combined biomarker profile (lipids plus exosomal cargo) and comparing the value of the subject's exosomal or combined biomarker profile with the value of a normal exosomal or biomarker profile, respectively. A change in the value of the subject's exosomal or combined biomarker profile, including a change in the subject's exosomal or combined biomarker profile, over normal values is indicative that the subject has an increased risk of suffering from memory impairment compared to a normal individual.

In sporadic Alzheimer's disease, neurofibrillary lesion formation is preceded by extensive post-translational modification of the microtubule associated protein tau. Immunoassays have been developed recently that detect tau in biological specimens, thus providing a means for pre-mortem diagnosis of Alzheimer's disease, which has remained elusive. These assays have been improved by the analysis of relevant post-translational modifications, such as phosphorylation, however opportunity for improvement remains. The present invention addresses this issue by disclosing synthetic methylated peptides derived from the tau protein of paired helical filaments and non-diseased control brain. Alzheimer's disease specificity is provided by the presence or absence of methyl moieties on lysine residues and differences between mono-, di-, and tri-methylation. The methylated peptide is useful as an antigen and a binding partner for identifying compounds that interact with the peptide and the methylated tau protein, including antibodies that can distinguish non-diseased brain from that affected by Alzheimer's disease. The resulting antibodies are useful diagnostically and therapeutically. The compounds that specifically bind to methylated tau proteins are useful for eliminating abnormally methylated tau.

Provided are a detection agent for detecting hydroxy vitamin D, preparation method thereof, and use thereof in 25-hydroxy vitamin D immunological detection. The detection agent comprises a conjugate formed by a 25-hydroxy vitamin D antigen derivative and protein carrier, and magnetic spheres coated by the conjugate. Also provided is a 25-hydroxy vitamin D detection kit comprising the detection agent.

Compositions and methods useful for point of care testing for hemophilia by measuring coagulation factor levels are provided.

Oakland's alaMar Kitchen & Bar is about to start serving 1,500 free meals per week to restaurant workers who have been displaced and derailed by the coronavirus outbreak.

Located at 100 Grand Ave., chef Nelson German's popular seafood restaurant has just issued this announcement:

"We are here for you, Oakland! ...…

Noted restaurateur Reem Assil has decided to close her Fruitvale restaurant, Reem's California.

"From the bottom of our hearts, we'd like to thank everyone who has supported us in keeping our humble oakland restaurant operation a force in our community.…

Off the Grid will stage a two-part free-meal giveaway today, April 8, from 12 noon to 1 p.m. at Nob Hill Foods Alameda and from 2:30 p.m. to 3:30 p.m. at Pak 'N Save Emeryville.

It's part of the Grocery Employees Meal Fund, which OTG recently launched to help creators feed grocery-store employees and their family members throughout the Covd-19 crisis.…

Oakland-based food-and-drinks company Purity Organic announced today that it is launching a limited new line of Sweet Leaf beverages that consumers can buy directly online.

"We can't wait to get Sweet Leaf back into the hands of our customers online," said Purity Organic vice president of marketing Bill Porter.…

Just in time to celebrate its ten-year anniversary, popular Filipino-fusion food truck Señor Sisig has established a long-term location in Oakland.

The brand-new spot is at 3331 Fruitvale Ave. in the Dimond District.…

People for the Ethical Treatment of Animals sent UC Berkeley chancellor Carol Christ a letter today requesting permission to place a banner on the university's famous clocktower that reads "It's High Time We Went Vegan. PETA."…

Now through May 5, healthcare workers and first responders can collect free "Thank You Meals" at any McDonald's location nationwide.

The promotion began on April 22.…

Together with a team of volunteers — including the Street Royalty Motorcycle Club — popular pitmaster Matt Horn prepared and served 600 pork and chicken sandwiches to feed the entire staff at Valley Children's Hospital in Fresno.

Rather than lament the delayed opening of his eagerly awaited Horn Barbecue brick-and-mortar restaurant in the heart of Oakland, last month the pitmaster created a philanthropic project, the Horn Initiative, which has since mid-March facilitated the making and serving of over 4,000 meals to frontline workers and others in need.…

The 2012 Progressive Opportunities Conference showcased the best work of nonprofits, companies, unions, activists, and government leaders, looking to shed light on some of our most pressing economic issues. The Conference sought to create an opportunity to network and exchange ideas, arming attendees with new tools to make positive economic change.…

California today announced its intent to declare bisphenol A a reproductive hazard. Under a state law known as Prop 65, warning signs would be required for consumer items that contain a certain high level of BPA.…

The present invention relates to a process for producing an electrolytic capacitor, the process comprising process steps i) ii): i) providing a capacitor body (1) that comprises an electrode body (2) of an electrode material,a dielectric (3) which at least partially covers the surface of this electrode material, anda solid electrolyte (4) at least comprising an electrically conductive material which at least partially covers the dielectric surface; ii) applying a primer solution e) to the capacitor body (1), followed by an application of a solution or dispersion a) comprising a conjugated polymer b) and a solvent or dispersant d), followed by an at least partial removal of the solvent or dispersant d) for the formation of the polymeric outer layer (5) that is formed onto the capacitor body (1); wherein the primer solution e) comprises at least one monofunctional amine and at least one carboxylic acid.

An apparatus is disclosed which includes an electrolytic capacitive element with multiple capacitor sections.

A conductive composite is provided, which includes a conductive conjugated polymer and a mixture. The mixture includes (a) boron oxide, and (b) sulfur-containing compound, nitrogen-containing compound, or a combination thereof. A capacitor is also provided, which includes an anode electrode, a dielectric layer on the anode electrode, a cathode electrode, and an electrolyte between the dielectric layer and the cathode electrode, wherein the electrolyte includes the described conductive composite.

A capacitor structure is provided, which includes a positive electrode, a dielectric layer on the positive electrode, and an organic-inorganic composite layer on the dielectric layer. The capacitor structure also includes a negative electrode, and a conductive conjugated polymer electrolyte disposed between the organic-inorganic composite layer and the negative electrode.

The invention relates to a device for thermally disconnecting or tripping an overvoltage protection device, comprising: a locking element (A1), on which a first force (F1) acts, and which is fixed in such a way that same is released when a limit temperature is exceeded; and a slider (S1) which is blocked in a first state (Z1) by the fixed locking element (A1), and on which a second force (F2) acts in order to transfer same into a second state (Z2) when the locking element (A1) is released.

A rework grid array interposer with direct power is described. The interposer has a foundation layer mountable between a motherboard and a package. A heater is embedded in the foundation layer to provide local heat to reflow solder to enable at least one of attachment or detachment of the package. A connector is mounted on the foundation layer and coupled to the heater and to the package to provide a connection path directly with the power supply and not via the motherboard. One type of interposer interfaces with a package having a solderable extension. Another interposer has a plurality of heater zones embedded in the foundation layer.

A method and system for cooling a device (preferably a micro-device), comprising cooling the device by using a lower critical solution temperature (LCST) mixture. Enhancement of heat transfer rates is achieved during phase separation of a two-component system (two-component mixture) with a LCST. Convective heat transfer rates in small diameter pipes and over a vertical (hot) plate are demonstrated.

An SSD with a package optimized for semiconductor wafers is configured by thinning a plurality of undiced wafers and stacking the wafers. The wafers are connected to each other by TSV. A subset of the wafers include memory circuits. One of the wafer not in the subset includes peripheral circuits. A casing houses the wafers.

A wiring device includes a housing that encloses a line voltage port and a low-voltage port for providing power to at least one removable load. The removable load can couple to a connector PCB. The connector PCB may include a tongue portion with retention surface features and a body portion with supporting circuitry. The tongue portion may be disposed within a low-voltage port of the wiring device. A plurality of conductive traces may extend from the body to the tongue of the connector PCB. The low voltage port may include sidewalls disposed around the tongue portion to guide the plug of a removable load into engagement with the conductive traces of the tongue portion so that one or more of the plurality of conductive traces electrically contact the removable load to deliver power to the removable load.

A household distribution box comprises a distribution box case; two service lines introduced from a transformer into the distribution box case of a consumer; three main lines installed in the distribution box case and provided with two lines and a second service line; two sub-lines installed in the distribution box case and formed by branching the second service line among the main lines into two lines; a first circuit breaker installed in the distribution box case; a second circuit breaker installed in the distribution box case; and a controller connected to the first circuit breaker.

The present disclosure provides a method and a system for protecting an electrical device. The method includes: acquiring coordinate data of the electronic device; determining whether the coordinate data exceeds a data range corresponding to a preset state of the electronic device; and disabling the electronic device when the coordinate data exceeds the data range corresponding to the preset state.

A ground fault circuit interrupter (GFCI) breaker testing system can include an enclosure having at least one wall that forms a cavity. The system can also include at least one GFCI breaker disposed within the cavity. The system can further include a sensing circuit assembly having at least one switch, where the at least one switch is electrically coupled to the at least one GFCI breaker. The system can also include a user interface assembly disposed, at least in part, outside the cavity, where the user interface assembly is coupled to the sensing circuit assembly, where the user interface assembly instructs the at least one switch to test the at least one GFCI breaker.

A switching regulator control circuit is used in a switching regulator that converts an input voltage into an output voltage by the switching of a switching device, and generates a switching signal for controlling the ON/OFF operation of the switching device. The switching regulator control circuit has a fault detector and a fault protector. The fault detector detects, based on the duty ratio of the switching signal or a variable correlated to it and included in a control signal used to generate the switching signal, a fault state where the duty ratio falls outside the normal modulation range. The fault protector stops the switching of the switching device when the fault detector detects a fault state.

A flexible circuit board includes a first circuit substrate, a second circuit substrate and a bonding layer. The first circuit substrate includes a first base layer, a first circuit layer, a second circuit layer and metal coating layer. The first circuit layer includes a signal line and at least two grounding lines. The metal coating layer encloses the signal line. The second circuit substrate includes a third circuit layer. The bonding layer is located between and bonding the first circuit substrate and the second circuit substrate. The second circuit layer, the third circuit layer are electrically coupled with the grounding lines by a plurality of electrically conductive holes. The first base layer, the bonding layer and the second circuit substrate cooperatively enclose a hermetic medium layer receiving the signal line. The hermitic medium layer is filled with air. A method for manufacturing the flexible circuit board is also provided.

In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing a magnetic particle embedded flexible substrate, a printed flexible substrate for a magnetic tray, or an electro-magnetic carrier for magnetized or ferromagnetic flexible substrates. For instance, in accordance with one embodiment, there are means disclosed for fabricating a flexible substrate having one or more electrical interconnects to couple with leads of an electrical device; integrating magnetic particles or ferromagnetic particles into the flexible substrate; supporting the flexible substrate with a carrier plate during one or more manufacturing processes for the flexible substrate, in which the flexible substrate is held flat against the carrier plate by an attractive magnetic force between the magnetic particles or ferromagnetic particles integrated with the flexible substrate and a complementary magnetic attraction of the carrier plate; and removing the flexible substrate from the carrier plate subsequent to completion of the one or more manufacturing processes for the flexible substrate. Other related embodiments are disclosed.

A package includes a conductive pad, with a plurality of openings penetrating through the conductive pad. A dielectric layer encircles the conductive pad. The dielectric layer has portions filling the plurality of openings. An Under-Bump Metallurgy (UBM) includes a via portion extending into the dielectric layer to contact the conductive pad. A solder region is overlying and contacting the UBM. An integrated passive device is bonded to the UBM through the solder region.

A flexible printed circuit board including an annular main board and a plurality of branches connected with the annular main board is provided. Each of the branches includes an extension portion connected with the annular main board and a bonding portion, and an electronic component is adapted to be disposed on the bonding portion. A supporting holder including an annular base, two wing structures, and a plurality of mounting portions is also disclosed, wherein the wing structures extend outward from the annular base and the mounting portions are located on the annular base and the wing structures. Further, a controller including the flexible printed circuit board and the supporting holder aforementioned is disclosed, wherein the annular main board is disposed on the annular base and the branches are disposed on the annular base and the wing structures, such that the bonding portions are located on the mounting portions correspondingly.

One embodiment provides a deformable housing, including a recess for holding a deformable device; a deformable portion comprising at least two surfaces having a plurality of concave/convex structures; and at least two support parts embedded in the deformable portion. Other aspects are described and claimed.

According to one embodiment, a storage device includes an enclosure, and a circuit board assembly in the enclosure. The circuit board assembly includes a first circuit board, a second circuit board opposed to the first circuit board, a third circuit board opposed to the second circuit board, a first connector connecting the first and second circuit boards to each other, a second connector connecting the second and third circuit boards to each other, and is offset to the first connector in a plane direction, a first spacer between the first and second circuit boards, and a second spacer between the second and third circuit boards. The first spacer includes a support body at a position opposed to the second connector and in contact with the first and second circuit boards.

An electronic device is provided. The electronic device includes a support member including at least a portion formed of a conductive material, an enclosure member configured to receive the support member and including at least a portion of which is formed of a conductive material. The conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other.

According to one embodiment, a storage device includes an enclosure, and a circuit board assembly in the enclosure. The circuit board assembly includes a first circuit board on which a heat-producing component is mounted, a second circuit board, a third circuit board, a first connector connecting the first and second circuit boards, a second connector connecting the second and third circuit boards, a first spacer sandwiched between the first and second circuit boards, and a second spacer sandwiched between the second and third circuit boards. The first spacer includes a spacer frame, a partition member opposed to the heat-producing component with a gap between, and a thermal transfer member attached to the partition member and in contact with the first circuit board.

An enhanced airflow chassis system includes a component chassis that defines a chassis enclosure including a chassis entrance and component slots. First component carriers are mounted to first components and positioned in each of the component slots. Each first component carrier defines first component carrier airflow apertures that direct airflow entering the chassis entrance to the first component mounted to that first component carrier. A backplane located in the chassis enclosure opposite the component slots from the chassis entrance defines backplane airflow apertures and includes a component connector located adjacent each of the component slots that is connected to the first component mounted to the component carrier positioned in that component slot. A chassis venting member positioned between at least two of the component slots defines chassis venting member airflow apertures that direct airflow entering the chassis entrance through the chassis enclosure to a subset of the backplane airflow apertures.

CHRISTINE Cassell (letters 28th April) asks a pertinent question when she enquires where the responsibility for the problem with PPEs for front line NHS workers lies.

75 YEARS AGO this week St John Ambulance volunteers played a vital role delivering first aid and providing support to both the public and the armed forces on VE Day.

HE MAY NOT be held in the highest regard by the public but there’s something to love about Piers Morgan on Good Morning Britain.

I say to all communities pat yourselves on the back for the great job you are doing taking care of each other and supporting each other.

As we predicted earlier this year, a new Rekordbox version has been released. Rekordbox 6 has a new functionality, Cloud Library Sync, which allows the ability to upload tracks and playlists to Dropbox and sync them across multiple devices. Cloud Library Sync: Tracks, playlists, and track metadata are able to be synced across four different […]

The post Rekordbox 6: Now With Cloud Library Syncing appeared first on DJ TechTools.

Weeks have passed, and DJs the world over have settled into the reality of sheltering in place. As efforts to combat COVID-19 push on, the masses are staying at home. Clubs have shuttered their doors, bars and restaurants are no more, and non-essential businesses are closed. But in this primetime of social distancing, there has […]

The post Streaming L(o)ive In The Time of COVID-19: What’s the future for DJ live streaming? appeared first on DJ TechTools.