A first photoresist pattern and a second photoresist pattern are formed over a substrate. The first photoresist pattern is separated from the second photoresist pattern by a gap. A chemical mixture is coated on the first and second photoresist patterns. The chemical mixture contains a chemical material and surfactant particles mixed into the chemical material. The chemical mixture fills the gap. A baking process is performed on the first and second photoresist patterns, the baking process causing the gap to shrink. At least some surfactant particles are disposed at sidewall boundaries of the gap. A developing process is performed on the first and second photoresist patterns. The developing process removes the chemical mixture in the gap and over the photoresist patterns. The surfactant particles disposed at sidewall boundaries of the gap reduce a capillary effect during the developing process.

A TFT and manufacturing method thereof, an array substrate and manufacturing method thereof, an X-ray detector and a display device are disclosed. The manufacturing method includes: forming a gate-insulating-layer thin film (3'), a semiconductor-layer thin film (4') and a passivation-shielding-layer thin film (5') successively; forming a pattern (5') that includes a passivation shielding layer through one patterning process, so that a portion, sheltered by the passivation shielding layer, of the semiconductor-layer thin film forms a pattern of an active layer (4a'); and performing an ion doping process to a portion, not sheltered by the passivation shielding layer, of the semiconductor-layer thin film to form a pattern comprising a source electrode (4c') and a drain electrode (4b'). The source electrode (4c') and the drain electrode (4b') are disposed on two sides of the active layer (4a') respectively and in a same layer as the active layer (4a'). The manufacturing method can reduce the number of patterning processes and improve the performance of the thin film transistor in the array substrate.

A method of forming a semiconductor device is provided such that a trench is formed in a semiconductor body at a first surface of the semiconductor body. Dopants are introduced into a first region at a bottom side of the trench by ion implantation. A filling material is formed in the trench. Dopants are introduced into a second region at a top side of the filling material. Thermal processing of the semiconductor body is carried out and is configured to intermix dopants from the first and the second regions by a diffusion process along a vertical direction perpendicular to the first surface.

A semiconductor device is provided that includes an n-type field effect transistor including a plurality of vertically stacked silicon-containing nanowires located in one region of a semiconductor substrate, and a p-type field effect transistor including a plurality of vertically stacked silicon germanium alloy nanowires located in another region of a semiconductor substrate. Each vertically stacked silicon-containing nanowire of the n-type field effect transistor has a different shape than the shape of each vertically stacked silicon germanium alloy nanowire of the p-type field effect transistor.

To provide a semiconductor device having improved reliability. After formation of an n+ type semiconductor region for source/drain, a first insulating film is formed on a semiconductor substrate so as to cover a gate electrode and a sidewall spacer. After heat treatment, a second insulating film is formed on the first insulating film and a resist pattern is formed on the second insulating film. Then, these insulating films are etched with the resist pattern as an etching mask. The resist pattern is removed, followed by wet washing treatment. A metal silicide layer is then formed by the salicide process.

A method of fabricating a semiconductor device includes forming a gate strip including a dummy electrode and a TiN layer. The method includes removing a first portion of the dummy electrode to form a first opening over a P-active region and an isolation region. The method includes performing an oxygen-containing plasma treatment on a first portion of the TiN layer; and filling the first opening with a first metal material. The method includes removing a second portion of the dummy electrode to form a second opening over an N-active region and the isolation region. The method includes performing a nitrogen-containing plasma treatment on a second portion of the TiN layer; and filling the second opening with a second metal material. The second portion of the TiN layer connects to the first portion of the TiN layer over the isolation region.

A method for forming a semiconductor structure includes forming a strained silicon germanium layer on top of a substrate. At least one patterned hard mask layer is formed on and in contact with at least a first portion of the strained silicon germanium layer. At least a first exposed portion and a second exposed portion of the strained silicon germanium layer are oxidized. The oxidizing process forms a first oxide region and a second oxide region within the first and second exposed portions, respectively, of the strained silicon germanium.

A method for manufacturing an LDMOS device includes: providing a semiconductor substrate (200), forming a drift region (201) in the semiconductor substrate (200), forming a gate material layer on the semiconductor substrate (200), and forming a negative photoresist layer (204) on the gate material layer; patterning the negative photoresist layer (204), and etching the gate material layer by using the patterned negative photoresist layer (204) as a mask so as to form a gate (203); forming a photoresist layer having an opening on the semiconductor substrate (200) and the patterned negative photoresist layer (204), the opening corresponding to a predetermined position for forming a body region (206); and injecting the body region (206) by using the gate (203) and the negative photoresist layer (204) located above the gate (203) as a self-alignment layer, so as to form a channel region.

The on-state characteristics of a transistor are improved and thus, a semiconductor device capable of high-speed response and high-speed operation is provided. A highly reliable semiconductor device showing stable electric characteristics is made. The semiconductor device includes a transistor including a first oxide layer; an oxide semiconductor layer over the first oxide layer; a source electrode layer and a drain electrode layer in contact with the oxide semiconductor layer; a second oxide layer over the oxide semiconductor layer; a gate insulating layer over the second oxide layer; and a gate electrode layer over the gate insulating layer. An end portion of the second oxide layer and an end portion of the gate insulating layer overlap with the source electrode layer and the drain electrode layer.

A semiconductor structure is disclosed. The semiconductor structure includes a source trench in a drift region, the source trench having a source trench dielectric liner and a source trench conductive filler surrounded by the source trench dielectric liner, a source region in a body region over the drift region. The semiconductor structure also includes a patterned source trench dielectric cap forming an insulated portion and an exposed portion of the source trench conductive filler, and a source contact layer coupling the source region to the exposed portion of the source trench conductive filler, the insulated portion of the source trench conductive filler increasing resistance between the source contact layer and the source trench conductive filler under the patterned source trench dielectric cap. The source trench is a serpentine source trench having a plurality of parallel portions connected by a plurality of curved portions.

A method for producing an integrated power transistor circuit includes forming at least one transistor cell in a cell array, each transistor cell having a doped region formed in a semiconductor substrate and adjoining a first surface of the semiconductor substrate on a first side of the semiconductor substrate, depositing a contact layer on the first side, structuring the contact layer to form a contact structure from the contact layer, the contact structure having, in a projection of the cell array orthogonal to the first surface, a first section and, outside the cell array, a second section which connects the first section to an interface structure, and forming an electrode structure on and in direct contact with the first section in the orthogonal projection of the cell array, the electrode structure being absent outside the cell array.

A semiconductor device includes a substrate comprising a channel region and a recess, wherein the recess is located at both side of the channel region; a gate structure formed over the channel region; a first SiP layer covering bottom corners of the gate structure and the recess; and a second SiP layer formed over the first SiP layer and in the recess, wherein the second SiP layer has a phosphorus concentration higher than that of the first SiP layer.

A method of production of a semiconductor device comprising a semiconductor layer forming step of forming a semiconductor layer including an inorganic oxide semiconductor on a board, a passivation film forming step of forming a passivation film comprising an organic material so as to cover the semiconductor layer, a baking step of baking the passivation film, and a cooling step of cooling the passivation film after baking, herein, in the cooling step, a cooling speed from a baking temperature at the time of baking in the baking step to a temperature 50° C. lower than the baking temperature is substantially controlled to 0.5 to 5° C./min in range is provided.

Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.

Hall effect devices and field effect transistors are formed incorporating a carbon-based nanostructure layer such as carbon nanotubes and/or graphene with a sacrificial metal layer formed there over to protect the carbon-based nanostructure layer during processing.

A method is provided for making smooth crystalline semiconductor thin-films and hole and electron transport films for solar cells and other electronic devices. Such semiconductor films have an average roughness of 3.4 nm thus allowing for effective deposition of additional semiconductor film layers such as perovskites for tandem solar cell structures which require extremely smooth surfaces for high quality device fabrication.

A magnetoresistive random access memory (MRAM) structure includes a bottom electrode structure. A magnetic tunnel junction (MTJ) element is over the bottom electrode structure. The MTJ element includes an anti-ferromagnetic material layer. A ferromagnetic pinned layer is over the anti-ferromagnetic material layer. A tunneling layer is over the ferromagnetic pinned layer. A ferromagnetic free layer is over the tunneling layer. The ferromagnetic free layer has a first portion and a demagnetized second portion. The MRAM also includes a top electrode structure over the first portion.

An organic layer deposition assembly for depositing a deposition material on a substrate includes a deposition source configured to spray the deposition material, a deposition source nozzle arranged in one side of the deposition source and including deposition source nozzles arranged in a first direction, a patterning slit sheet arranged to face the deposition source nozzle and having patterning slits in a second direction that crosses the first direction, and a correction sheet arranged between the deposition source nozzle and the patterning slit sheet and configured to block at least a part of the deposition material sprayed from the deposition source.

A method of forming microelectronic systems on a flexible substrate includes depositing a plurality of layers on one side of the flexible substrate. Each of the plurality of layers is deposited from one of a plurality of sources. A vertical projection of a perimeter of each one of the plurality of sources does not intersect the flexible substrate. The flexible substrate is in motion during the depositing the plurality of layers via a roll to roll feed and retrieval system.

One embodiment is a wide stripe semiconductor waveguide, which is cleaved at a Talbot length thereof, the wide stripe semiconductor waveguide having facets with mirror coatings. A system provides for selective pumping the wide stripe semiconductor waveguide to create and support a Talbot mode. In embodiments according to the present method and apparatus the gain is patterned so that a single unique pattern actually has the highest gain and hence it is the distribution that oscillates.

Foreign objects that have entered inside an insertion body are suppressed from reaching a detector side. In a buckle device, when a tongue plate is attached, an ejector slides downwards inside a buckle body, opening a through hole in a partitioning wall of a lower cover at the upper side. A main body portion of a slider member of a buckle switch is inserted into the through hole, closing off a portion of the through hole that has been opened by the ejector. Hence it is suppressed that foreign objects discharged through an insertion through hole in the buckle body to outside the buckle body pass through the through hole and reach the buckle switch side further than the partitioning wall.

An apparatus and method for carrying and storing a portion of rope is claimed. A portion of rope is braided and wound about two complementary loops. Attached to one complementary loop is a flexible fastener. The flexible fastener can be passed through the second complementary loop and attached to itself. The apparatus can then be worn as a bracelet. When the rope is needed, the person can unwind the rope. After using the rope, the rope can be rewound and then bound with the flexible fastener.

Substrates such as sheet metal components may be kept spaced apart from each other using a molded polymeric spacing device. The spacing device has a main body with a thickness corresponding to the desired minimum spacing between the substrates and, extending from the main body or a base connected to said main body, an attachment member capable of being inserted into an opening in one of the substrates, but resistant to being easily withdrawn from such opening. Noise and vibration that might otherwise be generated or propagated by closely proximate substrates are reduced through the use of such molded polymeric spacing devices, which may be integrally fashioned from a rubber.

The present invention provides an improvement in an article of jewelry of the type in which the ornamental portion of the article is secured or released selectively from the support portion of the article. The removable jewelry setting provides a simplified construction which is used readily by the wearer of jewelry to assemble a particular combination of ornament and support selected from a wide variety of such combinations made available by the improvement. The construction also enhances the ability to tailor a jewelry article to a particular style of dress without unduly multiplying the number of expensive ornaments required to provide a wide range of ornamented articles. The construction enables ease of interchange of the ornamental portion of an article of jewelry.

A device clip includes a first jaw member, and a second jaw member having fixed end pivotally connected to one end of the first jaw member and a free end provided with a rod member that is movable along the major axis of the second jaw member by an external force and can return to its former position when the external force disappears. Thus, the other end of the first jaw member is detachably lockable to the rod member at the free end of the second jaw member for enabling the device clip to conveniently and steadily link two objects together, for example, to link a camera bag to a backpack.

The present invention discloses a driving device for a belt axle of a winch, which addresses the problems existing in conventional winches, for example the driving devices being out of work attributing to wearing of the unidirectional teeth on the fixed base and rotary body of the winch. The rotary cylinder of the driving device of the invention is provided with insertion holes into which a crow bar can be inserted. The fixed base is fixedly connected with the belt axle of the winch. The rotary cylinder is covered on the fixed base and fixed thereto in the axial direction. A unidirectional mechanism is located between the rotary cylinder and the belt axle to be engaged by unidirectional teeth. As the shift element and shift plates can be conveniently removed, the worn shift plates or shift element can be conveniently replaced after being used for a long period.

A fixing buckle assembly for use as part of a motor vehicle seatbelt restraint system of a type having webbing for positioning on an occupant and a lap pretensioner for pretensioning the seatbelt restraint system. The buckle assembly includes a tongue, preferably affixed to a pyrotechnic lap pretensioner (PLP). The buckle assembly includes a buckle plate featuring an aperture for connection to a loop of the webbing. A cover assembly encases the internal components of the buckle assembly and is formed of two cover halves which are preferably injection molded and snap together in a clam-shell construction. Each of the cover halves have sections which circumscribe a tongue passageway such that after they are assembled and the tongue is inserted in the buckle assembly, the cover halves become interlocked together. At the opposite end of the buckle assembly, the cover halves each include a section extending from the aperture which is retained from separation by being enclosed by the webbing loop. These features prevent separation of the housing halves upon activation of the PLP.

An exemplary device that is useful for controlling vibrations of an elevator load bearing member includes a guide. A mass is moveable relative to the guide responsive to vibration of the load bearing member to introduce a force to counter the vibration.

A profiled retaining section for positioning a seam connecting two decorative layers includes an upper region, a center region and a lower region forming at least one anchor. The upper region is designed as a piping, or in the manner of a piping, for protruding over a visible side of the skins to be positioned. The center region includes two sides to be sewn to the decorative layers. The anchor is designed to be introduced in a groove having a lesser width than the anchor itself and to exert a force on the groove in the lateral direction. The upper region, the center region and the anchor are integral with each other and arranged in the vertical direction relative to each other. Also described is a composite part that uses the profiled retaining section.

A casket shell assembly and method provide for covering an economical or plain casket with a reusable decorative shell. The assembly includes a casket and a shell. The shell has a perimeter wall, an open top, and an open bottom. The shell receives the casket through the open top. A lip coupled to the perimeter wall of the shell supports the casket when the casket is inserted into the shell. A lid is coupled to the perimeter wall selectively covering the open top of the shell when the lid is in a closed position. A plurality of straps is positioned in the shell extending between the shell and the casket. Each of the straps has opposite free ends extendable through the open top of the shell for facilitating lifting of the casket from the shell.

An apparatus for preserving human or animal remains comprising a burial chamber further comprising a hermetically sealed interior containing gas or water vapor, wherein the gas creates a gas pressure within the hermetically sealed interior, and a vacuum pump, wherein the vacuum pump is in functional communication with the hermetically sealed interior, wherein the vacuum pump operates to evacuate the gas or the water vapor from the hermetically sealed interior, and wherein the vacuum pump is intermittently activated to reduce the gas pressure within the hermetically sealed interior for a desiccating duration.

A grave marker assembly that can be removably mounted and secured to a support surface such as a lawn crypt lid. The grave marker assembly has a fastening system that is not exposed to view and yet allows the grave marker to be easily installed and removed. The fastening system includes a channel and interior opening formed on a base member that is adapted to receive a fastener. The fastener in turn is adapted to be inserted into an opening formed on the crypt lid or other support surface. The assembly further includes a multi-function frame disposed along the outer periphery of the memorial marker that can serve as a decorative feature and draining functions.

A containment device for holding the remains of a cremated individual. The containment device may include a receptacle with a rim section and a containment section. A cap may be sealed on the receptacle once the remains of the cremated individual are within the containment section. The outside of the receptacle may include an attachment component. Therefore, the receptacle may be displayed in one's home for a time and then may be permanently mounted in a memorial site. An anchor may attach to the attachment component to prevent theft.

A concrete burial vault system having a layered construction of castable material encased in an inner liner and an outer casing of a thermoplastic polymer such as polypropylene utilizes the liner and casing as a mold for the concrete and enables monolithic molds with self-supporting securing tabs. This system allows the liner and casing to be manufactured at a central location and then transported to a plurality of use locations to be filled with concrete. The manufacturing method supports the system and provides an assembly advantage.

A decorative carapace for a burial vault including a carapace having a top surface and a substrate having a decorative graphic, the substrate being attached to the top surface of the carapace.

The sealing acrylic urn vault of the invention includes a generally square sheet of ⅝″ cast acrylic serving as the base and a generally square top portion which will have four adjacent side walls bonded to its edges and protruding downward. Each opposing side wall will be bonded length-wise to each adjoining side, creating a seamless cast acrylic box, open at the bottom, that lowers onto the acrylic base. Attached to the base are four 0.625″ tall ⅝″ thick acrylic guide rails, bonded equidistant from the outside base edge on all four sides of the base. This “railing system” is the fastening guide for the acrylic top portion which lowers onto the base with the inside of the four side walls bonded with the outside edges of the four guide rails.

A carrier is provided for facilitating the carrying and transportation of a funerary container having a bottom surface, a plurality of side surfaces and a top surface, along with a length and width and interior large enough to accommodate an un-cremated corpse. The carrier includes a base member having a length generally long enough to span the width of the funerary container and a upper surface sized and configured for receiving the bottom surface of the funerary container. An upstanding member has a lower end coupled to the base member and an upper end. The upstanding member extends in a plane generally perpendicular to the base member. A handle member is provided that is coupled to the upstanding member. The handle includes a hand receiving surface engageable by the hand of the user.

A coffin in an environmentally friendly material with a special shape and fittings at the places where the coffin is to be lifted, which is new in that the coffin itself has vertical recesses directed inwards, which cover both the coffin box and the lid, and wherein at each side of the coffin box bottom, a transverse lever or pipe has been placed, and wherein said pipe or lever is through-going to each and across each recess.

A casket assembly includes a bottom panel, side panels, flaps and end panels. The bottom panel is formed of a pliable material. The side panels are formed intrinsically with the bottom panel. Each side panel includes a lower section and an upper section foldably attached thereto. The lower section extends vertically upward from the bottom panel. In a first configuration, the upper section extends upward from the lower section. In a second configuration, the upper section extends in a direction other than vertically upward from the lower section. The end panels are formed intrinsically with the bottom panel. The flaps extend laterally from each end of the upper section. The flaps in the first configuration extend upward from a first vertical level defined by the top portion of the lower section, and in the second configuration extend downward from the first vertical level.

A body bag (900) can be assembled by a stitching process while providing increased fluid retention capabilities. An upper outer layer (101) and a lower outer layer (102), each of which can be non-woven materials, form the outer surfaces of the body bag (900). An absorbent layer (103) is disposed between the upper outer layer (101) and the lower outer layer (102). One or more edges (303,403,503,603) can be folded into a periphery (332) of the body bag (900). Stitching (802) can then be applied along the periphery (332) such that the stitching (802) passes through the upper outer layer (101), the lower outer layer (102), an upper edge (994) of the fold in the absorbent layer (103), and a complementary bottom edge (995) of the fold in the absorbent layer (103). Handles (1001,1002,1003,1004) can be included as well.

A concrete burial vault system having a layered construction of castable material encased in an inner liner and an outer casing of a thermoplastic polymer such as polypropylene utilizes the liner and casing as a mold for the concrete and enables monolithic molds with self-supporting securing tabs. This system allows the liner and casing to be manufactured at a central location and then transported to a plurality of use locations to be filled with concrete. The manufacturing method supports the system and provides an assembly advantage.

The present invention relates to a method to improve the appearance of a corpse by means of the application of specific thanatocosmetic compositions. The invention also relates to the new compositions and to their use in thanato-aesthetics.

Methods and systems for preserving tissues in situ using critical point drying are disclosed. Such methods and systems are particularly applicable to the preservation of a deceased body, such as a deceased person or animal, with or without removal of internal tissues or organs. A fixative can be perfused through the vascular system of the body while blood is removed from the body. The exterior of the body can also be immersed in a bath of fixative. The fixative in the vascular system and the bath can be replaced by subsequent washes of buffer, de-ionized water, and/or alcohol. The alcohol-infused and fixated body can be disposed in a pressure chamber and subjected to a critical point drying process using carbon dioxide. After the critical point drying process, the body is in a preserved state.

Embodiments are directed to an adjustable universal valve handle.

A removable handle assembly for a cooking vessel a gripping body, a front end of which forms a flared jaw. The flared jaw has projections adapted to clamp the wall of a vessel. The projections are substantially linear in shape in directions that intersect in front of the gripping body. A flared mobile jaw is mounted on the gripping body to rotate about a first axis between a release position and a clamping position. The flared jaw has two projections (504) of substantially linear shape in directions that intersect in front of the gripping body. An actuating lever mounted on the gripping body rotates about a second axis between a deployed position and a retracted position. A mechanism actuated by the actuating lever locks the mobile jaw in the clamping position.

Provided is a vehicle floor mat reducing a load on a mat main body. The vehicle floor mat includes at least one fastening device for fastening the mat main body to a vehicle. The fastening device includes a first fastening member fixed to the vehicle and a second fastening member fixed to the mat main body. The first fastening member includes a vertical rotating knob, and the second fastening member includes: an insertion receiving section for the rotating knob to be inserted thereinto and engaged therewith; and upper and lower half bodies sandwiching the mat main body and being connected to each other through a half body connecting portion for the rotating knob to be inserted thereinto and at least one outer connecting portion disposed outside the half body connecting portion provided around the insertion receiving section, thus improving a connecting strength between the upper and lower half bodies.

A hinge including a first hinge half rotatably connected to a second hinge half is described. A support mechanism selectively supports the first hinge half at one or more rotated positions relative to the second hinge half. The support mechanism includes a support which is selectively biased toward a support position in which the support is capable of supporting the first hinge half at a rotated position relative to the second hinge half. The support can further be selectively biased into a disengaged position in which the support is not capable of supporting the first hinge half relative to the second hinge half. With the support in a disengaged position, the first hinge half is freely pivotable relative to the second hinge half. An automatic reset mechanism may be utilized in connection with the hinge to reposition the support from the disengaged position to the support position as the hinge approaches a predefined position.

A rotary mechanism includes an accommodating slot structure, a supporting arm, a pivoting portion and a resilient component. The accommodating slot structure is disposed on the bezel. The accommodating slot structure includes a pivot hole structure and an opening structure, respectively formed on the lateral surface and a bottom of the accommodating slot structure. The supporting arm is disposed on the door. The pivoting portion is disposed on the surface of the supporting arm. The pivoting portion is disposed inside the pivot hole structure, so that the supporting arm is rotatably disposed inside the accommodating slot structure. The resilient component is movably accommodated inside the opening structure. A first end of the resilient component is resiliently connected to the lateral surface of the accommodating slot structure. A second end of the resilient component points the surface of the supporting arm, to prevent the pivoting portion from separation.

An electronic device capable of ejecting a peripheral element is disclosed, including a housing, a first wheel and a driving unit. The housing has a chamber, wherein the peripheral element is stored in the chamber. The first wheel is disposed in the housing, wherein the first wheel contacts the peripheral element. The driving unit is disposed in the housing, the driving unit rotates the first wheel, and the first wheel moves the peripheral element from a first position to a second position.