1 Omani Rial = 10.9657 Polish Zloty

1 Honduran Lempira = 0.168 Polish Zloty

1 Australian Dollar = 2.7475 Polish Zloty

1 Chinese Yuan Renminbi = 0.5944 Polish Zloty

1 Hungarian Forint = 0.013 Polish Zloty

1 Philippine Peso = 0.0833 Polish Zloty

1 Kenyan Shilling = 0.0396 Polish Zloty

1 Latvian Lat = 6.9513 Polish Zloty

1 Egyptian Pound = 0.2702 Polish Zloty

1 Botswana Pula = 0.3462 Polish Zloty

1 Bulgarian Lev = 2.3289 Polish Zloty

1 Canadian Dollar = 2.9996 Polish Zloty

1 Euro = 4.6128 Polish Zloty

1 Mexican Peso = 0.1776 Polish Zloty

1 Brazilian Real = 0.7335 Polish Zloty

1 United Arab Emirates Dirham = 1.1447 Polish Zloty

1 Sri Lanka Rupee = 0.0225 Polish Zloty

1 Algerian Dinar = 0.0328 Polish Zloty

1 Indonesian Rupiah = 0.0003 Polish Zloty

1 Lithuanian Lita = 1.424 Polish Zloty

1 Nigerian Naira = 0.0108 Polish Zloty

1 Czech Republic Koruna = 0.1673 Polish Zloty

1 Bolivian Boliviano = 0.6098 Polish Zloty

1 Japanese Yen = 0.0394 Polish Zloty

Power plants are a major source of CO2 emissions and contributor to global warming. This study reports on a portable technology to remove CO2 from their combustion exhaust gases. Pilot testing on a coal burning plant in Poland captured thousands of kilograms of CO2 per day. This could be a viable future means of mitigating CO2 emissions from the power generation sector.

New research has collated case studies of sustainable development in Poland. These indicate that there are a range of sustainability drivers and barriers, some of which are specific to transition economies in Central and Eastern Europe (CEE). It is hoped that the collection will trigger the development of a CEE database of good sustainability practices.

Up to 90% of consumed drugs enter the environment. This may have negative effects on wildlife, especially when the drugs take long periods to break down. This study assessed the breakdown of sulphonamides — a class of antibacterials — in samples from two rivers in Poland. The results showed that sulphamethoxazole, a common veterinary antibiotic, was the most persistent and that various factors inhibit degradation, including low temperatures, heavy metal pollution and low pH.

A group of chemicals found in personal care products may raise the risk of diabetes, a new study suggests.

Effectively addressing wildfire risk to communities on large multi-owner landscapes requires an understanding of the biophysical factors that influence risk, such as fuel loads, topography, and weather, and social factors such as the capacity and willingness for communities to engage in fire-mitigation activities.

Andrew Rickmann posted a photo:

Andrew Rickmann posted a photo:

Andrew Rickmann posted a photo:

An electrochemical finishing system for super conducting radio frequency (SCRF) cavities including a low viscosity electrolyte solution that is free of hydrofluoric acid, an electrode in contact with the electrolyte solution, the SCRF cavity being spaced apart from the electrode and in contact with the electrolyte solution and a power source including a first electrical lead electrically coupled to the electrode and a second electrical lead electrically coupled to the cavity, the power source being configured to pass an electric current between the electrode and the workpiece, wherein the electric current includes anodic pulses and cathodic pulses, and wherein the cathodic pulses are interposed between at least some of the anodic pulses. The SCRF cavity may be vertically oriented during the finishing process.

A polishing pad, having a polishing layer comprising a thermoset polyurethane foam, wherein the polishing layer has an in-plane variation of 12 or less in microrubber A hardness, the variation being obtained by measuring the polishing layer from a polishing surface side of the layer, the thermoset polyurethane foam contains, as raw material components, an isocyanate component and active-hydrogen-containing compounds, and the active-hydrogen-containing compounds comprise a trifunctional polyol having at least one terminated hydroxyl group that is a secondary hydroxyl group, and having a hydroxyl group value of 150 to 1,000 mg KOH/g in an amount of 10 to 50 parts by weight for 100 parts by weight of the active-hydrogen-containing compounds.

The polishing solution for CMP according to the invention comprises abrasive grains, an additive and water, and the polishing solution comprises an organic compound satisfying specified conditions as the additive. The polishing method of the invention is for polishing of a substrate having a silicon oxide film on the surface, and the polishing method comprises a step of polishing the silicon oxide film with a polishing pad while supplying the polishing solution for CMP between the silicon oxide film and the polishing pad.

Disclosed are an apparatus and a method for monitoring a glass plate polishing state. The apparatus may include a location measuring unit for measuring a location on a glass plate being polished by a polishing machine, a current measuring unit for measuring an electric current flowing into the polishing machine, a memory unit for storing a reference value of the electric current flowing into the polishing machine for each polishing location of the glass plate, and a control unit for determining whether a polishing state is faulty, by comparing a value of the electric current measured by the current measuring unit for each polishing location measured by the location measuring unit with a corresponding reference value of the electric current stored in the memory unit for each polishing location.

The present invention relates to a polishing apparatus for polishing an object to be polished (substrate) such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table configured to support a polishing pad, a polishing head having a top ring configured to press an object to be polished against the polishing pad while the object to be polished is rotated, and a dresser head having a dresser configured to dress the polishing pad. The polishing apparatus has a head cover having a purge gas introducing unit configured to introduce a purge gas into the head cover and an exhausting unit configured to exhaust the interior of the head cover. The pressure in the head cover is set to a pressure level slightly higher than the pressure outside the head cover, and main components of the polishing head are housed in the head cover.

The present invention provides: a method of polishing an object to be polished for processing a surface of the object to be polished into a concave or convex state with a high degree of accuracy; and a polishing pad. An object to be polished is placed on a polishing pad over the boundary between the first polishing region and the second polishing region, the first polishing region has grooves and the second polishing region has grooves different from those of the first polishing region, and either one of the two regions being formed on a region on the center side, and the other on the outer side in a radial direction on the surface of the polishing pad; and the object to be polished is polished by rotating the polishing pad and the object to be polished.

An enclosed polishing apparatus include a housing, a fixing seat, a guiding mechanism, and a chain-driven polishing mechanism. The housing includes a bottom housing and a top housing connected to the bottom housing. The fixing seat is securely placed in the bottom housing. The guiding mechanism is placed in the top housing above the fixing seat. The polishing mechanism is movably mounted on the guiding mechanism above the fixing seat. The polishing mechanism is driven and guided by the guiding mechanism to follow a desired polishing contour on a workpiece.

A machining apparatus for grinding, milling, polishing or the like of a dental workpiece. The machining apparatus contains a machining tool, a housing to which the machining tool is mounted rotatably about an axis of rotation relative to the housing, and a holding device to which the housing is fixed. The housing is mounted yieldingly movably to the holding device in dependence on forces exerted on the machining tool.

Nail polish remover strips are pre-sized for toe or fingernails and applied to a painted or artificial nail and left thereon for a predetermined period of time to dissolve the nail polish and/or nail bonding agent. Preferably a color change occurs to depict the appropriate dwelling time to dissolve the nail polish. Certain embodiments include odor reducing components. Preferably the strips are layered composites having an exterior odor impervious material, a layer of encapsulated acetone or nail polish removing agent, an absorbent layer, and a peelable backing, with the strips being sized to accommodate contact with a person's nail.

The method for surface inclusions detection, enhancement of endothelial and osteoblast cells adhesion and proliferation and sterilization of electropolished and magnetoelectropolished Nitinol implantable medical device surfaces uses an aqueous solution of chemical compounds containing halogenous oxyanions as hypochlorite (ClO−) and hypobromite (BrO−) preferentially 6% sodium hypochlorite (NaClO).

A plastic soft composition is formed of soft base material constantly provided with plasticity, porous fine particles for polishing contained in the base material, and the like, and a polishing process and a coating process are performed to a painted surface and the like using the plastic soft composition. The fine particles for polishing are impregnated with a coating agent (a surface protective agent) added with an activator which is emulsified by contact with water, and the coating agent is held in concave portions formed in the fine particles. Both polishing work and coating work are achieved by sliding the plastic soft composition on a painted surface by a palm pressure of a user.

Provided are a polishing pad which remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and which can be used for not only primary polishing but also finish polishing, and a manufacturing method therefor. The polishing pad is a polishing pad for polishing a semiconductor device, comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein the polyurethane-polyurea resin foam has a Young's modulus E in a range from 450 to 30000 kPa, and a density D in a range from 0.30 to 0.60 g/cm3.

A low defect chemical mechanical polishing composition for polishing silicon oxide containing substrates is provided comprising, as initial components: water, a colloidal silica abrasive; and, an additive according to formula I.

An object of the present invention is to provide a polishing pad that is prevented from causing an end-point detection error due to a reduction in light transmittance from the early stage to the final stage of the process, and to provide a method of producing a semiconductor device with the polishing pad. The present invention is directed to a polishing pad, comprising a polishing layer comprising a polishing region and a light-transmitting region, wherein a polishing side surface of the light-transmitting region is subjected to a surface roughness treatment, and the light-transmitting region has a light transmittance of 40% to 60% at a wavelength of 600 nm before use.

Polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

The inventive method comprises chemically-mechanically polishing a substrate with an inventive polishing composition comprising a liquid carrier and abrasive particles that have been treated with a compound.

A polishing composition contains colloidal silica particles having protrusions on the surfaces thereof. The average of values respectively obtained by dividing the height of a protrusion on the surface of each particle belonging to the part of the colloidal silica particles that has larger particle diameters than the volume average particle diameter of the colloidal silica particles by the width of a base portion of the same protrusion is no less than 0.245. Preferably, the part of the colloidal silica particles that has larger particle diameter than the volume average particle diameter of the colloidal silica particles has an average aspect ratio of no less than 1.15. Preferably, the protrusions on the surfaces of particles belonging to the part of the colloidal silica particles that has larger particle diameters than the volume average particle diameter of the colloidal silica particles have an average height of no less than 3.5 nm.

A method of manufacturing grooved polishing layers for use in chemical mechanical polishing pads is provided, wherein the formation of defects in the polishing layers are minimized.