A fabrication of a zeolite composite film includes mixing a composition of water, aluminum isopropoxide, TMAOH, and TEOS according to a set ratio, followed by stirring and heating to obtain a mixture; performing a centrifugation on the mixture to obtain an upper layer suspension; preparing a mesoporous particle suspension that includes a plurality of mesoporous particles, and each mesoporous particle includes a plurality of templating agents; vaporizing a mixture suspension formed from both the upper layer suspension and the mesoporous particle suspension to form a plurality of vaporized droplets; depositing the vaporized droplets on a heated substrate while removing the templating agents to form the zeolite composite film with a plurality of macroporous, mesoporous and microporous structures.

Disclosed are methods for making read sensors using developable bottom anti-reflective coating and amorphous carbon (a-C) layers as junction milling masks. The methods described herein provide an excellent chemical mechanical polishing or planarization (CMP) stop, and improve control in reader critical physical parameters, shield to shield spacing (SSS) and free layer track width (FLTW).

The present invention includes microfluidic systems having a microfabricated cavity that may be covered with a removable cover, where the removable cover allows at least part of the opening of the microfabricated cavity to be exposed or directly accessed by an operator. The microfluidic systems comprise chambers, flow and control channels formed in elastomeric layers that may comprise PDMS. The removable cover comprises a thermoplastic base film bonded to an elastomer layer by an adhesive layer. When the removable cover is peeled off, the chamber is at least partially open to allow sample extraction from the chamber. The chamber may have macromolecular crystals formed inside or resulting contents from a PCR reaction. The invention also includes a method for making vias in elastomeric layers by using the removable cover. The invention further includes methods and devices for peeling the peelable cover or a removable component such as Integrated Heater Spreader.

A manhole cover assembly includes a manhole structure, a manhole frame carried by the manhole structure and a manhole frame grout cementing the manhole frame to the manhole structure. The manhole frame grout includes a grout mixture having an epoxy resin, a curing agent and an aggregate. The epoxy resin and the aggregate are present in the grout mixture in an epoxy resin:aggregate weight ratio of about 0.09. A removable manhole cover is carried by the manhole frame. A manhole cover assembly fabrication method is also disclosed.

A light source device which can prevent the removal of light source elements of a light source device within a projector casing, a projector and a light source fabrication method are provided. An excitation light shining device 70 has a lens holding structure 79 and a light source holding structure 80 which are integrated together with excitation light sources held therebetween. The lens holding structure 79 has through holes 79f which first screw members 84 penetrate, and the light source holding structure 80 has screw holes 80h and screw holes 80k communicating with the screw holes 80h substantially at right angles. With the first screw members 84 penetrating the through holes 79f to be screwed into the screw holes 80h, screw thread portions of the first screw members 84 are pressed to be deformed plastically by distal end portions of the second screw members 85.

The invention relates to a substrate-based method for forming a three-dimensional object by additive fabrication by coating a liquid radiation curable resin comprising from 30 to 80 wt % of cationically curable compounds on a substrate, contacting the liquid radiation curable resin with a previously cured layer, selectively exposing the layer of liquid radiation curable layer to actinic radiation thereby forming a cured layer, separating the cured layer at the substrate, and repeating the steps a sufficient number of time in order to build up a three-dimensional object.

A fabrication method of a multi-domain vertical alignment pixel structure includes providing a substrate, forming a gate on the substrate, and forming an insulating layer on the substrate. A channel layer and a semiconductor layer are formed on the insulating layer. A source, a drain, and a capacitor-coupling electrode are formed. A passivation layer is formed to cover the source, the drain, a part of the channel layer, and a part of the semiconductor layer. A via hole is formed in the passivation layer to expose the drain, and a trench is formed in the passivation layer and the insulating layer. A lateral etched groove on the sidewall of the trench is formed to expose the side edge of the semiconductor layer. A first pixel electrode and a second pixel electrode are formed on the passivation layer at both sides of the trench, respectively.

Various embodiments of a photonic device and fabrication method thereof are provided. In one aspect, a device includes a substrate, a current confinement layer disposed on the substrate, an absorption layer disposed in the current confinement layer, and an electrical contact layer disposed on the absorption layer. The current confinement layer is doped in a pattern and configured to reduce dark current in the device. The photonic device may be a photodiode or a laser.

Methods for the fabrication of a Microelectromechanical Systems (“MEMS”) devices are provided, as are MEMS devices. In one embodiment, the MEMS device fabrication method includes forming at least one via opening extending into a substrate wafer, depositing a body of electrically-conductive material over the substrate wafer and into the via opening to produce a via, bonding the substrate wafer to a transducer wafer having an electrically-conductive transducer layer, and forming an electrical connection between the via and the electrically-conductive transducer layer. The substrate wafer is thinned to reveal the via through a bottom surface of the substrate wafer, and a backside conductor is produced over a bottom surface of the substrate wafer electrically coupled to the via.

Embodiments of a method for fabricating stacked microelectronic packages are provided, as are embodiments of a stacked microelectronic package. In one embodiment, the method includes arranging microelectronic device panels in a panel stack. Each microelectronic device panel includes a plurality of microelectronic devices and a plurality of package edge conductors extending therefrom. Trenches are formed in the panel stack exposing the plurality of package edge conductors. An electrically-conductive material is deposited into the trenches and contacts the plurality of package edge conductors exposed therethrough. The panel stack is then separated into partially-completed stacked microelectronic packages. For at least one of the partially-completed stacked microelectronic packages, selected portions of the electrically-conductive material are removed to define a plurality of patterned sidewall conductors interconnecting the microelectronic devices included within the stacked microelectronic package.

An optical element includes at least two stacked birefringent layers having respective local optical axes that are rotated by respective twist angles over respective thicknesses of the at least two layers, and are aligned along respective interfaces between the at least two layers. The respective twist angles and/or the respective thicknesses are different. The at least two stacked birefringent layers may be liquid crystal polymer optical retarder layers. Related devices and fabrication methods are also discussed.

A curved-surface display panel fabrication method for fabricating a curved-surface display panel using a flat display panel having a first substrate and a second substrate includes: paring partially outer surfaces of the first substrate and the second substrate so as to reduce thicknesses thereof to a predetermined thickness; bending the pared flat display panel to a desired curved shape; attaching a first guide member which has a shape corresponding to the desired curved shape to the first substrate with a predetermined gap from the pared outer surface thereof and attaching a second guide member with has a shape corresponding to the desired curved shape to the second substrate with a predetermined gap from the pared outer surface thereof; and forming light transmitting reinforcing layers respectively in a space between the first guide member and the first substrate and a space between the second guide member and the second substrate.

An insulated container includes a first laminated structure having a metal layer and a second laminated structure having a metal layer. The metal layer of the first laminated structure faces the metal layer of the second laminated structure. The insulated container also includes a foam material layer disposed between the first laminated structure and the second laminated structure. The metal layer of the first laminated structure is bonded to the metal layer of the second laminated structure at a plurality of locations.

A whip with a braided handle and method of fabrication which includes a generally cylindrical handle portion. The handle portion has an inboard end and an outboard end and is fabricated of a braided rope construction which comprises a plurality of single yarns twisted together to form a plurality of piled yarns which are then braided, with a helical angle of the twist of the single yarns within their respective plied yarn being equal and opposite to the helical angle of the plied yarns in the braid. Also included is an inboard first thread which is wrapped circumferentially about the handle end from adjacent the inboard end and extends outboardly. An outboard second thread is wrapped circumferentially around the handle portion to provide a handle. A whipping portion extends outboardly of the outboard end of the handle portion and is fabricated of extensions of the braided strands from the handle portion but in an unbraided braid form.

The present invention is that of a solar energy system that uses a light-guide solar panel (LGSP) to trap light inside a dielectric or other transparent panel and propagates the light to one of the panel edges for harvesting by a solar energy collector such as a photovoltaic cell. This allows for very thin modules whose thickness is comparable to the height of the solar energy collector. This eliminates eliminating the depth requirements inherent in traditional concentrated photovoltaic solar energy systems. A light guide solar panel has a deflecting layer, a light guide layer and a solar cell in optical communication with the light guide layer. The deflecting layer receives light at a first surface and inputs the light into the light guide layer. The light guide layer propagates the light to the solar cell, which is aligned generally parallel to the input surface.

Branched braided stent or graft devices and processes for fabrication of the devices are disclosed in which a trunk portion and two hinge leg portions are fabricated in one piece braided from a single plurality of filaments, whereby the legs contain the full plurality of filaments and the trunk portion contains a subset of the same plurality of filaments. The fabrication process involves braiding the hinged legs on a mandrel while retaining loops of filament between the hinged leg portions for subsequent braiding of the trunk portion of the stent or graft.

Interfaces for electrical (e.g., lighting) devices involve use of electrically conductive edge contacts arranged on or protruding from edges of printed circuit boards (PCBs) that provide or facilitate electrical connections to first and second externally accessible electrical contacts, such as may include threaded and foot contacts of a lighting device including a screw-shaped male base. First and/or second edge contacts of a PCB may protrude through first and second openings in a housing to form first and second externally accessible contact, or directly engage first and second externally accessible contact elements associated with (e.g., retained by) the housing. A contact element retained by a housing may define a slot in the interior of the housing to directly engage an edge contact of the PCB. Electric power is supplied to the PCB via edge contacts without need for intervening wires or soldered connections.

New net shape strength retaining high temperature alloy parts are formed from fine metallurgical powders by mechanically blending the powders and placing them in die, placing a piston in the die, extending the piston into a driving chamber, filling the chamber with CH4 and air and compressing the powders with the filling pressure. Igniting gas in the chamber drives the piston into the cavity, producing pressures of about 85 to 150 tsi, compacting the powders into a near net shape alloy part, ready for sintering at 2300° C. without shrinking. The alloy parts are Re, Mo—Re, W—Re, Re—Hf—HfC, Re—Ta—Hf—HfC, Re—Mo—Hf—HfC, Mo—Re—Ta, Mo—Re-f-HfC, W—Re—Hf—HfC, W—Re—Ta—Hf—HfC or W—Re—Mo—Hf alloys.

The method for forming a 3-D metal object by 3-D printing or injection molding comprising providing as a feed material metal particles formed by establishing multiple metal components in a primary billet of a ductile material, working the primary billet through a series of reduction steps to form the components into elongated elements, leaching the ductile material from the elongated elements and reducing the length to short uniform lengths.

Auxetic fabric structures, of the sort which can be useful in conjunction with composite materials, and related methods of fabrication.

A method for fabrication of a relatively low cost display or communicative novelty button in which a consumable restrictor sheet is placed over a vacuum draw type female mold cavity. The restrictor sheet may be of cardboard and be apertured with a diameter smaller than the mold cavity diameter. A thermoplastic sheet material is then placed over the restrictor sheet, heated to reach a formable state and vacuum drawn through the restricted aperture and down so that the sheet comes into contact with and generally conforms to the desired shape defined by the mold cavity. The plastic sheet material may then be trimmed near the edge of the restrictor sheet to leave a button shell mounted on a restrictor sheet which may then be used for purposes of display. The restrictor sheet also enables fabrication with an inwardly facing peripheral groove that may be used to secure a pin fastener. An alternate form of fastener in which a portion of the remaining plastic sheet is used is also disclosed.

A green ball grinding method includes the step of supplying a green ball between a first surface of a first member and a second surface of a second member constituting a grinding apparatus, and the step of grinding the green ball between the first surface and the second surface while the green ball rotates around its own axis and in orbital motion. In the step of grinding the green ball, the step of causing the green ball grinding to proceed while applying load between the green ball and each of the first surface and the second surface, and the step of modifying the rotation axis of the green ball by reducing the load lower than in the step of causing the green ball grinding to proceed are executed alternately.

A semiconductor package is provided, including: an insulating base body having a first surface with an opening and a second surface opposite to the first surface; an insulating extending body extending outward from an edge of the first surface of the insulating base body, wherein the insulating extending body is less in thickness than the insulating base body; an electronic element having opposite active and inactive surfaces and disposed in the opening with its inactive surface facing the insulating base body; a dielectric layer formed in the opening of the insulating base body and on the first surface of the insulating base body, the insulating extending body and the active surface of the electronic element; and a circuit layer formed on the dielectric layer and electrically connected to the electronic element. The configuration of the insulating layer of the invention facilitates to enhance the overall structural rigidity of the package.

Hall effect devices and field effect transistors are formed incorporating a carbon-based nanostructure layer such as carbon nanotubes and/or graphene with a sacrificial metal layer formed there over to protect the carbon-based nanostructure layer during processing.

A process writes phase shift error correction values into a phased-array antenna to normalize a range of manufacturing variances. An axial ratio is determined for an antenna weight vector (AWV) by making multiple measurements with the horn of a test antenna mechanically rotating from 0 to 180 degree or with dual polarization test antenna. For calibration of the whole array, each subarray is treated in the same fashion as equivalent to an antenna element in the subarray calibration. The subarray is electronically rotated as a whole (all elements rotated by the same phase shift value) from 0 to 360 degree during the full array calibration. Due to small power variation among AWVs, calibration solely by REV results fail to consistently converge to resolution. Accordingly, the apparatus measures and compares axial ratios. During final fabrication, the apparatus programs an AWV with best axial ratio into each non-transitory array element.

A system and method provides a piezoelectric stack arrangement for reduced driving voltage while maintaining a driving level for active piezoelectric materials. A stack arrangement of d36 shear mode single crystals of both air X-cut and Y-cut ±1:45° (±20°) arrangement are bonded with discrete conductive pillars to form a shear crystal stack. The bonding area between the neighboring crystal parts is minimized. The bonding pillars are positioned at less than a total surface are of the single crystal forming the stack. The stack fabrication is facilitated with a precision assembly system, where crystal parts are placed to desired locations on an assembly fixture for alignment following the preset operation steps. With the reduced clamping effect from bonding due to lower surface coverage of the discrete conductive pillars, such a piezoelectric d36 shear crystal stack exhibits a reduced driving voltage while maintaining a driving level and substantial and surprisingly improved performance.

A liquid crystal display (LCD) panel, a display device and a fabrication method of the LCD panel are provided. The LCD panel comprises a first substrate, a second substrate opposite to the first substrate, a liquid crystal (LC) layer sandwiched between the first substrate and the second substrate, a first alignment layer disposed on the first substrate, and a second alignment layer disposed on the second substrate. The first alignment layer is in contact with the LC layer and provides a first pre-tilt angle α to LC molecules in the LC layer, and the second alignment layer is in contact with the LC layer and provides a second pre-tilt angle β to the LC molecules in the LC layer, where α>β.

The present disclosure provides a display substrate and fabricating method, a display panel, and a display apparatus. The display substrate includes a substrate including a sealing region and a driving wire on the substrate. At least a portion of the driving wire is in the sealing region. The portion of the driving wire includes: a first surface, a second surface opposite to the first surface, and sides there-between connecting to the first surface and the second surface. Each side has a projection width on the substrate of at least about 1 μm.

An article may include a first polymeric material layer having a surface. A first conductive trace may form at least a portion of the first layer surface. The article may further include a second polymeric material layer. The second layer may have a first surface, a portion of the second layer first surface being bonded to a portion of the first layer surface. The second layer may have a portion of a channel defined therein, the channel at least partially coinciding with a portion of the first conductive trace. The article may also include a first patch interposed between the first layer surface and the second layer first surface. The first patch may span the channel and cover a portion of the first conductive trace.

A polymeric housing may have a channel defined therein. A first conductive trace may at least partially coincide with the channel. A first wire may have a first conductor surrounded by a first insulating jacket. The first conductor may be in electrical communication with the first conductive trace. A jacket bonding region of the first jacket may be welded to a housing bonding region of the housing. The jacket bonding region and the housing bonding region may be formed from a common type of polymer.

Researchers at the Mediated Matter Group at MIT Media Lab have created Aguahoja, a collection of natural artifacts that were digitally designed and robotically fabricated from the molecular components found in trees, insect exoskeletons, apples and bones.

(United States Ninth Circuit) - Held that an employee of the California State Board of Equalization violated clearly established law by participating in law enforcement's execution of a search warrant at the business premises of a man with whom he had a recent altercation. Affirmed the denial of his motion seeking qualified immunity in this lawsuit alleging civil rights and tort claims.

Paris, [France] : J.B. Baillière, Libraire de l'Académie Impériale de Médicine, 1856.

Presentation by Glenn Oliver of DuPont Electronic Technologies.

Eversheds Sutherland has advised Doncasters Group on the sale of its UK Fabrications and Blaenavon Forgings businesses to Arlington Capital Partners as two separate transactions. The deals were led by Corporate partner Richard Kyle with support from...

Kris De Decker questions some of our most cherished assumptions.

It's an industrial design approach, a product that is refined almost to perfection.

Company: Nanu India Recruitment Co
Qualification: Bachelor Of Technology (B.Tech/B.E), Diploma
Experience: 0 to 2
Salary: 1.80 to 4.20
location: Hyderabad / Secunderabad
Ref: 24819641
Summary: Fabrication Inspection Engineer- Apply Now Freshers also can apply as Trainee.

Wayne Hoch, 35, was driven to mental collapse after being taunted over his South African nationality by colleagues at UK firm Thor Atkinson Steel Fabrications Ltd.

Steel Design and Fabrication

Fabrication

Pre-fabrication