A toy construction system is provided that includes, in a toy construction system having a multiplicity of interconnecting members adapted for constructing a variety of projects, a rotator head device including a device housing having a conical-shaped cavity formed therein. The housing includes a plurality of female twist-lock connectors formed on the outer surface thereof, and the female connectors are adapted for attaching a first member of the toy construction system to the rotator head device housing. A rotating member, which is conical in shape and slightly smaller in size than the cavity formed in the device housing is included. The rotating member is rotatably disposed within the cavity and has a male twist-lock connector stem extending from an end thereof for connecting a second member of the toy construction system to the rotating member, whereby the first member is rotatable with respect to the second member.

A fastening element includes a holding part with a support plate and expanding cheeks, and a locking part guidingly received in the holding part. The expanding cheeks include cantilevered walls formed adjacent the support plate, which are offset radially outwardly with respect to a guide wall of the support plate which guides the locking part. The locking part can be pushed through the support plate substantially without force until it reaches inwardly protruding ramp projections formed on the expanding cheeks, which provide a better lever ratio for spreading the expanding cheeks.

A threaded connector for securing a panel member to a structure and for adjusting the position of the panel member relative to the structure. The connector comprises an elongate one-piece stud, a first spacer, a threaded nut, a second spacer and a turning formation. The connector permits the panel member to be mounted on the stud and the stud to be rotated to adjust the position of the panel member relative to the structure.

A connecting arrangement is provided between a plastic component with at least two mutually adjacent and at least approximately parallel walls and another structural element, having at least one force-transmission element which is adhesively bonded to the plastic component via an adhesive bond on the plastic component in frusto-conical or spherical-segment-shaped depressions in the mutually adjacent walls of the plastic component. The force-transmission element has a carrying structure for the other structural element. With the exception of a possibly provided coating, the force-transmission element is composed only of metallic material and has a plate which is adapted to the depression in the outer wall of the plastic component, which outer wall is adjacent to the other structural element. The edge of the plate rests with interposition on the outer wall in the surrounding region of the depression, wherein the plate is connected via a web to an end section of the force-transmission element, which end section is adapted to the depression in the other inner wall of the plastic component. The depression is configured in the outer wall without a bottom to such an extent that the end section of the force-transmission element can be inserted through the outer wall into the recess of the inner wall.

An improved e-track connector, or lockdown, is presented that can be installed in single locations instead of provided in tracks as in the industry. It also possesses a finished slot that accepts logistics straps buckles. The slot is a complete rectangle with no excess material folded under it and has been deburred and finished smooth. The device also possesses a drain slot along the side of the tang and drain holes in the buckle receiver such that liquid will drain out of the connector when it is mounted horizontally.

A programmable routing scheme provides improved connectivity both between Universal Digital Blocks (UDBs) and between the UDBs and other micro-controller elements, peripherals and external Inputs and Outputs (I/Os) in the same Integrated Circuit (IC). The routing scheme increases the number of functions, flexibility, and the overall routing efficiency for programmable architectures. The UDBs can be grouped in pairs and share associated horizontal routing channels. Bidirectional horizontal and vertical segmentation elements extend routing both horizontally and vertically between different UDB pairs and to the other peripherals and I/O.

An embodiment of this invention uses a massive parallel interconnect fabric (MPIF) at the flipped interface of a core die substrate (having the core logic blocks) and a context die (used for in circuit programming/context/customization of the core die substrate), to produce ASIC-like density and FPGA-like flexibility/programmability, while reducing the time and cost for development and going from prototyping to production, reducing cost per die, reducing or eliminating NRE, and increasing performance. Other embodiments of this invention enable debugging complex SoC through large contact points provided through the MPIF, provide for multi-platform functionality, and enable incorporating FGPA core in ASIC platform through the MPIF. Various examples are also given for different implementations.

Embodiments described herein provide approaches for improving a standard cell connection for circuit routing. Specifically, provided is an IC device having a plurality of cells, a first metal layer (M1) pin coupled to a contact bar extending from a first cell of the plurality of cells, and a second metal layer (M2) wire coupled to the contact bar, wherein the contact bar extends across at least one power rail. By extending the contact bar into an open area between the plurality of cells to couple the M1 pin and the M2 wire, routing efficiency and chip scaling are improved.

In a control device for a technical processing plant, a pneumatically driven actuator having an actuator stem is provided together with a valve operated by the actuator, the valve having a valve stem. A valve element is attached to the valve stem. A stem connector connects the two stems to each other for a forced transmission of axial actuating movements and for modifying an axial distance between adjacent ends of the valve stem and the actuator stem to adjust a total axial length of the two stems. The stem connector comprises two half-shells connected to each other, and two positioning devices are provided for a friction-locking coupling of the half-shells to the respective ends. At least one of the positioning devices is designed to modify an axial attachment position of the half-shells along one of the stems.

A semiconductor device comprises a first semiconductor chip including a first substrate and a plurality of first metal lines formed over the first substrate and a second semiconductor chip bonded on the first semiconductor chip, wherein the second semiconductor chip comprises a second substrate and a plurality of second metal lines formed over the second substrate. The semiconductor device further comprises a conductive plug coupled between the first metal lines and the second metal lines, wherein the conductive plug comprises a first portion formed over a first side of a hard mask layer, wherein the first portion is of a first width and a second portion formed over a second side of the hard mask layer, wherein the second portion is of a second width greater than or equal to the first width.

An interconnect structure and a method of forming an interconnect structure are disclosed. The interconnect structure includes a lower conductive feature in a lower low-k (LK) dielectric layer; a first etch stop layer (ESL) over the lower conductive feature, wherein the first ESL comprises a metal compound; an upper LK dielectric layer over the first ESL; and an upper conductive feature in the upper LK dielectric layer, wherein the upper conductive feature extends through the first ESL and connected to the lower conductive feature. The interconnect structure may further include a second ESL between the upper LK dielectric layer and the first ESL, or between the first ESL and the lower conductive feature, wherein the second ESL comprises a silicon compound.

An embodiment is an integrated circuit structure including a first die attached to a second die by a first connector. The first connector includes a solder joint portion between a first nickel-containing layer and a second nickel-containing layer, a first copper-containing layer between the first nickel-containing layer and the solder joint portion, and a second copper-containing layer between the second nickel-containing layer and the solder joint portion.

A semiconductor device has a semiconductor wafer with a plurality of contact pads. A first insulating layer is formed over the semiconductor wafer and contact pads. A portion of the first insulating layer is removed, exposing a first portion of the contact pads, while leaving a second portion of the contact pads covered. An under bump metallization layer and a plurality of bumps is formed over the contact pads and the first insulating layer. A second insulating layer is formed over the first insulating layer, a sidewall of the under bump metallization layer, sidewall of the bumps, and upper surface of the bumps. A portion of the second insulating layer covering the upper surface of the bumps is removed, but the second insulating layer is maintained over the sidewall of the bumps and the sidewall of the under bump metallization layer.

A microelectronic assembly and method of making, which includes a first microelectronic element (including a substrate with first and second opposing surfaces, a semiconductor device, and conductive pads at the first surface which are electrically coupled to the semiconductor device) and a second microelectronic element (including a handler with first and second opposing surfaces, a second semiconductor device, and conductive pads at the handler first surface which are electrically coupled to the second semiconductor device). The first and second microelectronic elements are integrated such that the second surfaces face each other. The first microelectronic element includes conductive elements each extending from one of its conductive pads, through the substrate to the second surface. The second microelectronic element includes conductive elements each extending between the handler first and second surfaces. The conductive elements of the first microelectronics element are electrically coupled to the conductive elements of the second microelectronics element.

A semiconductor device has a protective layer formed over an active surface of a semiconductor wafer. The semiconductor die with pre-applied protective layer are moved from the semiconductor wafer and mounted on a carrier. The semiconductor die and contact pads on the carrier are encapsulated. The carrier is removed. A first insulating layer is formed over the pre-applied protective layer and contact pads. Vias are formed in the first insulating layer and pre-applied protective layer to expose interconnect sites on the semiconductor die. An interconnect structure is formed over the first insulating layer in electrical contact with the interconnect sites on the semiconductor die and contact pads. The interconnect structure has a redistribution layer formed on the first insulating layer, a second insulating layer formed on the redistribution layer, and an under bump metallization layer formed over the second dielectric in electrical contact with the redistribution layer.

A system for lifting a vehicle via multiple slings comprises a vehicle not engineered with structural facility to withstand lifting forces, including a frame which unmodified will deform in response to vertically imposed lifting forces, frame reinforcing elements affixed to the frame at selected locations which are subject to lifting deformation, at least two lifting members at spaced-apart forward frame locations, at least two lifting members at spaced-apart rearward frame locations, and a plurality of elongate slings extending respectively between each lifting member and a common lifting vertex. Each lifting member has an enlarged lower base portion rigidly affixed to the frame and an upper lifting portion. The frame reinforcing elements resist deformation of the frame in response to vertically imposed lifting forces. The enlarged base portions of the lifting members apply forces over a correspondingly enlarged area of the frame and the reinforcing elements without deforming the frame.

A vacuum-lifting device includes a holding block and a nozzle. The holding block defines a holding hole and a threaded hole communicating with the holding hole. The nozzle includes a first section that is slidably received in the holding hole and a second section. The second section extends from the first section and has an outer diameter smaller than an outer diameter of the first section.

A connector-equipped communication module includes a communication module and a connector. The communication module includes a wiring board including antenna-mounted and IC-mounted regions at different positions in a planar view, an antenna element mounted in the antenna-mounted region, a wireless IC and a mounted component mounted in the IC-mounted region, and side terminals in the IC-mounted region and peripheral portions near the IC-mounted region. The connector includes a receiving portion including a placement portion configured to mount the communication module and a wall portion extending around the placement portion, inner wall terminals on an inner side of the wall portion at positions facing the side terminals, and external terminals located outward of the receiving portion and electrically connected to the inner wall terminals. In a state where the communication module is received in the receiving portion, the inner wall and side terminals are fitted so as to contact with each other.

The present disclosure provides methods and devices for testing a connection between speakers and a power amplifier. The disclosed methods and devices solve a problem that, upon a connection test for a power amplifier which has a booster power source, when a midpoint potential of the power amplifier and the voltage of the speaker connection terminal are compared, and it is determined that short-circuiting occurs on a ground side when the potential of the speaker connection terminal is lower than the midpoint potential, a wrong test is conducted if a midpoint potential is higher than a battery voltage.

The present application discloses apparatus and methods for increasing channel utilization for a high-speed serial interface of an integrated circuit (IC). A new circuit architecture is disclosed which provides circuitry that may be programmed flexibly to support a multitude of different channel bonding schemes. In accordance with one aspect of the invention, the new architecture decouples the granularity of control-signal channel bonding from the granularity of data-aggregation channel bonding. This advantageously allows optimization of configurations for both types of channel bonding. In another aspect of the invention, the logical boundaries of bonded user channels are decoupled from the physical boundaries of the PCS modules. This decoupling advantageously eliminates a rigid constraint of previous architectures.

A connecting apparatus for connecting two drawer wall parts which are intended to be arranged at a right angle includes at least one receiving part which has a receiving opening for receiving an end section of a first drawer wall part and has at least one insertion opening, a bracket which has at least two limbs which run substantially parallel, wherein the bracket can be pushed onto a web, which is arranged or formed on a second drawer wall part, in order to connect the first drawer wall part and the second drawer wall part, and wherein the at least two limbs of the bracket surround the web of the second drawer wall part, wherein a first limb of the bracket can be inserted into the insertion opening in the receiving part and connects the receiving part to the second drawer wall part in a positionally secure manner.

A method of making an electrical connection to a railroad rail includes fastening a wire bonding assembly to a railroad rail, the wire bonding assembly including first and second spaced apart washer plates contacting the rail and a metal bar supported by the washer plates. The metal bar is electrically connected with the rail with a first conductive lead contacting a selected point on the rail and a selected point on the metal bar. A second conductive lead is connected to another selected point on the metal bar for establishing an electrical connection to the rail from an electrical device.

A connection assembly for connection to the mouth of a flexible container comprising of an inner ring having an inner flange around its external diameter and an outer ring having a recess around its inner diameter sized to engage the inner flange. The inner and outer rings being adapted to interengage to trap the mouth between the inner and outer rings.

A method that utilizes software and hardware mechanisms to meet the FCC requirement for a U-NII antenna to be an integral part of the device in which it operates, while providing wireless ready U-NII devices and CRUable U-NII radios. Enhancements are made to the software BIOS, including the inclusion of a table of approved radio-antenna PCI ID pairs to create an authentication scheme that verifies and authenticates the radio and antenna combination as being an FCC-approved unique coupling during boot-up of the system. The BIOS also comprises an OEM field that stores an encrypted secret key utilized to complete a second check of the radio model placed in the device. During boot up of the device, the PCI ID pairs from the BIOS are compared against the PCI ID of the radio and the secret key is checked against the radio model. Only a system with an approved combination of radio and antenna is allowed to complete the boot process, indicating an FCC approved device-antenna-radio combination under the “integral” requirement.

A cavity filter includes a slider, a driving device, and an adapter. The slider is used to slide relative to and couple with a plurality of resonators located in the cavity filter to adjust a resonating frequency of the cavity filter. The driving device is used to drive the slider slide relative to the plurality of resonators and includes a shaft having a free end. The adapter is installed between the slider and the driving device and rotateably connected to the free end of the shaft with a gap configured between the free end and the adapter.

The connecting rod (6) for two articulations with parallel axes and for transmitting the rocking movements of an output lever of a shedding device to a heald frame belonging to a weaving loom, having a first connecting tip connecting to a first articulation and secured to a longitudinal bar, a second connecting tip (62) connecting to a second articulation and including members for clamping the bar that are accessible from one side of the connecting rod, and members (64) for separating the tips along a longitudinal axis (X6) of the connecting rod. The separating member having a bearing member (640) on an inclined surface (612; 630) whereof the normal is comprised in a plane (P6) perpendicular to the axes of the articulations and is inclined relative to the longitudinal axis (X6) of the connecting rod, while the bearing member (640) can be moved in a direction perpendicular to a plane (P34) containing the axes (X3, X4) of the articulations.

A buckstay connecting system includes a socket part that is fixed to the horizontal buckstay being separated from a lower end of the vertical buckstay between the lower end of the vertical buckstay and the horizontal buckstay, and an insertion part that is fixed to a lower portion of the vertical buckstay, is inserted into the socket part so as to be able to slide in a vertical direction, inhibits the horizontal buckstay from being inclined, and is allowed to be fastened to the socket part.

This application is directed to groove milling devices for milling a groove in a component. In one example, a groove milling device includes a milling disk which is rotatable about a rotational axis, wherein the groove milling device comprises a displacement device for moving the milling disk along the rotational axis during the milling process. In an example, the groove milling device may include a control device which actuates the displacement device automatically when a predetermined depth of the milled groove is reached during the milling process. In an example, the groove milling device may include a switch for activating the displacement device by an operator during the milling process. In an example, the energy required for actuating the displacement device may be generated by a generator coupled to a main drive spindle of the groove milling device.

A method and apparatus for automating some of the tasks that heretofore required operator action at headland turns or similar events are provided. The present invention automates operation of lift assist wheels and/or gull wings, such as those found on a stack-fold implement, based on the position of the tractor hitch to which the implement is coupled. An operator may control the position of the implement, such as at a headland turn, by raising and lowering the tractor hitch using a remote control. The invention enables the planter to compare the tractor hitch position relative to an implement position and control operation of the implement accordingly without additional user inputs.

Interconnect structures and methods of fabricating the same are provided. The interconnect structures provide highly reliable copper interconnect structures for improving current carrying capabilities (e.g., current spreading). The structure includes an under bump metallurgy formed in a trench. The under bump metallurgy includes at least: an adhesion layer; a plated barrier layer; and a plated conductive metal layer provided between the adhesion layer and the plated barrier layer. The structure further includes a solder bump formed on the under bump metallurgy.

A non-linear element (e.g., a diode) with small reverse saturation current is provided. A non-linear element includes a first electrode provided over a substrate, an oxide semiconductor film provided on and in contact with the first electrode, a second electrode provided on and in contact with the oxide semiconductor film, a gate insulating film covering the first electrode, the oxide semiconductor film, and the second electrode, and a third electrode provided in contact with the gate insulating film and adjacent to a side surface of the oxide semiconductor film with the gate insulating film interposed therebetween or a third electrode provided in contact with the gate insulating film and surrounding the second electrode. The third electrode is connected to the first electrode or the second electrode.

A pipe connecting structure of a water heater. Individual parts in the water heater are integrally coupled with a pipe body, which is injection-molded, provides paths of tap water and hot water, reduces the number of pipes connecting the individual parts, and simplifies the connection structure of the pipes. The pipe connecting structure of the water heater includes a tap water inlet pipe connected from a tap water inlet to a heat exchanger; a hot water supply pipe connected from the heat exchanger to a hot water outlet; a flow sensor for measuring the flow rate of the tap water introduced via the tap water inlet; and a flow control valve for controlling the flow rate of the hot water discharged via the hot water outlet. The pipe body connects and is integral with the tap water inlet, the tap water inlet pipe, the hot water supply pipe, and the hot water outlet.

A method of connecting two solar cells is disclosed. In one embodiment, the method comprises gripping an interconnect with a head of positioning device, heating the interconnect with the head of the positioning device to between two predetermined temperatures, where one is higher than the other, positioning the interconnect so as to overlay two adjacent solar cells, coupling the interconnect to each of the two adjacent solar cells, and releasing the interconnect from the head.

A back electrode type solar cell in which a no-electrode-formed region where no electrode is placed is provided in a part of a peripheral portion of a back surface of the back electrode type solar cell such that a line connecting end portions of a plurality of electrodes to one another includes a partially inwardly recessed region and the no-electrode-formed region is located adjacent to each of an electrode for n-type and an electrode for p-type adjacent to each other, a solar cell module, a method of manufacturing a back electrode type solar cell with interconnection sheet, and a method of manufacturing a solar cell module are provided.

A separate connection device (40) intended to be inserted between a metal frame (3), of an electrical component (1), and a metal supporting structure (20) in order to connect, electrically and separately, the frame to the supporting structure. The connection device (40) comprises a metal blade manufactured from spring steel which comprises two self-connecting end areas (45, 46) arranged in separate planes and comprising a set of sharp teeth (47) arranged in order to be embedded within the metal material and formed on a folded section of the metal blade so that the sets of teeth (37, 47) extend in opposite directions and in planes intended to intersect the planes of the frame (3) and of the supporting structure (20) when the connection device is mounted.

A three-phase disconnect switch for a power distribution system that supplies three-phase power from a source through a main circuit breaker to multiple three-phase feeder circuits, includes three pairs of contacts adapted for connection to the three phase lines of a selected one of the feeder circuits for opening and closing each of the phase lines, and a movable actuator associated with the three pairs of contacts and responsive to a signal indicating the occurrence of an arcing fault in the selected feeder circuit for initially creating a short circuit across the three phase lines of the feeder circuit and then opening the contacts.

A reversible folio for a tablet computer has a tablet shell with a cavity removably receiving the tablet computer. A keyboard is pivotally and removably coupled to the tablet shell. A channel is pivotally coupled to an edge of the keyboard. An interior of the channel removably receives the proximal edge of the tablet shell, and has a profile mating with a profile of the tablet shell. The channel and proximal edge have first and second symmetrical magnet arrays, respectively. The proximal edge of the tablet shell physically mates with the channel of the keyboard, and the second magnet array of the tablet shell magnetically mates with the first magnet array of the channel, in both a first orientation and an opposite second orientation.

A toy train car including a coupler or hitch. The coupler includes a first connector (e.g., socket) configured to be connected to the train car and a second connector (e.g., ball) configured to be connected to the train car. The first connector can be positioned in the front or rear of the train car. The second connector also can be positioned in the front or rear of the train car. Each train car can include a first connector and a second connector. The first and second connectors are configured to couple together to link a plurality of train cars together.

A forestry vehicle including a frame, a pivoting boom, a first structure, a second structure, and a debris guard. The pivoting boom is carried by the frame. The first structure is carried by the frame and is positioned on a first side of the pivoting boom. The second structure is also carried by the frame and is positioned on a second side of the pivoting boom. A channel exists between the first structure and the second structure. The pivoting boom travels in the channel as the boom pivots about its pivotal axis. The debris guard is pivotally and slidingly coupled to the boom.

A system for filling a jar with powdery material, for example for the manufacture of nuclear fuel, including a device for connection between the jar and a material feed system, where the device includes: a stationary connection portion connected to the feed system,a connection portion which moves relative to the stationary connection portion intended to be connected to the container's filling orifice, where the moving connection portion includes in the area of a downstream end a lip seal to achieve a tight connection by contact with the contours of the jar's filling orifice and where the said downstream end is connected to the stationary connection portion by a bellows so as to provide mechanical disengagement between the downstream end of the moving connection portion and the stationary connection portion.

A reusable aseptic connector is provided. The connector may be used to provide fluid communication between a bag-in-box (BIB) container and a beverage dispenser. The connector may provide aseptic properties of the connection by insulation of an inner volume of a first part and an inner volume of a second part, with the beverage component kept from contacting any of the part of the connector structure that are exposed to the environment and have a risk of induced contamination. The connector may comprise a resilient membrane and a sliding tube wherein the sliding tube is configured to have a portion move toward and through the resilient membrane to establish fluid communication between the first part and the second part, and for the portion to move away from the resilient membrane to destablish fluid communication between the first part and the second part when desired.

An electronic apparatus includes a switching element which has a control terminal and is driven by controlling voltage of the control terminal, a driving power supply circuit which supplies voltage required for driving the switching element, an on-driving circuit which is connected to the driving power supply circuit and the control terminal of the switching element and is supplied with voltage from the driving power supply circuit, and which applies a constant current to the control terminal of the switching element to charge the control terminal, thereby turning on the switching element, and at least one diode which is connected between the on-driving circuit and the control terminal of the switching element. The on-driving circuit applies a constant current to the control terminal of the switching element through the diode.

A method and apparatus comprising a refueling controller. The refueling controller is configured to receive data about a current rate of movement of a refueling boom while the refueling boom is in contact with a receiver aircraft during flight. The refueling controller is further configured to disconnect the refueling boom from the receiver aircraft based on the current rate of movement of the refueling boom and a current position of the refueling boom.

A device for connecting welding wires for CO2 gas welding includes a base frame, first and second electrode plates that are disposed apart from each other on the base frame and including disposing grooves to which an old wire and a new wire are respectively disposed, and clampers that are disposed to each electrode plate and that clamp the used wire and the new wire disposed to the disposing grooves, respectively.

A plier tool for crimping electrical connectors to wires includes two plier handles that are pivotally connected together by a pivotal coupling that allows for rotation of the handles, towards and away from one another. The two plier handles each have gripping portions that are graspable by a user to rotate the plier handles about the axis of rotation. A crimping die is located on each plier handle, at an end opposite of the gripping portion thereof, and rotation of the plier handles causes the crimping dies to be moved towards and away from one another between engaging and non-engaging positions. The crimping die, together, define an opening that is configured to receive an electrical connector in a manner that positions the electrical connector in an endwise direction that is generally perpendicular to the axis of rotation.

An exhaust connection coupler and a method for manufacturing a braid cover incorporated therein are provided. The method of manufacturing comprises the steps of providing a tubular sleeve formed of braided wire filaments and forming at least one end of the sleeve into shape using a forming die such that the at least one end of the cover includes a circumferential neck portion having a diameter smaller than the diameter of a body portion of the cover. In the method, the sleeve may be pressed between male and female forming dies in order to create the cover's desired shape, which can include a shoulder extending radially outwardly from the cover's neck portion and meeting the cover's body portion at a corner.

A mechanism for coupling a switch point to a point detector box having a point detector bar includes a first portion structured to be slidably coupled to the point detector bar and a second portion structured to be slidably coupled to the switch point.

In some embodiments, a connector attaches to an axle of an archery bow and comprises a cable terminal. The connector comprises a first body portion made from a first material and a second body portion made from a second material different from the first material. The first body portion defines an aperture therethrough arranged to engage the axle. The second body portion has a groove extending around at least a portion of its periphery, forming a teardrop shape. In some embodiments, the connector is configured to snap-fit onto an axle and be removable without tools.

A fluid flow connector and a method of manufacturing the same wherein the fluid flow connector utilizes a valve having a plunger which is made by overmolding a soft exterior to a hard core. The soft exterior being overmolded to the hard core by either insert or multi-shot methods. The method also including attaching the soft exterior to the hard core mechanically and/or by molecular bonding.

Connection system, with self-alignment, for elevator guides, in which the front surfaces thereof maintain a perfect 90° angle with respect to the longitudinal axis (e) of each guide (1) and there is a connection plate (2) that forms through-holes (241) that are offset and in correspondence with holes (141) in the wings (14), such that, when connection means (3) are mounted therein, a front self-alignment pressure is created between the two guides (1).