A method of detecting a cancer progression observation index gene group, comprising: a) preparing a plurality of AKR/J mice in which an oncogene is inserted into a thymocyte; b) dividing the AKR/J mice into three groups, raising the first group of the AKR/J mice after high-dose ionizing radiation of 0.8 Gy/min, raising the second group of the AKR/J mice after low-dose ionizing radiation of 0.7 mGy/hr, and raising the third group of the AKR/J mice in a general environment; c) obtaining a thymus of a dead mouse of the first or second group of the AKR/J mice throughout the b) operation and diagnosing cancer when a weight of the thymus is increased to twice or more than before radiation; d) extracting thymuses by sacrificing the first to third groups of the AKR/J mice at the time at which the third group of the AKR/J mice initially die; and e) selecting only a thymus having no change in weight compared to the organs of the same-aged non-irradiated AKR/J mice from the organs extracted in d) and detecting a gene of the organ whose weight is increased or decreased by a factor of two or more through gene analysis.

Compositions and methods for detecting Trichomonas vaginalis are provided.

A system and method for concurrently and uniformly removing thermal energy from clustered specimen samples.

A semiconductor device used for fluorescent-based molecule detection and a method for manufacturing the same are provided. The semiconductor device has a fluid channel layer defining a fluid channel through which a sample stream flows. A target cell coupled with a fluorescent source is contained by the sample stream. The semiconductor device also has an excitation light source for generating excitation light that reaches the target cell coupled with the fluorescent source to generate fluorescent light. The semiconductor device also has a light filter layer for permitting the fluorescent light to pass through and to block the excitation light and a light detection layer for detecting the fluorescent light. The functional components of the device are highly integrated. Leakage of the excitation light and background noise into the light detection component can be minimized to improve the quality of detection.

The present invention provides methods of determining cell sensitivity to a therapeutic agent.

The present invention relates to a novel method for detecting a detection object in a sample, and a detection device using the same. The detecting method of the present invention uses a “bridge composite” in which gold nanoparticles and an antibody specific to a detection object are coupled in order to induce a sufficient coupling reaction between the antibody and the detection object, thereby improving reactivity. Accordingly, since excellent resolution is provided, the method of the present invention has advantages of enabling accurate concentration measurement of a detection object in a sample, and amplifying a measurement signal. In addition, the method of the present invention can effectively detect small molecules such as hormones, vitamins, etc. having a small molecular weight.

A sensing sensor includes a wiring board, a piezoelectric resonator, a channel forming member, a case body, and a regulating portion. The case body houses the wiring board, the piezoelectric resonator, and the channel forming member. The case body includes a window faced to a region including the output terminal on the another surface side of the wiring board and an injection port supplying a supply liquid to the one end side of the channel. The regulating portion is disposed in the case body. The regulating portion regulates the wiring board from the one surface side when the wiring board is pressed from the another surface side. The piezoelectric resonator is pressed against the surrounding portion by the output terminal being pressed from the another surface side.

Viruses and other bioagents are of high medical and biodefense concern and their detection at concentrations well below the threshold necessary to cause health hazards continues to be a challenge with respect to sensitivity, specificity, and selectivity. Ideally, assays for accurate and real time detection of viral agents and other bioagents would not necessitate any pre-processing of the analyte, which would make them applicable for example to bodily fluids (blood, sputum) and man-made as well as naturally occurring bodies of water (pools, rivers). We describe herein a robust biosensor that combines the sensitivity of surface acoustic waves (SAW) generated at a frequency of 325 MHz with the specificity provided by antibodies and other ligands for the detection of viral agents. In preferred embodiments, a lithium tantalate based SAW transducer with silicon dioxide waveguide sensor platform featuring three test and one reference delay lines was used to adsorb antibodies directed against Coxsackie virus B4 or the negative-stranded category A bioagent Sin Nombre virus (SNV), a member of the genus Hantavirus, family Bunyaviridae, negative-stranded RNA viruses. Rapid detection (within seconds) of increasing concentrations of viral particles was linear over a range of order of magnitude for both viruses, although the sensor was approximately 50×104-fold more sensitive for the detection of SNV. For both pathogens, the sensor's selectivity for its target was not compromised by the presence of confounding Herpes Simplex virus type 1. The biosensor was able to detect SNV at doses lower than the load of virus typically found in a human patient suffering from hantavirus cardiopulmonary syndrome (HCPS). Further, in a proof-of-principle real world application, the SAW biosensor was capable of selectively detecting SNV agents in complex solutions, such as naturally occurring bodies of water (river, sewage effluent) without analyte pre-processing.

The present invention provides assays for detecting and measuring the presence or level of anti-TNFα drug therapeutics and autoantibodies in a sample. The present invention is useful for optimizing therapy and monitoring patients receiving anti-TNFα drug therapeutics to detect the presence or level of autoantibodies (e.g., HACA and/or HAHA) against the drug.

An antigenic characterization method using polyclonal antibody-based proximity ligation assays (polyPLA). Methods, kits, and other tools disclosed herein are useful in detecting microbial antigenic variants in samples, including clinical samples. The methods and kits have great utility in detecting antigenic variants for pathogenic microbes, including viruses, bacteria, and parasites.

The diagnosis of male infertility is based predominantly on the results of standard semen analysis for concentration, total motility, progressive motility, volume, pH, viscosity and/or morphology. When sperm enter the female reproductive tract, they must undergo a series of physiological changes, known as capacitation, in order to fertilize an egg. This process involves plasma membrane changes that occur in response to stimuli within the female tract. These changes include removal of sterols and redistribution of the ganglioside GM1. Semen analysis identifies only half the cases of male infertility due to standard semen analysis providing little information on sperm functional competence. Previous data demonstrated that localization of the ganglioside, GM1, identifies sub-populations of sperm capable of undergoing the functional maturation process known as capacitation and tracks strongly with fertility.

In sporadic Alzheimer's disease, neurofibrillary lesion formation is preceded by extensive post-translational modification of the microtubule associated protein tau. Immunoassays have been developed recently that detect tau in biological specimens, thus providing a means for pre-mortem diagnosis of Alzheimer's disease, which has remained elusive. These assays have been improved by the analysis of relevant post-translational modifications, such as phosphorylation, however opportunity for improvement remains. The present invention addresses this issue by disclosing synthetic methylated peptides derived from the tau protein of paired helical filaments and non-diseased control brain. Alzheimer's disease specificity is provided by the presence or absence of methyl moieties on lysine residues and differences between mono-, di-, and tri-methylation. The methylated peptide is useful as an antigen and a binding partner for identifying compounds that interact with the peptide and the methylated tau protein, including antibodies that can distinguish non-diseased brain from that affected by Alzheimer's disease. The resulting antibodies are useful diagnostically and therapeutically. The compounds that specifically bind to methylated tau proteins are useful for eliminating abnormally methylated tau.

Provided are a detection agent for detecting hydroxy vitamin D, preparation method thereof, and use thereof in 25-hydroxy vitamin D immunological detection. The detection agent comprises a conjugate formed by a 25-hydroxy vitamin D antigen derivative and protein carrier, and magnetic spheres coated by the conjugate. Also provided is a 25-hydroxy vitamin D detection kit comprising the detection agent.

The owners of Oakland's Homestead Restaurant have just debuted a new business concept that is meant to outlast the Covid-19 crisis.

Currently operating at the restaurant's 4029 Piedmont Ave. space Tuesdays through Saturdays from 10 a.m. to 6 p.m. via curbside pickup and Caviar or Doordash delivery, The Humble Sandwich comprises a selection of classic deli sandos made with the same high-quality ingredients for which the seven-year-old restaurant is revered.…

The owners of Oakland's Homestead Restaurant have debuted a new concept meant to outlast the COVID-19 crisis.

Celebrated chef-restaurateur Kyle Itani, who helms both Itani Ramen and Hopscotch Restaurant & Bar in Uptown Oakland, has just launched a brand-new project: a takeout sushi spot.

Operating out of Itani Ramen and serving its fare via pickup and delivery, Nikkei Sushi will be open Wednesday through Sunday, 2 p.m. - 8 p.m. during its soft opening with hours extending in the future.…

Uptown Oakland's alaMar Kitchen & Bar will celebrate its sixth anniversary this Friday, May 1, with a contactless, social-distancing, Covid-19-crisis parade.

"In celebration of this milestone, we are asking all of our fans and supporters to parade in the safety of their cars," management announced in a press release today.…

California today announced its intent to declare bisphenol A a reproductive hazard. Under a state law known as Prop 65, warning signs would be required for consumer items that contain a certain high level of BPA.…

If you happen to run into any medical residents anytime soon, they may look a little fatigued and broke, especially if they happen to be residents or pediatricians of UCSF Benioff Children’s Hospital of Oakland. Today, the CIR/SEIU Healthcare union that represents resident physicians and pediatricians said it plans to rally in front of the hospital on Friday at 12:15 p.m. along with nurses and community leaders to demand better wagers and working conditions.…

An electric circuit device connecting first and second external elements, the electric circuit device including: a first electronic component; a first bus bar electrically connected to the first electronic component; a second bus bar electrically connected to the electronic component and overlapped with the first bus bar in a direction perpendicular to main surfaces of the first and second bus bars; a first external terminal electrically connecting the first bus bar to the first external element; a second external terminal electrically connecting the second bus bar to the second external element; a first region in the first external terminal electrically coupled to the first external element; and a second region in the second external terminal electrically coupled to the second external element, and at least partially overlapped with the first region in the direction.

The invention relates to a device for thermally disconnecting or tripping an overvoltage protection device, comprising: a locking element (A1), on which a first force (F1) acts, and which is fixed in such a way that same is released when a limit temperature is exceeded; and a slider (S1) which is blocked in a first state (Z1) by the fixed locking element (A1), and on which a second force (F2) acts in order to transfer same into a second state (Z2) when the locking element (A1) is released.

Embodiments are generally directed to cooling of electronics using folded foil microchannels. An embodiment of an apparatus includes a semiconductor die; a substrate, the semiconductor die being coupled with the substrate; and a cooling apparatus for the semiconductor die, wherein the cooling apparatus includes a folded foil preform, the folded foil forming a plurality of microchannels, and a fluid coolant system to direct a fluid coolant through the microchannels of the folded foil.

A wiring device includes a housing that encloses a line voltage port and a low-voltage port for providing power to at least one removable load. The removable load can couple to a connector PCB. The connector PCB may include a tongue portion with retention surface features and a body portion with supporting circuitry. The tongue portion may be disposed within a low-voltage port of the wiring device. A plurality of conductive traces may extend from the body to the tongue of the connector PCB. The low voltage port may include sidewalls disposed around the tongue portion to guide the plug of a removable load into engagement with the conductive traces of the tongue portion so that one or more of the plurality of conductive traces electrically contact the removable load to deliver power to the removable load.

The present disclosure provides a method and a system for protecting an electrical device. The method includes: acquiring coordinate data of the electronic device; determining whether the coordinate data exceeds a data range corresponding to a preset state of the electronic device; and disabling the electronic device when the coordinate data exceeds the data range corresponding to the preset state.

A surge suppression device includes a micro electromechanical system (MEMS) switch electrically connected to a current path. Additionally, the surge suppression device includes a transient voltage suppression (TVS) device electrically connected in series to the MEMS switch. The surge suppression device is configured to protect electronic components from voltage surges or current surges.

An overvoltage protection device includes a resistor that is connected in series between an internal signal line connected to a communication terminal of a processor and a communication line, a diode of which a cathode is connected to the internal signal line and an anode is connected to a ground, and a PNP transistor of which a base is connected to a power supply terminal, an emitter is connected to the internal signal line, and a collector is connected to the ground. When a base-emitter voltage (a junction saturation voltage) of the transistor in operation is defined as VBE and a power source is turned on (a voltage V1) by the operation of the transistor, a voltage of the internal signal line is limited to the source voltage V1+VBE. When the power source is turned off (a voltage 0 V), the voltage of the internal signal line is limited to the source voltage 0 V+VBE.

The present invention provides a chip and an electronic device. The chip comprises at least one pin, and the chip comprises at least one ESD (Electrostatic Discharge) protection circuit inside, and the ESD protection circuit is employed to reduce or eliminate a damage of electrostatic to other elements or circuit inside the chip, and the ESD protection circuit is located corresponding to a pin, and the ESD protection circuit is electrically coupled to the pin. The electronic device comprises the aforesaid chip.

An electrical energy receiving end capable of overvoltage protection and a wireless electrical energy transmission device are provided. An electrical energy receiving coil is divided into a first receiving coil and a second receiving coil, so that under normal operation the first receiving coil and the second receiving coil jointly resonate with an impedance matching network to receive energy. When the electrical energy receiving end has an overvoltage, the first receiving coil and the impedance matching network (or the second receiving coil and the impedance matching network) form a loop, and due to the impedance mismatch, the energy received by the electrical energy receiving end is greatly reduced to solve the problem of overvoltage at the electrical energy receiving end.

Electronic device heat transfer technology is disclosed. In an example, an electronic device package can include a substrate. The electronic device package can also include a heat transfer component. The electronic device package can further include a heat-generating electronic component coupled to the substrate between the substrate and the heat transfer component. The electronic device package can also include a viscous thermal interface material (TIM) providing a heat transfer pathway between the electronic component and the heat transfer component. In addition, the electronic device package can include a barrier about at least a portion of a periphery of the viscous TIM to maintain the viscous TIM within a confined location in proximity to the electronic component. The TIM is uninterrupted by the barrier within the periphery.

In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing a magnetic particle embedded flexible substrate, a printed flexible substrate for a magnetic tray, or an electro-magnetic carrier for magnetized or ferromagnetic flexible substrates. For instance, in accordance with one embodiment, there are means disclosed for fabricating a flexible substrate having one or more electrical interconnects to couple with leads of an electrical device; integrating magnetic particles or ferromagnetic particles into the flexible substrate; supporting the flexible substrate with a carrier plate during one or more manufacturing processes for the flexible substrate, in which the flexible substrate is held flat against the carrier plate by an attractive magnetic force between the magnetic particles or ferromagnetic particles integrated with the flexible substrate and a complementary magnetic attraction of the carrier plate; and removing the flexible substrate from the carrier plate subsequent to completion of the one or more manufacturing processes for the flexible substrate. Other related embodiments are disclosed.

A package includes a conductive pad, with a plurality of openings penetrating through the conductive pad. A dielectric layer encircles the conductive pad. The dielectric layer has portions filling the plurality of openings. An Under-Bump Metallurgy (UBM) includes a via portion extending into the dielectric layer to contact the conductive pad. A solder region is overlying and contacting the UBM. An integrated passive device is bonded to the UBM through the solder region.

A circuit board upon which to mount an integrated circuit chip may include a first interconnect zone on the surface of the circuit board having first contacts with a first pitch, and a second interconnect zone, surrounding the first zone, having second contacts or traces with a second pitch that is smaller than the first pitch. The first contacts may have a design rule (DR) for direct chip attachment (DCA) to an integrated circuit chip. The first contacts may be formed by bonding a sacrificial substrate having the first contacts to a surface of the board; or by laser scribing trenches where the conductor will be plated to create the first contacts. Such a board allows DCA of smaller footprint processor chips for devices, such as tablet computers, cell phones, smart phones, and value phone devices.

A flexible printed circuit board including an annular main board and a plurality of branches connected with the annular main board is provided. Each of the branches includes an extension portion connected with the annular main board and a bonding portion, and an electronic component is adapted to be disposed on the bonding portion. A supporting holder including an annular base, two wing structures, and a plurality of mounting portions is also disclosed, wherein the wing structures extend outward from the annular base and the mounting portions are located on the annular base and the wing structures. Further, a controller including the flexible printed circuit board and the supporting holder aforementioned is disclosed, wherein the annular main board is disposed on the annular base and the branches are disposed on the annular base and the wing structures, such that the bonding portions are located on the mounting portions correspondingly.

A flexible substrate and a flexible display device including the same are disclosed. In one aspect, the flexible substrate includes a first substrate that is flexible and a metal wiring layer over the first substrate and having a first surface facing the first substrate, a second surface opposite to the first surface, and a plurality of holes penetrating the first and second surfaces. The holes are arranged in a plurality of rows. The holes comprise a first hole in an n-th row and a first hole in a (n-1)th row. The first hole of the n-th row is spaced apart from the first hole in the (n-1)th row by a first distance, and an edge of each of the holes is curved.

Provided herein is a resin fluxed solder paste that exhibits a desirable solder bump reinforcement effect without requiring an underfill process. The disclosure also provides a mount structure. The resin fluxed solder paste includes a non-resinic powder containing a solder powder and an inorganic powder; and a flux containing a first epoxy resin, a curing agent, and an organic acid. The non-resinic powder accounts for 30 to 90 wt % of the total, and the surface of the inorganic powder is covered with an organic resin.

A display device is disclosed. A back cover supports a back surface of a display panel. A bending member is bent at a predetermined curvature and attached to the back surface of the back cover. A curvature-changing unit is coupled to the back surface of the back cover to rotate the bending member and change the curvature of either the display panel or the back cover.

One embodiment provides a deformable housing, including a recess for holding a deformable device; a deformable portion comprising at least two surfaces having a plurality of concave/convex structures; and at least two support parts embedded in the deformable portion. Other aspects are described and claimed.

An automation field device having a housing and a modular field device electronics unit located inside the housing. The electronics unit has a first circuit board having at least one first and one second plug-in connector element, wherein the first plug-in connector element is used to electrically connect a peripheral unit, wherein both the first and the second plug-in connector elements can be contacted essentially from the same preferred plug-in direction, and a second circuit board having at least one third plug-in connector element, wherein the circuit boards are arranged such that the second plug-in connector element is connected to the third plug-in connector element in a detachable manner to electrically connect the peripheral unit to the second circuit board, and the second circuit board has at least one opening, via which the first plug-in connector element of the first circuit board is accessible for connecting the peripheral unit.

According to one embodiment, a storage device includes an enclosure, and a circuit board assembly in the enclosure. The circuit board assembly includes a first circuit board, a second circuit board opposed to the first circuit board, a third circuit board opposed to the second circuit board, a first connector connecting the first and second circuit boards to each other, a second connector connecting the second and third circuit boards to each other, and is offset to the first connector in a plane direction, a first spacer between the first and second circuit boards, and a second spacer between the second and third circuit boards. The first spacer includes a support body at a position opposed to the second connector and in contact with the first and second circuit boards.

An apparatus to support a flexible screen of an electronic device includes a plurality of shafts, a plurality of rows of first connecting members, and a plurality of rows of second connecting members. Each first and second connecting member has a top side, a bottom side, a left aperture and a right aperture extending from the top side to the bottom side, with each aperture coupled to a shaft. The width of the apertures for each second connecting member is greater than the width of the apertures for each first connecting member. The plurality of shafts are connected to each other by alternate rows of first connecting members and second connecting members along the length of the shafts. Each connecting member in a row of connecting members overlaps with two connecting members in an adjacent row of connecting members.