As per the reports, the companies with a presence in China are back in business with easing of restrictions, while India extended its lockdown further till 3rd May.  How Are Things In China? The trade association Nasscom has said member companies across the sector are operating with almost 80% attendance. Basically, the lockdown in China […]

The post Indian IT Firms Doing Chinese Operations Is Working With 80% Capacity! Chinese Economy Back On Track? first appeared on Trak.in . Trak.in Mobile Apps: Android | iOS.

Jordan Love has come a long way from the 5-foot-6, 130-pound kid who almost gave up football.

PCI-SIG DevCon 2019 APAC tour has come to Tokyo and Taipei this year. The focus is predominantly around the latest updates for PCIe Gen 5 which its version 1.0 specification was just released this year in May.  A series of presentations provided by PCI-SIG on the day 1 with comprehensive information covering all aspects of Gen 5 specification, including protocol, logical, electrical, compliance updates. On the day 2 (only in Taipei), several member companies shared their view on Testing, PCB analysis and Signal integrity. The exhibit is also another spotlight of this event where the member companies showcased their latest PCIe solutions.

Presentation Track (Taipei), Exhibit (Tokyo), Exhibit (Taipei) 

Cadence, as the market leading PCIe IP vendor, participated APAC tour this year with bringing in its latest PCIe IP solution offering (Gen 5/4) to the region as well as showcasing two live demo setups in the exhibit floor. One setup is the PCIe software development kit (SDK) while the other is the Interop/compliance/debug platform. Both come with the Cadence PCIe Gen 4 hardware setup and its corresponding software kit.

The SDK can be used for Device Driver Development, Firmware Development, and for pre-silicon emulation as well. It supports Xtensa and ARM processor with Linux OS and it also equip with Ethernet interface which can be used for remote debugging. It also supports PCIe stress tests for Speed change, link enable/disable, entry/exist for lower power states, …etc. 

Cadence PCIe 4.0 Software Development Kit

The “System Interop/Compliance/Debug platform” was set up to test with multiple endpoint and System platforms. This system come with integrated Cadence software for basic system debug without the need for analyzer to perform the analysis, such as LTSSM History, TS1/TS2 transmitted/received with time stamp, Link training phases, Capturing Packet errors details, Capturing PHY TX/RX internal state machine details, ...etc.

Cadence PCIe System Interop/Compliance/Debug Platform

The year 2019 is certainly a "fruitful year" for the PCIe as more Gen 4 products are now available in the market, Gen 5 v1.0 specification got officially ratified, and PCI-SIG's revealing of Gen 6 specification development. We were glad to be part of this APAC tour with the chance to further introduce Cadence’s complete and comprehensive PCIe IP solution.

See you all next year in APAC again!

More Information

For more information on Cadence's PCIe IP offerings, see our PCI Express page.

For more information on PCIe in general, and on the various PCI standards, see the PCI-SIG website.

Related Posts

• Blog: Did You “Stress Test” Yet? Essential Step to Ensure a Quality PCIe 4.0 Product
• Blog: PCIe Gen4: It’s Official, We’re Compliant
• Blog: PCIe 3.0 Still Shines While PCIe Keeps Evolving
• Blog: The PCIe 4.0 Era Continues at PCI-SIG Developers Conference 2016

Hi,

Is it possible to use a SystemVerilog package which is compiled into a library and then use it in a VHDL-2008 design file? Is such mixed-language flow supported?

I'm considering the latest versions of Incisive / Xcelium available today (Oct 2019).

Thank you,

Michal

Hi all,

I have a question regarding the manufacture : how to check a cluster of same net vias spacing, with have no shape or cline covered

Those who work in the IC Packaging design space have some unique challenges. We bridge between the IC design world (90/45-degree traces with rectangular and octagonal pins) and the PCB domain...

[[ Click on the title to access the full blog on the Cadence Community site. ]]

We have talked about aspects of the in-design symbol edit application mode in the past. This is the environment specific to the Allegro® Package Designer Plus layout tools allowing you to work...

[[ Click on the title to access the full blog on the Cadence Community site. ]]

In my previous blog, I talked about creating a footprint using an existing template in Allegro ECAD-MCAD Library Creator and explained how easily you can access an existing template and create a package from it by just clicking a button. In this blog...(read more)

I am trying to understand why axlDBTextBlockCompact(nil) on my test case says it can compact the text blocks down to 38, whereas I find only a total of 26 unique text block references in axlDBGetDesign()->text, axlDBGetDesign()->symbols and axlDBGetDesign()->symdefs. Where else are text blocks used besides these three?

Other tools allow a sanity check of placement density vs available board space.  There is an older post "Skill code to evaluate all components area (Accumulative Place bound area)"  (9 years ago) that has a couple of examples that no longer work or expired.

This would be useful to provide feedback to schismatic and project managers regarding the component density on the PCB and how it will affect the routing abilities.  Thermal considerations can be evaluated as well 

Has anyone attempted this or still being done externally in spread sheets?

Hello!

I have input signal like this  ->  input  wire [ADM_NUM-1:0][1:0] m_axi_ddr_rresp.

When i want to analyze coverage from IMC  this signal not covered!

Can i collect coverage for this signal?

They say Moore's law is slowing. It may be slowing but it is still running - it has not stopped! And, it has been running at full throttle for quite a few decades now.  The net result of this run? Well, you can't design ICs in isolation from the...(read more)

I’m not talking about carnival funhouse mirrors, but rather the different options for mirroring symbols, vias, and bond fingers in your IC Package layout. The Allegro Package Designer Plus and SiP Layout tools have two distinct styles of m...(read more)

  A few weeks ago, we talked about template text labels for design-specific information. There, we were focused on labels that are specific to the design as a whole: revision information, dates, authors, etc. Today, we’re looking at a diff...(read more)

We’ve all seen bar codes and the more modern QR codes. They’re everywhere you go – items at the grocery store, advertisements and posters, even on websites. Did you know that, with the productivity toolbox in Allegro Package Designe...(read more)

No, this isn’t a Hollywood movie. We’re talking about pieces of plane shapes with no connections to them, not an idyllic private oasis in the Caribbean (sorry). Removing shape islands is something you’ve always been able to do in th...(read more)

If you design wire bond packages, you’re familiar with the need for the bond fingers and rings on the package substrate layers to be exposed through the solder mask layer. If they aren’t, it becomes… rather difficult… to bon...(read more)

In the Allegro back-end layout products like Allegro Package Designer Plus, it would be reasonable to assume that the most often used command is none other than “show element” (shortcut key F4). This command, runnable at nearly any t...(read more)

Molding caps aren’t something we talk about too frequently around here. We all know they exist, and they serve an important purpose of protecting the delicate die from potentially harsh environmental conditions. They impact how well heat can be...(read more)

Those who work in the IC Packaging design space have some unique challenges. We bridge between the IC design world (90/45-degree traces with rectangular and octagonal pins) and the PCB domain (any-angle routing, filled planes, and a multitude of pad ...(read more)

We have talked about aspects of the in-design symbol edit application mode in the past. This is the environment specific to the Allegro Package Designer layout tools allowing you to work on symbol definitions directly in the context of your layout de...(read more)

I've redesigned a custom TO220FLAT Package

First I created a TO220shape.ssm  with PCB Editor. Then I created a surface mount T220build.pad in Padstack Editor using TO220shape.ssm. Then I created a TO220FLAT.psm in PCB Editor. I placed 3 Connect pins and 9 Mechanical pins for the TO220 TAB, using standard through-hole pads for better current handling.

Adding those Mechanical pins created many DRC errors caused by the proximity of those pads attached to the TO220shape.

Thru Pin to SMD Pin Spacing (-200.0 0.0) 5 MIL OVERLAP DEFAULT NET SPACING CONSTRAINTS Mechanical Pin "Pad50sq30d" Pin "T220build, 2"

I corrected the situation (so I though) by Waiving those DRC errors, thinking that they could not cause any problem and because that’s what I want, i.e.: 9 through-holes under the TO220 device. The idea being that when this device is mounted flat on the PCB it could carry lots of current via 9 pads that could make a good high current conductor to inner layers.

I then saved the Package and updated all related footprint schematic parts  in Capture. Created a new Netlist. Then I imported the new logic into PCB Editor to reflect that change. When the File > Import > Logic is finished I get no feedback error! (which, for me is a substantial achievement in itself)

Now, in the Design Window I see all those DRC errors popping up again, despite the fact that I waived those DRCs back in the Padstack edition. If I run a Design Rule Check (DRC) Report I will see all those DRC listed again. Now, I understand that I can go ahead and waive all those DRCs (100 in total) but I’m thinking there is got to be a better way of doing this.

Please, any advise is welcome. Thanks

Attached is the latest revision of the venerable Specman-Matlab package (Lead Application Engineer Jangook Lee is the latest to have refreshed it for a customer in Asia to support 64 bit mode.  Look for a guest blog post from him on this package shortly.)

There is a README file inside the package that gives a detailed overview, shows how to run a demo and/or validate it’s installed correctly, and explains the general test flow.  The test file included in the package called "test_get_cmp_mdim.e" shows all the capabilities of the package, including:

* Using Specman to initialize and tear down the Matlab engine in batch mode

* Issuing Matlab commands from e-code, using the Specman command prompt to load .m files, initializing variables, and other operational tasks.

* Transfering data to and from the Matlab engine to Specman / an e language test bench

* Comparing data of previously retrieved Matlab arrays

* Accessing Matlab arrays from e-code without converting them to e list data structure

* Convert Matlab arrays into e-lists

Happy coding!

Team Specman

Hello,

I am trying to import (in spectre) an spice model of a ceramic capacitor manufactured by Samsung EM. The link that includes the model is here :-

http://weblib.samsungsem.com/mlcc/mlcc-ec.do?partNumber=CL05A156MR6NWR

They proved static spice model and interactive spice model.

I had no problem while including the static model.

However, the interactive model which models voltage and temperature coefficients seems to not be an ordinary spice model. They provide HSPICE, LTSPICE, and PSPICE model files and I failed to include any of them.

Any suggestions ?

Hello,

I am using Virtuoso 6.1.7.

I am performing the parasitic extraction of a MOM cap array of 32 caps. I use Quantus QRC and I enable field solver. I select “QRCFS” for field solver type and “High” for field solver accuracy. The unit MOM cap is horizontally and vertically symmetric. The array looks like the sketch below and there are no other structures except the unit caps:

Rationally speaking, the capacitance values of the unit caps should be symmetric with respect to a vertical symmetry axis that is between cap16 and cap17 (shown with dashed red line). For example,

the capacitance of cap1 should be equal to the capacitance of cap32

the capacitance of cap2 should be equal to the capacitance of cap31

etc. as there are no other structures around the caps that might create some asymmetry.

Nevertheless, what I observe is the following after the parasitic extraction:

As it can be seen, the result is not symmetric contrary to what is expected. I should also add that I do not observe this when I perform parasitic extraction with no filed solver.

Why do I get this result? Is it an artifact resulting from the field solver tool (my conclusion was yes but still it must be verified)? If not, how can something like this happen?

Many thanks in advance.

Best regards,

Can

ભારતનાં પૂર્વ ચીફ statistician પ્રણવ સેને કહ્યું કે, લૉકડાઉનનાં માત્ર બે જ સપ્તાહમાં આશરે પાંચ કરોડ લોકોએ પોતાની નોકરી ગુમાવી દીધી છે

Relianceની અન્ય સબ્સિડિયરી કંપનીઓના શૅરોમાં પણ જોરદાર તેજી જોવા મળી

This Metasploit module exploits a vulnerability that exists due to a lack of input validation when creating a user. Messages for a given user are stored in a directory partially defined by the username. By creating a user with a directory traversal payload as the username, commands can be written to a given directory. To use this module with the cron exploitation method, run the exploit using the given payload, host, and port. After running the exploit, the payload will be executed within 60 seconds. Due to differences in how cron may run in certain Linux operating systems such as Ubuntu, it may be preferable to set the target to Bash Completion as the cron method may not work. If the target is set to Bash completion, start a listener using the given payload, host, and port before running the exploit. After running the exploit, the payload will be executed when a user logs into the system. For this exploitation method, bash completion must be enabled to gain code execution. This exploitation method will leave an Apache James mail object artifact in the /etc/bash_completion.d directory and the malicious user account.

In the macOS kernel, the XNU function wait_for_namespace_event() in bsd/vfs/vfs_syscalls.c releases a file descriptor for use by userspace but may then subsequently destroy that file descriptor using fp_free(), which unconditionally frees the fileproc and fileglob. This opens up a race window during which the process could manipulate those objects while they're being freed. Exploitation requires root privileges.

Slackware Security Advisory - New wavpack packages are available for Slackware 14.0, 14.1, 14.2, and -current to fix security issues.