A metal material is provided with a bismuth coating which enables the subsequent coating to be accomplished at a high throwing power, and has excellent corrosion resistance, coating adhesion and is able to be produced with reduced damage to the environment. The metal material has a surface and a bismuth-containing layer deposited on at least a part of the surface of the metal material, wherein the percentage of bismuth atoms in the number of atoms in the surface layer of the metal material with a bismuth coating is at least 10%.

A well, in particular an open well (14) with an upper end having a vertical axis (101), for containing a liquid and particles contained within said liquid, characterized by comprising at least two manipulation electrodes (1, 2, 3, 31, 32, 36, 17, 40, 41) able to be powered by electrical voltages, in particular alternating electrical voltages, so as to manoeuvre particles within the well by means of the dielectrophoretic effect. A platform comprising a plurality of wells as described above and a method for using said well.

Disclosed are electrochemical cells and methods for producing a halide of a non-alkali metal and for electrorefining the halide. The systems typically involve an electrochemical cell having a cathode structure configured for dissolving a hydrogen halide that forms the halide into a molten salt of the halogen and an alkali metal. Typically a direct current voltage is applied across the cathode and an anode that is fabricated with the non-alkali metal such that the halide of the non-alkali metal is formed adjacent the anode. Electrorefining cells and methods involve applying a direct current voltage across the anode where the halide of the non-alkali metal is formed and the cathode where the non-alkali metal is electro-deposited. In a representative embodiment the halogen is chlorine, the alkali metal is lithium and the non-alkali metal is uranium.

A biological sample measuring device including a mounting portion to which a biological sample measuring sensor is mounted, a voltage application section that applies voltage to a counter electrode of the biological sample measuring sensor mounted to the mounting portion, amplifiers that are selectively connected to a working electrode of the biological sample measuring sensor, and a determination section that is connected to these amplifiers. The determination section has a threshold determination section that determines a voltage value obtained by voltage conversion of the current value of the working electrode, a same determination section that selectively connects the amplifiers to the working electrode depending on the determination of the threshold determination section, and identifies the sample deposited on the biological sample measuring sensor from the output of the selected amplifier, and an output section that outputs a measurement value corresponding to the identified sample.

An implement is disclosed for smoothing grounds that include at least a compact base having a top surface and a lesser compact footing on top of the base. The implement includes a frame having a front portion, a central portion, a rear portion, and a width. Wheels are mounted for rotation directly to the frame, and tools are carried by the frame for engagement with the ground. The tools include a specially shaped cleaving blade connected to the rear portion of the frame by a tool support, which securely connects the cleaving blade at predetermined heights. The blade has a front shaving edge and a rear compressing edge. The blade extends straight across the width of the frame so as to maximize the drag displaced on the frame during use of the blade. Arrangement of the wheels directly on the frame provides optimal stabilization of the frame during operation of the blade.

A system for determining a cut location at a work surface includes a position sensor and a controller. The controller stores a final design plane of the work surface and determines an actual profile of the work surface. A plurality of target profiles extending along a path are determined, each corresponding to a cut location. The target profiles are based at least in part upon the cut location, a loading profile, slot parameters, and the actual profile of the work surface. The controller is further configured to determine a lowest cost target profile and the lowest cost target profile defines an optimized cut location. A method is also provided.

A ripping mechanism for a vehicle has a support frame. A ripping member has an engagement head that is configured for plowing a groove in the ground. The ripping member is preferably positionable in a selected working position and working orientation by adjustment of the support frame. The ripping member is preferably movable relative to the support frame to cause reciprocating movement of the engagement head at least partially longitudinally. A tilt adjustment cylinder is preferably operable to orient the ripping member in the selected orientation. A vibrator mechanism is preferably operatively connected to the ripping member and activatable to cause reciprocating movement of the engagement head at least partially longitudinally.

In one embodiment, a turf aerator includes a frame having wheels, a variable displacement pump, an engine for driving at least one of the wheels and driving the pump, a tine assembly supported by the frame and being movable between lowered and raised configurations, and a swash-plate-adjustment linkage extending from the tine assembly to the pump. The tine assembly includes: a base; a hydraulic motor in hydraulic communication with the pump; rotatable cranks powered by the hydraulic motor; a downwardly-extending arm rotatably coupled to each crank; a tine extending downwardly from each downwardly-extending arm; springs operatively anchored to the base; and a guide arm extending between each downwardly-extending arm and a respective spring. The swash-plate-adjustment linkage automatically adjusts the pump with movement of the tine assembly relative to the frame to provide output to the hydraulic motor substantially only when the tine assembly is at the lowered configuration.

A towable soil pulverizer having a center section and foldable wings mounted by hinges on opposite sides of the center section to fold upwardly or downwardly about substantially longitudinal hinge axes. Each hinge has a spaced ball joint and guide roller in roller slot. A wing float axis for each wing extends substantially perpendicular to the longitudinal hinge axis in a transverse direction, each wing also being pivotal about the float axis. The hinge design with the float axis prevents weight transfer between the center section and wing sections when the pulverizer operates over uneven soil, providing uniform soil conditioning over the width of the pulverizer. The center section rollers are positioned ahead of, behind, or co-linear with the wing rollers. Lockout kits are provided for mounting in the roller guide slots for restricting motion.

A method to collect soil cores from a green comprises the steps of providing a soil core collector, extracting soil cores from a green, allowing the cores to dry for at least fifteen minutes, and utilizing the core collector to gather the cores from the green.

A mount assembly is provided that allows for interconnecting an implement (e.g., snow plow, rotary brush etc.) to the front end of a vehicle while permitting that implement to move laterally relative to the front end of the vehicle.

A machine includes a plurality of ground engaging elements and an operator control station supported on a frame. A work tool is pivotably attached to the frame using a lift arm assembly and a tilt linkage. At least one device measures a quantity associated with at least one of the lift arm assembly, the tilt linkage, and the work tool. An electronic controller, in communication with an operator display and the at least one device. The electronic controller is configured to store an operator selected orientation of the work tool, calculate a current orientation of the work tool based on the quantity, and calculate a deviation of the current orientation from the operator selected orientation. A visual representation of the deviation is displayed on the operator display.

Some embodiments of a ground surface treatment system can include a flexible roller system having one or more of rollers arranged in a side-by-side position and include a flexible axle member extending through each row of rollers.

An agricultural system includes an agricultural row unit movable on a field between a first soil condition and a second soil condition, the first soil condition having a different soil hardness than the second soil condition. A down-pressure actuator applies an initial first pressure associated with the first soil condition. A soil-hardness sensing device is positioned at a distance D forward of the row unit and outputs a soil-hardness change signal when detecting a change from the first soil condition to the second soil condition. At least one memory device stores instructions that, when executed by at least one processor, cause the down-pressure actuator to change, in response to receiving the soil-hardness change signal, the initial first pressure to a different second pressure when the row unit encounters the second soil condition.

The disclosure describes, in one aspect, a system and method for controlling a rotation angle of a blade of a motor grader having a front frame operatively coupled to a rear frame at a point defining an articulation angle between the front and rear frames. The control system includes at least one sensor operatively associated with the blade, at least one sensor operatively associated with a wheel, at least one sensor operatively associated with at least one of the front frame or the rear frame, and a controller operatively coupled to the at least one sensors. The controller is adapted to determine a current position of the blade, determine a wheel steering angle, determine an articulation angle, and control the rotation angle of the blade based in part on the wheel steering angle and the articulation angle.

A cleanup device having a first board having a first edge, a second board having a first edge, a first hinge attached to the first edge of the first board and the first edge of the second board, an aperture defined by a portion of the first edge of the first board and a portion of the first edge of the second board, a first plate slidably attached to the first board, wherein the first plate is movable from a first, open position where the aperture is open to a second, closed position where the first plate extends over at least a portion of the aperture, and wherein a top surface of the first board is movable towards a top surface of the second board to form a V-shaped surface for directing dirt or soil off of the first board and the second board.

A swing control apparatus and a swing control method for a construction machine are provided. The swing control apparatus includes a start position estimation unit, a stop target position calculation unit, and a swing motor position control unit. Even if an operator releases a lever or commands a stop at different times, an upper swing structure of the construction machine (for example, excavator) can be stopped within a predetermined range, and thus the inconvenience caused by an additional driving operation, which is required as the stop position differs according to the time point where the stop command starts, can be solved.

A turf cutter device, an infill extractor/collector device, and a turf wind-up device are used to facilitate the cost-effective removal of an infilled synthetic turf and the subsequent installation of a new turf at the same site, with minimal subsurface disruption. An infill extractor/collector device mounted on a motorized vehicle moves a relatively narrow strip of filled artificial turf from the surface, in front of the vehicle, and directs the strip to an infill removal station. The infill removal station inverts the strip and redirects the strip back toward the front of the vehicle, after agitating the strip to extract the infill. After redirecting the strip toward the front of the vehicle, the vehicle drives over the unfilled strip. Meanwhile, the extractor/collector device moves the extracted infill rearwardly to a bag located in a trailer. The turf cutter device is used prior to infill extraction, while the turf wind up device may be used before or after infill extraction, depending on whether infill extraction takes place at the field or at a remote site, respectively.

A system for determining a cut location at a work surface includes a position sensor and a controller. The controller stores a desired operating parameter and a final design plane of the work surface and determines an actual profile of the work surface. The controller determines a plurality of target profiles corresponding to different cut locations. The target profiles are based at least in part upon the cut location, a loading profile, slot parameters, and the actual profile of the work surface. The controller further determines an optimized target profile relative to the desired operating parameter and the optimized target profile defines an optimized cut location.

A brake control system and method for motor vehicles is provided with an electronic control unit, by which, when the motor vehicle is stationary, a parking brake function can be activated manually or automatically. Its deactivation occurs upon reaching a predefined release condition. In the presence of a release condition the brake pressure, which was built up for the parking brake function, is released in a time offset manner at least in relation to the axles of the vehicle by way of the control unit.

A linkage arrangement (10) is provided for moveably connecting an attachment (6) to a work machine (8). The linkage arrangement (10) includes linkage group (12) having an upper arm (14) with a machine pivot point (20) for connecting to the work machine (8) and an attachment pivot point (22) for connecting to the attachment (6). The linkage group (12) further has a lower arm (16) with a machine pivot point (24) for connecting to the work machine (8) and an attachment pivot point (26) for connecting to the attachment (6). An actuator (30) extends between the upper and lower arms (14, 16), whereby during normal operation an increase in the length of the actuator (30) results in the attachment (6) being lowered relative to the work machine (8).

According to embodiments of the invention, a TFT array substrate, a manufacturing method of the TFT array substrate and a display device are provided. The method comprises: depositing a metal film on a substrate, and forming a gate electrode and a gate line; forming a gate insulating layer and a passivation layer on the substrate; depositing a transparent conductive layer, a first source/drain metal layer and a first ohmic contact layer, and forming a drain electrode, a pixel electrode, a data line, and a first ohmic contact layer pattern provided on the drain electrode; and depositing a semiconductor layer, a second ohmic contact layer and a second source/drain metal layer, and forming a source electrode, a second ohmic contact layer pattern provided below the source electrode, and a semiconductor channel between the source electrode and the drain electrode.

An organic light emitting display device includes a light shield layer formed on a substrate and a buffer layer formed on an entire surface of the substrate, an oxide semiconductor layer and first electrode formed on the buffer layer, a gate insulation film and gate electrode formed on the oxide semiconductor layer while being deposited to expose both edges of the oxide semiconductor layer, an interlayer insulation film formed to expose both the exposed edges of the oxide semiconductor layer and the first electrode, source and drain electrodes connected with one edge and the other edge of the oxide semiconductor layer, respectively, and a protective film formed to cover the source and drain electrodes while exposing a region of the first electrode so as to define a luminescent region and a non-luminescent region.

A display device includes a pixel portion including a plurality of pixels each including a first transistor, a second transistor, and a light-emitting element, in which a gate of the first transistor is electrically connected to a scan line, one of a source and a drain of the first transistor is electrically connected to a signal line, and the other of them is electrically connected to a gate of the second transistor; one of a source and a drain of the second transistor is electrically connected to a power supply line and the other of them is electrically connected to the light-emitting element, and the first transistor includes an oxide semiconductor layer. A period when the display device displays a still image includes a period in which output of a signal to all the scan lines in the pixel portion is stopped.

An organic light emitting diode (OLED) display a includes: a substrate; an organic light emitting element on the substrate and including a first electrode, a light emission layer, and a second electrode; and an encapsulation layer on the substrate while covering the organic light emitting element. The encapsulation layer includes an organic layer and an inorganic layer. A mixed area, where organic materials forming the organic layer and inorganic materials forming the inorganic layer co-exist along a plane direction of the encapsulation layer, is formed at the boundary between the organic layer and the inorganic layer.

There is provided a substrate for light-emitting element, including a mounting surface on which a light-emitting element is to be mounted, the mounting surface being one of two opposed main surfaces of the substrate. The substrate of the present invention is provided with a protection element for the light-emitting element, the protection element comprising a voltage-dependent resistive layer embedded in a body of the substrate, and comprising a first electrode and a second electrode each of which is in connection with the voltage-dependent resistive layer wherein the light-emitting element is to be mounted such that it is positioned in an overlapping relation with the voltage-dependent resistive layer.

An object is to manufacture a semiconductor device with high reliability by providing the semiconductor device including an oxide semiconductor with stable electric characteristics. In a transistor including an oxide semiconductor layer, a gallium oxide film is used for a gate insulating layer and made in contact with an oxide semiconductor layer. Further, gallium oxide films are provided so as to sandwich the oxide semiconductor layer, whereby reliability is increased. Furthermore, the gate insulating layer may have a stacked structure of a gallium oxide film and a hafnium oxide film.

The band tail state and defects in the band gap are reduced as much as possible, whereby optical absorption of energy which is in the vicinity of the band gap or less than or equal to the band gap is reduced. In that case, not by merely optimizing conditions of manufacturing an oxide semiconductor film, but by making an oxide semiconductor to be a substantially intrinsic semiconductor or extremely close to an intrinsic semiconductor, defects on which irradiation light acts are reduced and the effect of light irradiation is reduced essentially. That is, even in the case where light with a wavelength of 350 nm is delivered at 1×1013 photons/cm2·sec, a channel region of a transistor is formed using an oxide semiconductor, in which the absolute value of the amount of the variation in the threshold voltage is less than or equal to 0.65 V.

A semiconductor device includes wiring layers formed over a semiconductor wafer, a via-layer between the wiring layers, conductive films in the wiring layers, and a via-plug in the via-layer connecting the conductive films of the wiring layers above and below, a scribe region at an outer periphery of a chip region along an edge of the semiconductor substrate and including a pad region in the vicinity of the edge, the pad region overlapping the conductive films of the plurality of wiring layers in the plan view, the plurality of wiring layers including first second wiring layers, the conductive film of the first wiring layer includes a first conductive pattern formed over an entire surface of said pad region in a plan view, and the conductive film of the second wiring layer includes a second conductive pattern formed in a part of the pad region in a plan view.

A light emitting device including a light emitting structure having a first conduction type semiconductor layer, an active layer, and a second conduction type semiconductor layer, a transparent conductive layer disposed on the light emitting structure, a metal filter having an irregular pattern disposed between the light emitting structure and the transparent conductive layer, and openings disposed between the irregular patterns in the metal filter.

A display device comprising TFT elements having satisfactory characteristics and being easy to assemble. In the display device, a pixel emitting red light comprises a red color filter. The red color filter forms a light shielding film for the TFT elements in a driver circuit portion or in a pixel portion.

A non-linear element (e.g., a diode) with small reverse saturation current is provided. A non-linear element includes a first electrode provided over a substrate, an oxide semiconductor film provided on and in contact with the first electrode, a second electrode provided on and in contact with the oxide semiconductor film, a gate insulating film covering the first electrode, the oxide semiconductor film, and the second electrode, and a third electrode provided in contact with the gate insulating film and adjacent to a side surface of the oxide semiconductor film with the gate insulating film interposed therebetween or a third electrode provided in contact with the gate insulating film and surrounding the second electrode. The third electrode is connected to the first electrode or the second electrode.

Provided are three-dimensional nonvolatile memory devices and methods of fabricating the same. The memory devices include semiconductor pillars penetrating interlayer insulating layers and conductive layers alternately stacked on a substrate and electrically connected to the substrate and floating gates selectively interposed between the semiconductor pillars and the conductive layers. The floating gates are formed in recesses in the conductive layers.

An electronic device includes a silicon carbide layer including an n-type drift region therein, a contact forming a junction, such as a Schottky junction, with the drift region, and a p-type junction barrier region on the silicon carbide layer. The p-type junction barrier region includes a p-type polysilicon region forming a P-N heterojunction with the drift region, and the p-type junction barrier region is electrically connected to the contact. Related methods are also disclosed.

An object is to provide a semiconductor device including an oxide semiconductor film, which has stable electrical characteristics and high reliability. A stack of first and second material films is formed by forming the first material film (a film having a hexagonal crystal structure) having a thickness of 1 nm to 10 nm over an insulating surface and forming the second material film having a hexagonal crystal structure (a crystalline oxide semiconductor film) using the first material film as a nucleus. As the first material film, a material film having a wurtzite crystal structure (e.g., gallium nitride or aluminum nitride) or a material film having a corundum crystal structure (α-Al2O3, α-Ga2O3, In2O3, Ti2O3, V2O3, Cr2O3, or α-Fe2O3) is used.

A semiconductor device, includes a semiconductor substrate, a first interconnect layer formed over the semiconductor substrate, a gate electrode formed in the first interconnect layer, a gate insulating film formed over the gate electrode, a second interconnect layer formed over the gate insulating film, an oxide semiconductor layer formed in the second interconnect layer, and a via formed in the second interconnect layer and connected to the oxide semiconductor layer. The gate electrode, the gate insulating film and the oxide semiconductor layer overlap in a plan view.

Semiconductor devices including a stressor in a recess and methods of forming the semiconductor devices are provided. The methods may include forming a trench in an active region and the trench may include a notched portion of the active region. The methods may also include forming an embedded stressor in the trench. The embedded stressor may include a lower semiconductor layer and an upper semiconductor layer, which has a width narrower than a width of the lower semiconductor layer. A side of the upper semiconductor layer may not be aligned with a side of the lower semiconductor layer and an uppermost surface of the upper semiconductor layer may be higher than an uppermost surface of the active region.

It is an object to manufacture a highly reliable semiconductor device including a thin film transistor whose electric characteristics are stable. An insulating layer which covers an oxide semiconductor layer of the thin film transistor contains a boron element or an aluminum element. The insulating layer containing a boron element or an aluminum element is formed by a sputtering method using a silicon target or a silicon oxide target containing a boron element or an aluminum element. Alternatively, an insulating layer containing an antimony (Sb) element or a phosphorus (P) element instead of a boron element covers the oxide semiconductor layer of the thin film transistor.

A semiconductor device which includes a thin film transistor having an oxide semiconductor layer and excellent electrical characteristics is provided. Further, a method for manufacturing a semiconductor device in which plural kinds of thin film transistors of different structures are formed over one substrate to form plural kinds of circuits and in which the number of steps is not greatly increased is provided. After a metal thin film is formed over an insulating surface, an oxide semiconductor layer is formed thereover. Then, oxidation treatment such as heat treatment is performed to oxidize the metal thin film partly or entirely. Further, structures of thin film transistors are different between a circuit in which emphasis is placed on the speed of operation, such as a logic circuit, and a matrix circuit.

A light-emitting element includes a first electrode, a first light-emitting layer formed over the first electrode, a second light-emitting layer formed on and in contact with the first light-emitting layer to be in contact therewith, and a second electrode formed over the second light-emitting layer. The first light-emitting layer includes a first light-emitting substance and a hole-transporting organic compound, and the second light-emitting layer includes a second light-emitting substance and an electron-transporting organic compound. Substances are selected such that a difference in LUMO levels between the first light-emitting substance, the second light-emitting substance, and the electron-transporting organic compound is 0.2 eV or less, a difference in HOMO levels between the hole-transporting organic compound, the first light-emitting substance, and the second light-emitting substance is 0.2 eV or less, and a difference in LUMO levels between the hole-transporting organic compound and the first light-emitting substance is greater than 0.3 eV.

A semiconductor film having an impurity region to which at least an n-type or p-type impurity is added and a wiring are provided. The wiring includes a diffusion prevention film containing a conductive metal oxide, and a low resistance conductive film over the diffusion prevention film. In a contact portion between the wiring and the semiconductor film, the diffusion prevention film and the impurity region are in contact with each other. The diffusion prevention film is framed in such a manner that a conductive film is exposed to plasma generated from a mixed gas of an oxidizing gas and a halogen-based gas to form an oxide of a metal material contained in the conductive film, the conductive film in which the oxide of the metal material is formed is exposed to an atmosphere containing water to be fluidized, and the fluidized conductive film is solidified.

To provide a semiconductor device which has transistor characteristics with little variation and includes an oxide semiconductor. The semiconductor device includes an insulating film over a conductive film and an oxide semiconductor film over the insulating film. The oxide semiconductor film includes a first oxide semiconductor layer, a second oxide semiconductor layer over the first oxide semiconductor layer, and a third oxide semiconductor layer over the second oxide semiconductor layer. The energy level of a bottom of a conduction band of the second oxide semiconductor layer is lower than those of the first and third oxide semiconductor layers. An end portion of the second oxide semiconductor layer is positioned on an inner side than an end portion of the first oxide semiconductor layer.

A low resistivity interface material is provided between a self-aligned vertical heater element and a contact region of a selection device. A phase change chalcogenide material is deposited directly on the vertical heater element. In an embodiment, the vertical heater element in L-shaped, having a curved vertical wall along the wordline direction and a horizontal base. In an embodiment, the low resistivity interface material is deposited into a trench with a negative profile using a PVD technique. An upper surface of the low resistivity interface material may have a tapered bird-beak extension.

An amorphous oxide thin film containing amorphous oxide is exposed to an oxygen plasma generated by exciting an oxygen-containing gas in high frequency. The oxygen plasma is preferably generated under the condition that applied frequency is 1 kHz or more and 300 MHz or less and pressure is 5 Pa or more. The amorphous oxide thin film is preferably exposed by a sputtering method, ion-plating method, vacuum deposition method, sol-gel method or fine particle application method.

An object is to manufacture and provide a highly reliable semiconductor device including a thin film transistor with stable electric characteristics. In a method for manufacturing a semiconductor device including a thin film transistor in which a semiconductor layer including a channel formation region serves as an oxide semiconductor film, heat treatment for reducing impurities such as moisture (heat treatment for dehydration or dehydrogenation) is performed after an oxide insulating film serving as a protective film is formed in contact with an oxide semiconductor layer. Then, the impurities such as moisture, which exist not only in a source electrode layer, in a drain electrode layer, in a gate insulating layer, and in the oxide semiconductor layer but also at interfaces between the oxide semiconductor film and upper and lower films which are in contact with the oxide semiconductor layer, are reduced.

A device for use in a vehicle steering system, said device comprising at least one actuator affixed to a wheel linkage of at least one wheel of said vehicle steering system. The actuator comprises a rotation assembly engagable with a first wheel linkage segment, an electric motor for actuating movement of the rotation assembly via a gear box and one or more sensors integrally contained in the actuator for sensing one or more parameters selected from the group consisting of force, speed, turns and rotation. Rotation of the rotation assembly actuates linear movement of said first wheel linkage segment into and out of said actuator to thereby adjust one or more wheel parameters of said at least one wheel, and wherein said one or more sensors provide real time data to an actuator control unit integral to said actuator to self-adjust rotational parameters of said rotation assembly.

A control arrangement for a hydropneumatic suspension system and a hydropneumatic suspension system are provided. The control arrangement has a pressure supply connection, a return connection, a piston chamber connection adapted to be connected to the piston chamber of a suspension cylinder of the hydropneumatic suspension system, an annular chamber connection adapted to be connected to the annular chamber of the suspension cylinder, and at least one controllable valve arrangement comprising a plurality of switch positions via which the pressure supply connection and the return connection are connectable to the piston chamber connection and the annular chamber connection. The annular chamber connection is in flow connection with the return connection via a pressure-limiting line having a hydraulically controllable pressure-limiting element. The pressure-limiting element has a control input adapted to be acted upon via a control line by a control pressure which is limitable to a predefinable pressure limit.

A ski system includes a ski, a heel binding provided on an upper surface of the ski, a toe binding mount provided on the upper surface of the ski forward of the heel binding, a toe binding releasably mounted to the toe binding mount, and a quick-release locking mechanism for locking the toe binding to the toe binding mount. The quick-release locking mechanism is configured for release by hand.

An airbag system for protecting rear seat occupants in dynamic side impacts using an improved packaging arrangement is provided. The system includes seat base and seat back frames. The seat back frame is movable between an upright position and a reclined position. The system further includes a unified airbag having a pelvic portion and a thoracic portion. The pelvic portion is positioned adjacent to the seat base frame. The thoracic portion is positioned adjacent to the seat back frame. The unified airbag is attached to the seat base frame by fixed anchors and to the seat back frame by a movable anchor. A grooved track is provided for attachment of the movable anchor. The airbag may be a strip shape or a triangular shape. One or more tethers may be attached to the unified airbag.

Interior panels having integrated airbag doors for motor vehicles and methods for making such interior panels are provided herein. In one example, an interior panel comprises a substrate having outer and inner surfaces and an opening extending therethrough. A multi-shot injection molded airbag chute-door assembly is mounted to the substrate and comprises a chute wall that at least partially surrounds an interior space. A door flap portion is pivotally connected to the chute wall and at least partially covers the opening. A perimeter flange extends from the chute wall and has a flange section that overlies the outer surface of the substrate. A molded-in lip feature extends from the flange section and contacts the outer surface to form a seal between the flange section and the substrate. A skin covering extends over the substrate and a foam is disposed between the skin covering and the substrate.