1 Malaysian Ringgit = 5.7989 Czech Republic Koruna

1 Malaysian Ringgit = 131.2717 Costa Rican Colon

1 Malaysian Ringgit = 899.0457 Colombian Peso

1 Malaysian Ringgit = 1.6322 Chinese Yuan Renminbi

1 Malaysian Ringgit = 190.5391 Chilean Peso

1 Malaysian Ringgit = 0.224 Swiss Franc

1 Malaysian Ringgit = 0.3234 Canadian Dollar

1 Malaysian Ringgit = 2.8021 Botswana Pula

1 Malaysian Ringgit = 1.3226 Brazilian Real

1 Malaysian Ringgit = 1.5911 Bolivian Boliviano

1 Malaysian Ringgit = 0.3261 Brunei Dollar

1 Malaysian Ringgit = 0.0873 Bahraini Dinar

1 Malaysian Ringgit = 0.4166 Bulgarian Lev

1 Malaysian Ringgit = 19.6109 Bangladeshi Taka

1 Malaysian Ringgit = 0.3531 Australian Dollar

1 Malaysian Ringgit = 15.3374 Argentine Peso

1 Malaysian Ringgit = 0.4142 Netherlands Antillean Guilder

1 Malaysian Ringgit = 0.8475 United Arab Emirates Dirham

1 Nicaraguan Cordoba Oro = 0.126 Malaysian Ringgit

1 Netherlands Antillean Guilder = 2.4142 Malaysian Ringgit

1 Estonian Kroon = 0.3039 Malaysian Ringgit

1 Danish Krone = 0.6299 Malaysian Ringgit

1 Fiji Dollar = 1.9236 Malaysian Ringgit

1 New Zealand Dollar = 2.6602 Malaysian Ringgit

1 Croatian Kuna = 0.6246 Malaysian Ringgit

1 Peruvian Nuevo Sol = 1.2751 Malaysian Ringgit

1 Dominican Peso = 0.0787 Malaysian Ringgit

1 Papua New Guinean Kina = 1.2634 Malaysian Ringgit

1 Brunei Dollar = 3.0667 Malaysian Ringgit

Today, we are living in the era where whatever we think of as an idea is not far from being implemented…thanks to machine learning (ML) and artificial intelligence (AI) entering into the...

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Everyone keeps talking about “the cloud” this and “the cloud” that these days—but you’re a semiconductor designer. Everyone keeps saying “the cloud” is revolutionizing all aspects of electronics design—but what does it mean for you? Cadence's own Tom Hackett discussed this in a presentation at the Cadence Theater during DAC 2019.

What people refer to as “the cloud” is commonly divided into three categories: Infrastructure as a Service (IaaS), Platform as a Service (PaaS), and software as a Service (SaaS). With IaaS, you bring your own software—i.e. loading your owned or appropriately licensed tools onto cloud hardware that you rent by the minute. This service is available from providers like Google Cloud Platform, Amazon Web Service, and Microsoft Azure. In PaaS (also available from the major cloud providers), you create your own offering using capabilities and a software design environment provided by the cloud vendor that makes subsequent scaling and distribution really easy because the service was “born in the cloud”.  Lastly, there’s SaaS, where the cloud is used to access and manage functionality and data without requiring users to set up or manage any of the underlying infrastructure used to provide it.  SaaS companies like Workday and Salesforce deliver their value in this manner.  The Cadence Cloud portfolio makes use of both IaaS and SaaS, depending on the customers’ interest.  Cadence doesn’t have PaaS offerings because our customers don’t create their own EDA software from building blocks that Cadence provides.

All of these designations are great, but you’re a semiconductor designer. Presumably you use Workday or some similar software, or have in the past when you were an intern, but what about all of your tools? Those aren’t on the cloud.

Wait—actually, they are.

Using EDA tools in the cloud allows you to address complexity and data explosion issues you would have to simply struggle through before. Since you don’t have to worry about having the compute-power on-site, you can use way more power than you could before. You may be wary about this new generation of cloud-based tools, but don’t worry: the old rules of cloud computing no longer apply. Cloud capacity is far larger than it used to be, and it’s more secure. Updates to scheduling software means that resource competition isn’t as big of a deal anymore. Clouds today have nearly unlimited capacity—they’re so large that you don’t ever need to worry about running out of space.

The vast increase in raw compute available to designers through the cloud makes something like automotive functional safety verification, previously an extremely long verification task, doable in a reasonable time frame. With the cloud, it’s easy to scale the amount of compute you’re using to fit your task—whether it’s an automotive functional safety-related design or a small one.

Nowadays, the Cadence Cloud Portfolio brings you the best and brightest in cloud technology. No matter what your use case is, the Cadence Cloud Portfolio has a solution that works for you. You can even access the Palladium Cloud, allowing you to try out the benefits of an accelerator without having to buy one.

Cloud computing is the future of EDA. See the future here.

Bumps are central to the Virtuoso MultiTech Framework solution. Bumps provide a connection between stacked ICs, interposers, packages, and boards. Bump locations, connectivity, and other attributes are the basis for creating TILPs, which we combine to create system-level layouts.(read more)

If you have one of those Die layouts, which doesn’t have bumps, but rather uses pad shapes and labels to identify I/O locations, then you might be feeling a bit left out of all of this jazz and tango. Hence, today, I am writing to tell you that, fear not, we have a solution for your Die as well.(read more)

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Medidata Accelerates Launch of myMedidata Platform, Responding to COVID-19