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Nicaraguan Cordoba Oro(NIO)/Brazilian Real(BRL)

1 Nicaraguan Cordoba Oro = 0.1666 Brazilian Real



  • Nicaraguan Cordoba Oro

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Nicaraguan Cordoba Oro(NIO)/Bolivian Boliviano(BOB)

1 Nicaraguan Cordoba Oro = 0.2004 Bolivian Boliviano



  • Nicaraguan Cordoba Oro

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Nicaraguan Cordoba Oro(NIO)/Brunei Dollar(BND)

1 Nicaraguan Cordoba Oro = 0.0411 Brunei Dollar



  • Nicaraguan Cordoba Oro

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Nicaraguan Cordoba Oro(NIO)/Bahraini Dinar(BHD)

1 Nicaraguan Cordoba Oro = 0.011 Bahraini Dinar



  • Nicaraguan Cordoba Oro

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Nicaraguan Cordoba Oro(NIO)/Bulgarian Lev(BGN)

1 Nicaraguan Cordoba Oro = 0.0525 Bulgarian Lev



  • Nicaraguan Cordoba Oro

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Nicaraguan Cordoba Oro(NIO)/Bangladeshi Taka(BDT)

1 Nicaraguan Cordoba Oro = 2.4705 Bangladeshi Taka



  • Nicaraguan Cordoba Oro

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Nicaraguan Cordoba Oro(NIO)/Australian Dollar(AUD)

1 Nicaraguan Cordoba Oro = 0.0445 Australian Dollar



  • Nicaraguan Cordoba Oro

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Nicaraguan Cordoba Oro(NIO)/Argentine Peso(ARS)

1 Nicaraguan Cordoba Oro = 1.9321 Argentine Peso



  • Nicaraguan Cordoba Oro

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Nicaraguan Cordoba Oro(NIO)/Netherlands Antillean Guilder(ANG)

1 Nicaraguan Cordoba Oro = 0.0522 Netherlands Antillean Guilder



  • Nicaraguan Cordoba Oro

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Nicaraguan Cordoba Oro(NIO)/United Arab Emirates Dirham(AED)

1 Nicaraguan Cordoba Oro = 0.1068 United Arab Emirates Dirham



  • Nicaraguan Cordoba Oro

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Jordan Love's transformation from 'Sticks' to Packers' future QB

Jordan Love has come a long way from the 5-foot-6, 130-pound kid who almost gave up football.




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Netherlands Antillean Guilder(ANG)/Nicaraguan Cordoba Oro(NIO)

1 Netherlands Antillean Guilder = 19.1643 Nicaraguan Cordoba Oro



  • Netherlands Antillean Guilder

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Netherlands Antillean Guilder(ANG)/Jordanian Dinar(JOD)

1 Netherlands Antillean Guilder = 0.3952 Jordanian Dinar



  • Netherlands Antillean Guilder

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Estonian Kroon(EEK)/Nicaraguan Cordoba Oro(NIO)

1 Estonian Kroon = 2.4122 Nicaraguan Cordoba Oro




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Estonian Kroon(EEK)/Jordanian Dinar(JOD)

1 Estonian Kroon = 0.0497 Jordanian Dinar




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Danish Krone(DKK)/Nicaraguan Cordoba Oro(NIO)

1 Danish Krone = 4.9999 Nicaraguan Cordoba Oro




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Danish Krone(DKK)/Jordanian Dinar(JOD)

1 Danish Krone = 0.1031 Jordanian Dinar




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Fiji Dollar(FJD)/Nicaraguan Cordoba Oro(NIO)

1 Fiji Dollar = 15.2699 Nicaraguan Cordoba Oro




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Fiji Dollar(FJD)/Jordanian Dinar(JOD)

1 Fiji Dollar = 0.3149 Jordanian Dinar




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New Zealand Dollar(NZD)/Nicaraguan Cordoba Oro(NIO)

1 New Zealand Dollar = 21.1169 Nicaraguan Cordoba Oro



  • New Zealand Dollar

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New Zealand Dollar(NZD)/Jordanian Dinar(JOD)

1 New Zealand Dollar = 0.4355 Jordanian Dinar



  • New Zealand Dollar

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Croatian Kuna(HRK)/Nicaraguan Cordoba Oro(NIO)

1 Croatian Kuna = 4.9583 Nicaraguan Cordoba Oro




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Croatian Kuna(HRK)/Jordanian Dinar(JOD)

1 Croatian Kuna = 0.1023 Jordanian Dinar




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Peruvian Nuevo Sol(PEN)/Nicaraguan Cordoba Oro(NIO)

1 Peruvian Nuevo Sol = 10.1216 Nicaraguan Cordoba Oro



  • Peruvian Nuevo Sol

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Peruvian Nuevo Sol(PEN)/Jordanian Dinar(JOD)

1 Peruvian Nuevo Sol = 0.2087 Jordanian Dinar



  • Peruvian Nuevo Sol

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[Softball] Three Haskell Softball Athletes Awarded A.I.I. Team Honors!




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[Volleyball] Two Volleyball Athletes Hold Records in Coffin




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[Women's Basketball] Two Women's Basketball Athletes Clench Records at Coffin Sports Compelx




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Dominican Peso(DOP)/Nicaraguan Cordoba Oro(NIO)

1 Dominican Peso = 0.6251 Nicaraguan Cordoba Oro




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Dominican Peso(DOP)/Jordanian Dinar(JOD)

1 Dominican Peso = 0.0129 Jordanian Dinar




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[Men's Outdoor Track & Field] Men's Track & Field Team Earn a Third Place Conference Finish

Thomas Zunie, a junior from Zuni, NM takes first in the Men's 5000 meter run in a time of 17:21.41.  Zunie's finish in the 5000 garnered him a First Team All-Conference.  Zunie also earned a third place in the 1500 meter run with a time of 4:33.77.   




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Papua New Guinean Kina(PGK)/Nicaraguan Cordoba Oro(NIO)

1 Papua New Guinean Kina = 10.0291 Nicaraguan Cordoba Oro



  • Papua New Guinean Kina

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Papua New Guinean Kina(PGK)/Jordanian Dinar(JOD)

1 Papua New Guinean Kina = 0.2068 Jordanian Dinar



  • Papua New Guinean Kina

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Brunei Dollar(BND)/Nicaraguan Cordoba Oro(NIO)

1 Brunei Dollar = 24.3435 Nicaraguan Cordoba Oro




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Brunei Dollar(BND)/Jordanian Dinar(JOD)

1 Brunei Dollar = 0.502 Jordanian Dinar




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[Men's Basketball] Saturday 1/11/20 Men's Basketball Game Postponed to 2/12/20




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[Men's Basketball] Men's Basketball Athletes Rack Up Records on Statistics Board In Coffin ...




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The Hard Edges of Modern Lives

This new film is the latest remake of Devdas, but what is equally interesting is the fact that it is in conversation with films made in the West. Unlike Bhansali’s more spectacular version of the older story, Anurag Kashyap’s Dev.D is a genuine rewriting of Sarat Chandra’s novel. Kashyap doesn’t flinch from depicting the individual’s downward spiral, but he also gives women their own strength. He has set out to right a wrong—or, at least, tell a more realistic, even redemptive, story. If these characters have lost some of the affective depth of the original creations, they have also gained the hard edges of modern lives.

We don’t always feel the pain of Kashyap’s characters, but we are able to more readily recognize them. Take Chandramukhi, or Chanda, who is a school-girl humiliated by the MMS sex-scandal. Her father, protective and patriarchal, says that he has seen the tape and thinks she knew what she was doing. “How could you watch it?” the girl asks angrily. And then, “Did you get off on it?” When was the last time a father was asked such a question on the Hindi screen? With its frankness toward sex and masturbation, Dev.D takes a huge step toward honesty. In fact, more than the obvious tributes to Danny Boyle’s Trainspotting, or the over-extended psychedelic adventure on screen, in fact, as much as the moody style of film-making, the candour of such questions make Dev.D a film that is truly a part of world cinema.

Rave Out © 2007 IndiaUncut.com. All rights reserved.
India Uncut * The IU Blog * Rave Out * Extrowords * Workoutable * Linkastic




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Extrowords #102: Generalissimo 73

Sample clues

5 across: The US president’s bird (3,5,3)

11 down: Group once known as the Quarrymen (7)

10 across: Cavalry sword (5)

19 across: Masonic ritual (5,6)

1 down: Pioneer of Ostpolitik (6)

Extrowords © 2007 IndiaUncut.com. All rights reserved.
India Uncut * The IU Blog * Rave Out * Extrowords * Workoutable * Linkastic




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Extrowords #103: Generalissimo 74

Sample clues

14 across: FDR’s baby (3,4)

1 down: A glitch in the Matrix? (4,2)

4 down: Slanted character (6)

5 down: New Year’s venue in New York (5,6)

16 down: Atmosphere of melancholy (5)

Extrowords © 2007 IndiaUncut.com. All rights reserved.
India Uncut * The IU Blog * Rave Out * Extrowords * Workoutable * Linkastic




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Extrowords #104: Generalissimo 74

Sample clues

6 across: Alejandro González Iñárritu’s breakthrough film (6,6)

19 across: Soft leather shoe (8)

7 down: Randroids, for example (12)

12 down: First American World Chess Champion (7)

17 down: Circle of influence (5)

Extrowords © 2007 IndiaUncut.com. All rights reserved.
India Uncut * The IU Blog * Rave Out * Extrowords * Workoutable * Linkastic




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Extrowords #105: Generalissimo 75

Sample clues

5 across: Robbie Robertson song about Richard Manuel (6,5)

2 down: F5 on a keyboard (7)

10 across: Lionel Richie hit (5)

3 down: ALTAIR, for example (5)

16 down: The problem with Florida 2000 (5)

Extrowords © 2007 IndiaUncut.com. All rights reserved.
India Uncut * The IU Blog * Rave Out * Extrowords * Workoutable * Linkastic




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Extrowords #106: Generalissimo 76

Sample clues

9 across: Van Morrison classic from Moondance (7)

6 down: Order beginning with ‘A’ (12)

6 across: Fatal weakness (8,4)

19 across: Rolling Stones classic (12)

4 down: Massacre tool (8)

Extrowords © 2007 IndiaUncut.com. All rights reserved.
India Uncut * The IU Blog * Rave Out * Extrowords * Workoutable * Linkastic




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DAC 2015 Accellera Panel: Why Standards are Needed for Internet of Things (IoT)

Design and verification standards are critical if we want to get a new generation of Internet of Things (IoT) devices into the market, according to panelists at an Accellera Systems Initiative breakfast at the Design Automation Conference (DAC 2015) June 9. However, IoT devices for different vertical markets pose very different challenges and requirements, making the standards picture extremely complicated.

The panel was titled “Design and Verification Standards in the Era of IoT.” It was moderated by industry editor John Blyler, CEO of JB Systems Media and Technology. Panelists were as follows, shown left to right in the photo below:

  • Lu Dai, director of engineering, Qualcomm
  • Wael William Diab, senior director for strategy marketing, industry development and standardization, Huawei
  • Chris Rowen, CTO, IP Group, Cadence Design Systems, Inc.

 

In opening remarks, Blyler recalled a conversation from the recent IEEE International Microwave Symposium in which a panelist pointed to the networking and application layers as the key problem areas for RF and wireless standardization. Similarly, in the IoT space, we need to look “higher up” at the systems level and consider both software and hardware development, Blyler said.

Rowen helped set some context for the discussion by noting three important points about IoT:

  • IoT is not a product segment. Vertical product segments such as automotive, medical devices, and home automation all have very different characteristics.
  • IoT “devices” are components within a hierarchy of systems that includes sensors, applications, user interface, gateway application (such as cell phone), and finally the cloud, where all data is aggregated.
  • A bifurcation is taking place in design. We are going from extreme scale SoCs to “extreme fit” SoCs that are specialized, low energy, and very low cost.

Here are some of the questions and answers that were addressed during the panel discussion.

Q: The claim was recently made that given the level of interaction between sensors and gateways, 50X more verification nodes would have to be checked for IoT. What standards need to be enhanced or changed to accomplish that?

Rowen: That’s a huge number of design dimensions, and the way you attack a problem of that scale is by modularization. You define areas that are protected and encapsulated by standards, and you prove that individual elements will be compliant with that interface. We will see that many interesting problems will be in the software layers.

Q: Why is standardization so important for IoT?

Dai: A company that is trying to make a lot of chips has to deal with a variety of standards. If you have to deal with hundreds of standards, it’s a big bottleneck for bringing your products to market. If you have good standardization within the development process of the IC, that helps time to market.

When I first joined Qualcomm a few years ago, there was no internal verification methodology. When we had a new hire, it took months to ramp up on our internal methodology to become effective. Then came UVM [Universal Verification Methodology], and as UVM became standard, we reduced our ramp-up time tremendously. We’ve seen good engineers ramp up within days.

Diab: When we start to look at standards, we have to do a better job of understanding how they’re all going to play with each other. I don’t think one set of standards can solve the IoT problem. Some standards can grow vertically in markets like industrial, and other standards are getting more horizontal. Security is very important and is probably one thing that goes horizontally.

Requirements for verticals may be different, but processing capability, latency, bandwidth, and messaging capability are common [horizontal] concerns. I think a lot of standards organizations this year will work on horizontal slices [of IoT].

Q: IoT interoperability is important. Any suggestions for getting that done and moving forward?

Rowen: The interoperability problem is that many of these [IoT] devices are wireless. Wireless is interesting because it is really hard – it’s not like a USB plug. Wireless lacks the infrastructure that exists today around wired standards. If we do things in a heavily wireless way, there will be major barriers to overcome.

Dai: There are different standards for 4G LTE technology for different [geographical] markets. We have to make a chip that can work for 20 or 30 wireless technologies, and the cost for that is tremendous. The U.S., Europe, and China all have different tweaks. A good standard that works across the globe would reduce the cost a lot.

Q: If we’re talking about the need to define requirements, a good example to look at is power. Certainly you have UPF [Unified Power Format] for the chip, board, and module.

Rowen: There is certainly a big role for standards about power management. But there is also a domain in which we’re woefully under-equipped, and that is the ability to accurately model the different power usage scenarios at the applications level. Too often power devolves into something that runs over thousands of cycles to confirm that you can switch between power management levels successfully. That’s important, but it tells you very little about how much power your system is going to dissipate.

Dai: There are products that claim to be UPF compliant, but my biggest problem with my most recent chip was still with UPF. These tools are not necessarily 100% UPF compliant.

One other concern I have is that I cannot get one simulator to pass my Verilog code and then go to another that will pass. Even though we have a lot of tools, there is no certification process for a language standard.

Q: When we create a standard, does there need to be a companion compliance test?

Rowen: I think compliance is important. Compliance is being able to prove that you followed what you said you would follow. It also plays into functional safety requirements, where you need to prove you adhered to the flow.

Dai: When we [Qualcomm] sell our 4G chips, we have to go through a lot of certifications. It’s often a differentiating factor.

Q: For IoT you need power management and verification that includes analog. Comments?

Rowen: Small, cheap sensor nodes tend to be very analog-rich, lower scale in terms of digital content, and have lots of software. Part of understanding what’s different about standardization is built on understanding what’s different about the design process, and what does it mean to have a software-rich and analog-rich world.

Dai: Analog is important in this era of IoT. Analog needs to come into the standards community.

Richard Goering

Cadence Blog Posts About DAC 2015

Gary Smith at DAC 2015: How EDA Can Expand Into New Directions

DAC 2015: Google Smart Contact Lens Project Stretches Limits of IC Design

DAC 2015: Lip-Bu Tan, Cadence CEO, Sees Profound Changes in Semiconductors and EDA

DAC 2015: “Level of Compute in Vision Processing Extraordinary” – Chris Rowen

DAC 2015: Can We Build a Virtual Silicon Valley?

DAC 2015: Cadence Vision-Design Presentation Wins Best Paper Honors

 

 

 




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Cadence SoC Encounter 8.1 - Keyboard is not working

Hello, I am using Encounter 8.1. My mouse is working fine, but my keyboard is not working well in Encounter. I can type in some boxes, but in many boxes I cannot type. The binding key is also not responding. How do I fix this issue? Thanks.




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regarding digital flow

Respected sir,

How can i design and simulate cmos inverter using digital flow and also ineed to do prelayout ans post layout for the same cmos inverter..can i use cadence encounter for this experiments




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Force cell equivalence between same-footprint and same-functionality hard-macros in Conformal LEC

For a netlist vs. netlist LEC flow we have to solve the following problem:

- in the RTL code we replicate a large array of N x M all-identical hard-macros, let call them MACRO_A

- MACRO_A is pre-assembled in Innovus and contains digital parts and analog parts (bottom-up hierarchical flow)

- at top-level (full-chip) we instantiate this array of all-identical macros

- in the top-level place-and-route flow we perform ecoChangeCell to remaster the top row of this array with MACRO_B

- MACRO_B is just a copy of the original MACRO_A cell containing same pins position, same internal digital functionality and also same digital layout, only slight differences in one analog block inside the macro

- MACRO_A and MACRO_B have the same .lib file generated with the do_extract_model command at the end of the Innovus flow, they only differ in the name of the macro

- when performing post-synthesis netlist vs post-place-and-route we load .lib files of both macros in Conformal LEC

- the LEC flow fails because Conformal LEC sees only MACRO_A instantiated in the post-synthesis netlist and both MACRO_A and MACRO_B in the post-palce-and-route netlist

Since both digital functionality and STD cells layout are the same between MACRO_A and MACRO_B we don't want to keep track of this difference already at RTL stage, we just want to perform this ECO change in place-and-route and force Conformal to assume equivalence between MACRO_A and MACRO_B .

Basically what I'm searching for is something similar to the add_instance_equivalences Conformal command but that works between Golden and Revised designs on cell primitives/black-boxes .

Is this flow supported ?

Thanks in advance

Luca




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Parasitic node coordinates

Howdy,

            In the netlist generated after parasitic extraction, nodes have been added at fracture points to add parasitic devices. For example, in the image below, I'm referring to the nodes IN#1 and IN#2. Is there a way to determine their co-ordinates relative to the layout co-ordinate system? I could not find them in the Skill command reference and when I query the parasitic elements in the extracted view, it gives the graphical pin locations of the elements rather than the physical.

Thanks

Audi




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Preparing Accellera Portable Stimulus Standard for Ratification

The Accellera Portable Stimulus Working Group met at the DVCon 2018 to move the process forward towards ratification. While we can't predict exactly when it will be ratified, the goal is now more clearly in sight! Cadence booth was busy with a lo...(read more)




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BoardSurfers: Allegro In-Design Impedance Analysis: Screen your Routed Design Quickly

Have you ever manufactured a printed circuit board (PCB) without analyzing all the routed signal traces? Most designers will say “yes, all the time.” Trace widths and spacing are set by constraints,...

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