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Design and verification standards are critical if we want to get a new generation of Internet of Things (IoT) devices into the market, according to panelists at an Accellera Systems Initiative breakfast at the Design Automation Conference (DAC 2015) June 9. However, IoT devices for different vertical markets pose very different challenges and requirements, making the standards picture extremely complicated.

The panel was titled “Design and Verification Standards in the Era of IoT.” It was moderated by industry editor John Blyler, CEO of JB Systems Media and Technology. Panelists were as follows, shown left to right in the photo below:

• Lu Dai, director of engineering, Qualcomm
• Wael William Diab, senior director for strategy marketing, industry development and standardization, Huawei
• Chris Rowen, CTO, IP Group, Cadence Design Systems, Inc.

In opening remarks, Blyler recalled a conversation from the recent IEEE International Microwave Symposium in which a panelist pointed to the networking and application layers as the key problem areas for RF and wireless standardization. Similarly, in the IoT space, we need to look “higher up” at the systems level and consider both software and hardware development, Blyler said.

Rowen helped set some context for the discussion by noting three important points about IoT:

• IoT is not a product segment. Vertical product segments such as automotive, medical devices, and home automation all have very different characteristics.
• IoT “devices” are components within a hierarchy of systems that includes sensors, applications, user interface, gateway application (such as cell phone), and finally the cloud, where all data is aggregated.
• A bifurcation is taking place in design. We are going from extreme scale SoCs to “extreme fit” SoCs that are specialized, low energy, and very low cost.

Here are some of the questions and answers that were addressed during the panel discussion.

Q: The claim was recently made that given the level of interaction between sensors and gateways, 50X more verification nodes would have to be checked for IoT. What standards need to be enhanced or changed to accomplish that?

Rowen: That’s a huge number of design dimensions, and the way you attack a problem of that scale is by modularization. You define areas that are protected and encapsulated by standards, and you prove that individual elements will be compliant with that interface. We will see that many interesting problems will be in the software layers.

Q: Why is standardization so important for IoT?

Dai: A company that is trying to make a lot of chips has to deal with a variety of standards. If you have to deal with hundreds of standards, it’s a big bottleneck for bringing your products to market. If you have good standardization within the development process of the IC, that helps time to market.

When I first joined Qualcomm a few years ago, there was no internal verification methodology. When we had a new hire, it took months to ramp up on our internal methodology to become effective. Then came UVM [Universal Verification Methodology], and as UVM became standard, we reduced our ramp-up time tremendously. We’ve seen good engineers ramp up within days.

Diab: When we start to look at standards, we have to do a better job of understanding how they’re all going to play with each other. I don’t think one set of standards can solve the IoT problem. Some standards can grow vertically in markets like industrial, and other standards are getting more horizontal. Security is very important and is probably one thing that goes horizontally.

Requirements for verticals may be different, but processing capability, latency, bandwidth, and messaging capability are common [horizontal] concerns. I think a lot of standards organizations this year will work on horizontal slices [of IoT].

Q: IoT interoperability is important. Any suggestions for getting that done and moving forward?

Rowen: The interoperability problem is that many of these [IoT] devices are wireless. Wireless is interesting because it is really hard – it’s not like a USB plug. Wireless lacks the infrastructure that exists today around wired standards. If we do things in a heavily wireless way, there will be major barriers to overcome.

Dai: There are different standards for 4G LTE technology for different [geographical] markets. We have to make a chip that can work for 20 or 30 wireless technologies, and the cost for that is tremendous. The U.S., Europe, and China all have different tweaks. A good standard that works across the globe would reduce the cost a lot.

Q: If we’re talking about the need to define requirements, a good example to look at is power. Certainly you have UPF [Unified Power Format] for the chip, board, and module.

Rowen: There is certainly a big role for standards about power management. But there is also a domain in which we’re woefully under-equipped, and that is the ability to accurately model the different power usage scenarios at the applications level. Too often power devolves into something that runs over thousands of cycles to confirm that you can switch between power management levels successfully. That’s important, but it tells you very little about how much power your system is going to dissipate.

Dai: There are products that claim to be UPF compliant, but my biggest problem with my most recent chip was still with UPF. These tools are not necessarily 100% UPF compliant.

One other concern I have is that I cannot get one simulator to pass my Verilog code and then go to another that will pass. Even though we have a lot of tools, there is no certification process for a language standard.

Q: When we create a standard, does there need to be a companion compliance test?

Rowen: I think compliance is important. Compliance is being able to prove that you followed what you said you would follow. It also plays into functional safety requirements, where you need to prove you adhered to the flow.

Dai: When we [Qualcomm] sell our 4G chips, we have to go through a lot of certifications. It’s often a differentiating factor.

Q: For IoT you need power management and verification that includes analog. Comments?

Rowen: Small, cheap sensor nodes tend to be very analog-rich, lower scale in terms of digital content, and have lots of software. Part of understanding what’s different about standardization is built on understanding what’s different about the design process, and what does it mean to have a software-rich and analog-rich world.

Dai: Analog is important in this era of IoT. Analog needs to come into the standards community.

Richard Goering

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Hello, my name is Hsukang. I want to use Liberate to create a .lib file for the following circuit. This is a scan FF with two separate outputs.   The question is that no matter how I described its function, the synthesis tool said its a manformed scan FF.  Has anyone ever encountered anything like this？How should I describe the function correctly？I found that almost standard flip-flop cells are with only one output Q or have Qn at the same time. Does Liberate support scan flip-flop cells with two separate outputs ？

Thanks.

For a netlist vs. netlist LEC flow we have to solve the following problem:

- in the RTL code we replicate a large array of N x M all-identical hard-macros, let call them MACRO_A

- MACRO_A is pre-assembled in Innovus and contains digital parts and analog parts (bottom-up hierarchical flow)

- at top-level (full-chip) we instantiate this array of all-identical macros

- in the top-level place-and-route flow we perform ecoChangeCell to remaster the top row of this array with MACRO_B

- MACRO_B is just a copy of the original MACRO_A cell containing same pins position, same internal digital functionality and also same digital layout, only slight differences in one analog block inside the macro

- MACRO_A and MACRO_B have the same .lib file generated with the do_extract_model command at the end of the Innovus flow, they only differ in the name of the macro

- when performing post-synthesis netlist vs post-place-and-route we load .lib files of both macros in Conformal LEC

- the LEC flow fails because Conformal LEC sees only MACRO_A instantiated in the post-synthesis netlist and both MACRO_A and MACRO_B in the post-palce-and-route netlist

Since both digital functionality and STD cells layout are the same between MACRO_A and MACRO_B we don't want to keep track of this difference already at RTL stage, we just want to perform this ECO change in place-and-route and force Conformal to assume equivalence between MACRO_A and MACRO_B .

Basically what I'm searching for is something similar to the add_instance_equivalences Conformal command but that works between Golden and Revised designs on cell primitives/black-boxes .

Is this flow supported ?

Thanks in advance

Luca

I can get the bound stdcells using bndGetBoundObjects, but not get what each individual stdcell corresponds in layout.

Is there a way to get the layout bound stdcells of an array schematic symbol if the layout stdcell name do or do not match the symbol naming?

Once the schematic array stdcells are bound to the layout stdcells, how to get the correct terminal term~>name and net~>name?

Example of a schematic symbol and layout stdcell:

Schematic

INV<0:2>    instTerms~>terms~>name = ("vss" "vdd" "A" "Y")

                   instTerms~>net~>name = ("<*3>vss" "<*3>vdd" "in<0:2>" "nand2A,nand3B,nor2B")

Layout ( I know it is bad practice, but it happens )

stdcell1 instTerms~>terms~>name = ("vss" "vdd" "A" "Y")

             instTerms~>net~>name = ("vss" "vdd" "in<0>" "nand2A")

I23        instTerms~>terms~>name = ("vss" "vdd" "A" "Y")

             instTerms~>net~>name = ("vss" "vdd" "in<1>" "nand3B")

INV(2) instTerms~>terms~>name = ("vss" "vdd" "A" "Y")

             instTerms~>net~>name = ("vss" "vdd" "in<2>" "nor2B")

Paul

When I place a pcell and do not change the W parameter (default is used) the value is not saved in the OA cell property.

When I change the default value of the super master now, the old pcell will get the new default value automatically because there is nothing saved inside the OA cell for this parameter.

Do you have any Idea, that how we can save the default values in the OA cell properties so that this value doesn't get updated if the default values are updated in the new PDKs

I have a top cell & need to revise all the instances' cellview & export top cell as a new GDS file.

So I write a SKILL code to do so and I find out it will be a little bit slow by using the dbSave to save the cellview of each instance.

Code as below:

let( (topCV subCV )
topCV = dbOpenCellViewByType(newLibName topCellName "layout" "maskLayout" "a")
foreach(inst topCV->instances
subCV = dbOpenCellViewByType(newLibName inst->cellName "layout" "maskLayout" "a")
;;;revise code content
;;;...
;;;revise code content
dbSave(subCV)
dbClose(subCV)
)
dbSave(topCV)
dbClose(topCV)
system(strcat( "strmout -library " newLibName " -topCell " topCellName " -view layout -strmFile " resultFolder "/" topCellName ".gds -techLib " srcLibName " -enableColoring -logFile " topCellName "_strmOut.log" ) )
)

Even if the cell content is not revised, the run time of dbSave will be 2 minutes when there are ~ 1000 instances in topcell. The exported GDS file size is ~2MB.

And the dbSave becomes the bottle neck of the code runtime...

Is there any better way to do such a thing? 

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If you weren't able to attend the 2013 DVCon, you missed out on a great IEEE 1801/UPF tutorial delivered by members of the IEEE committee. Accellera had the event recorded and that recording is now posted on the Accellera.org website. Regardless of your work so far with low power design and verification, you need to watch this video.

Power management is becoming ubiquitous in our world. The popular aspect is that reduced power is good for the evironment and that is true. But for those teams that have been building chips around the 40nm node and below, there is another truth. Power management is required simply to get working silicon in many cases. As the industry expands the number of designs with power management and forges deeper into advanced nodes, we steadily identify improvements to the power format descriptions. The most recent set of imporvements to the IEEE 1801 standard are now available in the 2013 version of that standard.

To help bring the standard to life, five representatives from the IEEE joined to deliver a tutorial at DVCon in 2013. Qi Wang (Cadence), Erich Marschner (Mentor), Jeffrey Lee (Synopsys), John Biggs (ARM), and Sushma Honnavarra-Prasad (Broadcom) each contributed to the tutorial. It started with a review of the UPF basics that led to the IEEE 1801 standard delivered by the EDA companies. The IEEE 1801 users then presented tutorial content on how to apply the standard. The session then concluded with a look forward to the IEEE 1801-2013 (UPF 2.1) standard. The standard was released two months after the DVCon tutorial and is available through the Accellera Get program.

So after the bowl games are over and you'vre returned through the woods and back over the river from Grandma's, grab a cup of hot cocoa and learn more about the power standards you may well be using in 2014.

Regards,

Adam "The Jouler" Sherer

Hello,

I find a strange issue when using design variable -> right-click -> copy from cellview in assembler. Cadence version is IC618-64b. 500.9

In fact, I set the value of variable (e.g., AAA = 100), then after I right-click -> copy from cellview, AAA's is updated to other value. In my opinion "copy from cellview" should only update the missing variable to the list, but not change any variable value. 

Is there any mechanism could change variable value when using "copy from cellview"?

Thanks

Hi,

I am trying to characterize a D flip-flop for low voltage operation (0.6V) using Cadence Liberate (V16). This is a positive edge triggered D flip flop based on true-single-phase clocking scheme. After the characterization, the measurements reported for hold constraint arcs seem to deviate significantly from its (spectre) spice simulation.

The constraint and the power settings to the liberate are as follows : 

# -------------------------------------------- Timing Constraints --------------------------------------------------------------------------------
### Input waveform ###
set_var predriver_waveform 2;# 2=use pre-driver waveform
### Capacitance ###
set_var min_capacitance_for_outputs 1;# write min_capacitance attribute for output pins
### Timing ###
set_var force_condition 4
### Constraint ###
set_var constraint_info 2
#set_var constraint_search_time_abstol 1e-12 ;# 1ps resolution for bisection search
set_var nochange_mode 1 ;# enable nochange_* constraint characterization
### min_pulse_width ###
set_var conditional_mpw 0
set_var constraint_combinational 2

#---------------------------------------------- CCS Settings ----------------------------------------------------------------------------------------
set_var ccsn_include_passgate_attr 1
set_var ccsn_model_related_node_attr 1
set_var write_library_is_unbuffered 1

set_var ccsp_min_pts 15 ;# CCSP accuracy
set_var ccsp_rel_tol 0.01 ;# CCSP accuracy
set_var ccsp_table_reduction 0 ;# CCSP accuracy
set_var ccsp_tail_tol 0.02 ;# CCSP accuracy
set_var ccsp_related_pin_mode 2 ;# use 3 for multiple input switching scnarios and Voltus only libraries

#----------------------------------------------- Power ---------------------------------------------------------------------------------------------------
### Leakage ###
set_var max_leakage_vector [expr 2**10]
set_var leakage_float_internal_supply 0 ;# get worst case leakage for power switch cells when off
set_var reset_negative_leakage_power 1 ;# convert negative leakage current to 0

### Power ###
set_var voltage_map 1 ;# create pg_pin groups, related_power_pin / related_ground_pin
set_var pin_based_power 0 ;# 0=based on VDD only; 1=power based on VDD and VSS (default);
set_var power_combinational_include_output 0 ;# do not include output pins in when conditions for combinational cells

set_var force_default_group 1
set_default_group -criteria {power avg} ;# use average for default power group

#set_var power_subtract_leakage 4 ;# use 4 for cells with exhaustive leakage states.
set_var subtract_hidden_power 2 ;# 1=subtract hidden power for all cells
set_var subtract_hidden_power_use_default 3 ;# 3=subtract hidden power from matched when condition then default group
set_var power_multi_output_binning_mode 1 ;# binning for multi-output cell considered for both timing and power arcs
set_var power_minimize_switching 1
set_var max_hidden_vector [expr 2**10]
#--------------------------------------------------------------------------------------------------------------------------------------------------------------

I specifically used set_var constraint_combinational 2 in the settings, in case the Bisection pass/fail mode fails to capture the constraints. In my spice simulation, the hold_rise (D=1, CLK=R, Q=R) arc at-least requires ~250 ps for minimum CLK/D slew combination (for the  by default smallest capacitive load as per Liberate)  while Liberate reports only ~30 ps. The define_cell template to this flip flop is pretty generic, which does not have any user specified arcs. So which settings most likely affecting the constraint measurements in Liberate and how can I debug this issue ?

Thanks

Anuradha

This blog discusses key features of concurrently editing a hierarchical cellview.(read more)

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Hydrogen fuel cell electric vehicles (FCEV) were the belles of the ball at recent auto shows in Los Angeles and Tokyo, and researchers at the Energy Department's National Renewable Energy Laboratory (NREL) continue to play a key part in improving performance and durability while driving down costs.

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