A substrate for an organic light-emitting device which can improve the light extraction efficiency of an organic light-emitting device while realizing an intended level of transmittance, a method of fabricating the same, and an organic light-emitting device having the same. Light emitted from the OLED is emitted outward through the substrate. The substrate includes a substrate body and a number of crystallized particles disposed inside the substrate body, the number of crystallized particles forming a pattern inside the substrate body.

The present invention includes microfluidic systems having a microfabricated cavity that may be covered with a removable cover, where the removable cover allows at least part of the opening of the microfabricated cavity to be exposed or directly accessed by an operator. The microfluidic systems comprise chambers, flow and control channels formed in elastomeric layers that may comprise PDMS. The removable cover comprises a thermoplastic base film bonded to an elastomer layer by an adhesive layer. When the removable cover is peeled off, the chamber is at least partially open to allow sample extraction from the chamber. The chamber may have macromolecular crystals formed inside or resulting contents from a PCR reaction. The invention also includes a method for making vias in elastomeric layers by using the removable cover. The invention further includes methods and devices for peeling the peelable cover or a removable component such as Integrated Heater Spreader.

A custom brace and method for fabricating the custom brace includes marking a body with reference points and/or other indicators. Multiple images of the body from multiple angles are then obtained. The images are used to determine the contours of the body and the other markings are located and used to design the custom brace. Fenestrations can be added to the brace design. The custom brace can be fabricated with the fenestrations as a single piece structure or in multiple pieces that are assembled to complete the custom device.

A manhole cover assembly includes a manhole structure, a manhole frame carried by the manhole structure and a manhole frame grout cementing the manhole frame to the manhole structure. The manhole frame grout includes a grout mixture having an epoxy resin, a curing agent and an aggregate. The epoxy resin and the aggregate are present in the grout mixture in an epoxy resin:aggregate weight ratio of about 0.09. A removable manhole cover is carried by the manhole frame. A manhole cover assembly fabrication method is also disclosed.

An air duct assembly includes upper and lower pliable sheets that can be assembled in a sequence that makes the assembly easier to install and later easier to remove for periodic cleaning. To install the assembly, the upper sheet can be installed first by inserting the edges of the upper sheet within a pair of tracks and then fastening the upper sheet to a vertical supply air duct. An optional airflow modifier (e.g., filter, airflow turning vane, or noise attenuator) can be install where the supply air duct connects to the upper sheet. Once the upper sheet is suspended from the tracks and fastened to the main supply air duct, the lower sheet can be installed separately. Pliable end panels and pliable fasteners (e.g., zipper or VELCRO fastener) can make most of the air duct assembly machine washable. The upper and lower sheets can have different degrees of air permeability.

A light source device which can prevent the removal of light source elements of a light source device within a projector casing, a projector and a light source fabrication method are provided. An excitation light shining device 70 has a lens holding structure 79 and a light source holding structure 80 which are integrated together with excitation light sources held therebetween. The lens holding structure 79 has through holes 79f which first screw members 84 penetrate, and the light source holding structure 80 has screw holes 80h and screw holes 80k communicating with the screw holes 80h substantially at right angles. With the first screw members 84 penetrating the through holes 79f to be screwed into the screw holes 80h, screw thread portions of the first screw members 84 are pressed to be deformed plastically by distal end portions of the second screw members 85.

The invention relates to a substrate-based method for forming a three-dimensional object by additive fabrication by coating a liquid radiation curable resin comprising from 30 to 80 wt % of cationically curable compounds on a substrate, contacting the liquid radiation curable resin with a previously cured layer, selectively exposing the layer of liquid radiation curable layer to actinic radiation thereby forming a cured layer, separating the cured layer at the substrate, and repeating the steps a sufficient number of time in order to build up a three-dimensional object.

Provided are fiber fabrication method and the fiber fabricated thereby. In this method, different monomer solutions are electrospun through nozzles whose outlets are stuck to each other and simultaneously interfacially polymerized to form a polymer fiber without a complicated process of preparing a polymer solution. Therefore, a polymer fiber can be simply prepared.

A method of forming a polycrystalline silicon active layer for use in a thin film transistor is provided. The method includes forming a buffer layer over a substrate, forming an amorphous silicon layer over the buffer layer, applying a catalytic metal to a surface of the amorphous silicon layer, crystallizing the amorphous silicon layer having the catalytic metal thereon into a polycrystalline silicon layer, annealing the polycrystalline silicon layer in an N2 gas atmosphere to stabilize the polycrystalline silicon layer, etching a surface of the polycrystalline silicon layer using an etchant, and patterning the polycrystalline silicon layer to form an island-shaped active layer.

A fabrication method of a multi-domain vertical alignment pixel structure includes providing a substrate, forming a gate on the substrate, and forming an insulating layer on the substrate. A channel layer and a semiconductor layer are formed on the insulating layer. A source, a drain, and a capacitor-coupling electrode are formed. A passivation layer is formed to cover the source, the drain, a part of the channel layer, and a part of the semiconductor layer. A via hole is formed in the passivation layer to expose the drain, and a trench is formed in the passivation layer and the insulating layer. A lateral etched groove on the sidewall of the trench is formed to expose the side edge of the semiconductor layer. A first pixel electrode and a second pixel electrode are formed on the passivation layer at both sides of the trench, respectively.

Devices capable of deterring or preventing bulk extraction of drugs from, for example, drug-delivery systems are exemplarily disclosed. In one embodiment, such a device may include a package releasably retaining a drug and an agent. The agent is configured to suppress a physiological effect of the drug when the agent contacts the drug or is coadministered with the drug. The cell package is configured such that an amount of the drug is selectively releasable with respect to the agent when the package is operably proximate to an encoded key. The package, however, may be configured to impose a relatively high likelihood that either the drug will not be accessed or the drug will be contaminated by the agent if access to the contents of the package is sought without the use of an encoded key.

A method of enabling administration of a drug includes determining, within a drug-transfer device including cells, a location of at least one cell and generating information identifying the determined location. A user may be provided with the drug-transfer device. The drug is retained within the at least one cell when the user is provided with the drug-transfer device. The method also includes encoding a key with the information and providing the user with the key before, after or when the user is provided with the drug-transfer device. Drug retained within the at least one cell is selectively releasable when the key is operably proximate to the drug-transfer device and is encoded with the information. The key can be encoded with the information before and/or after being provided to the user. In some embodiments, the key is encoded based on instructions transmitted over a network.

An improved set of toy building or construction blocks, each block having a substantially square cross-section and a generally rectilinear configuration. Incorporated into the structure of the individual toy blocks are transversely oriented slots, grooves and protrusions of predetermined size and location. The slots, grooves and protrusions of pre-determined size and location are of either male or female configuration disposed medially along one or more plane of each block. When the male protrusion of one block is introduced perpendicular to the female slot of one end of another block, a frictional engagement is created resulting in a right angle. When the male protrusion of one block is introduced to the female slot in a linear fashion the result is a line segment. Joining a plurality of said toy building or construction blocks using various perpendicular connections in conjunction with linear connections results in the stable formation of construction or geometric structures without the use of fasteners or other connecting elements.

A conduction cooled high power semiconductor laser and a method for fabricating the same are provided. The conduction cooled high power semiconductor laser comprises a heat sink (2) and one or more semiconductor laser units (1). The semiconductor laser unit consists of a laser chip (3), a substrate (4) bonded to the laser chip for heat dissipation and electrical connection, and an insulation plate (5) soldered to the substrate for insulation and heat dissipation. The semiconductor laser unit is soldered on the heat sink with the insulation plate therebetween. The semiconductor laser unit may be tested, aged, and screened in advance, and thereby the yield of the lasers can be improved and the manufacturing costs can be reduced. The laser has desirable heat dissipation performance, high reliability, and is applicable to high temperature and other complex and volatile environments.

A method for fabricating a group-III nitride semiconductor laser device stably supplies laser cavity mirrors having a low lasing threshold current through the use of a semi-polar plane. A blade 5g is forced down through a first region ER1 to keep the first region ER1 squeezed between a support member H2 and a movable member H1 together with a part of a protective sheet TF in contact with the first region ER1 while the tension generated in the area of the protective sheet TF in contact with the first region ER1 with the movable member H1 increases until the semi-polar principal surface SF at an end face EG1 of the first region ER1 tilts by a deflection angle THETA from the semi-polar principal surface SF of a second region ER2, and a force is thereby generated in the first region ER1 in a direction opposite to the direction of travel of the blade 5g toward the first region ER1. For example, an angle ALPHA is within the range of 71 degrees to 79 degrees, and the deflection angle THETA is within the range of 11 to 19.

Various embodiments of a photonic device and fabrication method thereof are provided. In one aspect, a device includes a substrate, a current confinement layer disposed on the substrate, an absorption layer disposed in the current confinement layer, and an electrical contact layer disposed on the absorption layer. The current confinement layer is doped in a pattern and configured to reduce dark current in the device. The photonic device may be a photodiode or a laser.

An embodiment of this invention uses a massive parallel interconnect fabric (MPIF) at the flipped interface of a core die substrate (having the core logic blocks) and a context die (used for in circuit programming/context/customization of the core die substrate), to produce ASIC-like density and FPGA-like flexibility/programmability, while reducing the time and cost for development and going from prototyping to production, reducing cost per die, reducing or eliminating NRE, and increasing performance. Other embodiments of this invention enable debugging complex SoC through large contact points provided through the MPIF, provide for multi-platform functionality, and enable incorporating FGPA core in ASIC platform through the MPIF. Various examples are also given for different implementations.

The present invention relates generally to a semiconductor device and, more specifically, to optimizing the creep-age distance of the power semiconductor device and a preparation method thereof. The power semiconductor device includes a chip mounting unit with a die paddle and a plurality of leads arranged side by side located close to one side edge of the die paddle in a non-equidistant manner, a semiconductor chip attached on the die paddle, and a plastic packaging body covering the die paddle, the semiconductor chip, where the plastic packing body includes a plastic extension portion covering at least a part of a lead shoulder of a lead to obtain better electrical safety distance between the terminals of the semiconductor device, thus voltage creep-age distance of the device is increased.

Methods for the fabrication of a Microelectromechanical Systems (“MEMS”) devices are provided, as are MEMS devices. In one embodiment, the MEMS device fabrication method includes forming at least one via opening extending into a substrate wafer, depositing a body of electrically-conductive material over the substrate wafer and into the via opening to produce a via, bonding the substrate wafer to a transducer wafer having an electrically-conductive transducer layer, and forming an electrical connection between the via and the electrically-conductive transducer layer. The substrate wafer is thinned to reveal the via through a bottom surface of the substrate wafer, and a backside conductor is produced over a bottom surface of the substrate wafer electrically coupled to the via.

A method for fabricating a sensor includes: forming, on a base substrate, a pattern of a source electrode and a drain electrode, a pattern of a data line, a pattern of a receiving electrode, a pattern of a photodiode, and a pattern of a transparent electrode disposed by using a first patterning process; forming a pattern of an ohmic layer by using a second patterning process; forming a pattern of an active layer by using a third patterning process; forming a pattern of a gate insulating layer by using a fourth patterning process, wherein the gate insulating layer has a via hole above the transparent electrode; and forming a pattern of a gate electrode, a pattern of a gate line, and a pattern of a bias line connected to the transparent electrode via the via hole above the transparent electrode by using a fifth patterning process.

Embodiments of a method for fabricating stacked microelectronic packages are provided, as are embodiments of a stacked microelectronic package. In one embodiment, the method includes arranging microelectronic device panels in a panel stack. Each microelectronic device panel includes a plurality of microelectronic devices and a plurality of package edge conductors extending therefrom. Trenches are formed in the panel stack exposing the plurality of package edge conductors. An electrically-conductive material is deposited into the trenches and contacts the plurality of package edge conductors exposed therethrough. The panel stack is then separated into partially-completed stacked microelectronic packages. For at least one of the partially-completed stacked microelectronic packages, selected portions of the electrically-conductive material are removed to define a plurality of patterned sidewall conductors interconnecting the microelectronic devices included within the stacked microelectronic package.

The object of the invention is to provide a method for fabricating a semiconductor device having a peeled layer bonded to a base material with curvature. Particularly, the object is to provide a method for fabricating a display with curvature, more specifically, a light emitting device having an OLED bonded to a base material with curvature. An external force is applied to a support originally having curvature and elasticity, and the support is bonded to a peeled layer formed over a substrate. Then, when the substrate is peeled, the support returns into the original shape by the restoring force, and the peeled layer as well is curved along the shape of the support. Finally, a transfer object originally having curvature is bonded to the peeled layer, and then a device with a desired curvature is completed.

An optical element includes at least two stacked birefringent layers having respective local optical axes that are rotated by respective twist angles over respective thicknesses of the at least two layers, and are aligned along respective interfaces between the at least two layers. The respective twist angles and/or the respective thicknesses are different. The at least two stacked birefringent layers may be liquid crystal polymer optical retarder layers. Related devices and fabrication methods are also discussed.

UO2 nuclear fuel pellets are fabricated by adding additive powder comprising Mn compound and Al compound into UO2 powder.

A method of fabricating a nuclear fuel comprising a fissile material, one or more hollow microballoons, a phenolic resin, and metal matrix. The fissile material, phenolic resin and the one or more hollow microballoons are combined. The combined fissile material, phenolic resin and the hollow microballoons are heated sufficiently to form at least some fissile material carbides creating a nuclear fuel particle. The resulting nuclear fuel particle comprises one or more fission product collection spaces. In a preferred embodiment, the fissile material, phenolic resin and the one or more hollow microballoons are combined by forming the fissile material into microspheres. The fissile material microspheres are then overcoated with the phenolic resin and microballoon. In another preferred embodiment, the fissile material, phenolic resin and the one or more hollow microballoons are combined by overcoating the microballoon with the fissile material, and phenolic resin.

A curved-surface display panel fabrication method for fabricating a curved-surface display panel using a flat display panel having a first substrate and a second substrate includes: paring partially outer surfaces of the first substrate and the second substrate so as to reduce thicknesses thereof to a predetermined thickness; bending the pared flat display panel to a desired curved shape; attaching a first guide member which has a shape corresponding to the desired curved shape to the first substrate with a predetermined gap from the pared outer surface thereof and attaching a second guide member with has a shape corresponding to the desired curved shape to the second substrate with a predetermined gap from the pared outer surface thereof; and forming light transmitting reinforcing layers respectively in a space between the first guide member and the first substrate and a space between the second guide member and the second substrate.

A light emitting display device and a method of fabricating the same are disclosed. The light emitting display device comprises: a substrate comprising an active region in which a plurality of active pixels for displaying images are formed and a first dummy region disposed outside the active region and in which a plurality of first dummy pixels is formed; a first electrode formed on the substrate in each pixel; a pixel defining layer having an opening that exposes the first electrode; a surface treatment layer formed on the first electrode and having a plurality of grooves in each of the first dummy pixels; a light emitting layer formed on the surface treatment layer; and a second electrode formed on the light emitting layer in each of the active pixels.

In a method for fabricating a lightweight and thin liquid crystal display (LCD), a first mother substrate, a subsidiary substrate and a thin second mother substrate are provided. An edge cut is formed by cutting edges of the first and second mother substrates and the subsidiary substrate to be inclined at a predetermined angle. An array process is performed on the first mother substrate. The subsidiary substrate is attached to the second mother substrate. A color filter process is performed on the second mother substrate having the subsidiary substrate attached thereto. The first and second mother substrates are attached together. The subsidiary substrate is separated from the first and second substrates by spraying air between the second mother substrate and the subsidiary substrate, in which the edge cut is formed.

An insulated container includes a first laminated structure having a metal layer and a second laminated structure having a metal layer. The metal layer of the first laminated structure faces the metal layer of the second laminated structure. The insulated container also includes a foam material layer disposed between the first laminated structure and the second laminated structure. The metal layer of the first laminated structure is bonded to the metal layer of the second laminated structure at a plurality of locations.

A papermaking machine for the production of a fibrous web including a plurality of rollers and a structured fabric moving along the rollers. The structured fabric includes a plurality of weft yarns and a plurality of warp yarns woven with the plurality of weft yarns to produce a weave pattern, the plurality of warp yarns being a plurality of paired warp yarn sets. Each paired warp yarn set including a first warp yarn and a second warp yarn. Within the weave pattern the first warp yarn forms a float over at least four weft yarns and weaves with a single weft yarn immediately adjacent with the float. The second warp yarn having an inverse pattern to the first warp yarn, with the second warp yarn weaving with another single weft yarn that is not adjacent to the single weft yarn with which the first warp yarn is woven.

An industrial two-layer fabric includes an upper side fabric and a lower side fabric. The upper side warps of the upper side fabric comprise a first warp set and a second warp set. The first warp set contains two upper side warps and a warp binding yarn that binds the upper side fabric and the lower side fabric. The two upper side warps are woven with the same upper side wefts. The second warp set contains one upper side warp. At a position where the warp binding yarn passes above one of the upper side wefts, the warp binding yarn is placed between the two upper side warps of the first warp set and pass below the same one of the upper side wefts, whereby the two upper side warps and the warp binding yarn of the first warp set form the upper side warp design.

Protective garments include a flame resistant fabric that is strong and yet has a soft hand. The fabric is made from a combination of filament yarns and spun yarns. The filament yarns and spun yarns are woven together such that the filament yarns are separated by from about 2 to about 5 spun yarns in both the warp direction and the fill direction. The spun yarns may contain polybenzimidazole fibers in combination with other fibers, such as aramid fibers. The filament yarns may comprise para-aramid fibers. In one embodiment, the filament yarns may have a size larger than the spun yarns.

Disclosed is a fabric for an airbag including a polyester fiber, and particularly to a polyester fabric for an airbag of which toughness is 3.5 to 6.0 kJ/m3 and tearing strength measured according to the ASTM D 2261 TONGUE method is 18 to 30 kgf, wherein the fabric includes polyester fiber of which toughness is 70 to 95 J/m3, a method of preparing the same, and an airbag for a car including the same.

A woven fabric for a low profile implantable medical device includes a plurality of textile strands of a composite yarn aligned in a first direction interlaced with a plurality of textile strands of the composite yarn aligned in a second direction. The composite yarn includes a combination of a first material and a second material. The textile strands have a size between about 10 denier to about 20 denier. The first material has at least one characteristic different from the second material and the second material reacts favorably with blood when placed within an artery.

An industrial two-layer fabric includes a first warp set and a second warp set that are placed alternately and form a weave design of the upper side fabric. The first warp set contains two upper side warps. At least one of the upper side warps of the first warp set functions as a warp binding yarn that binds the upper side fabric and the lower side fabric. The second warp set contains one of upper side warps and one of lower side warps placed below the one of the upper side warps. At a position where two adjacent lower side warps are woven with one of the lower side wefts, the warp binding yarn placed between the two adjacent lower side warps is woven with the same one of the lower side wefts.

Fabric strap having at least two different segments. The first segment is wider and less elastic, providing a comfortable contacting area to the skin and the other segment is narrower and more elastic which is aesthetically more pleasing and easier for applying sewing process in the garment production. Preferably, the first segment is a sealed tubular structure and contains internally free-floating yarns, making it exert less stress to the skin and thus more comfortable to the wearer. In addition, the different segments of the strap are made in a single integral weaving process and thus is conducive to industry automation.

A fabric for forming a fibrous paper web having an embossed surface is provided that includes at least longitudinal and transverse threads interwoven with one another in a weave repeat defining a machine side and a paper side. Some of the longitudinal threads form embossing threads having projecting paper side floats on the paper side of the fabric passing over more than one transverse thread. The fabric includes at least a first woven fabric layer forming the paper side on its outside and having longitudinal and transverse first threads interwoven with one another and a second woven fabric layer forming the machine side on its outside and having longitudinal and transverse second threads interwoven with one another. At least some of the longitudinal second threads form embossing threads, which penetrate the first woven fabric layer for forming the paper side floats and connect the two woven fabric layers.

Crimp-imbalanced fabric systems are accomplished by varying the levels of yarn crimp within a single fabric layer and across layers of a multi-layer fabric system. The method includes developing a crimp in the yarn (utilized for producing a fabric layer) by optionally pulling the yarn through a solution that substantially coats the yarn. The optionally removable coating has a thickness that ensures a proper amount of crimp in the yarn. The tension in the yarn is controlled; the yarn is weaved; and a crimp is applied in the yarn. Once the crimp is applied, families of the crimped yarn are utilized as a single layer or multiple layer system to increase performance attributes including enhanced energy absorption.

A device for manufacturing a fabric has a plurality of automatically working apparatus arranged next to one another on at least one carrier for manufacturing a leno weave (a leno weave apparatus). Two leno threads are fed to each leno weave apparatus. The device has at least one weft thread picking device; wherein the weft thread is introduced into the shed of leno threads raised by a plurality of leno weave apparatus. The weft thread is bound using at least two leno threads at a plurality of points behind the weft thread over the width of the fabric. At least one of the leno weave apparatus arranged in the end region of the fabric carries out a higher number of interlacings for achieving a homogenized warp tension distribution over the width of the fabric; and/or the lowering of the shed is carried out by the leno weave apparatus over the width of the fabric at different times for achieving a homogenized warp tension distribution.

A multilayer fabric is joined by engaging joining loops formed at both ends of a disjoined industrial multilayer fabric having wefts and warps in layers. The joining loops are formed by folding back some or all the end portions of warps. The both ends of the fabric are joined by engaging the loops to form a common hole and inserting a core wire into the common hole. At least one upper side weft remains while a lower side weft below the remaining upper side weft is removed at the both ends of the fabric. The common hole and the core wire inserted therein are located below the remaining upper side weft. The folded portions of the warps are interwoven with wefts of a normal portion of the fabric.

A method weaves pile fabrics with at least two different pile heights (a, b) in the same pile row, wherein the fabrics have weft threads, ground warp threads and pile-warp threads (1, 2), wherein these pile-warp threads are interlaced in the fabric, according to a pattern, in a figure-forming manner or are inwoven in a non-figure-forming manner, and which, when they are figure-forming, form pile with a well-defined pile height. The method includes a first set of pile warp threads, under light strain and at least a second set of pile warp threads under a higher strain. A device for manufacturing such fabrics is described.

A three-dimensional woven fabric including front layer, rear layer, and light-shielding layer connecting front layer to rear layer and a method thereof are disclosed. The light-shielding layer is formed by repeatedly overlapping first, second, and third light-shielding layers with another light-shielding layer with adjacent ones among the first to the third light-shielding layers overlapped. The front layer includes front parts formed by weaving front layer wrap threads and weft threads, the front parts have front layer-connecting parts formed by sequentially and repeatedly weaving front layer wrapwrap threads and weft threads and light-shielding layer wrap threads, the rear layer includes rear layer-connecting parts formed by weaving sequentially and repeatedly the rear layer wrap threads and weft threads and light-shielding layer wrap threads. The light-shielding layers are formed by weaving light-shielding layer wrap threads and the weft threads, and the light-shielding layers are sequentially and repeatedly connected to front layer-connecting parts and rear layer-connecting parts. Three-dimensional shapes are implemented without adhesive. Various designs and light-shielding control are available.

An industrial two-layer fabric has an inner space between an upper side fabric and a lower side fabric. Some or all of upper side wefts or lower side wefts are secondary wefts interwoven with upper side warps or lower side warps so as to make the number of warps passing on an upper surface of the upper side fabric or passing on a lower surface of the lower side fabric larger than that on an inner space side of the upper or lower side fabric and a long crimp in the inner space is formed by the secondary weft.

An airbag fabric, airbag and method for making the airbag fabric, the fabric consisting of warp and weft yarns of synthetic fiber yarn, characterized by satisfying the following requirements: (1) the total fineness of the synthetic fiber yarn is 100 to 700 dtex;(2) Nf/Nw≧1.10 wherein, Nw represents the weaving density of warp yarns (yarns/2.54 cm) andNf represents the weaving density of weft yarns (yarns/2.54 cm);(3) EC1≧400N and EC2≧400N wherein, EC1 represents the edgecomb resistance (N) in the machine direction, as determined according to ASTM D6479-02, andEC2 represents the edgecomb resistance (N) in the crosswise direction as determined according to ASTM D6479-02;(4) 0.85≦EC2/EC1≦1.15; and(5) the air permeability, as determined according to the Frajour type method specified in JIS L1096 at a test pressure difference of 19.6 kPa, is 1.0 L/cm2·min or less.

A whip with a braided handle and method of fabrication which includes a generally cylindrical handle portion. The handle portion has an inboard end and an outboard end and is fabricated of a braided rope construction which comprises a plurality of single yarns twisted together to form a plurality of piled yarns which are then braided, with a helical angle of the twist of the single yarns within their respective plied yarn being equal and opposite to the helical angle of the plied yarns in the braid. Also included is an inboard first thread which is wrapped circumferentially about the handle end from adjacent the inboard end and extends outboardly. An outboard second thread is wrapped circumferentially around the handle portion to provide a handle. A whipping portion extends outboardly of the outboard end of the handle portion and is fabricated of extensions of the braided strands from the handle portion but in an unbraided braid form.

A hard bias (HB) structure for longitudinally biasing a free layer in a MR sensor is disclosed that includes a mildly etched seed layer and a hard bias (HB) layer on the etched seed layer. The HB layer may contain one or more HB sub-layers stacked on a lower sub-layer which contacts the etched seed layer. Each HB sub-layer is mildly etched before depositing another HB sub-layer thereon. The etch may be performed in an IBD chamber and creates a higher concentration of nucleation sites on the etched surface thereby promoting a smaller HB average grain size than would be realized with no etch treatments. A smaller HB average grain size is responsible for increasing Hcr in a CoPt HB layer to as high as 2500 to 3000 Oe. Higher Hcr is achieved without changing the seed layer or HB material and without changing the thickness of the aforementioned layers.

Interconnect structures and methods of fabricating the same are provided. The interconnect structures provide highly reliable copper interconnect structures for improving current carrying capabilities (e.g., current spreading). The structure includes an under bump metallurgy formed in a trench. The under bump metallurgy includes at least: an adhesion layer; a plated barrier layer; and a plated conductive metal layer provided between the adhesion layer and the plated barrier layer. The structure further includes a solder bump formed on the under bump metallurgy.

The present invention provides a method for fabricating a working electrode. The method comprises the following steps: providing a photoelectrode, which comprises a conductive substrate with a semiconductor material; providing a dye solution, which comprises a dye dissolved in a solvent; and applying a voltage for conducting an electrophoresis to adsorb said dye onto a surface of said semiconductor material. The method of present invention makes the dye adsorbed fast to a surface of a semiconductor material by electrophoresis, and therefore, significantly reduces the time for fabricating a dye-sensitized solar cell.

An organic light emitting display device includes a light shield layer formed on a substrate and a buffer layer formed on an entire surface of the substrate, an oxide semiconductor layer and first electrode formed on the buffer layer, a gate insulation film and gate electrode formed on the oxide semiconductor layer while being deposited to expose both edges of the oxide semiconductor layer, an interlayer insulation film formed to expose both the exposed edges of the oxide semiconductor layer and the first electrode, source and drain electrodes connected with one edge and the other edge of the oxide semiconductor layer, respectively, and a protective film formed to cover the source and drain electrodes while exposing a region of the first electrode so as to define a luminescent region and a non-luminescent region.

An electronic device includes a silicon carbide layer including an n-type drift region therein, a contact forming a junction, such as a Schottky junction, with the drift region, and a p-type junction barrier region on the silicon carbide layer. The p-type junction barrier region includes a p-type polysilicon region forming a P-N heterojunction with the drift region, and the p-type junction barrier region is electrically connected to the contact. Related methods are also disclosed.