An agricultural harvester (100) comprises a self-propelled vehicle (102); a feederhouse (104); a driveshaft (114) supported on the feederhouse (104), the driveshaft (114) having a first coupler (116) fixed to one end of the driveshaft (114), the first coupler (116) comprising a coupler body (420), a piston (416) disposed in the coupler body (420), and a first key (302) mechanically coupled to the piston (416) to be extended or retracted by the piston (416) to engage a mating coupler on a second driveshaft (120) of an agricultural harvesting head (106) that is supported on the feederhouse (104).

A drive arrangement for driving a first sickle bar section (42) and a second sickle bar section (36) of a harvesting platform (20) comprises a first gearbox (54) and the second gearbox (74) having an output drivingly connected to a respective first end of a respective sickle bar section (36, 42). Drive trains connect the first gearbox (54) and the second gearbox (74) to an input drive shaft (24). At least one of the drive trains comprises a belt drive. A synchronization transmission (82) is coupled to the second ends of the sickle bar sections (36, 42) and couples them in opposite movement directions.

A bale turning apparatus for attachment to a baler to generally align the cylindrical of the bales in each row as the bales are released from the baler. Using the disclosed invention, the bales are essentially turned ninety degrees from the orientation of bales from the position that they are typically released from a round baler. By accomplishing this general alignment of the cylindrical axis of each bale in each row, when baling corn stover or other row crops, the bale loading operation can later be done more efficiently by driving down the rows in the same direction as the combine and baler have traveled.

An agricultural work vehicle includes a vehicle body having longitudinally extending sides. An enclosed engine compartment is configured within the vehicle body. An air inlet is defined in side of the vehicle body for intake of air into the engine compartment. A grain bin forward of the engine compartment includes a grain bin extension skirt mounted above the grain bin. An intake housing is mounted over the air inlet in the vehicle body side and includes a forwardly extending portion mounted alongside the grain bin extension with an inlet opening oriented so as draw air primarily from an area forward of the engine compartment and above the vehicle body.

A harvesting header includes a cutter bed having a plurality of cutting elements arranged transverse to the header and a crop chopping and conditioning region having a crop chopping device and a crop conditioning device. The crop chopping device is configured to chop crop cut by the cutter bed into smaller lengths and the crop conditioning device is configured to crimp the crop to aid in drying. The first chopping roller has a tubular, cylindrically-shaped body and a plurality of parallel knife-mounting lugs extending radially outward along substantially the full length of the body. A plurality of chopping knives are attached to the knife-mounting lugs and arranged around the body, each chopping knife having a length that is shorter than the length of the knife-mounting lug to which it is attached such that each chopping knife covers only a portion of the lateral length of the first chopping roller.

A conditioning device for a forage harvester is equipped with a first roller, profiled in the axial direction, and a second roller, also profiled in the axial direction. The two rollers are rotated, around their axes, in opposite directions and are aligned parallel to one another. An element, profiled, in the axial direction, in a manner complementary to the profile of the first roller and adjacent to the circumference of the first roller, for the removal of crop residues from the roller, extends in a circular arc over a part of the circumference of the first roller.

A crop lifter apparatus has a base member adapted to be attached to a cutting header guard finger about a lifter pivot axis. A plurality of lifter tips with different configurations are releasably attachable to the base member at a mounting position such that the attached lifter tip extends forward from the base member. A bias element is operative to exert a bias force on the base member urging a front portion of the base member forward of the lifter pivot axis to pivot downward about the lifter pivot axis, and the bias force urges the base member to bear against a stop. The tips can be configured to suit various conditions of soils and crops.

The present invention relates to a baler ejection system that may be used with an agricultural harvester, such as a round baler, waste baler, combine, or cotton harvester. More particularly, the bale ejection system uses the motion of two pairs of parallel arms that extend transversely from the sidewalls of a bale chamber at two sets of distinct pivot points. When activated by the operator of the bale ejection system, the two pairs of parallel arms raise simultaneously to expose an outlet through which the bale may be ejected. The bale ejection system is designed to allow a larger outlet for the bale evacuation as compared to existing bale ejection systems that employ circular motion to expose the bale outlet. A formed bale may become ejected by one or more conveyer belts that exert a rearward force on the bale within the bale chamber.

A shield apparatus is mounted on the header of an agricultural implement which includes a rotatable collecting member to direct collected material rearwardly towards a rear discharge opening. The shield apparatus includes a panel member and a mounting bracket assembly which supports the panel member above the rear discharge opening of the header spanning in a lateral direction transversely to the forward working direction such that the panel member extends from a rear edge rearward of the collecting member to a front edge which is spaced forward and upwardly in relation to the rear edge. The shield apparatus ensures that material thrown upwardly above the rear of the header frame is redirected downwardly into the rear discharge opening of the header for collection by the implement in the usual manner. The shield apparatus does not interfere with the visibility of the operator when the panel member is clear.

A decelerator apparatus for mounting at the end of a pneumatic or gravity-fed fruit harvesting or delivery tube. The decelerator comprises a housing with a moving decelerator body aligned with a fruit-receiving inlet connected to the delivery tube. The decelerator body, for example a padded rotating wheel, moves at a speed slower than the speed at which the fruit is delivered into the housing, includes multiple depressions or indentations for receiving and separating fruit, and further defines a compressive deceleration path that moves the fruit in a compressive but protective fit toward a housing exit, releasing the fruit after the fruit has been decelerated to the speed of the moving body.

A suspension system for forage rakes having at least one floating forage rake wheel has a hydraulic cylinder is used for both lift and suspension of the floating forage rake wheel. A hydraulic accumulator provides expansion room for hydraulic fluid to move in and out of the hydraulic cylinder during suspension.

A mower carrying a rotary cutting deck has a height of cut system for adjusting the vertical position of the deck relative to the mower frame for changing or adjusting the height of cut. The height of cut system comprises a pair of parallel cross shafts that carry a plurality of pivotal suspension linkages that connect to the deck, the cross shafts and linkages pivoting jointly with one another and with a pivotal control lever. One of the cross shafts carries a torsion spring to counterbalance the weight of the deck. The control lever is maintained in a plurality of adjusted pivotal positions by a height selection bracket fixed to the frame with the height selection bracket being capable of having its position changed or adjusted relative to the frame by a single adjustment bolt. Each suspension linkage has its effective length adjusted by turning a threaded adjuster carried at the upper end of a connecting rod that is part of each linkage to allow the deck to be leveled relative to a reference plane. The adjustment of the height selection bracket is accomplished without affecting the length adjustments previously made to any of the suspension linkages.

A harvesting machine for threshing crop materials includes a platform supported in front of a chassis, an erecting device having a number pairs of guiding bars attached to the platform and having a channel formed between two bar members of each pair of guiding bars, a guiding element disposed between every two adjacent pairs of guiding bars for guiding a stalk of the crop materials into the channel of the guiding bars, a number of pawls extended into the channel for sending the stalk of the crop materials into the channel, and a cutting device having two or more cutting elements for cutting the stalk into a lower base segment that carries no grain and an upper straw segment that carries grains.

The present invention provides a method for measuring reflective intensity of display surface, including: obtaining a luminance value of a first display and a luminance value of a second display when displaying, the first display and the second display having the same observed luminance, the peripheral of the surface of the first display being surrounded by light-shielding object, the first display and the second display being placed side by side; and obtaining the reflective intensity of the display surface in the ambient based on the luminance value of the first display and the luminance values of the second display when displaying. As such, the present invention provides convenient and accurate means to measure the reflective intensity of display surface.

A flail rotor head attachment for use with any type harvesting machine having crop residue processing elements and including an input opening for receiving crop residue. The attachment includes a frame structure for operatively coupling the attachment to the harvesting machine, a flail rotor and an auger each mounted on the frame structure and a drive mechanism for rotating the flail rotor and the auger. The flail rotor includes a plurality of cutting elements for picking up and chopping crop residue from a field. The auger includes at least two flightings positioned in opposite directions for funneling crop residue towards the opening of the harvesting machine. Another embodiment includes a rake positioned between the flail rotor and the auger, the rake and the flail rotor rotating in the same direction and the auger rotating in an opposite direction.

A mower assembly is provided for cutting around a post. A support structure supports the mower assembly in cantilever fashion. The mower assembly includes a plurality of mower units with each mower unit having a rotary blade. Two or more mower units cooperate to engage and cut around a post and, during the process, the entire mower assembly rotates about an axis enabling the mower units to encircle and efficiently cut grass and other vegetation about the post.

A riding lawn mower may include a cutting deck coupled to a cutting blade, an engine, a deck drive coupled to the engine to receive power for operating the cutting blade, a ground drive coupled to the engine to receive power for movement of the riding lawn mower over ground, and a friction drive coupling the deck drive to the engine.

A combine harvester is provided that separates grain material from material other than grain using multiple processing areas, including a harvesting area, a feederhouse area, a threshing area, a cleaning area, and a grain delivery area. In a location at or prior to entering one of the processing areas, the material may be collected and held until a collection threshold is reached. Once it is determined that the collection threshold is reached, the material forming a first group of material may be transported from the location to the processing area or a subsequent processing area. The first group of material is transported from the location to the processing area or the subsequent processing area substantially simultaneously and thus simulates the gathering of a large amount of crop material even when small plots are involved. In this way, reduced cycle times may be achieved, and the efficiency benefits of large-plot harvesting may be extended to small-plot applications.

A harvester having one or more cutting blades for cutting leafy vegetables with a rotating brush for sweeping harvested leaves into a basket or enclosure. The blades are driven by an oscillatory drive mechanism. The brush may have limp bristles. The harvester may be hand-carried and operated by a motor, which drives both the brush and the cutting blades.

A deck lifting and height of cut assembly for a lawn mower, in which the deck lifting assembly includes at least one movable component and the height of cut assembly includes a height adjustment mechanism having a plurality of stop surfaces. A prop extends between the movable component of the deck lifting assembly and a first stop surface of the height adjustment mechanism to prevent the cutting deck assembly from lowering below a first height. The height adjustment mechanism is adjustable to place a second stop surface in engagement with the prop so that the cutting deck assembly is prevented from lowering below a second height different from the first height. The prop may also be used to maintain the cutting deck assembly in the full-up position during travel of the lawn mower between work areas.

A cutter guard for a rotating blade of a lawn mower, particularly for a robotic, self-guided or autonomous lawn mower forms a cutting bowl in which the blade is mounted for rotation about a generally vertical axis. The guard comprises a generally planar guard section surrounded by an arcuate section, transverse edges of which define an opening in the cutter guard, which in operation is pointed to the front of the lawn mower, to allow uncut grass to be accessed by the cutting blades. The arcuate section comprises a plurality of apertures.

A corn harvesting header comprises a knife bar extending along a front lower edge of a cutting header, with triangular knife sections attached along the bar and a plurality of guards with guard fingers extending forward. Pointed divider pans extend forward from the header such that a slot is formed between adjacent pans. A mounting bracket extends down from a rear of each pan and is attached to forward end portions of a pair of adjacent guard fingers, leaving rear portions of these guard fingers exposed. The divider pans are attached to alternating pairs of guard fingers such that a pair of bare guard fingers extends forward under and laterally adjacent to edges of each slot. The bottom surface of each seed pan is above the guard fingers an elevated distance that is greater than a spacing distance between the guard fingers. The header cuts the corn rows at angle.

A reel lawn mower which has a connection structure for connecting a reel cutting unit to a main body. The reel cutting unit has a spiral cutting reel which is rotated by a prime mover to cut grass together with a bedknife. In the connection structure, in order to connect the reel cutting unit to the main body so that the reel cutting unit rolls around a virtual horizontal line perpendicular to the shaft center of the cutting reel in the center of the axial direction of the cutting reel, the reel cutting unit includes a connecting arm with an arc portion shaped so as to follow a virtual arc centered on the virtual horizontal line. The connecting arm is slidably supported so as to prevent the arc portion from coming off the virtual arc.

A corn header has a row unit frame and an auger sweeping ears of corn toward a center of the corn header. A corn row divider assembly has a snout and gatherer hood hingeably coupled to, and aft of, the snout. An aft end of the gatherer hood is located beneath and to the rear of the fore end of the auger in an operational configuration of the divider assembly. The divider assembly further has a four-point hinge assembly coupling the aft end of the gatherer hood to the row unit frame. The four-point hinge assembly is configured to pivot the gatherer hood between the operational configuration and a non-operational configuration in which the gatherer hood is in a raised condition. The four-point hinge assembly moves the aft end of the gatherer hood forward so that the gatherer hood clears the auger when pivoting to the non-operational configuration.

A grass collection system may have an impeller with a through-shaft that mechanically couples power take off (PTO) energy to the mower deck. The PTO shaft may pass through the impeller and blower housing to power the mower deck, resulting in a compact mechanism. The PTO shaft may pass through a grass tunnel that connects between the blower housing and the mower deck, then may be connected to the mower deck to power the mower blades. The grass collection system may be deployed on a front mounted deck tractor that has front wheel drive. The front wheels may each have a hydrostatic pump and gearbox, and the PTO shaft may pass between or under the front wheel drive systems in connecting to the mower deck.

A windguard mechanism comprising a pair of arms attachable to an agricultural machine and a windguard plate extending between the pair of arms and positioned to hold down crop material processed by a pickup mechanism. The windguard plate comprises a first plate fixed between the pair of arms and a second plate positioned movably with respect to the first plate, wherein working surfaces of the first plate and of the second plate form a windguard working surface of an area independent on the position of the second plate.

A windrow merger includes at least one pickup head member and an internal drive assembly disposed within a longitudinal aperture defined internal to the at least one pickup head member, the drive assembly being for imparting a rotational motion to a plurality of tines by means of a drive shaft operably coupled thereto, the drive shaft extending in opposed directions from the drive assembly. A method of forming the windrow merger is further included.

A rotary implement includes a metallic body that is rotatable around an axis. The metallic body includes a tapered leading edge having an interface surface and an opposite, free surface. The metallic body has a first composition. A metallic layer has a first side surface that is attached to the interface surface and a free, second side surface opposite from the first side surface. The metallic layer has a second, different composition from the first composition. A rotary machine can include an actuator and the rotary implement operably coupled to the actuator. A method for making a rotary implement includes providing the metallic body that has the tapered leading edge having the interface surface and the opposite, free surface. The metallic layer is then attached to the interface surface of the metallic body.

A package includes a device die, which includes a metal pillar at a top surface of the device die, and a solder region on a sidewall of the metal pillar. A molding material encircles the device die, wherein a top surface of the molding material is substantially level with a top surface of the device die. A dielectric layer overlaps the molding material and the device die, with a bottom surface of the dielectric layer contacting a top surface of the device die and a top surface of the molding material. A redistribution line (RDL) extends into the dielectric layer to electrically couple to the metal pillar.

Disclosed herein is a wafer processing method including a processed position measuring step of imaging an area including a beam plasma generated by applying a pulsed laser beam to a wafer, by using an imaging unit during the formation of a laser processed groove on the wafer, and next measuring the positional relation between the position of the beam plasma and a preset processing position. Accordingly, it is possible to check whether or not the laser processed groove is formed at a desired position, in real time during laser processing. If the position of the laser processed groove is deviated, the processed position can be immediately corrected.

A semiconductor device has a plurality of semiconductor die. A first prefabricated insulating film is disposed over the semiconductor die. A conductive layer is formed over the first prefabricated insulating film. An interconnect structure is formed over the semiconductor die and first prefabricated insulating film. The first prefabricated insulating film is laminated over the semiconductor die. The first prefabricated insulating film includes glass cloth, glass fiber, or glass fillers. The semiconductor die is embedded within the first prefabricated insulating film with the first prefabricated insulating film covering first and side surfaces of the semiconductor die. The interconnect structure is formed over a second surface of the semiconductor die opposite the first surface. A portion of the first prefabricated insulating film is removed after disposing the first prefabricated insulating film over the semiconductor die. A second prefabricated insulating film is disposed over the first prefabricated insulating film.

A method of making a semiconductor device can include providing a wafer comprising a plurality of semiconductor die, wherein each semiconductor die comprises an active surface and a backside opposite the active surface. A photosensitive layer can be formed over the wafer and on a backside of each of the plurality of semiconductor die within the wafer with a coating machine. An identifying mark can be formed within the photosensitive layer for each of the plurality of semiconductor die with a digital exposure machine and a developer, wherein a thickness of the identifying mark is less than or equal to 50 percent of a thickness of the photosensitive layer. The photosensitive layer can be cured. The wafer can be singulated into a plurality of semiconductor devices.

A semiconductor package is provided, including: an insulating base body having a first surface with an opening and a second surface opposite to the first surface; an insulating extending body extending outward from an edge of the first surface of the insulating base body, wherein the insulating extending body is less in thickness than the insulating base body; an electronic element having opposite active and inactive surfaces and disposed in the opening with its inactive surface facing the insulating base body; a dielectric layer formed in the opening of the insulating base body and on the first surface of the insulating base body, the insulating extending body and the active surface of the electronic element; and a circuit layer formed on the dielectric layer and electrically connected to the electronic element. The configuration of the insulating layer of the invention facilitates to enhance the overall structural rigidity of the package.

A semiconductor device includes a first moisture-resistant ring disposed in a peripheral region surrounding a circuit region on a semiconductor substrate in such a way as to surround the circuit region and a second moisture-resistant ring disposed in the peripheral region in such a way as to surround the first moisture-resistant ring.

A manufacturing method of a package substrate is provided. The method includes forming a first circuit layer on a carrier. A passive component is disposed on the first circuit layer and the carrier. A dielectric layer is formed on the carrier to embed the passive component and the first circuit layer in the dielectric layer. A second circuit layer is formed on the dielectric layer. The carrier is removed from the dielectric layer. A manufacturing method of a chip package is also provided.

Presented herein are an interconnect structure and method for forming the same. The interconnect structure includes a contact pad disposed over a substrate and a connector disposed over the substrate and spaced apart from the contact pad. A passivation layer is disposed over the contact pad and over connector, the passivation layer having a contact pad opening, a connector opening, and a mounting pad opening. A post passivation layer including a trace and a mounting pad is disposed over the passivation layer. The trace may be disposed in the contact pad opening and contacting the mounting pad, and further disposed in the connector opening and contacting the connector. The mounting pad may be disposed in the mounting pad opening and contacting the opening. The mounting pad may be separated from the trace by a trace gap, which may optionally be at least 10 μm.

A method for wafer-level packaging includes providing a substrate having a conductive metal pad formed on the surface of the substrate; forming a metal core on the top of the conductive metal pad with the metal core protruding from the surface of the substrate; then, forming an under bump metal layer on the top surface and the side surface of the metal core; and finally, forming a bump structure on the top of the under bump metal layer.

A semiconductor mounting apparatus includes a storing unit that stores a liquid or a gas, a contact unit that comes into contact with a semiconductor chip when the storing unit is filled with the liquid or the gas, and a sucking unit that sucks up the semiconductor chip to bring the semiconductor chip into close contact with the contact unit.

A system for determining thickness variation values of a semiconductor substrate comprises a substrate vacuumed to a pedestal that defines a reference plane for measuring the substrate. A measurement probe assembly determines substrate CTV and BTV values, and defines a substrate slope angle. A thermal bonding assembly attaches a die to the substrate at a bonding angle congruent with the substrate slope angle. A plurality of substrates are measured using the same reference plane on the pedestal. Associated methods and processes are disclosed.

A bump-on-trace (BOT) interconnection in a package and methods of making the BOT interconnection are provided. An embodiment BOT interconnection comprises a landing trace including a distal end, a conductive pillar extending at least to the distal end of the landing trace; and a solder feature electrically coupling the landing trace and the conductive pillar. In an embodiment, the conductive pillar overhangs the end surface of the landing trace. In another embodiment, the landing trace includes one or more recesses for trapping the solder feature after reflow. Therefore, a wetting area available to the solder feature is increased while permitting the bump pitch of the package to remain small.

A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element; (b) ultrasonically forming tack bonds between ones of the first conductive structures and respective ones of the second conductive structures; and (c) forming completed bonds between the first conductive structures and the second conductive structures.

Package structures and methods are provided to integrate optoelectronic and CMOS devices using SOI semiconductor substrates for photonics applications. For example, a package structure includes an integrated circuit (IC) chip, and an optoelectronics device and interposer mounted to the IC chip. The IC chip includes a SOI substrate having a buried oxide layer, an active silicon layer disposed adjacent to the buried oxide layer, and a BEOL structure formed over the active silicon layer. An optical waveguide structure is patterned from the active silicon layer of the IC chip. The optoelectronics device is mounted on the buried oxide layer in alignment with a portion of the optical waveguide structure to enable direct or adiabatic coupling between the optoelectronics device and the optical waveguide structure. The interposer is bonded to the BEOL structure, and includes at least one substrate having conductive vias and wiring to provide electrical connections to the BEOL structure.

A semiconductor device includes a substrate comprising a trench; a gate dielectric layer formed over a surface of the trench; a gate electrode positioned at a level lower than a top surface of the substrate, and comprising a lower buried portion embedded in a lower portion of the trench over the gate dielectric layer and an upper buried portion positioned over the lower buried portion; and a dielectric work function adjusting liner positioned between the lower buried portion and the gate dielectric layer; and a dipole formed between the dielectric work function adjusting liner and the gate dielectric layer.

A method for forming a V-NAND device is disclosed. Specifically, the method involves deposition of at least one of semiconductive material, conductive material, or dielectric material to form a channel for the V-NAND device. In addition, the method may involve a pretreatment step where ALD, CVD, or other cyclical deposition processes may be used to improve adhesion of the material in the channel.

A method of forming a ferroelectric memory cell. The method comprises forming an electrode material exhibiting a desired dominant crystallographic orientation. A hafnium-based material is formed over the electrode material and the hafnium-based material is crystallized to induce formation of a ferroelectric material having a desired crystallographic orientation. Additional methods are also described, as are semiconductor device structures including the ferroelectric material.

Embodiments of the inventive concepts provide a method for manufacturing a semiconductor device. The method includes forming a stack structure including insulating layers and sacrificial layers which are alternately and repeatedly stacked on a substrate. A first photoresist pattern is formed on the stack structure. A first part of the stack structure is etched to form a stepwise structure using the first photoresist pattern as an etch mask. The first photoresist pattern includes a copolymer including a plurality of units represented by at least one of the following chemical formulas 1 to 3, wherein “R1”, “R2”, “R3”, “p”, “q” and “r” are the same as defined in the description.

A performance of a semiconductor device is improved. A film, which is made of silicon, is formed in a resistance element formation region on a semiconductor substrate, and an impurity, which is at least one type of elements selected from a group including a group 14 element and a group 18 element, is ion-implanted into the film, and a film portion which is formed of the film of a portion into which the impurity is ion-implanted is formed. Next, an insulating film with a charge storage portion therein is formed in a memory formation region on the semiconductor substrate, and a conductive film is formed on the insulating film.

A method of manufacturing a semiconductor device according to one embodiment includes forming a first film including a first metal above a processing target member. The method includes forming a second film including two or more types of element out of a second metal, carbon, and boron above the first film. The method includes forming a third film including the first metal above the second film. The method includes forming a mask film by providing an opening part to a stacked film including the first film, the second film and the third film. The method includes processing the processing target member by performing etching using the mask film as a mask.

Embodiments of the inventive concept provide a method for manufacturing a semiconductor device. The method includes forming a stack structure by alternately and repeatedly stacking insulating layers and sacrificial layers on a substrate, sequentially forming a first lower layer and a first photoresist pattern on the stack structure, etching the first lower layer using the first photoresist pattern as an etch mask to form a first lower pattern. A first part of the stack structure is etched to form a stepwise structure using the first lower pattern as an etch mask. The first lower layer includes a novolac-based organic polymer, and the first photoresist pattern includes a polymer including silicon.

The present invention provides a method for manufacturing the N-type TFT, which includes subjecting a light shielding layer to a grating like patternization treatment for controlling different zones of a poly-silicon layer to induce difference of crystallization so as to have different zones of the poly-silicon layer forming crystalline grains having different sizes, whereby through just one operation of ion doping, different zones of the poly-silicon layer have differences in electrical resistivity due to difference of grain size generated under the condition of identical doping concentration to provide an effect equivalent to an LDD structure for providing the TFT with a relatively low leakage current and improved reliability. Further, since only one operation of ion injection is involved, the manufacturing time and manufacturing cost can be saved, damages of the poly-silicon layer can be reduced, the activation time can be shortened, thereby facilitating the manufacture of flexible display devices.