An over-current protection device has a PTC device, first and second electrodes and an insulation layer. The PTC device comprises first and second electrically conductive members and a PTC layer laminated between the first and second electrically conductive members. The first and second electrodes are electrically connected to the first and second electrically conductive members, respectively. The insulation layer is disposed on a surface of the first electrically conductive member. The device is a stack structure extending along a first direction, and comprises at least one hole extending along a second direction substantially perpendicular to the first direction. The value of the covered area of the hole divided by the area of the form factor of the over-current protection device is not less than 2%, and the value of the thickness of the device divided by the number of the PTC devices is less than 0.7 mm.

A resistance component includes a stack of ceramic layers and inner electrodes. Inner electrodes of a first type are electrically conductively connected to a first external contact and inner electrodes of a second type are electrically conductively connected to a second external contact. The inner electrodes of the first type are arranged such that there is no overlap with the inner electrodes of the second type. An inner electrode of a third type, which is electrically conductively connected neither to the first external contact nor to the second external contact, at least partially overlaps the inner electrodes of the first type and the inner electrodes of the second type.

In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.

A chip resistor includes an insulating substrate, top terminal electrodes formed on top surface of the substrate using silver-based cermet, bottom electrodes, resistive element that is situated between the top terminal electrodes and overlaps them partially, an optional internal protective coating that covers resistive element completely or partially, an external protective coating that covers completely the internal protection coating and partially covers top terminal electrodes, a plated layer of nickel that covers face sides of the substrate, top and bottom electrodes, and overlaps partially external protective coating, finishing plated layer that covers nickel layer. The overlap of nickel layer and external protective layer possesses a sealing property because of metallization of the edges of external protective layer prior to the nickel plating process.

The invention relates to a main housing element for a multi-part housing of an electrical device. The main housing element consists of a frame element and at least one connector element integrated in the frame element and produced in one piece with the frame element. The connecting region between the at least one connector element and the frame element is configured as a predetermined breaking point. In the course of assembly of the main housing element a mechanical separation of the connector element from the frame element takes place, whereby the connector element and the frame element are uncoupled.

It is an object to provide a configuration with an enhanced sensing accuracy, in which a shunt resistance main body and a terminal member are formed as separate pieces. A shunt resistor includes a resistance main body and a terminal member (21) that is electrically connected to the resistance main body. The terminal member (21) includes a resistance connection portion (23) to be in contact with the resistance main body, and a circuit connection portion (24) provided so as to extend from the resistance connection portion (23). The circuit connection portion (24) is divided into two parts by a slit (27) being formed therein. The slit (27) is formed up to a part of the resistance connection portion (23).

Various aspects provide for structures and devices to protect against spurious electrical events (e.g., electrostatic discharge). Some embodiments incorporate a voltage switchable dielectric material (VSDM) bridging a gap between two conductive pads. Normally insulating, the VSDM may conduct current from one pad to the other during a spurious electrical event (e.g., shunting current to ground). Some aspects include gaps having a gap width that is greater than 50% of a spacing between electrical leads connected to the pads. Some devices include single layers of VSDM. Some devices include multiple layers of VSDM. Various devices may be designed to increase a ratio of active volume (of VSDM) to inactive volume.

A method of manufacturing a chip resistor includes forming a resistor assembly in which a conductive member including portions separated from each other in a first direction is provided in a resistance body member; and dividing the resistor assembly into chip resistors, each including a chip-shaped resistance body formed by a part of the resistance body member, a pair of main electrodes formed by a part of the conductive member and separated from each other in the first direction, and a pair of sub-electrodes formed by a part of the conductive member, separated from each other in the first direction, and adjacent to the main electrodes in a second direction perpendicular to the first direction with concave portions recessed in the first direction interposed therebetween, by punching.

The object of the invention is to provide a method and an apparatus that allow production of metal plate chip resistors having a relatively low resistance with high accuracy and yield through simple process. The object is achieved by apparatus for manufacturing metal plate chip resistors including cutting mold for cutting intermediate product strip transversely to obtain worked product chip, ohm meter for measuring the resistance of the worked product chip, control device having a calculating part for performing a calculation using the resistance measured by the ohm meter to work out a width in which the strip is to be cut transversely so as to obtain a worked product chip of a desired resistance, and cutting width adjustor for making an adjustment so that the strip is to be cut transversely in the width obtained from the calculating part.

An apparatus and method for improved current shunt sensing in an electrical system, such as a renewable energy electrical system, is disclosed. A current shunt according to aspects of the present disclosure includes a conductive portion that is placed in series with an electrical system The current shunt includes a sensing element that is used to measure the voltage across the conductive portion of the current shunt. The sensing element has an increased width relative to the width of the conductive portion of the shunt. The increased width of the sensing element provides for improved current shunt sensing that results in more accurate voltage (and thus current) measurements across a wide range of frequencies.

There is provided an array type chip resistor including: a chip body, four pairs of lower electrodes disposed on both sides of a lower surface of the chip body and formed so as to be extended to edges of the chip body, side electrodes formed so that the lower electrodes are extended to sides of the chip body, and a resistor interposed between the lower electrodes on the lower surface of the chip body and electrically connected to the lower electrode through a contact portion, wherein when a width of the side electrode is defined as d1, a distance between adjacent side electrodes is defined as d2, and a height of the side electrode is defined as h, in the case in which d1/d2 is 0.5 to 1.5, a value of h is 4,300/d1 μm or above and is 0.24d2+87.26 μm or less.

A piezoresistive sensor device and a method for making a piezoresistive device are disclosed. The sensor device comprises a silicon wafer having piezoresistive elements and contacts in electrical communication with the elements. The sensor device further comprises a contact glass coupled to the silicon wafer and having apertures aligned with the contacts. The sensor device also comprises a non-conductive frit for mounting the contact glass to a header glass, and a conductive non-lead glass frit disposed in the apertures and in electrical communication with the contacts. The method for making a piezoresistive sensor device, comprises bonding a contact glass to a silicon wafer such that apertures in the glass line up with contacts on the wafer, and filling the apertures with a non-lead glass frit such that the frit is in electrical communication with the contacts. The use of a lead free glass frit prevents catastrophic failure of the piezoresistive sensor and associated transducer in ultra high temperature applications.

A surface mount chip resistor for increasing power handling capabilities of radio frequency (RF) circuits and for minimizing parasitic capacitance and inductance effects, the chip resistor includes a ceramic substrate having a main portion and an outrigger. A resistor element is between an input contact and an output contact on a top surface of the main portion. A ground plane attachment area is on a top surface of the outrigger. The ground plane attachment area is mounted to a ground plane of a circuit board to provide a heat pathway for dissipating heat generated by the resistor element.

There are provided a chip resistor and a method of manufacturing the same. The chip resistor includes a ceramic substrate; an adhesion portion formed on a surface of the ceramic substrate; and a resistor formed on the adhesion portion, wherein the adhesion portion includes at least one of copper (Cu), nickel (Ni), and copper-nickel (Cu—Ni).

An electronic power apparatus is provided, including a circuit board having a conductive pads and a sense pad coupled to an output signal, and an actuator having a wiper portion accommodating a conductive wiper. The wiper includes a first end arranged to engage the sense pad and a second end arranged to slidably engage at least one of the conductive pads on the circuit board. The conductive pads are arranged in a first row of conductive pads and a second row of conductive pads in parallel with and at a distance to the first row of conductive pads. An alignment of the second row of conductive pads is offset with respect to the first row of conductive pads.

A substrate device includes an embedded layer of VSD material that overlays a conductive element or layer to provide a ground. An electrode, connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.

Provided is a non-linear resistive element which improves the degree of freedom of design of its mounting space. A ceramic sheet 10 which constitutes the non-linear resistive element is configured by a plurality of ceramic pieces 11 being consolidated in a plate like form by an insulating resin 12. One or a plurality of ceramic pieces 11 configure each of a plurality of conductive paths which penetrate the ceramic sheet 10 in a thickness direction thereof, and the ceramic pieces 11 which configure both ends of the conductive paths partially projects from the insulating resin 12.

A touch panel includes a touch sensor layer including a first transparent electrode and a second transparent electrode, wherein an arrangement direction of the first transparent electrode can be perpendicular to that of the second transparent electrode, and both of the first and second transparent electrodes include two transparent metallic patterns which are stacked and electrically connected to each other.

A resistive device includes a resistive layer, a flexible substrate arranged on the resistive layer, and an electrode layer. The electrode layer includes two electrode sections arranged below the resistive layer and separate to each other. Moreover, a method for manufacturing the resistive device with flexible substrate is also disclosed.

An elastomeric particle (1, 1, 1″) comprises a non-conducting elastomeric body (2) having an electrically conducting surface (4a, 4b, 6). Pressure sensor elements (20, 20', 20″; 30, 30', 30″, 30'″) comprising such elastomeric particles are disclosed, as well as sensor clusters (50″, 50'″, 50IV, 50V, 50VI, 50VII, 70) comprising such sensor elements. There is also disclosed a pressure sensor element (40, 40', 40″, 40'″, 40IV, 40V, 40VI, 40VII), comprising a resistive element (44, 44', 44″) providing a conduction path, a first electrode (42a, 42a-1, 42a-2, 42a-3, 42a-4, 42a-5, 42a-6), connected to the resistive element, a second electrode (42b, 42b'), which in a quiescent state is spaced from said first electrode, wherein the second electrode, when the pressure sensor element is subjected to a pressure, is arranged to contact said first electrode or said resistive element. Systems comprising such sensor elements and sensor clusters are disclosed, as well as methods of their fabrication.

A touch sensing apparatus has a plurality of unit regions, and each of the unit regions includes a first substrate, a second substrate and a spacer structure. The first substrate has a first electrode layer thereon. The second substrate is disposed opposite to the first substrate and has a second electrode thereon. The spacer structure is disposed between the first substrate and the second substrate. In particular, there are plural of sensing units in each of the unit regions, and sensing trigger forces of the sensing units in the unit region are not completely the same.

The invention provides a movable contact movable on a fixed contact or a resistor. The movable contact includes first and second sliders. The first and second sliders are arranged in such a manner as to slide along different sliding tracks from each other on the fixed contact or the resistor in accordance with movement of the movable contact.

A five axis vise includes two separated vise body portions that are supported on a machine tool table or other support that fixes the vise body portions in position. The vise body portions have jaws spaced up from the machine tool table sufficiently to permit machining five surfaces of a work piece held in the jaws. A vise screw is rotatably mounted in one of the vise body portions, and extends to the other vise body portion to actuate a movable jaw on the other vise body portion. The vise screw is threaded into a jaw nut that has a drive surface that engages and drives a driven surface on the movable jaw, with the drive and driven surfaces being inclined relative to the axis of force application to provide a downward force component on the movable jaw as it is tightened. The vise screw is an assembly of a threaded shank or shaft and a hub that is rotatably mounted in one of the body portions, with the threaded shank or shaft being locked in position in the hub.

A fixing device for fixing a workpiece includes a base, a first pressing block pressing the workpiece to the base, a second pressing block, a first support member, a second support member, and a side pressing block. The workpiece includes a preprocessing portion to be machined, which has an inner surface and an outer surface, the inner and outer surfaces of the preprocessing portion are sandwiched between non-rigid materials during a machining process to avoid the generating of swarfs.

A clamping mechanism includes a positioning member, a support plate, a frame, a fastening assembly, and an operating assembly. The support plate defines a through hole. The fastening assembly is fixed to the frame. The fastening assembly includes a fastening member and an elastic member. The positioning member extends through the through hole of the support plate, and is fastened by the fastening member under an elastic force of the elastic member. The operating assembly resists the fastening member, thereby driving the fastening member away from the positioning member.

A work orienting plate or angled vise parallel for use with a machine vise and which angled plate has first, second and third reference edges with the second and third reference edges being spaced apart side edges that are perpendicular to the first edge. Angled work piece support edges join the second and third reference edges, respectively. The angled work piece support edges are at different angles from one another so that a work piece can be supported on any one of the edges relative to a reference surface of a vise on which the work orienting plate is mounted to position the work piece at selected angles for machining angled surfaces.

A welding workbench assembly comprises a base. The welding workbench assembly further comprises a first wraparound barrier comprising at least three panels, including a first panel, a second panel, and a third panel. The second panel is adjacent to the first panel at a first end of the first panel and the third panel is adjacent to the first panel at a second end of the first panel. The welding workbench assembly further comprises a second wraparound barrier comprising at least three panels, including a fourth panel, a fifth panel, and a sixth panel. The fifth panel is adjacent to the fourth panel at a first end of the fourth panel and the sixth panel is adjacent to the fourth panel at a second end of the fourth panel.

A ski tip hold down assembly for holding the tip end of the ski. The ski tip hold down assembly having a base attached to a work bench and an upright stand affixed to the base. The upright stand having a ski rest on a top surface thereof and a ski tip hold down bar secured to the upright stand in spaced apart relation to the ski rest defining an opening adapted to receive a ski tip, with the ski oriented in a base-up configuration, with the ski tip extending underneath the ski tip hold down bar. The apparatus further including a tail rest assembly having a base adapted to be used on the work bench in spaced apart relation to the ski tip hold down assembly and further including an upright stand affixed to the base with a ski rest provided on a top surface thereof.

A system and method of painting parts of large dimensions that present a certain amount of flexibility that makes their shape geometrically unstable in the event of being moved. The surface of a part is moved in front of a paint spray device by an arm of a robot, while the spray device remains stationary relative to the robot and while the part is being deformed. Other elements include a gripper for gripping parts of large dimensions, the gripper being adapted to implement the method; an installation; and a booth for performing surface treatment of parts.

Disclosed herein is a rotary jig for battery cells to successively manufacture battery cells having different sizes including a main body configured to have a hexahedral structure having a rotary rod mounted at a lower end thereof, the main body being provided at sides thereof with mounting frames having sizes corresponding to sizes of battery cells so that the battery cells can be uprightly mounted in the mounting frames in a state in which electrode terminals of the battery cells are exposed upward, a die disposed at a lower end of the main body, the die connected to the rotary rod so that the die can be rotated manually or by a rotary motor, and support members formed at the die to support the mounting frames of the main body and the battery cells mounted in the mounting frames, wherein the rotary rod is rotated so that resistance welding is performed with respect to a portion of one of battery cells to be welded using a welding rod located above the battery cell in a state in which the battery cells are mounted to the corresponding sides of the main body.

A part fixturing system for securing a workpiece includes an expanding clamping device and a work holding device. The expanding clamping device includes a clamp base portion, first and second traversing wedge blocks, an actuation screw, and a clamp plate portion. The clamp base portion comprises a longitudinal recess, and the traversing wedge blocks are located inside the longitudinal recess, each block including an inclined contact surface and a threaded aperture. The actuation screw passes through the longitudinal recess of the clamp base portion and the threaded apertures of the traversing wedge blocks. The clamp plate portion comprises first and second declined contact surfaces. The work holding device comprises first and second support columns that define a longitudinal loading envelope. The expanding clamping device is positioned inside the longitudinal loading envelope of the work holding device and couples the workpiece to the first and second support columns.

An aspect of the present invention is drawn to a device for use with an electrostatic chuck having a top surface and a bottom surface, the top surface being separated from the bottom surface by a width, the electrostatic chuck additionally having a hole therein, the hole having a first width at the top surface and having a second width at the bottom surface, the first width being less than the second width, the top surface being capable of having wafer disposed thereon. The device includes a pin, a shaft, a neck portion and an outer housing portion. The pin has a pin width less than the first width. The shaft has a pin-holding portion, an end portion and a central portion disposed between the pin-holding portion and the end portion. The central portion has a first bearing portion. The outer housing portion has a first end and a second end and includes a second bearing portion. The shaft is disposed within the outer housing portion and is moveable relative to the outer housing portion. The neck portion is disposed at the first end. The second bearing portion is stationary relative to the neck portion. The first bearing portion is movable relative to the second bearing portion.

A support disk fixing apparatus which includes an upper surface to which a wafer is bonded, a lower surface, a cylindrical side surface between the upper surface and the lower surface, and a chamfered portion between the upper surface and the side surface, includes a base upon which the support disk is placed; and a fixture that is provided on the base, and that has a first surface that abuts against the side surface of the support disk and covers the side surface of the support disk, and a second surface that abuts against the chamfered portion of the support disk and covers the chamfered portion of the support disk.

The bonding apparatus is capable of effectively increasing temperature of a substrate and reducing occurrence of position gaps and poor connection in a process of flip-chip-bonding semiconductor devices to the substrate. The bonding apparatus comprises: a supporting unit for supporting the substrate, on which the semiconductor devices have been adhered by a non-conductive; and a heating/pressing unit for heating and pressing the substrate, the heating/pressing unit having a built-in heat source and a clamping face, onto which the substrate supported by the supporting unit is pressed. The substrate supported by the supporting unit is moved toward the clamping face of the heating/pressing unit so as to preheat the substrate and the semiconductor devices by radiation heat. Then, the semiconductor devices are pressed onto the clamping face of the heating/pressing unit so as to cure the non-conductive adhesive and bond bumps of the semiconductor devices to terminal sections of the substrate.

An apparatus for supporting a workpiece during processing of the workpiece is disclosed. The apparatus comprises: a chassis having a vacuum chamber that is connectable to a vacuum source; a supporting device rotatable relative to the chassis, the supporting device having a hollow compartment and a supporting surface for holding the workpiece; and at least one sealing device arranged between the chassis and the supporting device, to provide an air-tight seal between the chassis and the supporting device while allowing for rotation of the supporting device with respect to the chassis, so as to form a vacuum passage extending from the supporting surface of the supporting device through the hollow compartment of the supporting device and the vacuum chamber of the chassis to the vacuum source, to thereby hold the workpiece to the supporting surface of the supporting device during processing of the workpiece.

The present invention relates to an adjusting device of wafer machine, which includes a rotary adjustment assembly that is rotatable to cause the rotation of a rod so as to displace a support block thereby elevating or lowering a support post. A balance board is thus caused to move a wafer substrate so as to realize balancing of wafer through the support post, whereby efficient adjustment of the wafer machine to a balanced position can be achieved without extra expense of time in adjustment operation and thus accelerating the time of manufacturing process and providing extremely high precision and further effectively reducing the potential risk of damage caused by over-adjustment.

A loading container (10) for a washing machine (60) comprises a containing body (12) to support and position objects to be washed inside the washing machine (60) or washing devices (20, 22) containing the objects to be washed. The container (10) also comprises a base body (14), located below the containing body (12), and a rotation unit (45) to connect rotatably the base body (14) and the containing body (12) so as to allow a selective reciprocal angular positioning of the containing body (12) and the base body (14).

A turbine component repair apparatus includes: a first die having male and female halves for clamping a first section of a turbine blade with a platform and a root portion of an airfoil, the first die having a recess shaped to receive the root portion and retain a faying surface thereof in predetermined alignment; and a second die having male and female halves for clamping a repair section which defines a tip portion of the airfoil, the second die having a second recess shaped to receive the tip portion and retain a faying surface of the tip portion in predetermined alignment. The first and second dies have mating front faces configured to align their bottom surfaces in a common plane. A alignment device is removably attached to the second die to temporarily align the repair section in the absence of the male half of the second die.

A rocking jaw gripper for restraining tubulars including an arm with a rocking jaw gripper rocker jaw, a rocking jaw gripper frame connected with the arm, a locking pin connecting the rocking jaw gripper frame to the chain cylinder, a hinge pin connecting the rocking jaw gripper frame to the arm and a plate jaw fastener retaining the rocker jaw body between the top plate and the bottom plate by engaging the tail hole of the rocker jaw body. When the rocking jaw gripper is engaged, it acts to restrain the movement of a tubular during make-up and break-out.

A reconfigurable clamping system is disclosed. An example clamping system for securing a workpiece comprises a retention assembly and an inflatable bladder. The retention assembly comprises a plurality of links, each pair of adjacent links having a pivotal connection to enable the retention assembly to be configured to the general shape of a workpiece, and each pair of adjacent links having a locking mechanism to selectively lock an angular relationship between the pair. The inflatable bladder is coupled between the retention assembly and the workpiece and is to apply a clamping force to the workpiece.

A spring clamp includes a first body which comprises a gripping portion and a clamping portion, a second body which comprises a gripping portion and a clamping portion, a first pivot element which pivotally connects the first body and the second body, and a locking mechanism which comprises at least a pair of friction pair components. The first friction pair component is arranged on the first body, and includes a first friction pair element; and the second friction pair component is arranged on the second body, and includes a second friction pair element. The first and second friction pair elements rub against each other to effect the locking function. The rubbing of the friction pair elements occurs mainly in the plane perpendicular to the first pivot element axis.

A hand tool for inserting a large variety of connector components into narrow plastic irrigation piping is disclosed. This tool is an improved and progressive development of my previous Israeli patent no: 152089 in that it is designed to work with a large variety of connector components and is designed to accommodate both sizes of narrow spaghetti piping, whereas the previous patent could accommodate only a single size of narrow piping. The tool as shown in FIG. 2 has a body onto which all the elements are connected and the body is configured to sit comfortably in the palm of the hand. When pressing down on the handle, the grips secure the narrow piping and cause a connector component, deployed in appropriate recess provided in the tool to be easily inserted into the narrow piping.

A rotating cylinder includes and a main body, a piston head, a piston rod and a guide assembly. The piston head slidably is received within the main body. The piston rod partially received within the main body, the piston head is fixed to the piston head, the piston rod defines one or more guiding groove adjacent to the piston head, the guiding groove includes a straight portion, a first helix portion and a second helix portion, the straight portion extends axially toward the piston head, the first helix portion curvedly extends away from the straight portion toward the piston head, the second helix portion curvedly extends from an end of the first helix portion toward a direction away from the piston head and the straight portion. The guide assembly is mounted on the main body and includes one or more guiding member slidably engaged with the guiding groove.

An interlocking and removable tool for floral arranging, consisting of two interlocking pieces which form a sturdy grid when assembled. This grid is placed on top of a vase, jar, bowl, or other vessel used for housing arranged flowers. This grid keeps flowers in place while being arranged, without falling over, and allows the user to construct floral arrangements with ease. When the desired arrangement is complete, the interlocking components slide apart and are removed without disrupting the floral arrangement.

The present invention is directed to apparatus and methods for clamping along a work piece. In one embodiment, a clamping system includes one or more force applying units each including a plunger or force applying member adapted to apply clamping force to the work piece, and one or more coupling units linked with the force applying units forming a chain of force applying units and coupling units. The coupling units may include a lockable pivot adapted to pivot to conform the chain to the surface of the work piece when unlocked, and adapted to be locked when at least one of the plurality of force applying units applies clamping force to the work piece. In another embodiment, a clamping system may include multi-axis pivot units. In a further embodiment, a clamping system may include length adjusting units.

A support structure for supporting a semiconductor device during a bonding operation is provided. The support structure comprises a body portion defining an upper surface configured to support a semiconductor device during a bonding operation. The upper surface defines a constraining feature for constraining at least a portion of the semiconductor device during the bonding operation.

A device for cleaning trays comprises a tub that has a bottom and a wall. The tub is dimensioned such that a baking tray can be placed therein. The device further comprises a dish drain that can be placed in the tub. Said device for cleaning a baking tray uses only a small amount of space in a kitchen and is easy to handle. In fact, in a typical kitchen that already has a dish drain, the device requires no additional space.

A prosthetic inserter includes an inserter head having at least first and second bosses, at least one of the bosses movable from a first position to a second position, that couple the inserter to a femoral provisional component via a pair of corresponding apertures, such as drill holes, within the articulating surfaces of a selected one of a series of femoral provisional components. Each provisional component of the series is capable of having different aperture distances measured between a respective pair of apertures. The bosses of the inserter are biased into an engagement position in which the inserter can be secured to a femoral provisional component to eliminate the need for an external engagement force to be supplied to the inserter.

A device for recontouring a gas turbine blade includes at least one support configured to rest on an edge of the gas turbine blade during the recontouring, at least one side bearing configured to rest on an intake side or an outlet side of the gas turbine blade during the recontouring and a machining unit for machining the gas turbine blade. The machining unit is configured to fuse at least one partial area of the edge of the gas turbine blade using a beam of energy that is targeted such that material of the blade solidifies into a new contour, substantially without the addition of supplementary material.

An image forming apparatus includes an image forming part including a recording head to form an image on a recording medium, a conveyance mechanism disposed opposite the image forming part to convey the recording medium, and a cover closably openable relative to a body of the image forming apparatus and disposed opposite the conveyance mechanism with the image forming part interposed therebetween. The recording head is detachably attachable to the cover and is configured to move away from the conveyance mechanism when the cover is opened.