A method for scheduling a charge of a plug-in electric vehicle (PEV) includes receiving, by a load management system, PEV information from a PEV plugged into an electric vehicle supply equipment (EVSE); transformer information from a transformer management system, the transformer information relating to a transformer associated with the EVSE; determining, by the charging information based on the PEV information and transformer information; providing the charging information to the PEV.

According to some embodiments, battery charge management using a scheduling application is disclosed. A first parameter may be received from a scheduling application running on a mobile computing device having a battery pack. Based on at least the first parameter and battery pack data, a required charge percentage for the battery pack may be determined and the remaining capacity of the battery pack may be determined. If the remaining capacity of the battery pack is less than the required charge percentage, a charge termination voltage may be determined and the battery pack may be charged to the charge termination voltage.

An electricity generation device includes a permanent-magnet electric generator with three or more phase windings each having an output terminal and connected to a neutral point, and bidirectional semiconductor switching circuits capable of interrupting connections between the respective phase windings and the neutral point. Each switching circuit allows current to flow in both directions. A gate signal generation circuit outputs to one of the switching circuits during a period including the time at which the AC voltage excited in the corresponding phase winding turns from positive to negative and during a period including the time at which the AC voltage excited in the corresponding phase winding turns from negative to positive. A startup gate signal output circuit outputs a startup gate signal to all of the bidirectional semiconductor switching circuits when the permanent-magnet electric generator is to be started.

An on-demand electric power system for providing on-demand electric power in remote locations. The on-demand electric power system generally includes a protective housing, an engine-generator within the protective housing, a control switch electrically positioned between the engine-generator and an electric load, and a control unit in communication with the engine-generator and the control switch to control operation of the engine-generator along with electrical power to the electric load. The control unit detects when electrical power is required by an electric load and then first starts the engine-generator. After a period of time, the control unit then closes the control switch to provide electrical power to the electric load.

The regulator/brush-holder assembly (1) comprises a support (2) and an electrical circuit (5, 6) comprising a regulating element (5) connected by microwires to a trace circuit (6). The electrical circuit further includes a filtering circuit (10) separate from the regulating element and connected by microwires to the trace circuit. According to one particular embodiment, the filtering circuit comprises an insulating substrate (11) and surface-mounted components (C1, C2, S1, S2, V). A ground plane (19) and/or one or more ground pads may be provided for connection to a ground trace of the trace circuit. The filtration frequencies of the filter circuit extend from 100 kHz to 1 GHz.

A water heater system comprises a water tank, a burner plenum, a flue, a blower, a combustion air passageway, a dilution air passageway, an upstream manifold, and a downstream manifold. The upstream manifold divides air from the blower so that some air flows through the combustion air passageway to the burner plenum and some air flows through the dilution air passageway to the downstream manifold. The downstream manifold combines the air from the dilution air passageway with combustion products from the flue.

A livestock guide and manipulator panel prod is disclosed by this invention wherein electronic shocking circuitry is provided in combination with a hand-held livestock guiding and directing panel having electronic prods of said circuitry arranged on the surface of the panel.

When the present time of a clock circuit is a medication time recorded in advance in a SD card, a notice that the medication time has come is given by a voice output portion or the like. Presence/absence of a medicine package in each block of a medicine package case is sensed by a medicine package sensor. The time point and the presence/absence of the medicine package are recorded in the SD card. A notice corresponding to the presence/absence is output. At a time except for the medication time, taking-out of the case, opening/closing of the cover, taking-out and return of the medicine package are recorded in the SD card based on detection signals from the medicine package sensor, medicine package case sensor, and case cover opening/closing sensor. A notice corresponding to the sensed situation is output.

The present invention provides a technique which can disassemble a mandrel having a substantially cylindrical shape and being dividable into a plurality of segments, easily and efficiently. The disassembling method comprises, in the mandrel adhesively attached with a composite material structure on an outer peripheral surface thereof, a rotation step of rotating the pair of support rings along with the mandrel to position a segment which is a detached target to an uppermost portion; and a segment detaching step of detaching the segment which is the detached target positioned at the uppermost portion, from the pair of support rings; wherein in the segment detaching step, the segment which is the detached target is moved in a vertically downward direction to a position inside of the mandrel, between the pair of support rings, and is carried out from between the pair of support rings.

Electrode configurations for electric-field enhanced performance in catalysis and solid-state devices involving gases are provided. According to an embodiment, electric-field electrodes can be incorporated in devices such as gas sensors and fuel cells to shape an electric field provided with respect to sensing electrodes for the gas sensors and surfaces of the fuel cells. The shaped electric fields can alter surface dynamics, system thermodynamics, reaction kinetics, and adsorption/desorption processes. In one embodiment, ring-shaped electric-field electrodes can be provided around sensing electrodes of a planar gas sensor.

The present invention provides a manufacturing apparatus which can realize so-called sequential substrate transfer and can improve throughput, even when one multi-layered thin film includes plural layers of the same film type. A manufacturing apparatus according to an embodiment of the present invention includes a transfer chamber, three sputtering deposition chambers each including one sputtering cathode, two sputtering deposition chambers each including two or more sputtering cathodes, and a process chamber for performing a process other than sputtering, and the three sputtering deposition chambers, the two sputtering deposition chambers, and the process chamber are arranged around the transfer chamber so that each is able to perform delivery and receipt of the substrate with the transfer chamber.

The present disclosure relates to an electrode strip, a sensor strip, a system thereof and a manufacturing method thereof. The sensor strip includes a first reactive film, a second reactive film and a vent hole. The first reactive film includes a substrate, a first electrode layer and a first insulation layer. The first end of the first insulation layer is concaved to a first depth to form a first reactive area. The second reactive film includes a second electrode layer and a second insulation layer. The first end of the second insulation layer is concaved to a second depth to form a second reactive area. The vent hole penetrates the second insulation layer, the second electrode layer and the first insulation layer so as to connect the first reactive area and the second reactive area.

In a gas sensor sensing a specific gas component contained in gas to be measured, oxygen ion conductive solid electrolyte is used in a sensing element for sensing the specific gas component. A terminal unit is used, which comprises a pair of insulators, each having an inner side surface, disposed to pinch and hold the base end portion of the sensing element on the pair of electrode-mounted surfaces of the sensing element. The terminal unit comprises two pairs of metal terminals and a spring member. The metal terminals electrically contact electrode pads of the sensing element, pair by pair, respectively, and are disposed on the inner side surfaces of the insulators. The spring members press the pair of insulators at one or more positions of electrode-mounted surfaces of the sensing element in a width direction so that the insulators are pressed to be opposed to each other.

The present invention provides a device that decreases deformation during manufacturing of the device, provides a firm joint without use of an adhesive, and allows chemical modification of a channel during manufacturing of the device. The device includes two joined substrates, and a concavity is formed on at least one of the opposing surfaces of the two substrates so as to make a channel, where the two substrates are joined together by a covalent bond via a crosslinking agent (A), and the crosslinking agent (A) is exposed on an inner wall surface of the channel.

A well, in particular an open well (14) with an upper end having a vertical axis (101), for containing a liquid and particles contained within said liquid, characterized by comprising at least two manipulation electrodes (1, 2, 3, 31, 32, 36, 17, 40, 41) able to be powered by electrical voltages, in particular alternating electrical voltages, so as to manoeuvre particles within the well by means of the dielectrophoretic effect. A platform comprising a plurality of wells as described above and a method for using said well.

According to embodiments of the invention, a TFT array substrate, a manufacturing method of the TFT array substrate and a display device are provided. The method comprises: depositing a metal film on a substrate, and forming a gate electrode and a gate line; forming a gate insulating layer and a passivation layer on the substrate; depositing a transparent conductive layer, a first source/drain metal layer and a first ohmic contact layer, and forming a drain electrode, a pixel electrode, a data line, and a first ohmic contact layer pattern provided on the drain electrode; and depositing a semiconductor layer, a second ohmic contact layer and a second source/drain metal layer, and forming a source electrode, a second ohmic contact layer pattern provided below the source electrode, and a semiconductor channel between the source electrode and the drain electrode.

An organic light emitting diode (OLED) display a includes: a substrate; an organic light emitting element on the substrate and including a first electrode, a light emission layer, and a second electrode; and an encapsulation layer on the substrate while covering the organic light emitting element. The encapsulation layer includes an organic layer and an inorganic layer. A mixed area, where organic materials forming the organic layer and inorganic materials forming the inorganic layer co-exist along a plane direction of the encapsulation layer, is formed at the boundary between the organic layer and the inorganic layer.

An object is to manufacture a semiconductor device with high reliability by providing the semiconductor device including an oxide semiconductor with stable electric characteristics. In a transistor including an oxide semiconductor layer, a gallium oxide film is used for a gate insulating layer and made in contact with an oxide semiconductor layer. Further, gallium oxide films are provided so as to sandwich the oxide semiconductor layer, whereby reliability is increased. Furthermore, the gate insulating layer may have a stacked structure of a gallium oxide film and a hafnium oxide film.

A semiconductor device includes wiring layers formed over a semiconductor wafer, a via-layer between the wiring layers, conductive films in the wiring layers, and a via-plug in the via-layer connecting the conductive films of the wiring layers above and below, a scribe region at an outer periphery of a chip region along an edge of the semiconductor substrate and including a pad region in the vicinity of the edge, the pad region overlapping the conductive films of the plurality of wiring layers in the plan view, the plurality of wiring layers including first second wiring layers, the conductive film of the first wiring layer includes a first conductive pattern formed over an entire surface of said pad region in a plan view, and the conductive film of the second wiring layer includes a second conductive pattern formed in a part of the pad region in a plan view.

An object is to provide a semiconductor device including an oxide semiconductor film, which has stable electrical characteristics and high reliability. A stack of first and second material films is formed by forming the first material film (a film having a hexagonal crystal structure) having a thickness of 1 nm to 10 nm over an insulating surface and forming the second material film having a hexagonal crystal structure (a crystalline oxide semiconductor film) using the first material film as a nucleus. As the first material film, a material film having a wurtzite crystal structure (e.g., gallium nitride or aluminum nitride) or a material film having a corundum crystal structure (α-Al2O3, α-Ga2O3, In2O3, Ti2O3, V2O3, Cr2O3, or α-Fe2O3) is used.

A semiconductor device, includes a semiconductor substrate, a first interconnect layer formed over the semiconductor substrate, a gate electrode formed in the first interconnect layer, a gate insulating film formed over the gate electrode, a second interconnect layer formed over the gate insulating film, an oxide semiconductor layer formed in the second interconnect layer, and a via formed in the second interconnect layer and connected to the oxide semiconductor layer. The gate electrode, the gate insulating film and the oxide semiconductor layer overlap in a plan view.

It is an object to manufacture a highly reliable semiconductor device including a thin film transistor whose electric characteristics are stable. An insulating layer which covers an oxide semiconductor layer of the thin film transistor contains a boron element or an aluminum element. The insulating layer containing a boron element or an aluminum element is formed by a sputtering method using a silicon target or a silicon oxide target containing a boron element or an aluminum element. Alternatively, an insulating layer containing an antimony (Sb) element or a phosphorus (P) element instead of a boron element covers the oxide semiconductor layer of the thin film transistor.

A semiconductor device which includes a thin film transistor having an oxide semiconductor layer and excellent electrical characteristics is provided. Further, a method for manufacturing a semiconductor device in which plural kinds of thin film transistors of different structures are formed over one substrate to form plural kinds of circuits and in which the number of steps is not greatly increased is provided. After a metal thin film is formed over an insulating surface, an oxide semiconductor layer is formed thereover. Then, oxidation treatment such as heat treatment is performed to oxidize the metal thin film partly or entirely. Further, structures of thin film transistors are different between a circuit in which emphasis is placed on the speed of operation, such as a logic circuit, and a matrix circuit.

A semiconductor film having an impurity region to which at least an n-type or p-type impurity is added and a wiring are provided. The wiring includes a diffusion prevention film containing a conductive metal oxide, and a low resistance conductive film over the diffusion prevention film. In a contact portion between the wiring and the semiconductor film, the diffusion prevention film and the impurity region are in contact with each other. The diffusion prevention film is framed in such a manner that a conductive film is exposed to plasma generated from a mixed gas of an oxidizing gas and a halogen-based gas to form an oxide of a metal material contained in the conductive film, the conductive film in which the oxide of the metal material is formed is exposed to an atmosphere containing water to be fluidized, and the fluidized conductive film is solidified.

To provide a semiconductor device which has transistor characteristics with little variation and includes an oxide semiconductor. The semiconductor device includes an insulating film over a conductive film and an oxide semiconductor film over the insulating film. The oxide semiconductor film includes a first oxide semiconductor layer, a second oxide semiconductor layer over the first oxide semiconductor layer, and a third oxide semiconductor layer over the second oxide semiconductor layer. The energy level of a bottom of a conduction band of the second oxide semiconductor layer is lower than those of the first and third oxide semiconductor layers. An end portion of the second oxide semiconductor layer is positioned on an inner side than an end portion of the first oxide semiconductor layer.

An amorphous oxide thin film containing amorphous oxide is exposed to an oxygen plasma generated by exciting an oxygen-containing gas in high frequency. The oxygen plasma is preferably generated under the condition that applied frequency is 1 kHz or more and 300 MHz or less and pressure is 5 Pa or more. The amorphous oxide thin film is preferably exposed by a sputtering method, ion-plating method, vacuum deposition method, sol-gel method or fine particle application method.

An object is to manufacture and provide a highly reliable semiconductor device including a thin film transistor with stable electric characteristics. In a method for manufacturing a semiconductor device including a thin film transistor in which a semiconductor layer including a channel formation region serves as an oxide semiconductor film, heat treatment for reducing impurities such as moisture (heat treatment for dehydration or dehydrogenation) is performed after an oxide insulating film serving as a protective film is formed in contact with an oxide semiconductor layer. Then, the impurities such as moisture, which exist not only in a source electrode layer, in a drain electrode layer, in a gate insulating layer, and in the oxide semiconductor layer but also at interfaces between the oxide semiconductor film and upper and lower films which are in contact with the oxide semiconductor layer, are reduced.

The present invention provides a blanking apparatus comprising a plurality of blankers configured to respectively blank a plurality of beams with respect to a target position on an object, and a driving device configured to drive the plurality of blankers, wherein the driving device includes a change device configured to change relation between a combination of beams of the plurality of beams, and a target dose.

The invention relates to a thermal conduction element (20) for a package for transporting and/or storing radioactive materials, comprising: an internal part (30) intended to be in contact with a lateral body (14) of the package;an external part (34) intended to form a portion of an external envelope (24) of said package, holding radiological protection means (22);an intermediate part (32) arranged between the internal and external parts,the internal, external and intermediate parts being produced from copper and one of the alloys thereof. According to the invention, the external part (34) is equipped, at each of its two opposite ends, with an area (36) for connection by welding to another thermal conduction element (20), each connection area (36) being produced from steel.

According to one embodiment, a solid state imaging device includes a sensor substrate having a plurality of pixels formed on an upper face, a microlens array substrate having a plurality of microlenses formed and a connection post with one end bonded to a region between the microlenses on the microlens array substrate and with the other end bonded to the upper face.

Disclosed is a photovoltaic device. The photovoltaic device includes: a substrate; a first electrode placed on the substrate; a second electrode which is placed opposite to the first electrode and which light is incident on; a first unit cell being placed between the first electrode and the second electrode, and including an intrinsic semiconductor layer including crystalline silicon grains making the surface of the intrinsic semiconductor layer toward the second electrode textured; and a second unit cell placed between the first unit cell and the second electrode.

A back electrode type solar cell in which a no-electrode-formed region where no electrode is placed is provided in a part of a peripheral portion of a back surface of the back electrode type solar cell such that a line connecting end portions of a plurality of electrodes to one another includes a partially inwardly recessed region and the no-electrode-formed region is located adjacent to each of an electrode for n-type and an electrode for p-type adjacent to each other, a solar cell module, a method of manufacturing a back electrode type solar cell with interconnection sheet, and a method of manufacturing a solar cell module are provided.

A photovoltaic cell comprises a top subcell having a first band gap; a middle subcell comprising a substrate and having a second band gap, wherein the substrate comprises a first side and a second side opposite to the first side; and a bottom subcell having a third band gap, wherein the top subcell is grown on the first side of the substrate and the bottom subcell is grown on the second side of the substrate, wherein the first band gap is larger than the second band gap and the second band gap is larger than the third band gap.

A photovoltaic device including a substrate; a first electrode placed on the substrate; a second electrode which is placed opposite to the first electrode and which light is incident on; a first unit cell being placed between the first electrode and the second electrode, and including an intrinsic semiconductor layer including crystalline silicon grains making the surface of the intrinsic semiconductor layer toward the second electrode textured; and a second unit cell placed between the first unit cell and the second electrode.

A multi-junction solar cell having a Ge or GaAs substrate, as well as a solar cell structure having several subcells deposited on the substrate, the substrate having peripheral side faces, and the solar cell structure having a peripheral circumferential surface, which runs spaced apart from the side faces. To prevent oxidation and penetration of moisture, the circumferential surface of the solar cell structure is coated with a protective, electrically insulating first coating under essential exclusion of the upper surface facing the rays, or that without encroaching on the solar cell structure, the side faces of the substrate are coated with a protective, electrically insulating second coating or that both the side faces of the substrate as well as the circumferential surface of the solar cell structure are coated with a third coating by essential exclusion of the upper surface facing the rays.

In a case where components such as side flaps and crotch portions are arranged on multiple webs which are being conveyed while being arranged side by side in the width direction of the webs, articles in various sizes can be handled easily by a web conveying step of conveying a front waistline web 11A and a back waistline web 11B the webs being arranged side by side in a width direction of the webs, a flap attaching step of attaching side flaps 30 onto the web 11 of the front waistline web 11A or the back waistline web, a web gap changing step of changing a gap between the front waistline web 11A and the back waistline web 11B by a web gap changing mechanism 500 and a crotch member attaching step of attaching a crotch member 20 between the front waistline web 11A and the back waistline web 11B, wherein the web gap changing step is performed between the flap attaching step and the crotch member attaching step.

An arc chute assembly includes a housing having a first wall, a second wall, and a pair of side walls coupled to the first wall. The walls configured to form an arc area. The housing further having a divider wall coupled to the first wall between the side walls. The divider wall configured to form a first sub-arc area, a second sub-arc area, and an arc plate area. The first sub-arc area and the second sub-arc area are configured to be in flow communication with the arc plate area. The arc chute assembly further comprises a support coupled to the first wall and the side walls, and an arc plate coupled to the support. The arc plate having a body extending between the side walls and over the divider wall.

In an electrical distribution cabinet a mechanism providing quick, reliable, passive arc blast control has a flue chamber surrounding the likely arc site such as an electrical connection point. The flue chamber provides a flue channel which lengthens the arc and attenuates the current and temperature until the arc is extinguished. Preferably, the flue chamber and channel are formed of opposable open-faced polyhedral structures, one fitting inside the other. The mechanism is particularly suited for draw-out circuit breaker connections in a switch gear cabinet.

Containers and components thereof for use in the medical industry and methods to manufacture the same are described. An example tab for use with a medical container includes opposing sheets sealed to define an open ended chamber into which a port is to be at least partially positioned. The port is to enable access to the medical container. The tab includes a tear seal defined by each of the opposing sheets and a first guide positioned on a first side of each of the tear seals. The tab includes a second guide positioned on a second side of each of the tear seals, wherein the first and second guides are to enable a tear to propagate substantially between the guides and adjacent the tear seals.

A book having a page construction for improved page manipulation. The book includes a plurality of pages bound together at an edge margin, wherein each page includes a bound edge and a plurality of free edges. At least one of the free edges of at least one of the pages includes an edge relief. The pages may comprise cardboard or other stiff material having a thickness. The free edges include opposed top and bottom edges and a side edge. The edge relief may extend along the entire side edge or only a portion thereof. The edge relief may be in the form of, for example, a chamfer, a bevel, a radius, a notch, a step, or the like.

A light emitting apparatus including: a plurality of light emitting elements; a drive circuit including a transistor and a capacitor having one end connected to a gate of the transistor; and a signal supply circuit for receiving a digital gradation signal and outputting an analog voltage signal to the drive circuit, including a computation circuit configured to correct the input digital gradation signal to generate a corrected digital gradation signal, in which the drive circuit is configured to conduct an auto-zero operation which reduce the gate-source voltage of the transistor to a threshold voltage by flowing the drain current to the capacitor, and the computation circuit is configured to generate the corrected digital gradation signal by multiplying a correction coefficient to the input digital gradation signal subtracted by a particular signal common to the plurality of light emitting elements.

An adhesive layer that bonds the back surface of a plate capable of attracting a wafer and the front surface of a cooling plate together that includes a main adhesive portion, which is made of a hardened matter of a fluid adhesive, and an outer peripheral adhesive portion, gas-supply-hole adhesive portions, lift-pin-hole adhesive portions, and terminal-hole adhesive portions made of a double-faced tape. The tape portions bond the outer peripheral edge on the back surface of the plate and the outer peripheral edge on the front surface of the cooling plate together, and the outer peripheral edges of the holes on the back surface of the plate and the outer peripheral edges of these holes on the front surface of the cooling plate together.

A process for manufacturing surgical needles from solid, cylindrical needle blanks. A plurality of needle blanks are cut from a roll of wire and mounted to a flat carrier strip. The carrier strip then indexes each needle blank to a grinding station where an orbital grinding means grinds the distal end of each needle blank into a taper point while the needle blanks are held fixed in the carrier strip.

A surgical needle has a top edge formed by two pressed faces located inside or outside of curvature from pressing a material blank made of austenitic stainless steel having fibrous texture and cutting edges formed on both sides of a base. The top edge is sharp at a needle point and the sharp needle point is constituted of fibrous texture formed at the surface layer of the material blank. Grinding marks extending crosswise formed on the face of the mold are transferred to the pressed faces. A mold constitutes plural faces forming projecting angles (angle between two intersecting faces is 180° or below, and the line at which the two faces intersect is made as a projecting line) along edges of the blocks made of two rectangular prisms, and constitutes a cavity by suitably contacting the edges of the blocks.

A process for progressively manufacturing cutting edge needles or wire members. Needle blanks or wire blanks are cut from a roll of wire and mounted to a carrier strip. The carrier strip and needles are moved through a succession of coining dies and at least one trimming die, wherein the first coining die is an open coining die and the one or more successive coining dies are closed coining dies. The needle blanks or wire members are optionally curved, heat treated and electrochemically treated resulting in cutting edge needles or wire members formed without a grinding step and without adversely affecting point ductility.

A steel pin is disclosed of a type to be forcibly driven into a steel substrate by using a powder-actuated tool. The steel pin has a substantially cylindrical shank and a substantially sharp point which extends from one end of the substantially cylindrical shank, which conforms substantially to a tangent or secant ogive except for a substantially spherical tip having a radius in a range of approximately 0.02 inch (approximately 5 millimeters) to approximately 0.03 inch (approximately 7.5 millimeters), which has substantially true concentricity, which has surface-texture irregularities with a roughness-height index value in a range from approximately 10 microinches (approximately 0.25 micrometers) to approximately 15 microinches (approximately 0.38 micrometers), and which appears to be substantially free of other surface imperfections when viewed under 60× magnification. The substantially cylindrical shank is joined to the substantially sharp point at a transition having a substantially smooth, continuously curved surface, and is knurled near the transition. The steel pin is made by deforming a length of steel wire as by forging or swaging, so as to form the steel pin with the substantially cylindrical shank and with the substantially sharp point, and reshaping the substantially pointed end as by barrel finishing the steel pin in a finishing medium.

A process for the manufacture of suture needles and, more particularly, a process for enhancing the physical strength of the suture needles through an expedient cold-working or cold-forming procedure. Also disclosed is the provision of a novel and physically strengthened suture needle, particularly a surgical suture needle possessing a curvilinear configuration wherein the cross-sectional configuration of the needle is cold-formed into varying shapes in order to produce a needle having superior physical characteristics and strengths imparted thereto through the inventive process. The needles are essentially cold formed, and which process includes the aspect of imparting to straight metal rods which are preferably constituted from stainless steel, manufacturing steps which include sharpening one end of rod severed segments so as to form the needle tip, thereafter curving the needle with the metal still being in a relatively ductile state, and subjecting the needle to a cold forming process, such as through the intermediary of pressure die molds or stamping, to produce varying cross-sectional shapes along the length of the needle.

A steel pin is disclosed of a type to be forcibly driven into a steel substrate by using a powder-actuated tool. The steel pin has a substantially cylindrical shank, and a substantially sharp point which extends from one end of the substantially cylindrical shank, which conforms substantially to a tangent or secant ogive except for a substantially spherical tip having a radius in the range of approximately 0.015 inch (approximately 3.75 millimeters) to approximately 0.03 inch (approximately 7.5 millimeters), which has substantially true concentricity, which has surface-texture irregularities with a roughness-height index value not greater than approximately 30 microinches (approximately 0.76 micrometers), and which appears to be substantially free of other surface imperfections when viewed under 60× magnification. Optimally, the ogive is a tangent ogive with an ogive radius approximately ten times the shank diameter and with an ogive length approximately twice the shank diameter, and the tip radius is approximately 0.1 times the shank diameter. The substantially cylindrical shank is joined to the substantially sharp point at a transition having a substantially smooth, continuously curved surface, and which is knurled near the transition. The steel pin is made by deforming a length of steel wire, as by forging or swaging, so as to form the steel pin.

Channel-bodied surgical needles and surgical incision members are disclosed having a generally U-shaped cross-sectional body portion and a penetrating tip portion formed on at least one end thereof. Preferably, penetrating tip portions are formed at both ends of the channel-bodied portion. The surgical needle and/or surgical incision member may additionally includes apparatus engagement structure formed adjacent either end of the body portion and engagable with a suitable surgical suturing apparatus. The channel-bodied surgical needle and/or surgical incision member may additionally include securement structure for attachment of a length of suture material thereto. There is also disclosed apparatus for forming a channel-shaped body portion and the suture attachment structure. Additionally, methods for suturing tissue sections, particularly vascular tissue sections, with the channel-bodied surgical needle and the channel-bodied surgical incision members, are disclosed. Also, methods for forming the channel-bodied surgical needle and channel-bodied surgical incision member are disclosed.

This invention relates to a method for manufacturing a needle attached suture and an apparatus therefor. A needle attached suture is obtained by inserting a suture into an insertion hole formed in the end of a needle N which is held by a needle retaining unit 16 and by swaging the end of the needle with the suture. The method and the apparatus have been developed to accurately position the end of the needle for swaging with the suture to stabilize the swaging strength between the suture and the needle. Before the swaging, the needle is held by the needle retaining unit 16, and the end of the needle N is pushed to a certain position by a rod 99 or its equivalent. Thereby, the end of the needle N relative to the needle retaining unit 16 is accurately positioned.