Embodiments of the invention are generally directed to a single-ended configurable multi-mode driver. An embodiment of an apparatus includes an input to receive an input signal, an output to transmit a driven signal generated from the input signal on a communication channel, a mechanism for independently configuring a termination resistance of the driver apparatus, and a mechanism for independently configuring a voltage swing of the driven signal without modifying a supply voltage for the apparatus.

A resonator element includes a substrate including a first principal surface and a second principal surface respectively forming an obverse surface and a reverse surface of the substrate, and vibrating in a thickness-shear vibration mode, a first excitation electrode disposed on the first principal surface, and a second excitation electrode disposed on the second principal surface, and being larger than the first excitation electrode in a plan view, the first excitation electrode is disposed so as to fit into an outer edge of the second excitation electrode in the plan view, and the energy trap confficient M fulfills 15.5≦M≦36.7.

A resonator element includes a substrate vibrating in a thickness-shear vibration mode, a first excitation electrode disposed on one principal surface of the substrate, and has a shape obtained by cutting out four corners of a quadrangle, and a second excitation electrode disposed on the other principal surface of the substrate, and a ratio (S2/S1) between the area S1 of the quadrangle and the area S2 of the first excitation electrode fulfills 87.7%≦(S2/S1)

A self-feedback random generator comprises a digital-to-analog converter, a digital oscillator, a frequency-modulating unit and a first D-type flip-flop. The digital-to-analog converter receives a digital random-code signal and the digital random-code signal is converted to corresponding analog random signal. The frequency-modulating unit modulates frequency of first digital oscillating signal so as to increase random of frequency of first digital oscillating signal according to voltage value of the analog random signal, and accordingly outputs a second digital oscillating signal. The first D-type flip-flop receives the second digital oscillating signal and a clock signal, and reads the second digital oscillating signal through utilizing the clock signal so as to outputs the digital random-code signal, wherein frequency of the clock signal is smaller than frequency of the first digital oscillating signal, and random of frequency of the second digital oscillating signal corresponds to random of the digital random-code signal.

An integrated circuit (10) has an internal RC-oscillator (20) for providing an internal clock signal (CLI) having an adjustable oscillator frequency. The integrated circuit (10) further comprises terminals (101, 102) for connecting an external LC tank (30) having a resonance frequency and a calibration circuit (40) which is configured to adjust the oscillator frequency based on the resonance frequency of the LC tank (30) connected during operation of the integrated circuit (10). An internal auxiliary oscillator (46) is connected to the terminals (101, 102) in a switchable fashion and is configured to generate an auxiliary clock signal (CLA) based on the resonance frequency. The calibration circuit (40) comprises a frequency comparator (47) which is configured to determine a trimming word (TRW) based on a frequency comparison of the internal clock signal (CLI) and the auxiliary clock signal (CLA). The LC tank (30) to be connected is an antenna for receiving a radio signal.

The invention concerns an oscillator generating a wave composed of a frequency of on the order of terahertz from a beat of two optical waves generated by a dual-frequency optical source. The oscillator includes a modulator the transfer function of which is non-linear for generating harmonics with a frequency of less than one terahertz for each of the optical waves generated by the dual-frequency optical source, an optical detector able to detect at least one harmonic for each of the optical waves generated by the dual-frequency optical source and transforming the harmonics detected into an electrical signal, a phase comparator for comparing the electrical signal with a reference electrical signal, and a module for controlling at least one element of the dual-frequency optical source with a signal obtained from the signal resulting from the comparison.

An atomic oscillator includes: a gas cell which includes two window portions having a light transmissive property and in which metal atoms are sealed; a light emitting portion that emits excitation light to excite the metal atoms in the gas cell; a light detecting portion that detects the excitation light transmitted through the gas cell; a heater that generates heat; and a connection member that thermally connects the heater and each window portion of the gas cell to each other.

A method, an apparatus, and a computer program product are provided. The apparatus tunes a frequency provided by a VCO. The apparatus determines a relative capacitance change associated with a first frequency and a desired frequency from a look-up table. The apparatus adjusts a capacitor circuit in the VCO based on the determined relative capacitance change determined from the look-up table in order to tune from the first frequency to the desired frequency. The apparatus determines that the frequency provided by the VCO is a second frequency different than the desired frequency after adjusting the capacitor circuit. The apparatus performs an iterative search to further adjust the capacitor circuit when a difference between the second frequency and the desired frequency is greater than a threshold.

A ring-oscillator-based on-chip sensor (OCS) includes a substrate having a semiconductor surface upon which the OCS is formed. The OCS includes an odd number of digital logic stages formed in and on the semiconductor surface including a first stage and a last stage each including at least one NOR gate including a first gate stack and/or a NAND gate including a second gate stack. A feedback connection is from an output of the last stage to an input of the first stage. At least one discharge path including at least a first p-channel metal-oxide semiconductor (PMOS) device is coupled between the first gate stack and a ground pad, and/or at least one charge path including at least a first n-channel metal-oxide semiconductor (NMOS) device is coupled between the second gate stack a power supply pad.

A vibration element includes a piezoelectric substrate including a vibrating section and a thick section having a thickness larger than that of the vibrating section. The thick section includes a first thick section provided along a first outer edge of the vibrating section, a second thick section provided along a second outer edge, and a third thick section provided along another first outer edge. An inclined outer edge section that intersects with each of an X axis and a Z' axis is provided in a tip section of the piezoelectric substrate.

This invention relates to a novel rotary control valve with new joint methods and flow control mechanisms, inline-reparability and fully metal seals more particularly to a triple offset butterfly valve or ball valve with those features used for on-off and flow controlling under multiple extreme conditions or in severe services; such as the integrated gasification combined cycle under high temperature and pressure, Fluid Catalytic Cracking under high temperature over 1200 F with hard diamond like catalytic particles, shale fracking process under extreme high pressure and high velocity fluid with solid particles and corrosive additives and other critical applications for products life lasting 5 to 30 years like deepsea flow control systems and nuclear power plants and for the applications of millions cycles like jet or rocket turbine engine fuel delivery systems with high velocity fuel fluid mixed with highly oxidative gas under temperature 1365 F.

An assembly structure of an electronic control unit and a coil assembly of a solenoid valve for an electronic brake system connected to the electronic control unit having a printed circuit board and applying power to the solenoid valve. The coil assembly is penetrated to allow an upper portion of the solenoid valve to be fitted thereinto, and includes a cylindrical bobbin provided with a coil and a coil case. The electronic control unit is provided with a housing having an insertion groove and joined to the hydraulic control unit, the printed circuit board being disposed spaced apart from the coil assembly, and the housing is provided with an elastic member having one end contacting the printed circuit board and the other end contacting the coil case. The elastic member is configured with a coil spring to produce different elastic forces.

A butterfly valve (100) is provided. The butterfly valve (100) includes a valve body (103) including a valve bore (109) passing through the valve body (103), with the valve bore (109) including an upstream valve bore portion (109U) and a downstream valve bore portion (109D), a shaft bore (112), a valve shaft (121) located in the shaft bore (112) and extending substantially across the valve bore (109), and a valve flap (107) affixed to the valve shaft (121) and configured to be rotated by the valve shaft (121). The valve flap (107) is configured to rotate between a closed orientation blocking the valve bore (109) and an open orientation. The valve flap (107) is affixed on an upstream valve bore portion side of the valve shaft (121), wherein incoming fluid presses the valve flap (107) against the valve shaft (121).

A ball valve which can suppress the increasing of processing labor time and reliably prevent simultaneous rotation of a ball seat and a ball when the ball is rotated by handle manipulation is provided. The valve body 2 is formed of a hard material such as stainless steel, the ball seat is formed of a relatively soft material such as a fluorine resin, and a protrusion 18 is formed on a ball seat support surface 13 of the valve body 2 made of a hard material so as to bite into the ball seat 4.

The invention provides a switching valve having a valve element which is movable in a housing, an actuating apparatus acting on the valve element in a first direction and a spring apparatus charging the valve element in a second direction. According to the invention, the first and second directions are in opposition and the spring apparatus has a progressive spring characteristic.

A flush adaptor for use with a valve fitment assembly for dispensing liquids from a container; wherein the flush adaptor comprises an outer ring-collar; a flange with an edge molded to the bottom of the outer ring-collar; an interior ring-collar adjacent to the outer ring-collar; a ridge molded in the interior ring-collar; a seat molded onto the interior ring-collar and a pin molded into the interior ring-collar which keeps the valve in an open position; and a hollow tube molded into the adaptor to allow the flow of liquid through the adaptor and into the fitment assembly; whereby the flush adaptor allows for cleaning of the assembly and any tubes connected thereto.

A fuel system valve assembly may include a housing, a spring, and a body. The housing may have a fuel passage defined in part or more by a fuel passage wall. The fuel passage wall may have a seat and a cylindrical section. The cylindrical section may have a constant diameter and may be located downstream of the seat. In use, the body may reciprocate linearly in the housing between an open position and a closed position. The body may be biased to the closed position by the spring. The body may abut the seat when the body is in the closed position.

A steplessly adjustable hydraulic insert valve has a housing defining a radial direction and an end side in an installation direction. An inflow connector on the end side is connectable to a pressure medium source. First and second working connectors and a return connector are arranged in the radial direction. The return connector is connectable to a pressure medium tank. The housing has an axial bore and an actuator guided movably therein. The actuator can be held in an axial center position by at least one spring and is adjustable steplessly axially out of the center position by controllable actuation. At least one of the working connectors is fluidically connectable to the return connector by axial adjustment of the actuator. The actuator has a radial widened portion with first and second control edges for steplessly opening and/or closing first and second radial openings, respectively, of the return connector.

Power-efficient actuator apparatus and methods. In one exemplary embodiment, the actuator assembly utilizes a shape memory alloy (SMA) filament driven by an electronic power source to induce movement in the underlying assembly to actuate a load (e.g., water valve). In addition, a circuit board is included which allows the actuator assembly to be readily incorporated or retrofit into a wide range of systems such that the signal characteristics of the supply line can, among other applications, be conditioned in order to protect the SMA filament. Furthermore, the circuit board can also readily be adapted for use with “green” power sources such as photovoltaic systems and the like. Methods for manufacturing and utilizing the aforementioned actuator assembly are also disclosed.

A filler assembly is mounted in an axial hole of a cap of a valve. The filler assembly includes at least one first filler and at least one second filler stacked in a longitudinal direction. A valve rod received in the axial hole extends through the at least one first filler and the at least one second filler. At least one of two mutually abutting faces respectively of the at least one first filler and the at least one second filler is at a non-parallel angle to a radial direction perpendicular to the longitudinal direction. If one of the at least one first filler and the at least one second filler is subjected to a pressing force in the longitudinal direction, at least one of the at least one first filler and the at least one second filler is moved in the radial direction to press against the valve rod.

A butterfly valve including a valve body having a passage, a valve shaft assembly, a valve plate, and a tube that is friction fit inside the passage is provided. The valve shaft assembly includes a first shaft portion and a second shaft portion. The first and second shaft portions are in opposing spaced relation with the valve plate disposed therebetween. The valve plate has a flange such that when the butterfly valve is in the closed position a seal is formed with the tube, which is disposed within the fluid flow passage. The valve plate has lip extending from a portion of the valve plate that is radially outward from the circumference of the tube. The lip acts to reduce flow induced torque experienced while the valve plate is actuated from the closed to the open position.

A drain plug assembly that has particular application for sealing a drain hole in a high voltage battery compartment on a vehicle. The plug assembly includes a plug that inserted into the drain hole. The plug assembly further includes a return spring coupled to the plug and causing the plug to be biased into the drain hole. The plug assembly also includes at least one shape memory alloy device coupled to the plug and a support structure. The SMA device receives an electrical current that causes the device to contract and move the plug out of the drain hole against the bias of the return spring.

A solenoid valve, the magnet armature of which is designed to be movable relative to a first valve-closing element, for which purpose the first valve-closing element is accommodated telescopically in a coupling element attached to the magnet armature, wherein the coupling element is guided along the inner wall of a guide sleeve inserted in the valve housing in order to align the magnet armature precisely with the first valve-closing element in the direction of a second valve-closing element which is likewise accommodated in the guide sleeve.

For a flap assembly, in particular an exhaust gas flap assembly, with the flap mounted on both sides via bearing devices in the housing, the disclosure describes a design in which a bearing body is supported radially against an annular collar of the bearing device and, by way of the annular collar, is held braced in a radially spring-loaded manner in a predefined radial position.

A flow control valve element has a generally spherical ball. An inlet is formed in the ball. An outlet is also formed in the ball, the outlet opposing the inlet. A hollowed-out portion extends between the inlet and the outlet. A pair of opposing flats are formed in the ball, the flats each having a first flat portion formed in an external portion of the ball and an opposing second flat portion formed in the hollowed-out portion of the ball.

A method and device for the production of books, including: moving book blocks successively along a conveying section of a book production line; supplying a stack of book cases to the book production line; identifying a marking on each of the book blocks and the book cases; transmitting an identified marking on at least one book case to a machine control of the book production line; assigning a dataset stored in the machine control for a sequence of book cases to the supplied stack; determining a sequence in the machine control for book blocks positioned on the conveying section; comparing the dataset for the sequence of the book cases to the sequence of the book blocks; and removing and/or supplying at least one book block from or to the conveying section if the sequence of the book blocks deviates from the sequence of the book cases using the machine control.

A method for producing a bundle composed of book blocks includes gathering a plurality of printed sheets to form respective book blocks. The plurality of the book blocks are positioned with the same orientation and respectively positioned on lower edges of the printed sheets. Respectively two adjacent book blocks are offset from one another parallel to the lower edges of the printed sheets and transverse to a height of the bundle to be formed, such that a side edge of one of the two book block projects relative to a side edge of the adjacent book block. Thereafter the offset book blocks are combined to form the bundle and the bundle is compressed to fix the offset position of the book blocks.

The invention proposes a method for producing a printed product, in which a printed product, preferably produced in a forme-bound high-capacity printing process, in the form of a main product (2) or a subproduct is provided with an identification means which comprises a piece of individualizable product-specific information. At least two downstream individualization steps are performed, wherein the identification means allow the piece of information which is to be added in the at least two further downstream individualization steps to be associated with the respective product. Preferably, the new addressee-specific digital printed product comprises blog articles, preferably in the form of a blog insert, which is in turn preferably produced using digital printing. Identification means, for example in the form of ID tags (4, 4'), comprise not only the product-specific identification information but preferably also control information (31-36) which can be read by sensors on the handling devices (7-12) and hence directly control the handling of the respective product by this at least one handling device (7-12) and, in cooperation with inspection codes on the subproducts to be supplied, allow the correct supply to be inspected. The present invention also allows uninterrupted compilation of product packages for postal dispatch by virtue of the product sequence in the course of the conveying line comprising, at least in sections, a recurring succession of a respective one or more intermediate products partly individualized on an addressee-specific basis and at least one, preferably a plurality of, non-individualized standard intermediate products.

An apparatus and method are provided, for alternatively producing either small or bulk packs of napkins from a stack of folded napkins produced by one folding machine, through use of a pack dispatching arrangement having an inlet, a small pack transfer station and a bulk pack transfer station, and configured for operation in a small pack mode for dispatching a stream of spaced apart small packs of folded sheets separated from the stack of folded sheets, and received at an inlet of the pack dispatching arrangement, to the small pack transfer station, and alternatively operable in a bulk pack mode for dispatching a stream of spaced apart bulk packs of folded sheets separated from the stack of folded sheets, and received at an inlet of the pack dispatching arrangement, to the bulk pack transfer station.

Imaging apparatus and methods for bindery systems. An example apparatus disclosed herein includes a platform having a plurality of openings to provide suction through a surface of the platform and a first track that moves across the surface of the platform. The first track has a plurality of apertures to fluidly couple the suction to an upper surface of the first track.

A supply device (10) for a machine for transversely cutting two strips (11 and 12) of a flexible material, in particular a strip of paper, moving continuously, to produce separate stacks of documents cut transversely according to predetermined formats. The device comprises lower and upper driving mechanisms (13, 14) associated with the two strips (11, 12) of flexible material respectively, which each include a mechanically rotated first roller (13a, 14a) and a freely rotatable second bearing roller (13b and 14b). The driving mechanism is mounted on a frame (15) supported by a movable platform (16) which is rigidly connected to a linear actuator (17) arranged to be moved transversely with respect to the direction of movement of the strips (11 and 12). Optical reading cells (11a, 11b, 12a, 12b) define the operating modes of the driving servomotors (13b and 14b) and of the linear actuator (17).

In a first step, in a printed material web (1) moved in a feed direction, a first material web part (5) which is formed by a material web section (1a)is folded against the rest of the material web (6) that is formed from two material web portions (1b, 1c)).In the region of a connecting line (2b) extending between neighbouring material web sections (1b, 1c) the two material web parts (5,6) are connected to one another by a means of a bonding adhesive. In a subsequent step the material web (1) is folded again along a line (2b) extending between two neighbouring material web sections. (1b, 1c)All material web sections (1a, 1b, 1c) lie above one another. Subsequently, multi-page sub-products (11), the pages (12a, 12b, 12c) of which are connected to one another in the region of the spine (13) of the sub-product, are separated from the twice-folded material web (1). Finally, the sub-products (11) are placed on top of one another to form a stack (16) and are connected to one another in the region of the spine (13) thereof by means of a bonding adhesive.

A sheet binding apparatus which forms concavity and the convexity on a sheet bundle including a plurality of sheets in a thickness direction so as to bind the sheet bundle, the sheet binding apparatus includes: a pair of concave-convex members, each of which has concave-convex portion in the thickness direction of the sheet bundle and which forms the concavity and the convexity on the sheet bundle in the thickness direction while niping the sheet bundle therebetween; wherein in the pair of concave-convex members, one of the concave-convex members has a greater difference in height of the concave-convex portion than that of the other concave-convex member which engages with the above-described concave-convex member.

An image recording apparatus includes: a recording unit for recording an image on a recording medium; a tray for supporting the recording medium recorded by the recording unit; a conveyor mechanism for conveying the recorded medium to the tray; and an alignment mechanism for aligning a plurality of recording media stacked on the tray, by application of an external force. In a period from a start to an end of recording based on one recording job, the alignment mechanism aligns the plurality of recording media stacked on the tray in a period in which image recording is not performed, and the alignment mechanism does not align the plurality of recording media stacked on the tray in a period in which image recording is being performed.

A sheet processing apparatus includes a pair of squeezing members having a projection and a recess to engage each other, to squeeze a sheet bundle inserted therebetween in a direction of thickness of the sheet bundle, and a pressure applying unit to apply pressing force to the squeezing members to squeeze and bind the sheet bundle. The pressing force generated between the squeezing members by the pressure applying unit increases in strength as a relative distance between the squeezing members decreases.

A web product folding and stacking machine includes two folding line making rolls, two folding fingers, a first carrier unit, a stoppage unit and a holder. The folding line making rolls and the folding fingers are operated to fold up web products on the first carrier unit to form a stack of interfolded web products. Further, there is at least one suction device arranged on the top surface of the first carrier unit to suck the web products nearing the top surface of the first carrier unit and facilitate accurate stacking of the interfolded web products.

A multi-function binding machine is proposed. The multi-function binding machine (700) comprises a binding station (135) for binding blocks of signatures (105), and a feeding station (115) for receiving signatures in succession, opening the signatures, and feeding the signatures to the binding station; in the solution according to an embodiment of the invention, the multi-function binding machine further comprises a further feeding station (715) for receiving pre-signatures in successions, folding groups of at least one pre-signature into further signatures (729), and feeding the further signatures to the binding station.

The present invention relates generally to a semiconductor device and, more specifically, to optimizing the creep-age distance of the power semiconductor device and a preparation method thereof. The power semiconductor device includes a chip mounting unit with a die paddle and a plurality of leads arranged side by side located close to one side edge of the die paddle in a non-equidistant manner, a semiconductor chip attached on the die paddle, and a plastic packaging body covering the die paddle, the semiconductor chip, where the plastic packing body includes a plastic extension portion covering at least a part of a lead shoulder of a lead to obtain better electrical safety distance between the terminals of the semiconductor device, thus voltage creep-age distance of the device is increased.

Some implementations provide a structure that includes a first package substrate, a first component, a second package substrate, a second component, and a third component. The first package substrate has a first area. The first component has a first height and is positioned on the first area. The second package substrate is coupled to the first package substrate. The second package substrate has second and third areas. The second area of the second package substrate vertically overlaps with the first area of the first package substrate The third area of the second package substrate is non-overlapping with the first area of the first package substrate. The second component has a second height and is positioned on the second area. The third component is positioned on the third area. The third component has a third height that is greater than each of the first and second heights.

A land grid array (LGA) package including a substrate having a plurality of lands formed on a first surface of the substrate, a semiconductor chip mounted on a second surface of the substrate, a connection portion connecting the semiconductor chip and the substrate, and a support layer formed on part of a surface of a first land.

Maskless hybrid laser scribing and plasma etching wafer dicing processes are described. In an example, a method of dicing a semiconductor wafer having a front surface with a plurality of integrated circuits thereon and having a passivation layer disposed between and covering metal pillar/solder bump pairs of the integrated circuits involves laser scribing, without the use of a mask layer, the passivation layer to provide scribe lines exposing the semiconductor wafer. The method also involves plasma etching the semiconductor wafer through the scribe lines to singulate the integrated circuits, wherein the passivation layer protects the integrated circuits during at least a portion of the plasma etching. The method also involves thinning the passivation layer to partially expose the metal pillar/solder bump pairs of the integrated circuits.

An apparatus including a die including a dielectric material on a device side, an insulating layer surrounding a die area and embedding a thickness dimension of the die; and a carrier including a plurality of layers of conductive material disposed on the device side of the die, a first one of the layers of conductive materials being formed on the insulating layer and patterned into traces at least a portion of which are connected to respective contact points on the die. A method including disposing a die on a sacrificial substrate with a device side of the die opposite the sacrificial substrate; disposing a mold on the sacrificial substrate around; introducing an insulating material into a chase of the mold; removing the mold; forming a carrier on the insulating material adjacent a device side of a die; and separating the die and the carrier from the sacrificial substrate.

In a disclosed embodiment, a method for tiling selected vias in a semiconductor device having a plurality of vias comprises generating a layout database for the semiconductor device; creating zones around the plurality of vias; measuring density of covering metal in each zone; selecting a low density zone as being a zone that has a metal density less than a threshold metal density; and adding at least one tiling feature on a metal layer above the plurality of vias in the low density zone so that metal density of the low density zone increases to at least the same as the threshold metal density.

Methods for the fabrication of a Microelectromechanical Systems (“MEMS”) devices are provided, as are MEMS devices. In one embodiment, the MEMS device fabrication method includes forming at least one via opening extending into a substrate wafer, depositing a body of electrically-conductive material over the substrate wafer and into the via opening to produce a via, bonding the substrate wafer to a transducer wafer having an electrically-conductive transducer layer, and forming an electrical connection between the via and the electrically-conductive transducer layer. The substrate wafer is thinned to reveal the via through a bottom surface of the substrate wafer, and a backside conductor is produced over a bottom surface of the substrate wafer electrically coupled to the via.

A bump-on-trace (BOT) structure is described. The BOT structure includes a first work piece with a metal trace on a surface of the first work piece, wherein the metal trace has a first axis. The BOT structure further includes a second work piece with an elongated metal bump, wherein the elongated metal bump has a second axis, wherein the second axis is at a non-zero angle from the first axis. The BOT structure further includes a metal bump, wherein the metal bump electrically connects the metal trace and the elongated metal bump. A package having a BOT structure and a method of forming the BOT structure are also described.

The present invention relates to a camera module including: a lens unit mounted with at least one or more lenses; an image sensor mounted with an image pickup device for converting a light converged through the lenses to an electric signal; a PCB (Printed Circuit Board) mounted with the image sensor; and a holder accommodated inside the lens unit for supporting the lens unit, wherein the lens unit is bonded and fixed at an inner surface of the holder, whereby the lens unit mounted with a plurality of lenses is bonded to a lateral surface of a holder to prevent generation of vertical tilting phenomenon at the lens unit caused by a conventional improper coating of epoxy, and particularly, the coating of epoxy on the lateral surface of the holder advantageously enhances adhesive power to increase a bonded area.

Described herein are methods and systems for providing corrective maintenance using global knowledge sharing. A method to provide corrective maintenance with a CM system includes performing a query to generate a ranking of fixable causes based on factors (e.g., symptoms, configuration, test). The ranking may be determined based on a fixable cause percent match with the factors. The ranking of fixable causes may be associated with one or more solutions for each fixable cause. The ranking can be updated based on performing tests or solutions.

A method for fabricating a sensor includes: forming, on a base substrate, a pattern of a source electrode and a drain electrode, a pattern of a data line, a pattern of a receiving electrode, a pattern of a photodiode, and a pattern of a transparent electrode disposed by using a first patterning process; forming a pattern of an ohmic layer by using a second patterning process; forming a pattern of an active layer by using a third patterning process; forming a pattern of a gate insulating layer by using a fourth patterning process, wherein the gate insulating layer has a via hole above the transparent electrode; and forming a pattern of a gate electrode, a pattern of a gate line, and a pattern of a bias line connected to the transparent electrode via the via hole above the transparent electrode by using a fifth patterning process.

An object of an embodiment of the present invention to be disclosed is to prevent oxygen from being taken in a single crystal semiconductor layer in laser irradiation even when crystallinity of the single crystal semiconductor layer is repaired by irradiation with a laser beam; and to make substantially equal or reduce an oxygen concentration in the semiconductor layer after the laser irradiation comparing before the laser irradiation. A single crystal semiconductor layer which is provided over a base substrate by bonding is irradiated with a laser beam, whereby the crystallinity of the single crystal semiconductor layer is repaired. The laser irradiation is performed under a reducing atmosphere or an inert atmosphere.

A first impurity region is formed by ion implantation through a first opening formed in a mask layer. By depositing a spacer layer on an etching stop layer on which the mask layer has been provided, a mask portion having the mask layer and the spacer layer is formed. By anisotropically etching the spacer layer, a second opening surrounded by a second sidewall is formed in the mask portion. A second impurity region is formed by ion implantation through the second opening. An angle of the second sidewall with respect to a surface is 90°±10° across a height as great as a second depth. Thus, accuracy in extension of an impurity region can be enhanced.