An apparatus for extracting and collecting particulate infill from an infilled artificial turf field. A vehicle has a first forward end and a second rearward end. An infill extractor is located at the first end of the vehicle and adapted to extract infill from a strip of infilled athletic turf. Extracted infill falls into a bottom section of the infill extractor. An infill mover is secured to the vehicle and adapted to move the extracted infill from the bottom section of the infill extractor toward the second end of the vehicle. An infill collector is connected to the second end of the vehicle and operable to cooperate with the infill mover to collect the moved infill. The infill collector includes a frame that is laterally movable relative to the vehicle from an operative “in use” position to a stowed position.

According to embodiments of the invention, a TFT array substrate, a manufacturing method of the TFT array substrate and a display device are provided. The method comprises: depositing a metal film on a substrate, and forming a gate electrode and a gate line; forming a gate insulating layer and a passivation layer on the substrate; depositing a transparent conductive layer, a first source/drain metal layer and a first ohmic contact layer, and forming a drain electrode, a pixel electrode, a data line, and a first ohmic contact layer pattern provided on the drain electrode; and depositing a semiconductor layer, a second ohmic contact layer and a second source/drain metal layer, and forming a source electrode, a second ohmic contact layer pattern provided below the source electrode, and a semiconductor channel between the source electrode and the drain electrode.

An organic light emitting diode (OLED) display a includes: a substrate; an organic light emitting element on the substrate and including a first electrode, a light emission layer, and a second electrode; and an encapsulation layer on the substrate while covering the organic light emitting element. The encapsulation layer includes an organic layer and an inorganic layer. A mixed area, where organic materials forming the organic layer and inorganic materials forming the inorganic layer co-exist along a plane direction of the encapsulation layer, is formed at the boundary between the organic layer and the inorganic layer.

An object is to manufacture a semiconductor device with high reliability by providing the semiconductor device including an oxide semiconductor with stable electric characteristics. In a transistor including an oxide semiconductor layer, a gallium oxide film is used for a gate insulating layer and made in contact with an oxide semiconductor layer. Further, gallium oxide films are provided so as to sandwich the oxide semiconductor layer, whereby reliability is increased. Furthermore, the gate insulating layer may have a stacked structure of a gallium oxide film and a hafnium oxide film.

A semiconductor device includes wiring layers formed over a semiconductor wafer, a via-layer between the wiring layers, conductive films in the wiring layers, and a via-plug in the via-layer connecting the conductive films of the wiring layers above and below, a scribe region at an outer periphery of a chip region along an edge of the semiconductor substrate and including a pad region in the vicinity of the edge, the pad region overlapping the conductive films of the plurality of wiring layers in the plan view, the plurality of wiring layers including first second wiring layers, the conductive film of the first wiring layer includes a first conductive pattern formed over an entire surface of said pad region in a plan view, and the conductive film of the second wiring layer includes a second conductive pattern formed in a part of the pad region in a plan view.

Various embodiments related to a compact device package are disclosed herein. In some arrangements, a flexible substrate can be coupled to a carrier having walls angled relative to one another. The substrate can be shaped to include two bends. First and second integrated device dies can be mounted on opposite sides of the substrate between the two bends in various arrangements.

An object is to provide a semiconductor device including an oxide semiconductor film, which has stable electrical characteristics and high reliability. A stack of first and second material films is formed by forming the first material film (a film having a hexagonal crystal structure) having a thickness of 1 nm to 10 nm over an insulating surface and forming the second material film having a hexagonal crystal structure (a crystalline oxide semiconductor film) using the first material film as a nucleus. As the first material film, a material film having a wurtzite crystal structure (e.g., gallium nitride or aluminum nitride) or a material film having a corundum crystal structure (α-Al2O3, α-Ga2O3, In2O3, Ti2O3, V2O3, Cr2O3, or α-Fe2O3) is used.

A semiconductor device, includes a semiconductor substrate, a first interconnect layer formed over the semiconductor substrate, a gate electrode formed in the first interconnect layer, a gate insulating film formed over the gate electrode, a second interconnect layer formed over the gate insulating film, an oxide semiconductor layer formed in the second interconnect layer, and a via formed in the second interconnect layer and connected to the oxide semiconductor layer. The gate electrode, the gate insulating film and the oxide semiconductor layer overlap in a plan view.

It is an object to manufacture a highly reliable semiconductor device including a thin film transistor whose electric characteristics are stable. An insulating layer which covers an oxide semiconductor layer of the thin film transistor contains a boron element or an aluminum element. The insulating layer containing a boron element or an aluminum element is formed by a sputtering method using a silicon target or a silicon oxide target containing a boron element or an aluminum element. Alternatively, an insulating layer containing an antimony (Sb) element or a phosphorus (P) element instead of a boron element covers the oxide semiconductor layer of the thin film transistor.

A semiconductor device which includes a thin film transistor having an oxide semiconductor layer and excellent electrical characteristics is provided. Further, a method for manufacturing a semiconductor device in which plural kinds of thin film transistors of different structures are formed over one substrate to form plural kinds of circuits and in which the number of steps is not greatly increased is provided. After a metal thin film is formed over an insulating surface, an oxide semiconductor layer is formed thereover. Then, oxidation treatment such as heat treatment is performed to oxidize the metal thin film partly or entirely. Further, structures of thin film transistors are different between a circuit in which emphasis is placed on the speed of operation, such as a logic circuit, and a matrix circuit.

A semiconductor film having an impurity region to which at least an n-type or p-type impurity is added and a wiring are provided. The wiring includes a diffusion prevention film containing a conductive metal oxide, and a low resistance conductive film over the diffusion prevention film. In a contact portion between the wiring and the semiconductor film, the diffusion prevention film and the impurity region are in contact with each other. The diffusion prevention film is framed in such a manner that a conductive film is exposed to plasma generated from a mixed gas of an oxidizing gas and a halogen-based gas to form an oxide of a metal material contained in the conductive film, the conductive film in which the oxide of the metal material is formed is exposed to an atmosphere containing water to be fluidized, and the fluidized conductive film is solidified.

To provide a semiconductor device which has transistor characteristics with little variation and includes an oxide semiconductor. The semiconductor device includes an insulating film over a conductive film and an oxide semiconductor film over the insulating film. The oxide semiconductor film includes a first oxide semiconductor layer, a second oxide semiconductor layer over the first oxide semiconductor layer, and a third oxide semiconductor layer over the second oxide semiconductor layer. The energy level of a bottom of a conduction band of the second oxide semiconductor layer is lower than those of the first and third oxide semiconductor layers. An end portion of the second oxide semiconductor layer is positioned on an inner side than an end portion of the first oxide semiconductor layer.

An amorphous oxide thin film containing amorphous oxide is exposed to an oxygen plasma generated by exciting an oxygen-containing gas in high frequency. The oxygen plasma is preferably generated under the condition that applied frequency is 1 kHz or more and 300 MHz or less and pressure is 5 Pa or more. The amorphous oxide thin film is preferably exposed by a sputtering method, ion-plating method, vacuum deposition method, sol-gel method or fine particle application method.

An object is to manufacture and provide a highly reliable semiconductor device including a thin film transistor with stable electric characteristics. In a method for manufacturing a semiconductor device including a thin film transistor in which a semiconductor layer including a channel formation region serves as an oxide semiconductor film, heat treatment for reducing impurities such as moisture (heat treatment for dehydration or dehydrogenation) is performed after an oxide insulating film serving as a protective film is formed in contact with an oxide semiconductor layer. Then, the impurities such as moisture, which exist not only in a source electrode layer, in a drain electrode layer, in a gate insulating layer, and in the oxide semiconductor layer but also at interfaces between the oxide semiconductor film and upper and lower films which are in contact with the oxide semiconductor layer, are reduced.

A lightweight folding motorized chair with mechanical traction steering and braking. A folding frame supports the traction wheels and the drive system with hinged frame members configured to mechanically fold the control levers, wheels and periphery components into a substantially flat configuration for easy storage in small spaces. A mix of weight saving choices including: structural materials; mechanical traction control system; lithium ion battery; and overall lightweight design keeps the folding motorized chair at a size and weight that a person can lift into the trunk of a car.

An arrangement having a piston configured to move along an axial pathway a rotating seal configured to seal an inside environment from an outside environment, the rotating seal configured to be acted upon by a pressure exerted from the piston, a differential pressure sensor measuring a pressure difference between a first fluid from the outside environment and a second fluid on the inside environment, a motor connected to the piston, the motor configured to actuate the piston to a position along an axial pathway and an electronic feedback control system connected to the motor, the electronic feedback system configured to interface with the differential pressure sensor and maintain a pressure generated by the piston onto the rotating seal to a desired pressure.

This invention provides a structure for gunpowder charge for charging gunpowders of different rates in combined fracturing perforation devices. The structure for gunpowder charge is convenient to mount and transport. In one embodiment, said structure for gunpowder charge comprises an inner gunpowder box located between adjacent perforating charges in the charge frame of a perforation device, and an outer gunpowder box attached to the outer wall of the charge frame, wherein said outer gunpowder box comprises one or two box units (2 or 4) with at least one claw at the inner side of said box unit, said claw can be locked into a groove or installation hole of the charge frame, and wherein said inner gunpowder box and said outer gunpowder box are charged with gunpowders of different burning rates.

Embodiments of the invention relate to polycrystalline diamond compacts (“PDCs”) comprising a polycrystalline diamond (“PCD”) table including at least a portion having aluminum carbide disposed interstitially between bonded-together diamond grains thereof, and methods of fabricating such PDCs. In an embodiment, a PDC includes a substrate, and a PCD table bonded to the substrate. The PCD table includes a plurality of bonded-together diamond grains defining a plurality of interstitial regions. The PCD table further includes aluminum carbide disposed in at least a portion of the plurality of interstitial regions.

The present invention provides a blanking apparatus comprising a plurality of blankers configured to respectively blank a plurality of beams with respect to a target position on an object, and a driving device configured to drive the plurality of blankers, wherein the driving device includes a change device configured to change relation between a combination of beams of the plurality of beams, and a target dose.

The invention relates to a thermal conduction element (20) for a package for transporting and/or storing radioactive materials, comprising: an internal part (30) intended to be in contact with a lateral body (14) of the package;an external part (34) intended to form a portion of an external envelope (24) of said package, holding radiological protection means (22);an intermediate part (32) arranged between the internal and external parts,the internal, external and intermediate parts being produced from copper and one of the alloys thereof. According to the invention, the external part (34) is equipped, at each of its two opposite ends, with an area (36) for connection by welding to another thermal conduction element (20), each connection area (36) being produced from steel.

A coupling and various methods of use of the coupling. In one embodiment a coupling is provided for use with an appliance operated by a power supply, which coupling allows mounting/dismounting of the appliance without electrical isolation from the supply, said coupling comprising: a) a mounting member having a first encapsulated transformer element and suitable controls connectable to the power supply, said member being suitable for fixing to a structure; and b) a holder member engageable with said mounting member and suitable for holding or for connecting thereto an appliance, said holder member including a second encapsulated transformer element able to conduct power to an appliance.

Examples of the present invention include apparatus and methods for monitoring aging of an item. A solid-state structure is located within, adjacent to, or otherwise proximate the item, the solid-state structure including nanostructures. The electrical resistance and/or magnetization of the solid-state structure is determined to determine the degree of aging of the item. In representative examples, the solid-state structure includes nanostructures of a metal, such as a ferromagnetic metal, within a non-magnetic matrix, such as a semimetal, semiconductor, or insulator.

Image sensors and methods of operating the same. An image sensor includes a pixel array including a plurality of pixels. Each of the plurality of pixels includes a photo sensor, the voltage-current characteristics of which vary according to energy of incident light, and that generates a sense current determined by the energy of the incident light; a reset unit that is activated to generate a reference current, according to a reset signal for resetting at least one of the plurality of pixels; and a conversion unit that converts the sense current and the reference current into a sense voltage and a reference voltage, respectively.

According to one embodiment, a solid state imaging device includes a sensor substrate having a plurality of pixels formed on an upper face, a microlens array substrate having a plurality of microlenses formed and a connection post with one end bonded to a region between the microlenses on the microlens array substrate and with the other end bonded to the upper face.

A fluidized bed reactor includes a bottom portion, a roof portion, and side walls vertically extending between the bottom portion and the roof portion, forming a reaction chamber of the reactor. At least one side wall of the reaction chamber forms at least one vertical indentation in the reaction chamber, which indentation extends from the plane of the at least one side wall towards the reaction chamber. The indentation extending from the plane of the at least one side wall towards the reaction chamber is formed of a portion of the at least one side wall, protruding from the plane of the at least one side wall towards the reaction chamber, and the portion of the at least one side wall includes at least two substantially vertical indenting wall portions deviating from the plane of the at least one side wall at vertical lines within a distance from each other.

Methods and apparatus for converting electromagnetic radiation, such as solar energy, into electric energy with increased efficiency when compared to conventional solar cells are provided. A photovoltaic (PV) device generally includes a window layer; an absorber layer disposed below the window layer such that electrons are generated when photons travel through the window layer and are absorbed by the absorber layer; and a plurality of contacts for external connection coupled to the absorber layer, such that all of the contacts for external connection are disposed below the absorber layer and do not block any of the photons from reaching the absorber layer through the window layer. Locating all the contacts on the back side of the PV device avoids solar shadows caused by front side contacts, typically found in conventional solar cells. Therefore, PV devices described herein with back side contacts may allow for increased efficiency when compared to conventional solar cells.

Disclosed is a photovoltaic device. The photovoltaic device includes: a substrate; a first electrode placed on the substrate; a second electrode which is placed opposite to the first electrode and which light is incident on; a first unit cell being placed between the first electrode and the second electrode, and including an intrinsic semiconductor layer including crystalline silicon grains making the surface of the intrinsic semiconductor layer toward the second electrode textured; and a second unit cell placed between the first unit cell and the second electrode.

This disclosure relates to electroconductive paste formulations useful in solar panel technology. In one aspect, the disclosure relates to an inorganic reaction system for use in electroconductive paste compositions, wherein the inorganic reaction system comprises a lead containing matrix composition and a tellurium containing matrix composition. In another aspect, the disclosure relates to an electroconductive paste composition comprising a conductive metal component, an inorganic reaction system and an organic vehicle. Another aspect of the disclosure relates to a solar cell produced by applying an electroconductive paste composition of the invention to a silicon wafer. Yet another aspect relates to a solar cell module assembled using solar cells produced by applying an electroconductive paste composition to a silicon wafer, wherein the electroconductive paste composition comprises an conductive metal component, an inorganic reaction system and an organic vehicle.

Novel photoactive polymers, as well as related photovoltaic cells, articles, systems, and methods, are disclosed.

A back electrode type solar cell in which a no-electrode-formed region where no electrode is placed is provided in a part of a peripheral portion of a back surface of the back electrode type solar cell such that a line connecting end portions of a plurality of electrodes to one another includes a partially inwardly recessed region and the no-electrode-formed region is located adjacent to each of an electrode for n-type and an electrode for p-type adjacent to each other, a solar cell module, a method of manufacturing a back electrode type solar cell with interconnection sheet, and a method of manufacturing a solar cell module are provided.

A photovoltaic cell comprises a top subcell having a first band gap; a middle subcell comprising a substrate and having a second band gap, wherein the substrate comprises a first side and a second side opposite to the first side; and a bottom subcell having a third band gap, wherein the top subcell is grown on the first side of the substrate and the bottom subcell is grown on the second side of the substrate, wherein the first band gap is larger than the second band gap and the second band gap is larger than the third band gap.

A photovoltaic device including a substrate; a first electrode placed on the substrate; a second electrode which is placed opposite to the first electrode and which light is incident on; a first unit cell being placed between the first electrode and the second electrode, and including an intrinsic semiconductor layer including crystalline silicon grains making the surface of the intrinsic semiconductor layer toward the second electrode textured; and a second unit cell placed between the first unit cell and the second electrode.

A multi-junction solar cell having a Ge or GaAs substrate, as well as a solar cell structure having several subcells deposited on the substrate, the substrate having peripheral side faces, and the solar cell structure having a peripheral circumferential surface, which runs spaced apart from the side faces. To prevent oxidation and penetration of moisture, the circumferential surface of the solar cell structure is coated with a protective, electrically insulating first coating under essential exclusion of the upper surface facing the rays, or that without encroaching on the solar cell structure, the side faces of the substrate are coated with a protective, electrically insulating second coating or that both the side faces of the substrate as well as the circumferential surface of the solar cell structure are coated with a third coating by essential exclusion of the upper surface facing the rays.

In a case where components such as side flaps and crotch portions are arranged on multiple webs which are being conveyed while being arranged side by side in the width direction of the webs, articles in various sizes can be handled easily by a web conveying step of conveying a front waistline web 11A and a back waistline web 11B the webs being arranged side by side in a width direction of the webs, a flap attaching step of attaching side flaps 30 onto the web 11 of the front waistline web 11A or the back waistline web, a web gap changing step of changing a gap between the front waistline web 11A and the back waistline web 11B by a web gap changing mechanism 500 and a crotch member attaching step of attaching a crotch member 20 between the front waistline web 11A and the back waistline web 11B, wherein the web gap changing step is performed between the flap attaching step and the crotch member attaching step.

According to one embodiment, a tractor comprises a guide shaft, a first belt unit, a second belt unit, a fixing unit and a connecting unit. The first belt unit is supported by the guide shaft so as to move in an axis direction of the guide shaft. The second belt unit is arranged to face the first belt unit in the axis direction of the guide shaft and supported by the guide shaft. The fixing unit, which is movably supported by the guide shaft in the axis direction of the guide shaft and is capable of being fixed on the guide shaft. The connecting unit configured to connect the first belt unit to the fixing unit with a clearance in the axis direction of the guide shaft.

A method for phase modulation of a carrier signal from a transmitter to a contactless transponder in which data is coded as consecutive symbols, each corresponding to a predefined number of carrier cycles, and in which a symbol time is at least two cycles of the carrier signal includes, at the transmitter, spreading a phase jump of a symbol in relation to a preceding symbol over a first part of the symbol time. The establishment of the phase jump is completed in the first part of the symbol time. The periods of the cycles are constant during a second part of the symbol time.

An arc chute assembly includes a housing having a first wall, a second wall, and a pair of side walls coupled to the first wall. The walls configured to form an arc area. The housing further having a divider wall coupled to the first wall between the side walls. The divider wall configured to form a first sub-arc area, a second sub-arc area, and an arc plate area. The first sub-arc area and the second sub-arc area are configured to be in flow communication with the arc plate area. The arc chute assembly further comprises a support coupled to the first wall and the side walls, and an arc plate coupled to the support. The arc plate having a body extending between the side walls and over the divider wall.

An electromagnetic actuator comprising a core moving between a latched position and an open position, a permanent magnet, a coil designed to generate a first magnetic control flux to move the core from an open position to a latched position, and a second magnetic control flux designed to facilitate movement of the moving core from the latched position to the open position. The permanent magnet is positioned on the moving core so as to be at least partly outside the fixed magnetic circuit in which the first magnetic control flux flows in the open position, and to be at least partly inside the fixed magnetic circuit used for flow of a magnetic polarization flux of the magnet in the latched position.

A method of manufacturing a power contactor from an existing contactor having a magnetic amplifier that comprises a blowout coil and a ferromagnetic core, and an arc chute for extinguishing an arc generated by opening the existing contactor under a current load is disclosed. The method includes removing a bolt assembly from the existing contactor and at least one side plate from the existing contactor. The method also includes removing the ferromagnetic core from the existing contactor.

The present invention relates to contactors for unidirectional DC operation with permanent magnetic arc extinguishing. In addition to the blow magnets, the contactors are equipped with compensatory permanent magnets for compensating the magnetic field in the vicinity of the contact bridge in order to prevent contact levitation, i.e., an uncontrolled opening of the contacts that is due to a magnetic force generated by a strong current flowing through the contact bridge. To this end, the compensatory permanent magnets are arranged in the vicinity of the contact bridge and polarized in the opposite direction of the blow magnets. The magnetic field of the compensatory magnets and the current flowing through the contact bridge are generating a magnetic force that acts on the contact bridge and tends to keep the electrical contacts closed.

A circuit interrupter includes, a first contact and a second contact, the second contact being moveable relative to the first contact, a drive assembly structured to move the second contact relative to the first contact, and an erosion monitoring device including a linear transducer coupled to a portion of the drive assembly. The liner transducer is structured to generate an output signal representative of an amount of linear displacement of the portion of the drive assembly, wherein the erosion monitoring device is structured to monitor a degree of erosion of at least one of the first contact and the second contact based on the output signal.

A gas-insulated type circuit breaker including a housing defining a gas volume for a dielectric insulation gas; a first arcing contact member and a second arcing contact member, wherein the first arcing contact member and the second arcing contact member are movable relative to each other along an axis; a first nominal contact member and a second nominal contact member, wherein the first nominal contact member and the second nominal contact member are movable relative to each other along the axis; and a first nominal contact shielding arrangement including an inner shield member and an outer shield member, wherein the inner shield member and the outer shield member are arranged coaxially about the axis. The first nominal contact member is arranged co-axially between the inner shield member and the outer shield member, and is movable relative to the inner shield member and to the outer shield member.

An exemplary medium or high voltage switch has a first set of contact elements and a second set of contact elements. Each contact element includes an insulating carrier carrying conducting elements. In the closed state of the switch, the conducting elements align to form one or more current paths between terminals of the switch along an axial direction. For opening the switch, the contact elements are mutually displaced by means of one or two drives along a direction perpendicular to the axial direction. The switching arrangement is arranged in a fluid-tight housing in a gas of elevated pressure or in a liquid. The switch has a high voltage withstand capability and fast switching times.

A multi-standard flash-memory-card carrier is about the same size as a thick credit card and fits into a wallet. The multi-standard flash-memory-card carrier has bays that accept flash-memory cards. Larger bays on one side receive SD cards and a Memory Stick Duo card, while micro bays on another side of the carrier receive microSD cards and Memory Stick Micro cards. A carrier spine sandwiched between top and bottom covers has openings forming the bays. Spring-clip tabs on spring-clip fingers fit into notches on the side of the flash-memory cards to secure the flash-memory cards into the multi-standard flash-memory-card carrier to prevent loss. The spring-clip fingers are movable parts of the carrier spine that are deformed during insertion of the flash-memory cards. Both micro and standard flash-memory cards can be carried in the same multi-standard flash-memory-card carrier that can be placed in plastic sleeves for credit cards in a person's wallet.

Containers and components thereof for use in the medical industry and methods to manufacture the same are described. An example tab for use with a medical container includes opposing sheets sealed to define an open ended chamber into which a port is to be at least partially positioned. The port is to enable access to the medical container. The tab includes a tear seal defined by each of the opposing sheets and a first guide positioned on a first side of each of the tear seals. The tab includes a second guide positioned on a second side of each of the tear seals, wherein the first and second guides are to enable a tear to propagate substantially between the guides and adjacent the tear seals.

A container storing an anesthetic is disclosed. The container is sealed by a closure and stores a liquid anesthetic solution. The anesthetic is from 0.1% to 10% by weight of the liquid anesthetic solution. The container is made of a material that is inert to the anesthetic and the closure is made of siliconized rubber or a metal. A concentration of the anesthetic in a liquid anesthetic solution stored in the container following a predetermined time period is at least 93% of a concentration of the anesthetic in a liquid anesthetic solution before the liquid anesthetic solution is stored in the container.

A tactile orientation indicator is positioned along the periphery of a bill, and a tactile denomination indicator is positioned elsewhere along the periphery of the bill. The user of the bill may then use their tactile senses to feel along the edges of the bill to orient the bill to a pre-determined orientation based on the location of the orientation indicator. The user then feels along the periphery of the bill to locate the denomination indicator. Using a predetermined system associating the location of the denomination indicator with a particular bill denomination, the user may then identify the denomination of the bill even if blind or otherwise visually impaired.

A differential circuit with a function to compensate unevenness observed in the differential gain thereof is disclosed. The differential circuit provides a low-pass filter in one of the paired transistors not receiving the input signal in addition to another low-pass filter that provides an average of output signals as a reference level of the differential circuit. The cut-off frequency of the filter is preferably set to be equal to the transition frequency at which the self-heating effect explicitly influences the trans-conductance of the transistor.

A light emitting apparatus including: a plurality of light emitting elements; a drive circuit including a transistor and a capacitor having one end connected to a gate of the transistor; and a signal supply circuit for receiving a digital gradation signal and outputting an analog voltage signal to the drive circuit, including a computation circuit configured to correct the input digital gradation signal to generate a corrected digital gradation signal, in which the drive circuit is configured to conduct an auto-zero operation which reduce the gate-source voltage of the transistor to a threshold voltage by flowing the drain current to the capacitor, and the computation circuit is configured to generate the corrected digital gradation signal by multiplying a correction coefficient to the input digital gradation signal subtracted by a particular signal common to the plurality of light emitting elements.

An adhesive layer that bonds the back surface of a plate capable of attracting a wafer and the front surface of a cooling plate together that includes a main adhesive portion, which is made of a hardened matter of a fluid adhesive, and an outer peripheral adhesive portion, gas-supply-hole adhesive portions, lift-pin-hole adhesive portions, and terminal-hole adhesive portions made of a double-faced tape. The tape portions bond the outer peripheral edge on the back surface of the plate and the outer peripheral edge on the front surface of the cooling plate together, and the outer peripheral edges of the holes on the back surface of the plate and the outer peripheral edges of these holes on the front surface of the cooling plate together.