A method weaves pile fabrics with at least two different pile heights (a, b) in the same pile row, wherein the fabrics have weft threads, ground warp threads and pile-warp threads (1, 2), wherein these pile-warp threads are interlaced in the fabric, according to a pattern, in a figure-forming manner or are inwoven in a non-figure-forming manner, and which, when they are figure-forming, form pile with a well-defined pile height. The method includes a first set of pile warp threads, under light strain and at least a second set of pile warp threads under a higher strain. A device for manufacturing such fabrics is described.

This lanyard, which is movable by elasticity between a rest position and a stretched position, comprises a tubular sheath made from non-stretchable material, and a set of elastic threads joined to the sheath. According to the invention, the elastic threads define at least one longitudinal weaving zone in which they are woven on one surface of the sheath only, each weaving zone being proper to form a bending zone of the lanyard, in the rest position, in which the elastic threads are folded onto themselves.

The regulator/brush-holder assembly (1) comprises a support (2) and an electrical circuit (5, 6) comprising a regulating element (5) connected by microwires to a trace circuit (6). The electrical circuit further includes a filtering circuit (10) separate from the regulating element and connected by microwires to the trace circuit. According to one particular embodiment, the filtering circuit comprises an insulating substrate (11) and surface-mounted components (C1, C2, S1, S2, V). A ground plane (19) and/or one or more ground pads may be provided for connection to a ground trace of the trace circuit. The filtration frequencies of the filter circuit extend from 100 kHz to 1 GHz.

The present invention provides a technique which can disassemble a mandrel having a substantially cylindrical shape and being dividable into a plurality of segments, easily and efficiently. The disassembling method comprises, in the mandrel adhesively attached with a composite material structure on an outer peripheral surface thereof, a rotation step of rotating the pair of support rings along with the mandrel to position a segment which is a detached target to an uppermost portion; and a segment detaching step of detaching the segment which is the detached target positioned at the uppermost portion, from the pair of support rings; wherein in the segment detaching step, the segment which is the detached target is moved in a vertically downward direction to a position inside of the mandrel, between the pair of support rings, and is carried out from between the pair of support rings.

The present invention provides a manufacturing apparatus which can realize so-called sequential substrate transfer and can improve throughput, even when one multi-layered thin film includes plural layers of the same film type. A manufacturing apparatus according to an embodiment of the present invention includes a transfer chamber, three sputtering deposition chambers each including one sputtering cathode, two sputtering deposition chambers each including two or more sputtering cathodes, and a process chamber for performing a process other than sputtering, and the three sputtering deposition chambers, the two sputtering deposition chambers, and the process chamber are arranged around the transfer chamber so that each is able to perform delivery and receipt of the substrate with the transfer chamber.

In a gas sensor sensing a specific gas component contained in gas to be measured, oxygen ion conductive solid electrolyte is used in a sensing element for sensing the specific gas component. A terminal unit is used, which comprises a pair of insulators, each having an inner side surface, disposed to pinch and hold the base end portion of the sensing element on the pair of electrode-mounted surfaces of the sensing element. The terminal unit comprises two pairs of metal terminals and a spring member. The metal terminals electrically contact electrode pads of the sensing element, pair by pair, respectively, and are disposed on the inner side surfaces of the insulators. The spring members press the pair of insulators at one or more positions of electrode-mounted surfaces of the sensing element in a width direction so that the insulators are pressed to be opposed to each other.

The present invention provides a device that decreases deformation during manufacturing of the device, provides a firm joint without use of an adhesive, and allows chemical modification of a channel during manufacturing of the device. The device includes two joined substrates, and a concavity is formed on at least one of the opposing surfaces of the two substrates so as to make a channel, where the two substrates are joined together by a covalent bond via a crosslinking agent (A), and the crosslinking agent (A) is exposed on an inner wall surface of the channel.

According to embodiments of the invention, a TFT array substrate, a manufacturing method of the TFT array substrate and a display device are provided. The method comprises: depositing a metal film on a substrate, and forming a gate electrode and a gate line; forming a gate insulating layer and a passivation layer on the substrate; depositing a transparent conductive layer, a first source/drain metal layer and a first ohmic contact layer, and forming a drain electrode, a pixel electrode, a data line, and a first ohmic contact layer pattern provided on the drain electrode; and depositing a semiconductor layer, a second ohmic contact layer and a second source/drain metal layer, and forming a source electrode, a second ohmic contact layer pattern provided below the source electrode, and a semiconductor channel between the source electrode and the drain electrode.

An organic light emitting diode (OLED) display a includes: a substrate; an organic light emitting element on the substrate and including a first electrode, a light emission layer, and a second electrode; and an encapsulation layer on the substrate while covering the organic light emitting element. The encapsulation layer includes an organic layer and an inorganic layer. A mixed area, where organic materials forming the organic layer and inorganic materials forming the inorganic layer co-exist along a plane direction of the encapsulation layer, is formed at the boundary between the organic layer and the inorganic layer.

An object is to manufacture a semiconductor device with high reliability by providing the semiconductor device including an oxide semiconductor with stable electric characteristics. In a transistor including an oxide semiconductor layer, a gallium oxide film is used for a gate insulating layer and made in contact with an oxide semiconductor layer. Further, gallium oxide films are provided so as to sandwich the oxide semiconductor layer, whereby reliability is increased. Furthermore, the gate insulating layer may have a stacked structure of a gallium oxide film and a hafnium oxide film.

A semiconductor device includes wiring layers formed over a semiconductor wafer, a via-layer between the wiring layers, conductive films in the wiring layers, and a via-plug in the via-layer connecting the conductive films of the wiring layers above and below, a scribe region at an outer periphery of a chip region along an edge of the semiconductor substrate and including a pad region in the vicinity of the edge, the pad region overlapping the conductive films of the plurality of wiring layers in the plan view, the plurality of wiring layers including first second wiring layers, the conductive film of the first wiring layer includes a first conductive pattern formed over an entire surface of said pad region in a plan view, and the conductive film of the second wiring layer includes a second conductive pattern formed in a part of the pad region in a plan view.

An object is to provide a semiconductor device including an oxide semiconductor film, which has stable electrical characteristics and high reliability. A stack of first and second material films is formed by forming the first material film (a film having a hexagonal crystal structure) having a thickness of 1 nm to 10 nm over an insulating surface and forming the second material film having a hexagonal crystal structure (a crystalline oxide semiconductor film) using the first material film as a nucleus. As the first material film, a material film having a wurtzite crystal structure (e.g., gallium nitride or aluminum nitride) or a material film having a corundum crystal structure (α-Al2O3, α-Ga2O3, In2O3, Ti2O3, V2O3, Cr2O3, or α-Fe2O3) is used.

A semiconductor device, includes a semiconductor substrate, a first interconnect layer formed over the semiconductor substrate, a gate electrode formed in the first interconnect layer, a gate insulating film formed over the gate electrode, a second interconnect layer formed over the gate insulating film, an oxide semiconductor layer formed in the second interconnect layer, and a via formed in the second interconnect layer and connected to the oxide semiconductor layer. The gate electrode, the gate insulating film and the oxide semiconductor layer overlap in a plan view.

It is an object to manufacture a highly reliable semiconductor device including a thin film transistor whose electric characteristics are stable. An insulating layer which covers an oxide semiconductor layer of the thin film transistor contains a boron element or an aluminum element. The insulating layer containing a boron element or an aluminum element is formed by a sputtering method using a silicon target or a silicon oxide target containing a boron element or an aluminum element. Alternatively, an insulating layer containing an antimony (Sb) element or a phosphorus (P) element instead of a boron element covers the oxide semiconductor layer of the thin film transistor.

A semiconductor device which includes a thin film transistor having an oxide semiconductor layer and excellent electrical characteristics is provided. Further, a method for manufacturing a semiconductor device in which plural kinds of thin film transistors of different structures are formed over one substrate to form plural kinds of circuits and in which the number of steps is not greatly increased is provided. After a metal thin film is formed over an insulating surface, an oxide semiconductor layer is formed thereover. Then, oxidation treatment such as heat treatment is performed to oxidize the metal thin film partly or entirely. Further, structures of thin film transistors are different between a circuit in which emphasis is placed on the speed of operation, such as a logic circuit, and a matrix circuit.

A semiconductor film having an impurity region to which at least an n-type or p-type impurity is added and a wiring are provided. The wiring includes a diffusion prevention film containing a conductive metal oxide, and a low resistance conductive film over the diffusion prevention film. In a contact portion between the wiring and the semiconductor film, the diffusion prevention film and the impurity region are in contact with each other. The diffusion prevention film is framed in such a manner that a conductive film is exposed to plasma generated from a mixed gas of an oxidizing gas and a halogen-based gas to form an oxide of a metal material contained in the conductive film, the conductive film in which the oxide of the metal material is formed is exposed to an atmosphere containing water to be fluidized, and the fluidized conductive film is solidified.

To provide a semiconductor device which has transistor characteristics with little variation and includes an oxide semiconductor. The semiconductor device includes an insulating film over a conductive film and an oxide semiconductor film over the insulating film. The oxide semiconductor film includes a first oxide semiconductor layer, a second oxide semiconductor layer over the first oxide semiconductor layer, and a third oxide semiconductor layer over the second oxide semiconductor layer. The energy level of a bottom of a conduction band of the second oxide semiconductor layer is lower than those of the first and third oxide semiconductor layers. An end portion of the second oxide semiconductor layer is positioned on an inner side than an end portion of the first oxide semiconductor layer.

An amorphous oxide thin film containing amorphous oxide is exposed to an oxygen plasma generated by exciting an oxygen-containing gas in high frequency. The oxygen plasma is preferably generated under the condition that applied frequency is 1 kHz or more and 300 MHz or less and pressure is 5 Pa or more. The amorphous oxide thin film is preferably exposed by a sputtering method, ion-plating method, vacuum deposition method, sol-gel method or fine particle application method.

An object is to manufacture and provide a highly reliable semiconductor device including a thin film transistor with stable electric characteristics. In a method for manufacturing a semiconductor device including a thin film transistor in which a semiconductor layer including a channel formation region serves as an oxide semiconductor film, heat treatment for reducing impurities such as moisture (heat treatment for dehydration or dehydrogenation) is performed after an oxide insulating film serving as a protective film is formed in contact with an oxide semiconductor layer. Then, the impurities such as moisture, which exist not only in a source electrode layer, in a drain electrode layer, in a gate insulating layer, and in the oxide semiconductor layer but also at interfaces between the oxide semiconductor film and upper and lower films which are in contact with the oxide semiconductor layer, are reduced.

The present invention provides a blanking apparatus comprising a plurality of blankers configured to respectively blank a plurality of beams with respect to a target position on an object, and a driving device configured to drive the plurality of blankers, wherein the driving device includes a change device configured to change relation between a combination of beams of the plurality of beams, and a target dose.

According to one embodiment, a solid state imaging device includes a sensor substrate having a plurality of pixels formed on an upper face, a microlens array substrate having a plurality of microlenses formed and a connection post with one end bonded to a region between the microlenses on the microlens array substrate and with the other end bonded to the upper face.

Disclosed is a photovoltaic device. The photovoltaic device includes: a substrate; a first electrode placed on the substrate; a second electrode which is placed opposite to the first electrode and which light is incident on; a first unit cell being placed between the first electrode and the second electrode, and including an intrinsic semiconductor layer including crystalline silicon grains making the surface of the intrinsic semiconductor layer toward the second electrode textured; and a second unit cell placed between the first unit cell and the second electrode.

A back electrode type solar cell in which a no-electrode-formed region where no electrode is placed is provided in a part of a peripheral portion of a back surface of the back electrode type solar cell such that a line connecting end portions of a plurality of electrodes to one another includes a partially inwardly recessed region and the no-electrode-formed region is located adjacent to each of an electrode for n-type and an electrode for p-type adjacent to each other, a solar cell module, a method of manufacturing a back electrode type solar cell with interconnection sheet, and a method of manufacturing a solar cell module are provided.

A photovoltaic cell comprises a top subcell having a first band gap; a middle subcell comprising a substrate and having a second band gap, wherein the substrate comprises a first side and a second side opposite to the first side; and a bottom subcell having a third band gap, wherein the top subcell is grown on the first side of the substrate and the bottom subcell is grown on the second side of the substrate, wherein the first band gap is larger than the second band gap and the second band gap is larger than the third band gap.

A photovoltaic device including a substrate; a first electrode placed on the substrate; a second electrode which is placed opposite to the first electrode and which light is incident on; a first unit cell being placed between the first electrode and the second electrode, and including an intrinsic semiconductor layer including crystalline silicon grains making the surface of the intrinsic semiconductor layer toward the second electrode textured; and a second unit cell placed between the first unit cell and the second electrode.

A multi-junction solar cell having a Ge or GaAs substrate, as well as a solar cell structure having several subcells deposited on the substrate, the substrate having peripheral side faces, and the solar cell structure having a peripheral circumferential surface, which runs spaced apart from the side faces. To prevent oxidation and penetration of moisture, the circumferential surface of the solar cell structure is coated with a protective, electrically insulating first coating under essential exclusion of the upper surface facing the rays, or that without encroaching on the solar cell structure, the side faces of the substrate are coated with a protective, electrically insulating second coating or that both the side faces of the substrate as well as the circumferential surface of the solar cell structure are coated with a third coating by essential exclusion of the upper surface facing the rays.

In a case where components such as side flaps and crotch portions are arranged on multiple webs which are being conveyed while being arranged side by side in the width direction of the webs, articles in various sizes can be handled easily by a web conveying step of conveying a front waistline web 11A and a back waistline web 11B the webs being arranged side by side in a width direction of the webs, a flap attaching step of attaching side flaps 30 onto the web 11 of the front waistline web 11A or the back waistline web, a web gap changing step of changing a gap between the front waistline web 11A and the back waistline web 11B by a web gap changing mechanism 500 and a crotch member attaching step of attaching a crotch member 20 between the front waistline web 11A and the back waistline web 11B, wherein the web gap changing step is performed between the flap attaching step and the crotch member attaching step.

An arc chute assembly includes a housing having a first wall, a second wall, and a pair of side walls coupled to the first wall. The walls configured to form an arc area. The housing further having a divider wall coupled to the first wall between the side walls. The divider wall configured to form a first sub-arc area, a second sub-arc area, and an arc plate area. The first sub-arc area and the second sub-arc area are configured to be in flow communication with the arc plate area. The arc chute assembly further comprises a support coupled to the first wall and the side walls, and an arc plate coupled to the support. The arc plate having a body extending between the side walls and over the divider wall.

A light emitting apparatus including: a plurality of light emitting elements; a drive circuit including a transistor and a capacitor having one end connected to a gate of the transistor; and a signal supply circuit for receiving a digital gradation signal and outputting an analog voltage signal to the drive circuit, including a computation circuit configured to correct the input digital gradation signal to generate a corrected digital gradation signal, in which the drive circuit is configured to conduct an auto-zero operation which reduce the gate-source voltage of the transistor to a threshold voltage by flowing the drain current to the capacitor, and the computation circuit is configured to generate the corrected digital gradation signal by multiplying a correction coefficient to the input digital gradation signal subtracted by a particular signal common to the plurality of light emitting elements.

An adhesive layer that bonds the back surface of a plate capable of attracting a wafer and the front surface of a cooling plate together that includes a main adhesive portion, which is made of a hardened matter of a fluid adhesive, and an outer peripheral adhesive portion, gas-supply-hole adhesive portions, lift-pin-hole adhesive portions, and terminal-hole adhesive portions made of a double-faced tape. The tape portions bond the outer peripheral edge on the back surface of the plate and the outer peripheral edge on the front surface of the cooling plate together, and the outer peripheral edges of the holes on the back surface of the plate and the outer peripheral edges of these holes on the front surface of the cooling plate together.

A process for manufacturing surgical needles from solid, cylindrical needle blanks. A plurality of needle blanks are cut from a roll of wire and mounted to a flat carrier strip. The carrier strip then indexes each needle blank to a grinding station where an orbital grinding means grinds the distal end of each needle blank into a taper point while the needle blanks are held fixed in the carrier strip.

A surgical needle has a top edge formed by two pressed faces located inside or outside of curvature from pressing a material blank made of austenitic stainless steel having fibrous texture and cutting edges formed on both sides of a base. The top edge is sharp at a needle point and the sharp needle point is constituted of fibrous texture formed at the surface layer of the material blank. Grinding marks extending crosswise formed on the face of the mold are transferred to the pressed faces. A mold constitutes plural faces forming projecting angles (angle between two intersecting faces is 180° or below, and the line at which the two faces intersect is made as a projecting line) along edges of the blocks made of two rectangular prisms, and constitutes a cavity by suitably contacting the edges of the blocks.

A process for progressively manufacturing cutting edge needles or wire members. Needle blanks or wire blanks are cut from a roll of wire and mounted to a carrier strip. The carrier strip and needles are moved through a succession of coining dies and at least one trimming die, wherein the first coining die is an open coining die and the one or more successive coining dies are closed coining dies. The needle blanks or wire members are optionally curved, heat treated and electrochemically treated resulting in cutting edge needles or wire members formed without a grinding step and without adversely affecting point ductility.

This invention relates to a method for manufacturing a needle attached suture and an apparatus therefor. A needle attached suture is obtained by inserting a suture into an insertion hole formed in the end of a needle N which is held by a needle retaining unit 16 and by swaging the end of the needle with the suture. The method and the apparatus have been developed to accurately position the end of the needle for swaging with the suture to stabilize the swaging strength between the suture and the needle. Before the swaging, the needle is held by the needle retaining unit 16, and the end of the needle N is pushed to a certain position by a rod 99 or its equivalent. Thereby, the end of the needle N relative to the needle retaining unit 16 is accurately positioned.

A tip portion of a needle main body having an edge point includes a first slant surface slanted at 10-18 degrees with respect to the axis of the needle main body, a pair of second slant surfaces slanted at 16-23 degrees, and a pair of third slant surfaces slanted at 19-27 degrees. The ratios of the lengths of the first, second, and third slant surfaces are set to be 40-50%, 5-15%, and 35-55%. At the time of forming the second slant surfaces and the third slant surfaces, a grinding wheel or the needle main body is turned relative to the other in a horizontal plane so that the direction of axis of the grinding wheel and the direction of axis of the needle main body are in a twisted or distorted relationship from a substantially orthogonal relationship such that the radial outer sides of the second and the third slant surfaces are included downwardly.

A process for manufacturing a surgical needle incorporates at least one pressing operation which, preferably, in conjunction with a trimming and/or etching process, ultimately forms the sharpened needle end. The grinding operation in the preferred process does not produce the primary sharpened edges of the needle, but, rather is incorporated, in one instance, to reduce excess needle material prior to the pressing operation. Consequently, the amount of flash material generated during pressing is substantially reduced. This feature desirably enhances the subsequent trimming and etching operations, and produces a needle which is extremely sharp, durable and exhibits an improved retention of sharpness over periods of prolonged use.

A process for manufacturing a surgical needle incorporates at least one pressing operation which, preferably, in conjunction with a trimming and/or etching process, ultimately forms the sharpened needle end. The grinding operation in the preferred process does not produce the primary sharpened edges of the needle, but, rather is incorporated, in one instance, to reduce excess needle material prior to the pressing operation. Consequently, the amount of flash material generated during pressing is substantially reduced. This feature desirably enhances the subsequent trimming and etching operations, and produces a needle which is extremely sharp, durable and exhibits an improved retention of sharpness over periods of prolonged use.

A process of a pixel electrode of a direct-sight type of reflection type liquid-crystal display device is simplified. A pixel electrode 120 of a reflection type liquid-crystal display device is formed of an aluminum film which is formed by sputtering. In forming the aluminum film, moisture is intentionally contained in atmosphere, and also a sample is heated. With this process, aluminum grains grow so that irregularities of μm order is formed on the surface of the aluminum film. The aluminum film thus formed allows the incident light to be irregularly reflected so that it is in a visually white muddy state. This is suitable to the pixel electrode for the reflection type liquid-crystal display device.

A touch apparatus, a transparent scan electrode, a geometric electrode structure and a manufacturing method thereof are disclosed. The transparent scan electrode structure comprises a first transparent scan electrode, a second transparent scan electrode and an isolative layer. The first transparent scan electrode comprises a first resistance region and a second resistance region. A resistance value of the second resistance region is higher than that of the first resistance region. The isolative layer is disposed between the first transparent scan electrode and the second transparent scan electrode.

There are provided an apparatus and a method for manufacturing a vitreous silica crucible which can prevent the deterioration of the inner surface property in the manufacturing process of a vitreous silica crucible. The apparatus includes a mold defining an outer shape of a vitreous silica crucible, and an arc discharge unit having electrodes and a power-supply unit, wherein each of the electrodes includes a tip end directed to the mold, the other end opposite to the tip end, and a bent portion provided between the tip end and the other end.

A yttria sintered body is provided which includes yttria as a principal ingredient and 5 to 40 vol. % silicon nitride, and which exhibits enhanced corrosion resistance and mechanical strength.

A metallic protecting cover is formed from two axially split members, i.e. a first protecting cover member secured to a mounting eye, and a second protecting cover member having an overall length shorter than that of each of first and second cylinders and having a predetermined gap between itself and the second cylinder. The second protecting cover member is press-fitted into the first protecting cover member secured to the mounting eye to integrate the first and second protecting cover members into the protecting cover. Accordingly, the lower end of the second cylinder can be caulked in a state where the second protecting cover member has been temporarily assembled to the second cylinder. Thus, it is possible to ensure the required strength of the protecting cover and to increase the degree of freedom in assembly process.

A method of creating a bend in a construction component for use in a transportation vehicle. The method comprises providing a plurality of cuts in the construction component so as to create a region of increased flexibility in the construction component. The method further comprises bending the construction component in the region of increased flexibility so as to cause the construction component to acquire a bent shape, and then rigidifying the construction component in the region of increased flexibility so as to cause said construction component to maintain the acquired bent shape.

Method and device for preparing a paste by blending or mixing materials, in particular for making aluminum production electrodes. The method includes the following operations: a) introducing the materials to be blended or mixed into a vat (31) having an inner surface extending along a substantially horizontal axis of revolution (X), b) rotating the vat (31) about the axis of revolution (X) and urging the materials via centrifugation against the inner surface of the vat (31), and c) locally dislodging the centrifuged materials from the inner surface by rotating the vat (31) and causing same to fall onto a crumbling tool (40).

There is provided in one aspect a nozzle boot arrangement for supporting a nozzle of a fuel dispensing unit, the nozzle including a spout and a base portion including a grip. The arrangement includes a nozzle boot including means for supporting the nozzle at the base portion thereof, and a section for receiving at least a portion of the spout. The arrangement also includes a stopper provided at said receiving section and formed separately from said nozzle boot. The stopper is arranged to cooperate with the spout to prevent the nozzle from falling about from the nozzle boot arrangement by rotation of the nozzle about said supporting means. According to further aspects, there is provided a fuel dispensing unit, a nozzle boot module and method of manufacturing a nozzle boot arrangement.

A processing system according to embodiments has an article supplier which supplies an article; a first conveyor which conveys an object to be processed; a workbench which is provided on the downstream side of the first conveyor and places thereon the object to be processed, conveyed by the first conveyor; a robot which takes out the article from the article supplier and subjects the object to be processed, placed on the workbench, to an operation using the article according to a previously instructed operation movement; and a second conveyor which is provided on the downstream side of the workbench and conveys the object to be processed, which has been subjected to the operation by the robot.

A device for accommodating objects, in particular for use in an airplane, comprises at least one panel. The panel has at least one outer edge which is provided with a rim in order to form a shock-absorbing edge. The rim comprises plastic that is integrally molded onto the outer edge of the panel. The device can be an airplane trolley, folding trolley, container or galley.

The method includes subjecting the pozzolans in crushed state to a high energetic mechanical processing by grinding in a grinding equipment, whereby the pozzolan particles receive mechanical impulses, and the grinding is carried out for a predetermined time resulting in a compressive strength of a 2 inch side cube of mortar having 80% Portland cement and 20% natural pozzolan in a ratio of 1:2.75 to standard sand and in addition water required to obtain a flow of the mortar according to American standard ASTM C 109, which has been properly compacted under vibration and hardened at +20° C. in sealed condition, which after 28 days is ≧75% of the compressive strength of a 2 inch side cube, treated as the cube, of a mortar having a ratio of Portland cement:sand of 1:2.75 and water corresponding to 48.5% of the weight of Portland cement.

An object of this invention is to provide a cellulose ester film which satisfies the requirement 0.95

A solar cell module manufacturing device is disclosed. The device includes a wire supply portion, a correction portion, and a cutting portion. The supply portion includes a bobbin and wiring material on the bobbin. The correction portion corrects curvature of the wiring material. The correction portion comprises a first pulley that comes in contact with the wiring material which is drawn from the bobbin. The first pulley comprises at a periphery thereof a first groove. The first groove comprises a first basal surface and a pair of first inclined surfaces which are arranged on both sides of the first basal surface. An inclination angle θ1 of the first inclined surface relative to the first basal surface being less than or equal to an inclination angle θ2 of the wiring material which is drawn from the supply portion relative to the first basal surface.