In a sheet storing apparatus of the present invention, a tailing end supporting member which temporarily supports a tailing end of a dropping sheet bundle is arranged between a discharging port of a processing tray to discharge the sheet bundle and the upmost sheet on a stack tray as being movable between an operating position above a sheet placement face and a waiting position outside the stack tray.

A sheet processing apparatus and a method of controlling the same align sheets stacked on a stacking unit, by causing a first alignment member and a second alignment member to come into contact with edges of a sheet stacked on the stacking unit in a sheet width direction. In a case that a second sheet that is different from a first sheet stacked on the stacking unit is to be stacked on the first sheet and aligned using the first alignment member and the second alignment member, control is performed to discharge a partition sheet onto the first sheet stacked on the stacking unit.

An interconnect structure and a method of forming an interconnect structure are disclosed. The interconnect structure includes a lower conductive feature in a lower low-k (LK) dielectric layer; a first etch stop layer (ESL) over the lower conductive feature, wherein the first ESL comprises a metal compound; an upper LK dielectric layer over the first ESL; and an upper conductive feature in the upper LK dielectric layer, wherein the upper conductive feature extends through the first ESL and connected to the lower conductive feature. The interconnect structure may further include a second ESL between the upper LK dielectric layer and the first ESL, or between the first ESL and the lower conductive feature, wherein the second ESL comprises a silicon compound.

In manufacturing an LSI, or semiconductor integrated circuit device, the step of assembling device (such as resin sealing step) is normally followed by a voltage-application test in an environment of high temperature (e.g., from 85 to 130° C.) and high humidity (e.g., about 80% RH). It has been found that separation of a titanium nitride anti-reflection film from an upper film and generation of cracks in the titanium nitride film at an upper surface edge part of the aluminum-based bonding pad applied with a positive voltage in the test is caused by an electrochemical reaction due to moisture incoming through the sealing resin and the like to generate oxidation and bulging of the titanium nitride film. These problems are addressed by removing the titanium nitride film over the pad in a ring or slit shape at peripheral area of the aluminum-based bonding pad.

It is an object to provide a semiconductor device including a thin film transistor with favorable electric properties and high reliability, and a method for manufacturing the semiconductor device with high productivity. In an inverted staggered (bottom gate) thin film transistor, an oxide semiconductor film containing In, Ga, and Zn is used as a semiconductor layer, and a buffer layer formed using a metal oxide layer is provided between the semiconductor layer and a source and drain electrode layers. The metal oxide layer is intentionally provided as the buffer layer between the semiconductor layer and the source and drain electrode layers, whereby ohmic contact is obtained.

An object is to provide a thin film transistor and a method for manufacturing the thin film transistor including an oxide semiconductor with a controlled threshold voltage, high operation speed, a relatively easy manufacturing process, and sufficient reliability. An impurity having influence on carrier concentration in the oxide semiconductor layer, such as a hydrogen atom or a compound containing a hydrogen atom such as H2O, may be eliminated. An oxide insulating layer containing a large number of defects such as dangling bonds may be formed in contact with the oxide semiconductor layer, such that the impurity diffuses into the oxide insulating layer and the impurity concentration in the oxide semiconductor layer is reduced. The oxide semiconductor layer or the oxide insulating layer in contact with the oxide semiconductor layer may be formed in a deposition chamber which is evacuated with use of a cryopump whereby the impurity concentration is reduced.

A sensor substrate includes a blocking pattern disposed on a base substrate, a first electrode disposed on the base substrate and overlapping the blocking pattern, the first electrode including a plurality of first unit parts arranged in a first direction, each of the first unit parts including a plurality of lines connected to each other in a mesh-type arrangement, a color filter layer disposed on the base substrate, a plurality of contact holes defined in the color filter layer and exposing the first unit parts, and a bridge line between and connected to first unit parts adjacent to each other in the first direction, through the contact holes.

Provided is a back plate component having reflective sheet reinforcing structure. The back plate component includes: a frame, a reflective sheet and a plurality of supporting film sheets. The frame includes a plurality of lateral beams and vertical beams, and at least one hollow part is included between the lateral beams and the vertical beams. The reflective sheet is attached to the frame, and includes a reflective surface and a back surface corresponding to the reflective surface. A portion of the back surface covers the whole hollow part. The plurality of supporting film sheets is attached to the back surface at a region corresponding to the hollow part, and includes a material the same as that of the reflective sheet. A liquid crystal display device is further disclosed herein.

The present invention provides an optical compensated bending (OCB) mode liquid crystal display (LCD) panel and a method for manufacturing the same. The method comprises the following steps: forming alignment layers on substrate, respectively; forming a liquid crystal layer between the alignment layers to form a liquid crystal cell; applying an electrical signal across the liquid crystal cell; and irradiating light rays to or heating the liquid crystal cell, so as to form a first polymer alignment layer and a second polymer alignment layer, respectively. The present invention can reduce a phase transition time of liquid crystal molecules from a splay state to a bent state.

Embodiments of the disclosed technology relate to a color filter substrate and a method of manufacturing the same. The color filter substrate comprises a base substrate having a black matrix pattern thereon, the black matrix pattern having a plurality of openings; and a plurality of color filter layers in different colors, disposed on the base substrate and located at the openings of the black matrix pattern, the color filter layers being glass layers in different colors.

A liquid crystal display panel, including: a pixel electrode formed on a first substrate; an alignment layer formed on the pixel electrode, wherein the alignment layer includes an alignment layer material and aligns first liquid crystal molecules in a direction substantially perpendicular to the pixel electrode; and a photo hardening layer formed on the alignment layer, wherein the photo hardening layer includes a photo hardening layer material and aligns second liquid crystal molecules to be tilted with respect to the pixel electrode, wherein the alignment layer material and the photo hardening layer material have different polarities from each other.

The present invention provides a backlight module and a liquid crystal display device using the backlight module. The backlight module includes: a backplane (2), a light guide plate (4) arranged in the backplane (2), a backlight source (6) arranged in the backplane (2), an optic film assembly (8) arranged above the light guide plate (4), and a reflection plate (9) arranged between the backplane (2) and the light guide plate (4). The backlight source (6) includes a PCB (62) and a plurality of LED lights (64) mounted on and electrically connected to the PCB (62). The backplane (2) includes a bottom plate (22) and a plurality of side plates (24) perpendicularly connected to the bottom plate (22). The bottom plate (22) of the backplane (2) includes a snap-engagement structure (220) formed thereon. The PCB (62) is snap-fit into and retained by the snap-engagement structure (220). The reflection plate (9) is directly positioned on and supported by the PCB (62).

The invention relates to genes coding for TCP family transcription factors and having a biological role in the development of axillary buds and branch growth. Furthermore, the invention relates to the promoters of the transcription of said genes, to the genetic constructs containing same and to the uses thereof, including the use of agents that modulate the expression of these genes in order to modify plant architecture.

A safety bow assembly for a child seat comprises: a bow body that has opposite first and second ends; first and second connecting parts that are connected to the child seat, the first connecting part defining an accommodating space and having a side wall; and an engaging lever that is connected movably to the side wall, that is formed with an engaging element facing the accommodating space, and that is movable relative to the side wall between a first position, in which the engaging element is adapted to engage releasably a coupling part of the child seat, and a second position, in which the engaging element is adapted to be disengaged from the coupling part.

There are provided a single package television tuning apparatus and a television receiver including the apparatus. The apparatus includes: a printed circuit board; a switching part installed on the printed circuit board and selecting one of a first radio frequency signal and a second radio frequency signal inputted; a tuner part installed on the printed circuit board and down-converting one of the first radio frequency signal and the second radio frequency signal, the one selected by the switching part; first and second input connectors receiving the first radio frequency signal and the second radio frequency signal; and a chassis supporting the first and second input connectors, covering the printed circuit board, the switching part, and the tuner part, and electrically connected to grounds of the switching part and the tuner part.

A communication module is provided in which its characteristic of separation between its first and second tuner units is improved. The module is equipped with a circuit board having a first main surface, and a second main surface opposite to the first main surface; a first amplifier arranged on the first main surface, for amplifying a first signal; a first mixer arranged on the first main surface, for converting a signal supplied from the first amplifier to an intermediate-frequency signal; a second amplifier for amplifying a second signal; and a mixer for converting a signal supplied from the second amplifier to an intermediate-frequency signal, both arranged on the second main surface of the circuit board.

A band-pass filter device includes: a plurality of band-pass filter elements on a principal plane of a substrate; wherein the band-pass filter elements correspond to a plurality of respective channels divided by frequency regions, and each have a plurality of piezoelectric resonators. Each of the piezoelectric resonators includes a piezoelectric film whose periphery is supported by the substrate, a first electrode formed on a lower surface of the piezoelectric film, a second electrode formed on an upper surface of the piezoelectric film and formed in a state of overlapping at least a part of the first electrode with the piezoelectric film interposed between the second electrode and the first electrode, a lower space formed between the substrate and the piezoelectric film, and an upper space formed over the piezoelectric film.

A handy printer and a mobile phone based on the use of the same are provided, wherein the printing can be performed on recording paper sheets having various sizes. The handy printer comprises a cover member which is movable between an exposure position at which an ink discharge surface of an ink discharge head is exposable to the outside and a cover position at which the discharge surface is hidden from the outside. When the cover member is positioned at the cover position, the recording is permitted on a recording paper sheet accommodated in a recording paper-accommodating mechanism. When the cover member is positioned at the exposure position, the recording is permitted on a recording medium disposed outside a handy-printer body casing.

One of mark sensors is automatically selected in accordance with specifications of a thermal sheet. A cutting position on the thermal sheet is decided on the basis of an output of the selected one mark sensor.

A sheet feeder for transporting a sheet unreeled from a roll includes a feed roller to unreel the sheet from the roll, a registration roller to transport the sheet unreeled by the feed roller to the image forming unit, a pressure roller pressing against the registration roller, forming a registration nip together with the registration roller, a movable sheet guide to guide the sheet to the registration roller, disposed between the feed roller and the registration roller in a sheet conveyance path, a support member to movably support the movable sheet guide relative to an apparatus body in which the sheet feeder is disposed, and a bias member to bias the sheet guide toward the sheet. The movable sheet guide wraps more of the sheet around the registration roller as a degree of tension of the sheet increases by moving against a bias force exerted by the bias member.

Currency bills are received, transported, and imaged to produce image data from which a visually readable image of each currency bill can be reproduced. Each of the currency bills includes a denomination, a serial number, and a set of secondary identifiers. One of the currency bills is determined to be a suspect bill. The suspect bill serial number is attempted to be extracted from the image data associated with the suspect bill. In response to failing to extract a complete serial number of the suspect bill, a serial number field in a suspect report is populated with a serial number snippet image.

Provided are a backlight unit and a display device having the same. The backlight unit includes a case having an opening, at least one lamp assembly disposed on a side surface of the case and including a light source, an optical transreflective unit on the case, the optical transreflective unit transmitting a portion of first light passing through the opening and reflecting a portion of second light generated from the light source, and an optical sheet including a first diffusion unit on the optical transreflective unit.

A time recorder includes a first sensor that detects the side edge of a time card having a cut-out formed at at least one corner of the bottom, a second sensor that detects the bottom of the time card, and a card feeding unit that feeds the time card. When the time card is fed by this card feeding unit, a pulse counter of the card feeding unit counts the number of pulses of predetermined pulse signals after the first sensor detects the time card and until the second sensor detects the time card. Next, the front and back faces of the time card are determined based on the number of pulses that is a counting result. Hence, the front and back faces can be determined by the first sensor and the second sensor only.

After a reducing agent is added to a water reaction system containing silver ions to deposit silver particles by reduction, the silver particles are dried to obtain a silver powder which is heat-treated at a temperature of higher than 100° C. and lower than 400° C. The silver powder thus heat-treated has a maximum coefficient of thermal expansion of not greater than 1.5% at a temperature of 50° C. to 800° C., and has no heating peak when the silver powder is heated from 50° C. to 800° C. The silver powder has an ignition loss of not greater than 1.0% when the silver powder is ignited until the weight of the silver powder is constant at 800° C. The silver powder has a tap density of not less than 2 g/cm3 and a BET specific surface area of not greater than 5 m2/g.

New 6xxx aluminum alloy bodies and methods of producing the same are disclosed. The new 6xxx aluminum alloy bodies may be produced by preparing the aluminum alloy body for post-solutionizing cold work, cold working by at least 25%, and then thermally treating. The new 6xxx aluminum alloy bodies may realize improved strength and other properties.

Nanostructured Mn—Al, Mn—Al—C permanent magnets are disclosed. The magnets have high coercivities (about 4.8 kOe and 5.2 kOe) and high magnetization values. An intennetallic composition includes a ternary transition metal modified manganese aluminum alloy Mn—Al—Fe, Mn—Al—Ni, or Mn—Al—Co having at least about 80% of a magnetic τ phase and permanent magnetic properties. The alloy may have a saturation magnetization value of at least 96 emu/g with approximately 5% ternary transition metal replacing Al. The alloy may also have a saturation magnetization value of at least 105 emu/g with 10% ternary transition metal replacing Al.

A Cu—Ni—Mo alloy thin film, including Ni as a solution element and Mo as a diffusion barrier element. Ni and Mo are co-doped with Cu. The enthalpy of mixing between Mo and Cu is +19 kJ/mol, and the enthalpy of mixing between Mo and Ni is −7 kJ/mol. The atomic fraction of Mo/Ni is within the range of 0.06-0.20 or the weight faction of Mo/Ni within the range of 0.10-0.33. The total amount of Ni and Mo additions is within the range of 0.14-1.02 at. % or wt. %. A method for manufacturing the alloy thin film is also provided.

Basic zinc cyanurate fine particles are produced by subjecting a mixed slurry to wet dispersion using a dispersion medium at a temperature in the range of 5 to 55° C., the mixed slurry being formed by blending water, cyanuric acid, and at least one component selected from zinc oxide and basic zinc carbonate such that the cyanuric acid concentration is 0.1 to 10.0 mass % with respect to water.

An object of the present invention is to provide a Ni-based superalloy, especially for a conventional casting, having a good balance among high temperature strength, corrosion resistance and oxidation resistance, as compared to a conventional material. The Ni-based superalloy comprises Cr, Co, Al, Ti, Ta, W, Mo, Nb, C, B, and inevitable impurities, the balance being Ni, the Ni-based superalloy having a superalloy composition comprising, by mass, 13.1 to 16.0% Cr, 11.1 to 20.0% Co, 2.30 to 3.30% Al, 4.55 to 6.00% Ti, 2.50 to 3.50% Ta, 4.00 to 5.50% W, 0.10 to 1.20% Mo, 0.10 to 0.90% Nb, 0.05 to 0.20% C, and 0.005 to 0.02% B.

An apparatus for closing opened packaging includes a base having an upper surface and a lower surface, a strap attached to the base, and two complementary handle sections attached to the base. The handle sections extend upwardly from the upper surface of the base, and together form a grippable handle. A space exists between the handle sections to receive the strap therethrough. The handle sections can be releasably attached to each other.

Textured surface for increasing Leidenfrost temperature. The texture comprises of surface features over multiple length scales—from micro to nanoscale—wherein the features at each length scale have a size, aspect ratio, and spacing selected to increase the Leidenfrost temperature. The structure includes an array of microscale structures disposed on the surface, the structure having size, aspect ratio and spacing selected to increase Leidenfrost temperature. The microscale structures may also include nanoscale structures on their surface to create a hierarchical structure. The structures result in an increased Leidenfrost temperature.

UO2 nuclear fuel pellets are fabricated by adding additive powder comprising Mn compound and Al compound into UO2 powder.

Electrochemical corrosion potential (ECP) probe assemblies may be used to monitor ECP of materials due to coolant chemistry in an operating nuclear reactor. Example embodiment assemblies include at least one ECP probe that detects ECP of potentially several different materials, a structural body providing a fluid flow path for the coolant over the ECP probes, and a signal transmitter that transmits or carries ECP data to an external receiver. The ECP probes may be of any number and/or type, so as to detect ECP for different component materials, including stainless steel, a zirconium alloys, etc. The ECP probes may further detect ECP due to ion concentration, pH, etc. The ECP data may be transmitted through wired or wireless signal transmitters. Example methods include installing and using example embodiment ECP probe assemblies in nuclear reactors and facilities.

The invention relates to a nuclear fuel cladding totally or partially made of a composite material with a ceramic matrix containing silicon carbide (SiC) fibers as a matrix reinforcement and an interphase layer provided between the matrix and the fibers, the matrix including silicon carbide as well as at least one of the following additional carbides: titanium carbide (TiC), zirconium carbide (Zrc), and ternary titanium silicon carbide (Ti3SiC2). When irradiated and at temperatures of between 800° C. and 1200° C., said cladding can mechanically maintain the nuclear fuel within the cladding while enabling optimal thermal-energy transfer towards the coolant. The invention also relates to a method for making the nuclear fuel cladding.

A method for manufacture of an electronic interface card (100) including defining a pair of apertures in a substrate layer (116), associating an antenna (112) with the substrate layer (116) such that opposite ends of the antenna (112) terminate at the apertures, placing a metal element in each of the apertures, connecting the ends of the antenna to the metal elements, laminating the substrate layer together with a top layer (114) and a bottom layer (118), forming a recess (122) in the top layer and the substrate layer, attaching end of connection wires (130) to the metal elements, attaching opposite ends of the connection wires (130) to a chip module (120) and sealing the chip module in the recess (122).

An RFID tag or label or device includes an RFID chip and an antenna. The antenna is manufactured by weakening a portion of a foil material, which weakened portion may be in a tessellating pattern. The foil material is then placed in contact with adhesive on a substrate. The foil material and substrate are separated, so as to retain on the substrate the portion of the foil material in contact with the adhesive. The foil material remaining on the substrate defines an antenna, which may subsequently be electrically connected to an RFID chip to provide an RFID tag or label or device.

A semiconductor device including an integrator circuit, in which electric discharge from a capacitor can be reduced to shorten time required for charging the capacitor in the case where supply of power supply voltage is stopped and restarted, and a method for driving the semiconductor device are provided. One embodiment has a structure in which a transistor with small off-state current is electrically connected in series to a capacitor in an integrator circuit. Further, in one embodiment of the present invention, a transistor with small off-state current is electrically connected in series to a capacitor in an integrator circuit; the transistor is on in a period during which power supply voltage is supplied; and the transistor is off in a period during which supply of the power supply voltage is stopped.

A digital phase locked loop (DPLL), a method of operating the same, and a device including the same are provided. The DPLL includes a digitally-controlled oscillator configured to change a frequency and a phase of an output oscillation signal in response to a digital control code; a main divider configured to divide the frequency of the output oscillation signal and generate a first feedback signal based on the divided frequency; and a phase-to-digital converter configured to subdivide the phase of the output oscillation signal and to generate a quantized code by converting a phase difference between a reference signal and the first feedback signal using a phase-subdivided signal resulting from the subdivision. The digital control code is generated based on the quantized code.

A curved-surface display panel fabrication method for fabricating a curved-surface display panel using a flat display panel having a first substrate and a second substrate includes: paring partially outer surfaces of the first substrate and the second substrate so as to reduce thicknesses thereof to a predetermined thickness; bending the pared flat display panel to a desired curved shape; attaching a first guide member which has a shape corresponding to the desired curved shape to the first substrate with a predetermined gap from the pared outer surface thereof and attaching a second guide member with has a shape corresponding to the desired curved shape to the second substrate with a predetermined gap from the pared outer surface thereof; and forming light transmitting reinforcing layers respectively in a space between the first guide member and the first substrate and a space between the second guide member and the second substrate.

A substrate attachment device of a display device and a method for manufacturing the display device using the same are disclosed. The substrate attachment device of the display device includes a guide unit which is curvedly disposed, a first support unit which moves forward and backwards along the guide unit and transfers a cover substrate having a curved surface, a second support unit which is disposed on the guide unit, moves forward and backwards, and transfers a display panel, and a roller unit which rotates so that the cover substrate having the curved surface is attached to the display panel.

The spark plug has a configuration satisfying the relationships of B≧0.7A and 0.3 mm≦A≦0.6 mm, where B is an axial thickness along the central axis line Q of the weld portion formed between the base material electrode and the noble-metal chip, and A is an axial distance along the central axis line Q between the intersection points P3 and X. The intersection point P3 is a point at which a phantom axis line radially distant from the central axis line Q by D/2 (D being a diameter of the noble-metal chip) intersects with the boundary line between the weld portion and the noble-metal chip. The intersection point X is a point at which an extension of the contour line of the base material electrode in the vicinity of the weld portion intersects with a boundary line between the weld portion and the base material electrode.

An organic light emitting display device and a method of manufacturing the same are provided. The organic light emitting display device includes: a substrate including a display portion displaying an image as a plurality of sub-pixels that are arranged, and a non-display portion extending at an edge of the display portion; and a sealant formed along a periphery of the display portion, wherein an organic film having an emissive layer is formed on the plurality of sub-pixels, and an emissive layer storage unit storing an emissive layer coated on the non-display portion is formed between the display portion and the sealant. By forming the emissive layer storage unit by removing at least a part of a pixel defining layer on an edge of the substrate, a raw material of the emissive layer coated on the non-display portion on the substrate is easily processed via the emissive layer storage unit.

Provided is a method of manufacturing an organic luminescence display device, the method including: bringing a getter powder into direct contact with a first surface of an encapsulation substrate; irradiating a laser to a second surface of the encapsulation substrate correspondingly to a getter pattern area to melt the second surface of the encapsulation substrate; and bonding the getter powder to the molten second surface of the encapsulation substrate to form a getter pattern corresponding to the getter pattern area. Since the getter powder is directly bonded to the encapsulation substrate by laser irradiation, a fine getter pattern may be formed.

A light emitting display device and a method of fabricating the same are disclosed. The light emitting display device comprises: a substrate comprising an active region in which a plurality of active pixels for displaying images are formed and a first dummy region disposed outside the active region and in which a plurality of first dummy pixels is formed; a first electrode formed on the substrate in each pixel; a pixel defining layer having an opening that exposes the first electrode; a surface treatment layer formed on the first electrode and having a plurality of grooves in each of the first dummy pixels; a light emitting layer formed on the surface treatment layer; and a second electrode formed on the light emitting layer in each of the active pixels.

A liquid crystal display is provided that includes: a first display panel including a thin film transistor and a plurality of pixel electrodes; a second display panel facing the first display panel with a cell gap therebetween; a lower resistive layer disposed on the first display panel; an upper resistive layer disposed on the second display panel; and a sensing spacer connecting the lower resistive layer and the upper resistive layer.

Disclosed are a flat panel type image display device of a clear borderless design without a case defining an external appearance of an image display device, and a method for manufacturing the same. The flat panel type image display device includes an image display panel to display an image, a panel guide including a panel fixing portion, to which the image display panel is attached, and a guide frame formed in a dual coupling structure, the panel fixing portion being configured to move together with the guide frame in at least one direction of x, y, and z-axis directions, and a bottom case formed to cover an opened back surface of the panel guide comprising a back surface of the image display panel, the bottom case being fixed to an inner side surface of the panel guide.

A display device according to an exemplary embodiment of the present invention includes a substrate, a display panel disposed on the substrate, a sealing substrate which is disposed opposite to the display panel, and a sealing unit disposed between the substrate and the sealing substrate, enclosing the display panel. The sealing unit has a penetration hole which passes through the sealing unit in a vertical direction.

A simple manufacturing method for an organic electroluminescent panel in which organic electroluminescent elements are arranged and sealed by a sealing adhesive. The electroluminescent panel has excellent sealing properties and excellent durability as a result of the organic electroluminescent elements being adhered to one another by a heat-curable adhesive. The manufacturing method is for an organic electroluminescent panel in which at least a first electrode, an organic functional layer containing a light-emitting layer, an organic electroluminescent element having a second electrode, and a sealing substrate are bonded together on a substrate by the heat-curable adhesive. The method includes forming a heat-curable adhesive layer on the sealing substrate, subjecting the heat-curable adhesive layer formed on the sealing substrate to pre-heating treatment, bonding the pre-heated heat-curable adhesive layer to the organic electroluminescent element, and subjecting the heat-curable adhesive layer to heat curing, in the given order.

Disclosed is a method of producing an organic light emitting device, an organic light emitting device produced by using the method, and an apparatus used in the method. The method includes preparing a first electrode, forming one or more organic material layers on the first electrode, and forming a second electrode on the organic material layers, wherein the method includes changing functions of predetermined pattern regions of one or more layers of the organic material layers or the electrodes.

A simple manufacturing method for an organic electroluminescent panel in which organic electroluminescent elements are arranged and sealed by a sealing adhesive. The electroluminescent panel has excellent sealing properties and excellent durability as a result of the organic electroluminescent elements being adhered to one another by a heat-curable adhesive. The manufacturing method is for an organic electroluminescent panel in which at least a first electrode, an organic functional layer containing a light-emitting layer, an organic electroluminescent element having a second electrode, and a sealing substrate are bonded together on a substrate by the heat-curable adhesive. The method includes forming a heat-curable adhesive layer on the sealing substrate, subjecting the heat-curable adhesive layer formed on the sealing substrate to pre-heating treatment, bonding the pre-heated heat-curable adhesive layer to the organic electroluminescent element, and subjecting the heat-curable adhesive layer to heat curing, in the given order.