The invention concerns an oscillator generating a wave composed of a frequency of on the order of terahertz from a beat of two optical waves generated by a dual-frequency optical source. The oscillator includes a modulator the transfer function of which is non-linear for generating harmonics with a frequency of less than one terahertz for each of the optical waves generated by the dual-frequency optical source, an optical detector able to detect at least one harmonic for each of the optical waves generated by the dual-frequency optical source and transforming the harmonics detected into an electrical signal, a phase comparator for comparing the electrical signal with a reference electrical signal, and a module for controlling at least one element of the dual-frequency optical source with a signal obtained from the signal resulting from the comparison.

Various techniques for generating an output clock based on a reference clock. This disclosure relates to generating an output clock signal based on a reference clock signal. In one embodiment, a method includes generating, using information received from a control circuit, an output clock signal using both a first number of edges or an input clock signal and a second, different number of edges of the input clock signal. In this embodiment, the control circuit runs at a frequency that is less than a frequency of the input clock signal. The received information may indicate, for a pulse of the output clock signal, whether the pulse should be generated using the first number of edges or the second number of edges. In some cases, the second number of edges may be the first number of edges plus one. The first and second number of edges may be programmable quantities.

A circuit includes first and second transconductance stages that generate first and second currents, respectively, in response to an input signal. A current combiner circuit selectively couples the first current to a first output, selectively couples the second current to the first output, selectively couples the first current to a second output, and selectively couples the second current to the second output. In response to the first current being coupled to both the first and second outputs, the current combiner circuit couples the second current to both the first and second outputs. In response to the first current being decoupled from the second output, the current combiner circuit decouples the second current from both the first and second outputs. In response to the first current being decoupled from the first output, the current combiner circuit decouples the second current from both the first and second outputs.

An apparatus includes a light foil device configured to move based on radiation pressure associated with light received by the light foil device. The apparatus includes a mechanism configured to transition between operational states in response to the movement of the light foil device, or includes a valve configured to control a flow of material through a conduit based, at least in part, on the movement of the light foil device.

A drain plug assembly that has particular application for sealing a drain hole in a high voltage battery compartment on a vehicle. The plug assembly includes a plug that inserted into the drain hole. The plug assembly further includes a return spring coupled to the plug and causing the plug to be biased into the drain hole. The plug assembly also includes at least one shape memory alloy device coupled to the plug and a support structure. The SMA device receives an electrical current that causes the device to contract and move the plug out of the drain hole against the bias of the return spring.

A flow control valve element has a generally spherical ball. An inlet is formed in the ball. An outlet is also formed in the ball, the outlet opposing the inlet. A hollowed-out portion extends between the inlet and the outlet. A pair of opposing flats are formed in the ball, the flats each having a first flat portion formed in an external portion of the ball and an opposing second flat portion formed in the hollowed-out portion of the ball.

The present invention involves, in some embodiments, systems and methods involving fluid handling apparatus for pumping fluid to and from a patient, which may include a reusable component and a disposable pumping cartridge. The reusable component may comprise a control chamber and a pressure transducer configured to measure a gas pressure associated with the control chamber, as well as a processor. The processor may be configured to supply the control chamber with a gas at a predetermined pressure, monitor the gas pressure associated within the control chamber with the pressure transducer over a predetermined period of time, and determine if the change in gas pressure associated within the control chamber exceeds a maximum allowable predetermined limit.

A sheet binding apparatus which forms concavity and the convexity on a sheet bundle including a plurality of sheets in a thickness direction so as to bind the sheet bundle, the sheet binding apparatus includes: a pair of concave-convex members, each of which has concave-convex portion in the thickness direction of the sheet bundle and which forms the concavity and the convexity on the sheet bundle in the thickness direction while niping the sheet bundle therebetween; wherein in the pair of concave-convex members, one of the concave-convex members has a greater difference in height of the concave-convex portion than that of the other concave-convex member which engages with the above-described concave-convex member.

The present invention relates generally to a semiconductor device and, more specifically, to optimizing the creep-age distance of the power semiconductor device and a preparation method thereof. The power semiconductor device includes a chip mounting unit with a die paddle and a plurality of leads arranged side by side located close to one side edge of the die paddle in a non-equidistant manner, a semiconductor chip attached on the die paddle, and a plastic packaging body covering the die paddle, the semiconductor chip, where the plastic packing body includes a plastic extension portion covering at least a part of a lead shoulder of a lead to obtain better electrical safety distance between the terminals of the semiconductor device, thus voltage creep-age distance of the device is increased.

A land grid array (LGA) package including a substrate having a plurality of lands formed on a first surface of the substrate, a semiconductor chip mounted on a second surface of the substrate, a connection portion connecting the semiconductor chip and the substrate, and a support layer formed on part of a surface of a first land.

Methods for the fabrication of a Microelectromechanical Systems (“MEMS”) devices are provided, as are MEMS devices. In one embodiment, the MEMS device fabrication method includes forming at least one via opening extending into a substrate wafer, depositing a body of electrically-conductive material over the substrate wafer and into the via opening to produce a via, bonding the substrate wafer to a transducer wafer having an electrically-conductive transducer layer, and forming an electrical connection between the via and the electrically-conductive transducer layer. The substrate wafer is thinned to reveal the via through a bottom surface of the substrate wafer, and a backside conductor is produced over a bottom surface of the substrate wafer electrically coupled to the via.

The present invention relates to a camera module including: a lens unit mounted with at least one or more lenses; an image sensor mounted with an image pickup device for converting a light converged through the lenses to an electric signal; a PCB (Printed Circuit Board) mounted with the image sensor; and a holder accommodated inside the lens unit for supporting the lens unit, wherein the lens unit is bonded and fixed at an inner surface of the holder, whereby the lens unit mounted with a plurality of lenses is bonded to a lateral surface of a holder to prevent generation of vertical tilting phenomenon at the lens unit caused by a conventional improper coating of epoxy, and particularly, the coating of epoxy on the lateral surface of the holder advantageously enhances adhesive power to increase a bonded area.

A method for fabricating a sensor includes: forming, on a base substrate, a pattern of a source electrode and a drain electrode, a pattern of a data line, a pattern of a receiving electrode, a pattern of a photodiode, and a pattern of a transparent electrode disposed by using a first patterning process; forming a pattern of an ohmic layer by using a second patterning process; forming a pattern of an active layer by using a third patterning process; forming a pattern of a gate insulating layer by using a fourth patterning process, wherein the gate insulating layer has a via hole above the transparent electrode; and forming a pattern of a gate electrode, a pattern of a gate line, and a pattern of a bias line connected to the transparent electrode via the via hole above the transparent electrode by using a fifth patterning process.

A first impurity region is formed by ion implantation through a first opening formed in a mask layer. By depositing a spacer layer on an etching stop layer on which the mask layer has been provided, a mask portion having the mask layer and the spacer layer is formed. By anisotropically etching the spacer layer, a second opening surrounded by a second sidewall is formed in the mask portion. A second impurity region is formed by ion implantation through the second opening. An angle of the second sidewall with respect to a surface is 90°±10° across a height as great as a second depth. Thus, accuracy in extension of an impurity region can be enhanced.

A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby.

Embodiments of a method for fabricating stacked microelectronic packages are provided, as are embodiments of a stacked microelectronic package. In one embodiment, the method includes arranging microelectronic device panels in a panel stack. Each microelectronic device panel includes a plurality of microelectronic devices and a plurality of package edge conductors extending therefrom. Trenches are formed in the panel stack exposing the plurality of package edge conductors. An electrically-conductive material is deposited into the trenches and contacts the plurality of package edge conductors exposed therethrough. The panel stack is then separated into partially-completed stacked microelectronic packages. For at least one of the partially-completed stacked microelectronic packages, selected portions of the electrically-conductive material are removed to define a plurality of patterned sidewall conductors interconnecting the microelectronic devices included within the stacked microelectronic package.

The object of the invention is to provide a method for fabricating a semiconductor device having a peeled layer bonded to a base material with curvature. Particularly, the object is to provide a method for fabricating a display with curvature, more specifically, a light emitting device having an OLED bonded to a base material with curvature. An external force is applied to a support originally having curvature and elasticity, and the support is bonded to a peeled layer formed over a substrate. Then, when the substrate is peeled, the support returns into the original shape by the restoring force, and the peeled layer as well is curved along the shape of the support. Finally, a transfer object originally having curvature is bonded to the peeled layer, and then a device with a desired curvature is completed.

Methods for fabricating integrated circuits include fabricating a logic device on a substrate, forming an intermediate semiconductor substrate on a surface of the logic device, and fabricating a capacitor-less memory cell on the intermediate semiconductor substrate. Integrated circuits with capacitor-less memory cells formed on a surface of a logic device are also disclosed, as are multi-core microprocessors including such integrated circuits.

A semiconductor device has a protective layer formed over an active surface of a semiconductor wafer. The semiconductor die with pre-applied protective layer are moved from the semiconductor wafer and mounted on a carrier. The semiconductor die and contact pads on the carrier are encapsulated. The carrier is removed. A first insulating layer is formed over the pre-applied protective layer and contact pads. Vias are formed in the first insulating layer and pre-applied protective layer to expose interconnect sites on the semiconductor die. An interconnect structure is formed over the first insulating layer in electrical contact with the interconnect sites on the semiconductor die and contact pads. The interconnect structure has a redistribution layer formed on the first insulating layer, a second insulating layer formed on the redistribution layer, and an under bump metallization layer formed over the second dielectric in electrical contact with the redistribution layer.

The purpose of the present invention is to provide a projection image display device in which all of the multiple light sources to be used are positioned optimally, regardless of the mode of installation of the device. This projection image display device has two illumination optical systems (1, 2) that are each provided with a light source (111, 211), a color separator for separating into three colors of light, a liquid crystal panel (150, 250) for forming an optical image, and a color synthesis prism (160, 260) for color-synthesizing. A polarization beam splitter (3) for synthesis synthesizes an optical image formed by the illumination optical system (1, 2), and projects the same from a projection lens (4). The optical axis (101, 201) of each light source (111, 211) is positioned within the same plane as the optical axis (401) of the projection lens (4), and so as to orthogonally intersect the optical axis (401) of the projection lens.

The present invention provides an optical compensated bending (OCB) mode liquid crystal display (LCD) panel and a method for manufacturing the same. The method comprises the following steps: forming alignment layers on substrate, respectively; forming a liquid crystal layer between the alignment layers to form a liquid crystal cell; applying an electrical signal across the liquid crystal cell; and irradiating light rays to or heating the liquid crystal cell, so as to form a first polymer alignment layer and a second polymer alignment layer, respectively. The present invention can reduce a phase transition time of liquid crystal molecules from a splay state to a bent state.

There is provided an optical laminate which comprises: a polarizing film wherein a thin polarizing layer is laminated on one main surface of a substrate; and an optical element (lens array). The thin polarizing layer has a thickness of 8 μm or less. The substrate has a thickness of 20 μm to 80 μm. The optical element is a pattern retardation plate including a plurality of regions having different slow axis directions.

An optical switch for performing high extinction ratio switching of an optical signal includes a beam polarizing element and one or more optical elements. The optical elements are configured to direct an optical signal along a first or second optical path based on the polarization state of the optical signal as it passes through the optical elements. The optical switch performs high extinction ratio switching of the optical signal by preventing unwanted optical energy from entering an output port by using an absorptive or reflective optical element or by directing the unwanted optical energy along a different optical path.

An optical element includes at least two stacked birefringent layers having respective local optical axes that are rotated by respective twist angles over respective thicknesses of the at least two layers, and are aligned along respective interfaces between the at least two layers. The respective twist angles and/or the respective thicknesses are different. The at least two stacked birefringent layers may be liquid crystal polymer optical retarder layers. Related devices and fabrication methods are also discussed.

Thrombospondin 1 (TSP-1), TSP-2, interleukin 17B receptor (IL-17BR) and heparin-binding epidermal growth factor-like growth factor (HB-EGF) associated with stem cell activity and use thereof.

The present invention relates to the generation of a mucin-producing cell using stem/progenitor cells obtained from the amniotic membrane of umbilical cord and therapeutic uses of such mucin-producing cells.

Methods and compositions for targeted delivery of biotherapeutics are provided. The compositions comprise bile-sensitive St. thermophilus bacteria modified to release a biotherapeutic agent following bile exposure. Biotherapeutic agents released by the St. thermophilus bacteria disclosed herein include AQ and AQR rich peptides. Methods of the invention comprise administering to a subject a St. thermophilus bacterium modified to release a biotherapeutic agent following bile exposure. Administration of the St. thermophilus bacterium promotes a desired therapeutic response. The bacterium may be modified to express and release AQ or AQR rich peptides which subsequently inhibit cellular apoptosis or reduce mucosal damage. Thus, methods of the invention find use in treating or preventing a variety of gastrointestinal disorders including C. difficile infection and antibiotic-associated diarrhea.

Disclosed are process for contacting a protein containing material with one or more wet-mill streams. The protein content of the protein containing material is increased.

A chair including a dynamically-flexible back and seat having a shape that adjusts to the movements of a user seated in the chair to enhance user comfort. Each of the back and seat has an air gap formed therewithin and a resilient frame or liner with a spring memory. The resilient liner is adapted to flex in response to compressive forces that are generated as the user slides his body back or from side-to-side in the chair. Accordingly, some of the chair back and some of the chair seat move into respective air gaps so that the shapes of the back and seat change to conform to the movements of the user. The air gaps also establish air flow ventilation channels which run laterally through the back and seat of the chair.

An ergonomic back support device utilizing one or multiple vertical components that include layers (28,36), pressure distributing layers (34,38,50), and a single notched layer (48). These layers provide primary back support located behind and conforming to the Erector spinae muscles (124). The vertical components form an open channel (24) that is parallel to the prime neurological pathway of the spinal column (100). The vertical conforming support components and open channel facilitate physiological functions that promote health. The device accomplishes support without using any transverse, hard or continuous components across or against the back. Other embodiments include the following additional vertical components: a lateral pressure-adjusting device (14), heating layers (40,46), circulation stimulating layers (42,44), and massage layers (52,54). Embodiments include portable and permanently installed versions that can be utilized in the following applications, including, but not limited to, furniture, vehicles, trains, aircraft, boats, ships, and backpacks.

An operating unit (1) for installation in an aircraft cabin comprises an operating unit front side (10) and an operating unit rear side (20), at least one operating element (12, 14) attached in the region of the operating unit front side (10) and accessible to a user, and a holding device (40) for attaching the operating unit (1) to a monument (30) accommodating the operating unit (1) in its state mounted in the aircraft cabin. The holding device (40) is designed to attach the operating unit (1) in its state mounted in the aircraft cabin to the monument (30), in a first position or in a second position, as desired, the operating element (12, 14) in the second position of the operating unit (1) being situated in a spatial position which is lowered with respect to the spatial position of the operating element (12, 14) in the first position of the operating unit (1) and/or is displaced in a direction parallel to an imaginary straight line connecting the operating unit rear side (20) to the operating unit front side (10).

More specifically, the crash indication system for a child safety seat includes a seat bottom. A base is provided for supporting the seat bottom, which is slidably connected to the bases so that the seat body is movable relative to the base, between a resting position and a ride down position, a position due to a change in environmental forces. The seat body is adjustably affixed to a carriage to set a recline position. An indicator member is attached to the carriage and moves therewith to visually track and monitor the movement of the seat. When ride down of the seat occurs due to a change in forces to the seat, the indicator member moves with the sliding carriage to reflect a ride down position of the seat bottom. A ratchet connection is provided to prevent the carriage from going back to its resting position.

There is provided a moveable power seat slide device assembly comprising a movable seat cushion and seat rail including upper rails secured to the seat cushion and lower rails secured to the body of the golf cart, a motor for driving each movable seat and a current control circuit. The prostate golf cart seat protects the prostate area from continuous bouncing. The seat has two 8 inch stationary end cushions. The center would consist of two 8 inch cushions moving along a rail which allows riders to automatically close the 7 inch seat gap to 3 inches from the stationary end cushion. The center air space between each rider and seat would have a depth 1½ inches.

The present disclosure describes a method of manufacture and a structure for an automobile seat cover that includes a seat cover body with an outer perimeter, a seat cover skirt with a first edge sewn with an overlock stitch to the seat cover body for a majority of the outer perimeter, and a second edge, distal from the first edge, comprising a tie element extending for a majority of the second edge around a seat opening in the seat cover. A portion of the seat cover skirt and the seat cover body corresponding to a location of at least one airbag installed in an automobile seat cover over which the seat cover is to be placed are sewn together with one of a straight stitch and a lock stitch instead of the overlock stitch. In some implementations, the thread used is a brightly colored string.

According to an example embodiment, an apparatus is provided that produces a small-step switchable capacitor, which can have steps that are smaller in value than the smallest capacitor used in the system. In one embodiment, an input signal is connected to a switchable capacitor system that includes at least one and/or a plurality of small-step, switchable capacitors. In an example embodiment, a capacitor system may be provided that includes a first capacitance block coupled in series with a second capacitance block. In an example embodiment, the second capacitance block may include one or more switchable capacitors to provide a step in capacitance for the capacitor system between a first setting and a second setting using the one or more switchable capacitors. Also, in an example embodiment, the step in capacitance of the capacitor system may be determined based, at least in part, on a ratio of the capacitance of the second capacitance block to the capacitance of the first capacitance block.

The invention provides a variable tuning circuit capable of extending a variable range in a high frequency band, ensuring the value of L of an inductor to increase the value of Q of a circuit in a low frequency band, and preventing a reduction in gain, an increase in noise, and unstable oscillation. A variable tuning circuit includes: a first parallel resonance circuit that includes a varactor diode, a capacitor connected in series to the varactor diode, and a first inductor connected in parallel to the varactor diode and the capacitor; and a second parallel resonance circuit that includes a second inductor connected in parallel to the varactor diode with a direct current cut-off capacitor interposed therebetween. When the varactor diode has a maximum capacitance, a resonant frequency of the second parallel resonance circuit is set about a lowest frequency in a variable frequency range.

Provided is an oscillator including: a MEMS resonator for mechanically vibrating; an output oscillator circuit for oscillating at a resonance frequency of the MEMS resonator to output an oscillation signal; and a MEMS capacitor for changing a capacitance thereof caused by a change in a distance between an anode electrode and a cathode beam according to an environmental temperature.

An embodiment of the present invention provides an apparatus, comprising at least one anti-parallel pair VVC network comprised of two parallel VVCs with one biased in the opposite polarity of the other and at least one anti-series VVC network comprised of two VVCs configured in series, one biased in the opposite polarity of the other such that the resulting AC capacitive variations produce a desired capacitance variation.

A broadcast receiving device includes a card slot, a fan, a temperature sensor, a memory component and a control unit. The card slot accepts an IC card. The fan rotates to cool the IC card. The temperature sensor measures a first temperature. The memory component stores correlation information indicating a correlation between the first temperature and a second temperature of the IC card. The control unit acquires the second temperature based on the first temperature and the correlation information. The control unit determines if the second temperature exceeds a predetermined temperature. The control unit switches from a first output mode, in which an audio-video signal is outputted via the IC card, to a second output mode, in which the audio-video signal is outputted by bypassing the IC card, when the control unit determines that the second temperature exceeds the predetermined temperature.

In a signal communication device, a frequency-selective filter has at least one component that is biased by a control signal to establish a center frequency of the frequency-selective filter. A closed-loop bias generator is provided to generate the control signal and to adjust the control signal based, at least in part, on a comparison of the control signal and a reference signal.

A communication module is provided in which its characteristic of separation between its first and second tuner units is improved. The module is equipped with a circuit board having a first main surface, and a second main surface opposite to the first main surface; a first amplifier arranged on the first main surface, for amplifying a first signal; a first mixer arranged on the first main surface, for converting a signal supplied from the first amplifier to an intermediate-frequency signal; a second amplifier for amplifying a second signal; and a mixer for converting a signal supplied from the second amplifier to an intermediate-frequency signal, both arranged on the second main surface of the circuit board.

One embodiment relates to a circuit for active loss compensation. The circuit includes a parallel inductor-capacitive (LC) tank circuit having a first single-ended output. A first adjustable capacitor, which includes a first terminal and a second terminal, is coupled to the first single-ended output. The circuit also includes a first pair of transistors having sources coupled to a first common node. One transistor of the first pair of transistors has a drain coupled to the first single-ended output and the other transistor of the first pair of transistors has a gate coupled to the second terminal of the first adjustable capacitor. Other embodiments are also disclosed.

Disclosed are one-port and two-port voltage-tunable micro-electromechanical capacitors, switches, and filter devices. High aspect-ratio metal micromachining is used to implement very high quality factor (Q) tunable and fixed capacitors, fixed inductors, and low insertion loss tunable and fixed bandpass LC filters. The tunable capacitors can move in the plane of the substrate by the application of DC voltages and achieve greater than 100% of tuning. A combination of low-loss substrate and highest conductivity metal is used to achieve record high Q and low insertion loss at radio frequencies. The disclosed tunable capacitor structure can also be used as a micromechanical switch.

Aspects and embodiments of the present invention provide a system for obtaining, processing and managing data from an implanted sensor. In some embodiments, a patient or other persons can use a flexible antenna to obtain data from the implanted sensor. The flexible antenna includes at least one transmit loop and at least one receive loop. The transmit loop is adapted to propagate energizing signals to the implanted sensor. The receive loop is adapted to detect a response signal from the implanted sensor. The transmit loop includes a capacitor formed by a discontinuous area. The capacitor is adapted to allow the loop to be tuned. The flexible antenna can communicate with a patient device that collects the data from the implanted sensor, creates a data file and transmits the data file to a remote server over a network. A physician or other authorized person may access the remote server using an access device.

A tunable capacitor device may be provided in accordance with example embodiments of the invention. The tunable capacitor device may include a first capacitor; a second capacitor; a third capacitor, where the first, second, and third capacitors are connected in series, wherein the second capacitor is positioned between the first capacitor and the second capacitor; and at least one switch transistor, where the at least one switch transistor is connected in parallel with the second capacitor.

The present invention is directed to a piezo-electrically actuated membrane (ex.—a tuner) configured for use with a tunable cavity filter. The piezo-electrically actuated tuner may be formed of printed circuit board materials and may be placed over the cavities of the tunable cavity filter. Further, the piezo-electrically actuated tuner may promote high level performance of the tunable cavity filter, while allowing the tunable cavity filter to be tunable across wide bands.

A RFID transponder includes a resonant circuit for providing a clock signal at a predetermined clock frequency, a self-calibration stage for calibrating the resonant circuit's current clock frequency towards the predetermined clock frequency. The self-calibration stage is adapted to compare a first clock frequency of the resonant circuit determined during an interrogation period, during which the resonant circuit is excited by an external RF signal, with a second clock frequency determined during a frequency maintenance period, during which the resonant circuit is excited internally through an oscillation maintenance circuit of the RFID transponder and to calibrate the resonant circuit towards the predetermined clock frequency based on the comparison result.

An electrical component provides a ceramic element located on or in a dielectric substrate between and in contact with a pair of electrical conductors, wherein the ceramic element includes one or more metal oxides having fluctuations in metal-oxide compositional uniformity less than or equal to 1.5 mol % throughout the ceramic element. A method of fabricating an electrical component, provides or forming a ceramic element between and in contact with a pair of electrical conductors on a substrate including depositing a mixture of metalorganic precursors and causing simultaneous decomposition of the metal oxide precursors to form the ceramic element including one or more metal oxides.

Methods and means related to an electronic circuit having an inductor and a memcapacitor are provided. Circuitry is formed upon a substrate such that an inductor and non-volatile memory capacitor are formed. Additional circuitry can be optionally formed on the substrate as well. The capacitive value of the memcapacitor is adjustable within a range by way of an applied programming voltage. The capacitive value of the memcapacitor is maintained until reprogrammed at some later time. Oscillators, phase-locked loops and other circuits can be configured using embodiments of the present teachings.

An improved grounding technique for mechanically adjustable rotary capacitors uses a directly grounded bronze sliding contact to effectively and continuously ground the rotating comb-like blades of the capacitor. RF measurements of the continuity and repeatability of the capacitance settings prove the suitability of the modified capacitors for using in pre-calibrated multi-capacitor MHz range impedance tuners.