Systems and methods to operate a power supply. A power supply has an inductor and a capacitor coupled in a substantially series connection. The power supply has a first selectably conductive path that selectably couples a first power pack to the series reactive circuit and a second selectably conductive path that selectably couples the series reactive circuit to a substantially series combination of the first power pack and a second power pack. When the first power pack output voltage is above the threshold, the first selectably conductive path couples electrical current between the first power pack to the series reactive circuit. Otherwise, the second selectably conductive path couples electrical current between the series combination and the series reactive circuit. The controller further transfers charge from the second power pack to the first power pack.

Embodiments of the present invention provide an electronic switch for commodity use. Specifically, embodiments of this invention provide a high capacity intelligent electronic switch for commodity use. A flexible film substrate is used along with a field-effect transistor (FET) to produce a commodity switch. Multiple printed flexible electronics PFE substrates are stacked to and integrated into an electronic switch system. Various methods are used to measure power consumption within the switch. The modular cell design allows for horizontal and vertical scaling.

A power semiconductor has power terminals arranged in a row at one side of the housing, with control terminals arranged in a row at the other side of the housing. The spacing between adjacent power terminals is greater than the spacing between adjacent control terminals.

An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.

A capacitor includes: an anode part that is drawn from an anode body of a capacitor element to an element end-face, to be formed over the element end-face; a cathode part that is drawn from a cathode body of the capacitor element to the element end-face, to be formed over the element end-face; an anode terminal member that is disposed in a sealing member; a cathode terminal member that is disposed in the sealing member; an anode current collector plate that is connected to the anode part, and is also connected to the anode terminal member; and a cathode current collector plate that is connected to the cathode part, and is also connected to the cathode terminal member.

Disclosed herein is a mounting structure of a circuit board having a multi-layered ceramic capacitor thereon. The mounting structure of a circuit board having a multi-layered ceramic capacitor thereon, in which a dielectric layer on which inner electrodes are disposed is stacked and external electrode terminals connecting the inner electrodes in parallel are disposed on both ends thereof, wherein the inner electrodes of the multi-layered ceramic capacitor and the circuit board are disposed so as to be a horizontal direction to connect the external electrode terminals with a land on the circuit board by a conductive material and a ratio of a bonding area ASOLEDER of the conductive material to the area AMLCC of the external electrode terminals AMLCC is set to be less than 1.4, thereby remarkably reducing the vibration noise.

An apparatus includes a case capable of receiving a plurality of capacitive elements, each capacitor element having at least two capacitors, and each capacitor having a capacitive value. The apparatus also includes a cover assembly with a peripheral edge secured to the case. The cover assembly includes, for each of the plurality of capacitive elements, a cover terminal that extends upwardly from the cover assembly generally at a central region of the cover assembly. Each cover terminal is connected to one of the at least two capacitors of the respective one of the plurality of capacitive elements. The cover assembly also includes, for each of the plurality of capacitive elements, a cover terminal that extends upwardly from the cover assembly at a position spaced apart from the cover terminal generally at the central region of the cover assembly.

A method of preparing soybean mixed powder comprising a soybean powder having properties wherein formation of agglomerate is small when the powder is added to water and then heated with stirring to dissolve the powder.

Atmosphere control members (ACMs) are used in various ways. In one aspect, at least one of the atmospheres in contact with the ACM is cause to flow over the surface of the ACM. In another aspect, the ACM is an internal ACM which does not form part of the exterior surface of a container. In another aspect, the ACM forms part of a reusable module. In another aspect, a plurality of sealed containers, each including an ACM, are stored in an outer container also including an ACM. FIGS. 3-5 illustrate a shipping container (11) comprising an internal ACM (3) having one surface which is exposed to the packaging atmosphere within the shipping container and an opposite surface which is part of a closed chamber (2) to which gases can be supplied in a controlled fashion.

An exemplary center housing rotating assembly includes a turbine wheel (260); a compressor wheel (240); a center housing (210) that includes a through bore (215), extending from a compressor end to a turbine end along a bore axis, and a recess (217), adjacent the bore, in a plane orthogonal to the bore axis; a bearing assembly (230) positioned in the bore that includes a keyway (233); and an anti-rotation component (280) seated in the recess and at least partially in the keyway to restrict rotation of the bearing assembly in the bore. Various other exemplary devices, systems, methods, etc., are also disclosed.

A centrifugal blower in a cooling system of an electronic device having asymmetrical blade spacing with acceptable balance. The asymmetrical blade spacing is determined according to a set of desired acoustic artifacts that are favorable and balance that is similar to that found with equal fan blade spacing. In one embodiment, the fan impeller can include thirty one fan blades. The perceived sound quality from the fan is improved with essentially no effect on the thermal performance of the fan.

A semiconductor laser produces infrared radiation suitable for jamming a heat seeking missile, wherein a wavelength of the radiation is in a range of 2-5 microns, and the laser has a semiconductor lasing medium of Pb1-xSexPb1-xSnxSe or Ga0.84In0.16As0.14Sb0.86. These materials can be doped to provide a p/n junction, wherein the laser is excitable by electric current passing through the p/n junction. The third one of these materials can be constructed also as a uniform undoped slab which is excitable optically. Cooling of the lasing medium is accomplished by use of a lithium heat sink thermally coupled to the lasing medium by a diamond thermal diffuser which conducts heat from the relatively small region of the laser to spread out the thermal energy along a relatively large surface of the heat sink. Modulation circuitry is connected to the excitation apparatus to provide a pulse train of the radiation.

An apparatus and method are provided, for alternatively producing either small or bulk packs of napkins from a stack of folded napkins produced by one folding machine, through use of a pack dispatching arrangement having an inlet, a small pack transfer station and a bulk pack transfer station, and configured for operation in a small pack mode for dispatching a stream of spaced apart small packs of folded sheets separated from the stack of folded sheets, and received at an inlet of the pack dispatching arrangement, to the small pack transfer station, and alternatively operable in a bulk pack mode for dispatching a stream of spaced apart bulk packs of folded sheets separated from the stack of folded sheets, and received at an inlet of the pack dispatching arrangement, to the bulk pack transfer station.

The stack package includes a first semiconductor package and a second semiconductor package. The first semiconductor package includes a first substrate having a first modulus and at least one semiconductor chip mounted on the first substrate. The second semiconductor package stacked on the first semiconductor package and includes a second substrate having a second modulus and at least one semiconductor chip mounted on the second substrate. The second modulus is less than the first modulus. Even in the event that the first semiconductor package is under severe warpage due to a temperature change, the flexible second substrate, which includes e.g., polyimide or poly ethylene terephthalate, of the second semiconductor package may be less sensitive to the temperature change, thereby improving reliability of the stack package.

A land grid array (LGA) package including a substrate having a plurality of lands formed on a first surface of the substrate, a semiconductor chip mounted on a second surface of the substrate, a connection portion connecting the semiconductor chip and the substrate, and a support layer formed on part of a surface of a first land.

An apparatus including a die including a dielectric material on a device side, an insulating layer surrounding a die area and embedding a thickness dimension of the die; and a carrier including a plurality of layers of conductive material disposed on the device side of the die, a first one of the layers of conductive materials being formed on the insulating layer and patterned into traces at least a portion of which are connected to respective contact points on the die. A method including disposing a die on a sacrificial substrate with a device side of the die opposite the sacrificial substrate; disposing a mold on the sacrificial substrate around; introducing an insulating material into a chase of the mold; removing the mold; forming a carrier on the insulating material adjacent a device side of a die; and separating the die and the carrier from the sacrificial substrate.

Disclosed herein is a single mask package apparatus on a device comprising a first substrate having a land disposed on a first surface, a stud disposed on the land and a protective layer disposed over the first surface of the first substrate and around the stud. The protective layer may optionally have a thickness of at least 3 μm. A PPI may be disposed over the protective layer and in electrical contact with the stud, with a first portion of the PPI extending laterally from the stud. An interconnect may be disposed on and in electrical contact with the first portion of the PPI, and a second substrate mounted on the interconnect. A molding compound may be disposed over the PPI and around the interconnect. The stud may be a substantially solid material having a cylindrical cross section and may optionally be wirebonded to the land.

A multi-chip package is provided. The multi-chip package includes a plurality of chips including at least one bad chip and at least one good chip that are stacked and a plurality of through electrodes each penetrating the chips. A logic circuit included in the at least one bad chip is isolated from each of the plurality of through electrodes.

Systems, manufactures, methods and/or techniques for a merged fiducial for chip packages are described. According to some embodiments, an integrated circuit package may include a package substrate having a first side and a second side, a plurality of conductive traces coupled to the first side and a plurality of balls disposed on the second side. The balls may be adapted to electrically connect the laminate package to a circuit board. The integrated circuit package may include a plurality of ball pads disposed on the second side, the ball pads being adapted to electrically connect the plurality of balls to the plurality of conductive traces. One or more of the ball pads may be uniquely shaped when compared to the rest of the plurality of ball pads, optionally, to serve as a fiducial to designate an A1 pin or ball of the laminate package.

A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby.

Embodiments of a method for fabricating stacked microelectronic packages are provided, as are embodiments of a stacked microelectronic package. In one embodiment, the method includes arranging microelectronic device panels in a panel stack. Each microelectronic device panel includes a plurality of microelectronic devices and a plurality of package edge conductors extending therefrom. Trenches are formed in the panel stack exposing the plurality of package edge conductors. An electrically-conductive material is deposited into the trenches and contacts the plurality of package edge conductors exposed therethrough. The panel stack is then separated into partially-completed stacked microelectronic packages. For at least one of the partially-completed stacked microelectronic packages, selected portions of the electrically-conductive material are removed to define a plurality of patterned sidewall conductors interconnecting the microelectronic devices included within the stacked microelectronic package.

Methods for fabricating integrated circuits include fabricating a logic device on a substrate, forming an intermediate semiconductor substrate on a surface of the logic device, and fabricating a capacitor-less memory cell on the intermediate semiconductor substrate. Integrated circuits with capacitor-less memory cells formed on a surface of a logic device are also disclosed, as are multi-core microprocessors including such integrated circuits.

A display apparatus includes a lower substrate, an upper substrate, a spacer and an image display layer. The spacer includes a main spacer, a first sub-spacer and a second sub-spacer. The main spacer has a height greater than that of the first and second sub-spacers. The second sub-spacer has an area wider than that of the main spacer and the first sub-spacer.

According to an example embodiment, an apparatus is provided that produces a small-step switchable capacitor, which can have steps that are smaller in value than the smallest capacitor used in the system. In one embodiment, an input signal is connected to a switchable capacitor system that includes at least one and/or a plurality of small-step, switchable capacitors. In an example embodiment, a capacitor system may be provided that includes a first capacitance block coupled in series with a second capacitance block. In an example embodiment, the second capacitance block may include one or more switchable capacitors to provide a step in capacitance for the capacitor system between a first setting and a second setting using the one or more switchable capacitors. Also, in an example embodiment, the step in capacitance of the capacitor system may be determined based, at least in part, on a ratio of the capacitance of the second capacitance block to the capacitance of the first capacitance block.

The invention provides a variable tuning circuit capable of extending a variable range in a high frequency band, ensuring the value of L of an inductor to increase the value of Q of a circuit in a low frequency band, and preventing a reduction in gain, an increase in noise, and unstable oscillation. A variable tuning circuit includes: a first parallel resonance circuit that includes a varactor diode, a capacitor connected in series to the varactor diode, and a first inductor connected in parallel to the varactor diode and the capacitor; and a second parallel resonance circuit that includes a second inductor connected in parallel to the varactor diode with a direct current cut-off capacitor interposed therebetween. When the varactor diode has a maximum capacitance, a resonant frequency of the second parallel resonance circuit is set about a lowest frequency in a variable frequency range.

Provided is an oscillator including: a MEMS resonator for mechanically vibrating; an output oscillator circuit for oscillating at a resonance frequency of the MEMS resonator to output an oscillation signal; and a MEMS capacitor for changing a capacitance thereof caused by a change in a distance between an anode electrode and a cathode beam according to an environmental temperature.

There are provided a single package television tuning apparatus and a television receiver including the apparatus. The apparatus includes: a printed circuit board; a switching part installed on the printed circuit board and selecting one of a first radio frequency signal and a second radio frequency signal inputted; a tuner part installed on the printed circuit board and down-converting one of the first radio frequency signal and the second radio frequency signal, the one selected by the switching part; first and second input connectors receiving the first radio frequency signal and the second radio frequency signal; and a chassis supporting the first and second input connectors, covering the printed circuit board, the switching part, and the tuner part, and electrically connected to grounds of the switching part and the tuner part.

An embodiment of the present invention provides an apparatus, comprising at least one anti-parallel pair VVC network comprised of two parallel VVCs with one biased in the opposite polarity of the other and at least one anti-series VVC network comprised of two VVCs configured in series, one biased in the opposite polarity of the other such that the resulting AC capacitive variations produce a desired capacitance variation.

Disclosed are one-port and two-port voltage-tunable micro-electromechanical capacitors, switches, and filter devices. High aspect-ratio metal micromachining is used to implement very high quality factor (Q) tunable and fixed capacitors, fixed inductors, and low insertion loss tunable and fixed bandpass LC filters. The tunable capacitors can move in the plane of the substrate by the application of DC voltages and achieve greater than 100% of tuning. A combination of low-loss substrate and highest conductivity metal is used to achieve record high Q and low insertion loss at radio frequencies. The disclosed tunable capacitor structure can also be used as a micromechanical switch.

A tunable capacitor device may be provided in accordance with example embodiments of the invention. The tunable capacitor device may include a first capacitor; a second capacitor; a third capacitor, where the first, second, and third capacitors are connected in series, wherein the second capacitor is positioned between the first capacitor and the second capacitor; and at least one switch transistor, where the at least one switch transistor is connected in parallel with the second capacitor.

Methods and means related to an electronic circuit having an inductor and a memcapacitor are provided. Circuitry is formed upon a substrate such that an inductor and non-volatile memory capacitor are formed. Additional circuitry can be optionally formed on the substrate as well. The capacitive value of the memcapacitor is adjustable within a range by way of an applied programming voltage. The capacitive value of the memcapacitor is maintained until reprogrammed at some later time. Oscillators, phase-locked loops and other circuits can be configured using embodiments of the present teachings.

Aspects of a method and system for configuring a transformer embedded in a multi-layer integrated circuit package are provided. In this regard, a windings ratio of a transformer embedded in a multi-layer IC package bonded to an IC may be configured, via logic, circuitry, and/or code in the IC, based on signal levels at one or more terminals of the transformer. The transformer may comprise a plurality of inductive loops fabricated in transmission line media. The integrated circuit may be flip-chip bonded to the multi-layer package. The IC may comprise a signal strength indicator enabled to measure signal levels input to or output by the transformer. The windings ratio may be configured via one or more switches in the IC and/or in the multi-layer package. The IC and/or the multi-layer package may comprise ferromagnetic material which may improve magnetic coupling of the transformer.

An improved grounding technique for mechanically adjustable rotary capacitors uses a directly grounded bronze sliding contact to effectively and continuously ground the rotating comb-like blades of the capacitor. RF measurements of the continuity and repeatability of the capacitance settings prove the suitability of the modified capacitors for using in pre-calibrated multi-capacitor MHz range impedance tuners.

A method and apparatus for use in a digitally tuning a capacitor in an integrated circuit device is described. A Digitally Tuned Capacitor DTC is described which facilitates digitally controlling capacitance applied between a first and second terminal. In some embodiments, the first terminal comprises an RF+ terminal and the second terminal comprises an RF− terminal. In accordance with some embodiments, the DTCs comprise a plurality of sub-circuits ordered in significance from least significant bit (LSB) to most significant bit (MSB) sub-circuits, wherein the plurality of significant bit sub-circuits are coupled together in parallel, and wherein each sub-circuit has a first node coupled to the first RF terminal, and a second node coupled to the second RF terminal. The DTCs further include an input means for receiving a digital control word, wherein the digital control word comprises bits that are similarly ordered in significance from an LSB to an MSB.

In a reflow process, a plurality of solder bumps between a first workpiece and a second workpiece is melted. During a solidification stage of the plurality of solder bumps, the plurality of solder bumps is cooled at a first cooling rate. After the solidification stage is finished, the plurality of solder bumps is cooled at a second cooling rate lower than the first cooling rate.

The present invention provides a sputtering target suitable for producing an amorphous transparent conductive film which can be formed without heating a substrate and without feeding water during the sputtering; which is easily crystallized by low-temperature annealing; and which has low resistivity after the crystallization. An oxide sintered compact containing an indium oxide as a main component, while containing tin as a first additive element, and one or more elements selected from germanium, nickel, manganese, and aluminum as a second additive element, with the content of tin which is the first additive element being 2-15 atom % relative to the total content of indium and tin, and the total content of the second additive element being 0.1-2 atom % relative to the total content of indium, tin and the second additive element.

A pressurized water nuclear reactor (PWR) includes a once through steam generator (OTSG) disposed in a generally cylindrical pressure vessel and a divider plate spaced apart from the open end of a central riser. A sealing portion of the pressure vessel and the divider plate define an integral pressurizer volume that is separated by the divider plate from the remaining interior volume of the pressure vessel. An internal control rod drive mechanism (CRDM) has all mechanical and electromagnetomotive components including at least a motor and a lead screw disposed inside the pressure vessel. Optionally CRDM units are staggered at two or more different levels such that no two neighboring CRDM units are at the same level. Internal primary coolant pumps have all mechanical and electromagnetomotive components including at least a motor and at least one impeller disposed inside the pressure vessel. Optionally, the pumps and/or CRDM are arranged below the OTSG.

An improved grid for a nuclear reactor fuel assembly that has an egg-crate base grid as the primary support structure with each support cell of the base grid that supports a fuel rod having a lock-support sleeve that is rotatable within the support cell between a first and second orientation. In the first orientation the lock-support sleeve fits loosely within the support cell of the base grid and respectively, loosely receives the fuel rods that are loaded therein. The lock-support sleeves are then rotated to a second orientation that locks the fuel rods axially within the support cells.

A method of fabricating a nuclear fuel comprising a fissile material, one or more hollow microballoons, a phenolic resin, and metal matrix. The fissile material, phenolic resin and the one or more hollow microballoons are combined. The combined fissile material, phenolic resin and the hollow microballoons are heated sufficiently to form at least some fissile material carbides creating a nuclear fuel particle. The resulting nuclear fuel particle comprises one or more fission product collection spaces. In a preferred embodiment, the fissile material, phenolic resin and the one or more hollow microballoons are combined by forming the fissile material into microspheres. The fissile material microspheres are then overcoated with the phenolic resin and microballoon. In another preferred embodiment, the fissile material, phenolic resin and the one or more hollow microballoons are combined by overcoating the microballoon with the fissile material, and phenolic resin.

A pressurized water nuclear reactor (PWR) includes a once through steam generator (OTSG) disposed in a generally cylindrical pressure vessel and a divider plate spaced apart from the open end of a central riser. A sealing portion of the pressure vessel and the divider plate define an integral pressurizer volume that is separated by the divider plate from the remaining interior volume of the pressure vessel. An internal control rod drive mechanism (CRDM) has all mechanical and electromagnetomotive components including at least a motor and a lead screw disposed inside the pressure vessel. Optionally CRDM units are staggered at two or more different levels such that no two neighboring CRDM units are at the same level. Internal primary coolant pumps have all mechanical and electromagnetomotive components including at least a motor and at least one impeller disposed inside the pressure vessel. Optionally, the pumps and/or CRDM are arranged below the OTSG.

In an illustrative embodiment, a pressurized water nuclear reactor (PWR) includes a pressure vessel (12, 14, 16), a nuclear reactor core (10) disposed in the pressure vessel, and a vertically oriented hollow central riser (36) disposed above the nuclear reactor core inside the pressure vessel. A once-through steam generator (OTSG) (30) disposed in the pressure vessel includes vertical tubes (32) arranged in an annular volume defined by the central riser and the pressure vessel. The OTSG further includes a fluid flow volume surrounding the vertical tubes and having a feedwater inlet (50) and a steam outlet (52). The PWR has an operating state in which feedwater injected into the fluid flow volume at the feedwater inlet is converted to steam by heat emanating from primary coolant flowing inside the tubes of the OTSG, and the steam is discharged from the fluid flow volume at the steam outlet.

Embodiments of the present disclosure can include devices for storing and exchanging color space encoded images. The encoded images can store input data into high capacity multi-colored composite two-dimensional pictures having different symbols organized in specific order using sets in a color space. The encoding can include performing two-level error correction and generating frames based on the color space for formatting and calibrating the encoded images during decoding. The decoding can use the frames to perform color restoration and distortion correction. The decoding can be based on a pseudo-Euclidean distance between a distorted color and a color in a color calibration cells. In some embodiments, an encoded image can be further divided into sub-images during encoding for simplified distortion correction.

A noise resistant switch control circuit is provided. The circuit includes a low pass filter configured to couple to a first terminal of a switch and a first voltage clamp coupled to the low pass filter. The first voltage clamp is configured to couple to a control terminal of the switch and limit a voltage of the control terminal relative to the first terminal to within a first clamping range. The circuit includes a second voltage clamp coupled to an input terminal of the switch control circuit. The second voltage clamp is configured to couple to the control terminal of the switch. The second voltage clamp is further configured to reduce a level of a control voltage coupled to the second voltage clamp. The circuit includes a bias device configured to couple to the control terminal of the switch and to impress a biasing voltage to the control terminal.

A power package is provided comprising a packaged transistor and a driving unit connected to the transistor and adapted to drive the transistor. A control terminal of the transistor is connected to a middle terminal pin of the housing of the transistor and outer terminal pins of the housing are connected to the driving unit and to a voltage level, respectively, wherein the connections are crossing free.

An easy-open and reclosable package includes a pouch including a discrete laminate including a base strip, a panel section, and a die cut defining a die cut segment; a first and second anchor seal; the base strip including a sealing segment, backing segment, and intermediate layer including a pressure sensitive adhesive; and a product disposed in the pouch. The die cut segment is so arranged that when the package is opened, the sealing segment is partially removed from the base strip, the pressure sensitive adhesive is partially exposed, and the package can thereafter be reclosed by adhering any of the first side panel, second side panel, and panel section to the pressure sensitive adhesive. Methods of making the package, and a pouch, are also disclosed.

A sorbent container includes a plurality of sealed pockets connected in a strip. At least one of the pockets is a filled pocket containing a quantity of sorbent material. A pocket adjacent to the filled pocket is empty.

A new and novel impact energy attenuation material, impact energy attenuation module employing the material and a fit system for optimizing the performance thereof is provided. Non-linear energy attenuating material consisting of a plurality of loose particles is employed for impact energy dissipation. The loose particles are preferably spherical elastomeric balls. An impact energy attenuation module includes a container that holds the loose particles. The impact energy attenuation module can be provided in a wide range of sizes and shapes and the loose particles can be provided in different materials, sizes, density, compaction and hardness to suit with the application at hand. A matrix of impact energy attenuation module are provided about the surface of a shell to provide the required impact energy attenuation. The material, impact energy attenuation module and system of the present invention are well suited for protection of body parts and other cushioning and protection needs.

The present invention relates to the description of machine-assisted production assemblies and to the optimization thereof, said assemblies having, built therein, a patented device for folding into deep coated folds, thus making it possible to create paper packaging for fast food, said assemblies all comprising a folded element from a folded paper strip 31. Said machines are modular and all comprise, upstream, an assembly of modules 5, 6, and 7 that supply a folded paper strip 31 that is then converted in a specific finishing module 8 for making, from said lidded paper strip, a packaging for a sandwich or loose product such as fries or chicken pieces.

In the case of a package (1) for single-dose films (2) containing active substances, comprising an upper packaging material element (3) and a lower packaging material element (4) which are connected together by a peripheral seal area or respectively sealing seam (5) such that a cavity (6) for holding the film (2) is formed, said cavity being enclosed on all sides, wherein the upper packaging material element (3) and the lower packaging material element (4) each have at least one cut (7, 8) in the region of the seal area or respectively, the sealing seam (5), said cuts being congruent, andat least one cut (7, 8) is crossed by a folding or bending line (10), the folding or bending line (10) is formed in a weakened manner.

An inflatable structure may be formed from a single piece of flexible film using a provided method of manufacturing. The inflatable structure may include quilting seals which divide the inflatable chamber. The inflatable structure may also include an external valve opening extending through multiple layers of the flexible film. The external valve opening may further be partially defined by edge portions of the flexible film formed by folding the flexible film. The external valve opening may be configured to align with an opening in a container or an inflation aperture in a pouch so that the inflatable structure can be inflated while inside the container/pouch. A corresponding inflation device fills the inflatable structure with air and may do so without requiring heat sealing or contact between the inflatable structure and outlet of the inflation device. A hinged plate apparatus may assist in directing air into the external valve opening.