photonics
photonics
Celestial AI Acquires Rockley Photonics Patent Portfolio, Strengthening Photonic Fabric IP
SANTA CLARA, Calif., Oct. 22, 2024 — Celestial AI today announced the acquisition of silicon photonics intellectual property from Rockley Photonics, including worldwide issued and pending patents. The combination of Celestial […]
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photonics
IonQ and NKT Photonics Collaborate on Next-Gen Laser Tech for Quantum Data Centers
COLLEGE PARK, Md., Nov. 8, 2024 — IonQ, a leader in the quantum computing industry, has announced a partnership with NKT Photonics, a subsidiary of Hamamatsu Photonics, to procure next-generation laser […]
The post IonQ and NKT Photonics Collaborate on Next-Gen Laser Tech for Quantum Data Centers appeared first on HPCwire.
photonics
2020 Photonics North (PN) [electronic journal].
photonics
2020 IEEE Photonics Society Summer Topicals Meeting Series (SUM) [electronic journal].
photonics
Tensile strained semiconductor photon emission and detection devices and integrated photonics system
Tensile strained germanium is provided that can be sufficiently strained to provide a nearly direct band gap material or a direct band gap material. Compressively stressed or tensile stressed stressor materials in contact with germanium regions induce uniaxial or biaxial tensile strain in the germanium regions. Stressor materials may include silicon nitride or silicon germanium. The resulting strained germanium structure can be used to emit or detect photons including, for example, generating photons within a resonant cavity to provide a laser.
photonics
PACKAGING OPTOELECTRONIC COMPONENTS AND CMOS CIRCUITRY USING SILICON-ON-INSULATOR SUBSTRATES FOR PHOTONICS APPLICATIONS
Package structures and methods are provided to integrate optoelectronic and CMOS devices using SOI semiconductor substrates for photonics applications. For example, a package structure includes an integrated circuit (IC) chip, and an optoelectronics device and interposer mounted to the IC chip. The IC chip includes a SOI substrate having a buried oxide layer, an active silicon layer disposed adjacent to the buried oxide layer, and a BEOL structure formed over the active silicon layer. An optical waveguide structure is patterned from the active silicon layer of the IC chip. The optoelectronics device is mounted on the buried oxide layer in alignment with a portion of the optical waveguide structure to enable direct or adiabatic coupling between the optoelectronics device and the optical waveguide structure. The interposer is bonded to the BEOL structure, and includes at least one substrate having conductive vias and wiring to provide electrical connections to the BEOL structure.
photonics
UTEP Professor Named Fellow of International Society for Optics and Photonics
Raymond C. Rumpf, Ph.D., professor of electrical and computer engineering at The University of Texas at El Paso, was promoted to Fellow of the International Society for Optics and Photonics (SPIE), an educational nonprofit established to advance light-based science, engineering and technology.
photonics
Advanced fabrication technologies for micro/nano optics and photonics VII: 3-5 February 2014, San Francisco, California, United States / Georg von Freymann, Winston V. Schoenfeld, Raymond C. Rumpf, editors ; sponsored by SPIE ; cosponsored by Samsung Adva
photonics
Nanoscale materials and devices for electronics, photonics and solar energy / Anatoli Korkin, Stephen Goodnick, Robert Nemanich, editors
photonics
Semiconductor lasers and diode-based light sources for biophotonics / edited by Peter E. Andersen, Paul Michael Petersen
photonics
Semiconductor lasers and diode-based light sources for biophotonics / edited by Peter E. Andersen and Paul Michael Petersen
photonics
Resonant tunneling diode photonics: devices and applications / Charlie Ironside, Bruno Romeira, José Figueiredo
photonics
2019 PhotonIcs & Electromagnetics Research Symposium - Spring (PIERS-Spring) [electronic journal].
photonics
2019 Photonics & Electromagnetics Research Symposium - Fall (PIERS - Fall) [electronic journal].
photonics
2019 IEEE/ACM Workshop on Photonics-Optics Technology Oriented Networking, Information and Computing Systems (PHOTONICS) [electronic journal].
photonics
2019 Asia Communications and Photonics Conference (ACP) [electronic journal].
photonics
Nanophotonics, Nanooptics, Nanobiotechnology, and Their Applications: Selected Proceedings of the 6th International Conference Nanotechnology and Nanomaterials (NANO2018), August 27-30, 2018, Kyiv, Ukraine.
photonics
Electrons in solids: mesoscopics, photonics, quantum computing, correlations, topology / Hendrik Bluhm, Thomas Brückel, Markus Morgenstern, Gero Plessen, Christoph Stampfer
photonics
Mathematical and computational methods in photonics and phononics / Habib Ammari [and five others]
photonics
Photonics and fiber optics: foundations and applications / [edited by] Tarun Kumar Gangopadhyay, Pathik Kumbhakar, Mrinal Kanti Mandal
photonics
Ultrafast Bandgap Photonics: 18-20 April 2016, Baltimore, Maryland, United States / Michael K. Rafailov, Eric Mazur, editors ; sponsored and published by SPIE
photonics
The 2nd International Conference on Applied Photonics and Electronics 2019 (InCAPE 2019): 22 August 2019, Putrajaya, Malaysia / editor, Mohamad Halim Abd. Wahid [and 6 others]
photonics
Semiconductor nanophotonics: materials, models, and devices / Michael Kneissl, Andreas Knorr, Stephan Reitzenstein, Axel Hoffmann, editors
photonics